1. INTRODUCTION - 3 - 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of the phones. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use. B. Incidence of Harm If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done. C. Changes in Service A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service. D. Maintenance Limitations Maintenance limitations on the phones must be performed only by the LGE or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Theref ore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty. E. Notice of Radiated Emissions The phones complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
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Transcript
1. INTRODUCTION
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1. INTRODUCTION
1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the
features of the phones.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (forexample, persons other than your company’s employees, agents, subcontractors, or personworking on your company’s behalf) can result in substantial additional charges for yourtelecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System usersare responsible for programming and configuring the equipment to prevent unauthorized use. LGEdoes not warrant that this product is immune from the above case but will prevent unauthorized useof common-carrier telecommunication service of facilities accessed through or connected to it. LGEwill not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possiblycausing harm or interruption in service to the telephone network, it should disconnect telephoneservice until repair can be done. A telephone company may temporarily disconnect service as longas repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. Ifthese changes could reasonably be expected to affect the use of the phones or compatibility withthe network, the telephone company is required to give advanced written notice to the user,allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the LGE or its authorized agent.The user may not make any changes and/or repairs expect as specifically noted in this manual.Theref ore, note that unauthorized alternations or repair may affect the regulatory status of thesystem and may void any remaining warranty.
E. Notice of Radiated Emissions
The phones complies with rules regarding radiation and radio frequency emission as defined bylocal regulatory agencies. In accordance with these agencies, you may be required to provideinformation such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightlydifferent.
G. Interference and Attenuation
An the phones may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Followinginformation is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange systemboards.
When repairs are made to a system board, they should spread the floor with anti-static matwhich is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protectivepackage as described.
1. INTRODUCTION
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1. INTRODUCTION
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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
6 Output RF Spectrum 1,800 -24(due to switching transient)
GSM
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious EmissionsConduction, Emission StatusConduction, Emission Status
2. PERFORMANCE
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Item Description Specification
GSM, EGSM
8 Bit Error RatioBER (Class II) < 2.439% @-102 dBm
DCSBER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 * -5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
16 Sending Distortion-20 30.7
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side tone Distortion Three stage distortion < 10%
18 System frequency (13 MHz) tolerance ≤ 2.5 ppm
2. PERFORMANCE
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Item Description Specification
19 32.768KHz tolerance ≤ 30 ppm
At least 80 dB under below conditions:20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge VoltageFast Charge : < 500 mA
Slow Charge: < 60 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm
Batter Bar Number Voltage
0 ~ 3.62 V
23 Battery Indicator 1 3.62 ~ 3.73 V
2 3.73 ~ 3.82 V
3 3.82 V ~
24 Low Voltage Warning3.5 0.03 V (Call)
3.62 0.03 V (Standby)
25 Forced shut down Voltage 3.35 0.03 V1 Li-Polymer Battery
26 Battery TypeStandard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 760 mAh(820 mAh)
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Out put: 5.2 V, 600 mA
3. TECHNICAL BRIEF
3.1 ReceiverThe receiver part consists of a dual band(GSM & DCS) antenna switch, two RF SAW filters, aexternal dual RF VCO and a transceiver IC(TRF6150). All active circuits for a complete receiverchain with the exception of RF VCO are contained in the transceiver IC(TRF6150).
The TRF6150 chip set has direct conversion structure, so the received RF signal is directlyconverted to base band I and Q signal by the transceiver IC(IF frequency is 0 Hz), which containstwo LNAs and three direct conversion demodulators for E-GSM, DCS and PCS. The demodulated Iand Q signals pass two base band AGC amplifiers and a channel filter, which are on both I and Qsignal paths. The RF front-end circuit is shown Fig. 3-1.
Figure 3-1. RF front-end circuit.
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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3.1.1 RF front end
RF front end consists of an antenna, a dual band antenna switch, two RF SAWs and two LNAs forE-GSM, DCS band, which are contained in the transceiver IC (TRF6150).
The RF received signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are input via theantenna or coaxial connector. An antenna matching circuit is between the antenna and theconnector.
