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Issue with this product was that system critical fuses that were being blown at 35 degrees were being seen unblown at minus temperature on a large scale
Looking into the technology and the physics of the cell this is not uncommon Usually this technology is used for consumer products
We can extend the state of the art if we can make antifuse technology really automotive qualified with no temperature screen
• Antifuse technology blows through an oxide • Increase the leakage compared to non blown• Comparison is done with a sense amp with a certain tolerance • Which changes over temperature• Hence multiple effects that compound the tolerance of the
detection of a blown fuse• Result is high defect rate across temperature – OK for consumer• For Automotive requires a second temperature stage
It has been shown that by using a very low supply voltage screen for parameters sensitive to cold temperature, a reliable and most effective technique can be developed to remove such problem devices resulting either from process issues or from randomly expected defects. In combination with an intelligent nearest neighbor removal one can have a high degree of confidence in shipping high quality and reliable dice even when suspect wafers have been produced.