VC2 that are connected to 4-Input NOR Gate (U607) to switch either TX or RX path on. When theRX path is turned on, the received RF signal, which has passed through the dual band antennaswitch, is filtered by an appropriate RF SAW filter for better stop band rejection. The filtered RFsignal is amplified by an LNA integrated in the transceiver IC(TRF6150) and pass to a directconversion demodulator. This process is thecsame both GSM and DCS.
The logic and current is given below. Table 3-1.
Table 3-1. The logic and current
3.1.2 Demodulator and Baseband Processing
IF stage is not necessary in this system because the receiver is based on direct conversionarchitecture. So the RX LO frequency is the same as input radio frequency. The amplified signal atLNA stage passes to a direct conversion demodulator and is mixed down to generate I&Q BBsignals. The BB I&Q signals pass via two integrated baseband amplifiers with digitallyprogrammable gain and two fully integrated baseband channel filters to the baseband A/Dconverters which is contained in baseband chipset. Fig.3-2 shows RX path block diagram.
3.1.3 DC offset compensation
The transceiver IC(TRF6150) is based on direct-conversion architecture. This implies that aparasitic DC offset may appear at the output of the IQ demodulator. To reduce the static offset dueto components mismatch and LO self-mixing, the IC includes a hardware DC offset compensationcircuit on both I and Q base band paths. The transceiver IC uses a divider by 2 for LO generation inEGSM and a multiplier by 2 in DCS to minimize the DC offset generated by self mixing and the LOradiation. In addition, a quadrature demodulator gain mismatch calibration system is used to reducethe signal distortion.
VC1 VC2
GSM TX 2.7 V 0 V
DCS TX 0 V 2.7 V
GSM/DCS RX 0 V 0 V
Figure 3-2. RX path block diagram.
Table 3-2. Gain and Noise Figure of RX path.
Table 3-3. Total Gain and Noise Figure of RX path.
Total Gain Total Noise FigureGSM, EGSM 22.9 dB 7.2 dBDCS 19.1 dB 8.2 dB
3. TECHNICAL BRIEF
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3.2 SynthesizerThe TRF6150 includes two synthesizer parts. Two synthesizers consist of an IF synthesizer, whichis an integer-N synthesizer, and a RF synthesizer, which is a fractional-N synthesizer. The TRF6150is a transceiver IC suitable for GSM and DCS GPRS up to class 12 applications. So, synthesizersuse a number of techniques to improve lock time, making them well suited to GPRS.
The main fractional-N synthesizer (RF synthesizer), which includes a RF VCO with external tankcircuits, is necessary for both transmitting and receiving operation. The RF VCO works only whenthe transmitting operation is on. The main fractional-N synthesizer has frequency band from 1294MHz to 1356 MHz. Output frequency of the RF VCO is set by the factional number, prescaler andcounter. An buffer amplifier follows the RF VCO. The purpose of the buffer is to give reverseisolation and prevent any frequency pulling of the VCO when the transceiver is powered UP andDOWN.
A dual band external VCO, which uses the PLL block of the main fractional-N synthesizer, isnecessary for transmitting and receiving operation. The dual band means that it can support GSM,DCS frequency operation. For transmitting operation, the OPLL block of the TRF6150 directlymodulates the dual band external VCO with I and Q signals. For receiving operation, the externalVCO output frequency band is fr 90902 to 940MHz for DCS Rx and from 1850 to 1920MHz for GSMRx. The frequency of the signal from the external VCO is divided by 2 for GSM Rx and is doubled by2 for DCS Rx operation before entering into the direct conversion mixer.
The auxiliary integer-N synthesizer (IF synthesizer), which includes an IF VCO with external tankcircuits, is necessary for transmitting operation only. The IF VCO has a frequency band from 832MHz to 858 MHz. Output frequency of IF VCO is settled by prescaler and counter. The fractionalcounter in the RF synthesizer just differs from the IF synthesizer. The IF VCO is also followed by abuffer amplifier, which is to give reverse isolation and prevent any frequency pulling of the VCOwhen the transceiver is powered UP and DOWN.
A fixed reference frequency of 1.3MHz for Rx (or 2.6MHz for Tx) is generated by a reference dividerfrom the external applied 13 MHz crystal oscillator.
The phase frequency detector with charge pump provides programmable output current, whichcould drive the capability and the pulse width.
The counter and mode settings of the synthesizer in the TRF6150 are programmed via 3-wireinterface.
Table 3-4. 3-wire BUS of Synthesizer in the TRF6150
Pin Number DescriptionCLK 11 Serial clock input to the synthesizerDATA 12 Serial data input to the synthesizerEN 13 Input latches the serial data transferred to the synthesizer
Figure 3-3. Synthesizer internal Block Diagram.
3. TECHNICAL BRIEF
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The IF and RF output frequencies of the TRF6150 are set by programming the internal divider registers.The frequency setting equations of the IF and RF frequencies are as follows.
is the output frequency of the IF VCO (the auxiliary integer-N synthesizer) and is the outputfrequency of the RF VCO (the main fractional-N synthesizer). The frequency band of the RF VCO is from1294MHz to 1356 MHz, and the frequency band of the IF VCO is from 832MHz to 858Mhz, whichfrequency bands are for the transmitting operation only.
Figure 3-4. Synthesizer Circuit.
3. TECHNICAL BRIEF
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3.3 Transmitter The Transmitter part contains TRF6150 active parts, PAM, coupler, dual schottky diode and dualband VCO. The TRF6150 active parts consist of the vector modulator and offset phase-locked loopblock (OPLL) including down-converter, phase detector, and APC IC for power control. The VCOfeed the output frequencies into PAM and TRF6150 for Tx local frequency. The peak output powerof the PAM is controlled by means of a closed feedback loop. A dual band directional coupler isused to control the RF output from the PAM. The PAM outputs from the directional coupler pass tothe antenna connector via an integrated dual band antenna switch module.
Figure 3-5. Transmitter Block Diagram.
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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3.3.1 Tx Modulator
The Tx I & Q signals from BB analog chipset are fed to the TRF6150 Tx modulator, where they aremodulated onto either a Tx of 880 MHz(for GSM-Tx) or 1710 MHz(for DCS-Tx) by the quadraturemixer inside the U604. The Tx LO signal(1294 – 1356 MHz, 426.4 MHz) is fed from the internalmain and aux.
VCO.
The modulator provides more than 40dBc of carrier and unwanted side-band rejection andproduces a GMSK modulated signal. The BB software is able to cancel out differential DC offsets inthe I/Q BB signals caused by imperfections in the D/A converters. The Tx-Modulator implements aquadrature modulator. The frequency input signal is split into two precise orthogonal carriers, whichare multiplied by the BB modulation signal IP/IN and QP/QN. It is used as reference signal for theOPLL.
Figure 3-6. TX IF Modulator and OPLL Circuit.
3.3.2 OPLL
The down converter contained inside of the TRF6150 (U604) mixes the Tx RF frequency with theRF VCO signal from the ENFVZ4L07(U600) to generate a feedback signal at 414.4MHz for GSM,EGSM and DCS operation. The feedback signal passes to one port of the phase detector.
The GMSK reference signal from the Tx IF modulator passes via a second limiter to the otherinput port of the phase detector. The phase detector generates an error current proportional to thephase difference between the feedback signal from the down-converter and the `reference’ signalfrom the Tx IF modulator. The error current is filtered by a second order low-pass filter to generatean output voltage, which depends on the GMSK modulation and the desired channel frequency.This voltage controls the transmit VCO such that the VCO output signal, centered on the correct RFchannel is frequency modulated with the original GMSK data.
The center frequency of the transmit VCO is offset from the RF VCO frequency by 414.4MHz forGSM ,EGSM and DCS operation.
3.3.3 Power Amplifier
The PF08122B (U601) is Dual band power amplifier for EGSM (880 to 915 MHz) and DCS (1710 to1785 MHz). The efficiency of module is the 55% at 35 dBm for E-GSM and the 50% at 32.5 dBm forDCS for 3.5 V nominal battery use.
This module should be operated under the GSM burst pulse. To avoid permanent degradation, CWoperation should not be applied. To avoid the oscillation at no input power, before the input is cutoff, the control voltage Vapc should be control to less than 0.5 V. We have to improve thermalresistance, the through holes should be layouted as many as possible on PCB under the module.And to get good stability, all the GND terminals and the metal cap should be soldered to groundplane of PCB.
Figure 3-7. Power Amplifier and its Control Part Circuits.
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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3.3.4 PA Circuit and Control
The power amplifier control circuit ensures that the RF signal is regulated to the required limits ofoperation. RF power is controlled by driving the power control pins of power amplifier and sensing.The resultant RF output power via a directional coupler (N600). The RF sense voltage is peakdetected using an schottky diode of BAT15-099(D600). This detected voltage is compared to theDAC voltage in the TRF6150 to control the output power.
An internal input signal (PA_LEVEL) from CALYPSO, digital BB chipset, (U200) is applied to theAPC IC in TRF6150 during the PA_ON mode and a directional coupler near the antenna feeds aportion of the RF output signal back to the APC IC and peak detector converts this signal to a lowfrequency feedback signal that balances the amplifier when this signal equal to the RAMP inputsignal level.
3.4 13 MHz ClockThe 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated CrystalOscillator), which oscillates at a frequency of 13 MHz.The 13MHz clock is used within the Synthesizer block of the TRF6150, BB Analog chip-set(NAUCICA_CS), and Digital (CALYPSO). The inverter IC, SN74AHC1GU04 buffer the output toNAUCICA_CS and CALYPSO.
Figure 3-8. VCTCXO Circuit.
3.5 Power Supplies and Control SignalsThree Regulators are integrated in the TRF6150 to provide DC power to the RF blocks (RegulatorR1, R2 R3). The Regulator R1 is used to provide DC power to the receiver, the transmitter and thePA control loop of the TRF6150. The Regulator R2 is used to provide DC power to the DC offsetcompensation circuit, the auxiliary synthesizer, the main synthesizer and VCOs. The Regulator R3is used for the external Rx/Tx VCO. An external regulator is used to provide DC power to theVCTCXO(U605).
Table 3-5. Regulator Specification
Figure 3-9. External Regulator Circuit.
3. TECHNICAL BRIEF
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Regulator Voltage Powers Enable SignalRegulator R1, R2, R3 Receiver, Transmitter,
(These are all integrated 2.8 V 0.1 V Synthesizers, VCOsin the TRF6150)
ADP3330_2V85 (U605) 2.85 V 0.5 V VCTXO RF_ENA, XO_ENA
3. TECHNICAL BRIEF
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3.6 Digital Baseband (DBB) Processor
Figure 3-10. Top level block diagram of the Calypso G2(HERCROM400G2).
3.6.1 General Description
CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone.This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro-Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bitSRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOSgates.
The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding.
CALYPSO implements all features for the structural test of the logic (full-SCAN, BIST, PMT, JTAG
boundary-SCAN).
3.6.2 Block Description
CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEAbus standard as interface with their associated application peripherals.
CALYPSO is composed from the following blocks:
• ARM7TDMIE : ARM7TDMI CPU core
• DSP subchip
• ARM peripherals:
General purpose peripherals• ARM Memory Interface for external RAM, Flash or ROM• 4 Mbit Static RAM with write-buffer
Application peripherals• ARM General purposes I/O with keyboard interface and two PWM modulation signals• UART 16C750 interface (UART_IRDA) with
- IRDA control capabilities (SIR)- Software flow control (UART mode).
• UART 16C750 interface (UART_MODEM) with
- hardware flow protocol (DCD, CTS/RTS)- autobaud function
• SIM Interface.
• TPU(Time Processing Unit) : Processing for GSM time base
• TSP(Time Serial Port) : GSM data interface with RF and ABB
In total 16 allowable resources, the phones is using 13 resources except 3 resources dedicated toSIM and Memory. the phones GPIO(General Purpose Input/Output) Map, describing application,I/O state, and enable level, is shown in below table.
Table 3-10. GPIO Map Table
3.7 Analog Baseband (ABB) Processor
3.7.1 General Description
Nausica CS is Analog Baseband (ABB)Chip supports GSM900, DCS1800, GPRS Class 10 with
- Audio Signal Processing & Interface- Baseband in-phase(I), quadrature(Q) Signal Processing- RF interface with DBB (time serial port)- Supply voltage regulation- Battery charging control- Switch ON/OFF- 3V/5V SIM card Interface- 4 internal & 5external ADC channels
I/O # Application I/O Resource Inactive ActiveState State State
I/O (0) FOLDER I GPIO HIGH LOW(Open) (Closed)
I/O (1) MELODY_INT I GPIO HIGH LOW
I/O(2) DCD O GPIO LOW HIGH
I/O (3) DSR I GPIO HIGH LOW
I/O (4) Sub_backlight O GPIO LOW HIGH
I/O (5) SIM_PWCTL O SIM
I/O (6) Jack_Detect O GPIO LOW HIGH
I/O (7) LCD_RESET O GPIO HIGH LOW
I/O (8) SPK_EN O GPIO LOW HIGH
I/O (9) MELODY_RESET O GPIO HIGH LOW
I/O (10) SUB_LED1 O GPIO LOW HIGH
I/O (11) SUB_LED2 O GPIO LOW HIGH
I/O (12) SUB_LED3 O GPIO LOW HIGH
I/O (13) HANDSFREE I GPIO HIGH LOW
I/O (14) NBHE O MEMORY
I/O (15) NBLE O MEMORY
3.7.2 Audio Signal Processing & Interface
Audio signal processing is divided Uplink path and downlink path..
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signaland then transmit it to DBB Chip. This transmitted signal is reformed to fit in GSM Frame format anddelivered to RF Chip. MICBIAS is 2.5Vlevel.
The downlink path amplifies the signal from DBB chip and outputs it to Receiver(or Speaker).
Figure 3-13. Audio Interface Block Diagram
3.7.3 Baseband Codec(BBC)
Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL).
BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) com-ponent and quadrature(Q) component with burst data from DBB. This modulated signal istransmitted through RF section via air.
BDL process is opposite procedure of BUL. Namely, it performs GMSK demodulation with inputanalog I&Q signal from RF section, and then transmit it to DSP of DBB chip with 270KHz data ratethrough BSP.
Figure 3-14. Baseband Codec Block Diagram
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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3.7.4 Voltage Regulation(VREG)
There are 5 LDO(Low Drop Output) regulators in ABB chip.
The output of these 5 LDOs are as following table. (Figure 3-6) shows the power supply relatedblocks of DBB/ABB and their interfaces in the phones.
Figure 3-15. Power Supply Scheme
Table 3-11. LDO Output Table
3.7.5 ADC Channels
ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 5external ADC channel. This block operates charging process and other related process by readingbattery voltage and other analog values.
Output Voltage Usage
VR1 1.8V Digital Core of DBB
VR1B 2.0V Digital Core of ABB
VR2 2.9V Memory Interface of DBB
VR2B 2.9V Digital I/Os of DBB & ABB
VR3 2.9V Analog Block
Table 3-12. ADC Channel Spec
3.7.6 Charging
Charging block in ABB processes charging operation by using VBAT, ICHG value through ADCchannel. Battery Block Indication and SPEC of the phones is as follow.
Figure 3-16. Battery Block Indication
1. Charging method : CC-CV2. Charger detect voltage : 4.0V3. Charging time : 2h4. Icon stop current : 100mA5. Charging current : 420mA6. CV voltage : 4.2V7. Cutoff current : 40mA8. Full charge indication current (icon stop current) : 100mA9. Recharge voltage : 4.16V10. Low battery alarm
12. Switch-off voltage : 3.35V13. Charging temperature adc range
a. ~ -2°C : not charging operation.b. -2°C ~ 47°C : charging.c. 47°C ~ : not charging operation.
3. TECHNICAL BRIEF
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ADC 9 channels
Resource Name
VCHG VCHG
VBAT VBAT Charging Management
ICHG ICHG
VBACKUP VBACKUP Backup Battery
ADCIN1 Not Use
ADCIN2 BATT_Themister Battery Detect
ADCIN3 RADIO_TEMP Temperature Sensing
ADCIN4/TSCXP Hook_Detect HOOK_DETECT
ADCIN5/TSCYP Not Use
3. TECHNICAL BRIEF
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3.7.7 Switch ON/OFF
The phones Power State : Defined 4cases as follow
- Power-ON : mobile is powered by main battery or backup battery.- Power-OFF : mobile isn’t any battery.- Switch-ON : mobile powered and waken up from switch-off state.- Switch-OFF : mobile is powered to maintain only the permanent function(ULPD).
To enter into Switch-ON state, one of following 4 condition is satisfied.
- PWR-ON : pushed after a debouncing time of 30ms.- ON_REMOTE : After debouncing, when a falling edgeis detected on RPWON pin.- IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin.- CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG.
17 I_LED1 BACKLIGHT Indicator LED Enable 1(Enable High)
18 I_LED2 BACKLIGHT Indicator LED Enable 2(Enable High)
19 I_LED3 BACKLIGHT Indicator LED Enable 3(Enable High)
20 EL_EN BACKLIGHTSub LCD EL backlight Enable(Enable High)
21 VBAT PWR VBAT for White LED operation
22 SUB_CS Sub Interface Sub LCD Chip Select1 (Low Enable)
23 CS2(A2) (Parallel) Sub LCD Chip Select2 (High Enable)
24 VSS1 GND Ground
25 VBAT1 PWR VBAT for White LED operation
26 MOTOR VIBRATOR Vibrator Enable
27 REC(-) Receiver Negative
28 REC(+)AUDIO
Receiver Positive
29 SPK(-) Speaker Negative
30 SPK(+) Speaker Positive
3. TECHNICAL BRIEF
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3.7.10 KeyPad Switching & Scanning
Table 3-14. Keypad Map
DBB supports 25 Keymap and Switch-ON Key is directly connected to ABB(see Figure 3-17).
Figure 3-17. Keypad Scanning Scheme
KBC0 KBC1 KBC2 KBC3 KBC4
KBR0 [ ] [ ] [ ] [ ] [CFM]
KBR1 [1] [2] [3] [F4] [Voice Memo]
KBR2 [4] [5] [6] [F1] [Vol Up]
KBR3 [7] [8] [9] 1[F2] [Vol Down]
KBR4 [*] [0] [#] [SEND] [F3]
3.7.11 Audio
Figure 3-18. Audio Section Scheme
UplinkThe microphone is soldered to the main PCB. The uplink signal is passed to MICIP and MICIN pinsof Nausica_CS. The MICBIAS voltage is supplied from Nausica_CS(dedicated mode only) throughswitching IC(U404) and R401. The MICBIAS voltage path is switchable by control the U404.
When the headset is inserted, U400 outputs 2.8V high state and it’s input of U404(#1) and Calypso(Jack_Detect). On detecting this 2.8V output, Calypso makes Nausica_CS switches the micamplifier path from main to auxiliary. In addition, this 2.8V output applied to U404(#1) and U404switches the MICBIAS voltage path from main mic to headset mic through D401 and R419.
Figure 3-19. Uplink Path
3. TECHNICAL BRIEF
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DownlinkThe downlink signal is passed from EARP and EARN pins of Nausica_CS. When the headset isinserted and Calypso detects ‘Jack_Detect’ signal(output of U400), Calypso makes Nausica_CSswitches the downlink path from ‘EARP’ and ‘EARN’ to ‘AUXOP’ and ‘AUXON’.
Figure 3-20. Downlink Path
Speaker PhoneIn speakerphone mode, Calypso makes ‘SPK_EN’ to 2.8V and EARP signal is passed to speakerthrough MIDI IC(U403).
3.7.12 KeyPad and Main LCD back-light Illumination
There are 19 Deep Blue LEDs in Main Board and 3 LEDs in LCD module for KeyPad Back-light and
Main LCD Back-light respectively, which are driven by ‘KEYLIGHT’ line from Calypso.
Figure 3-21. KeyPad and Main LCD Back-light Scheme
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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3.7.13 Sub_LCD EL Illumination
In Sub-LCD EL illumination, there is an EL driver in FPCB Board, which is driven bySUB_BACKLIGHT line from Calypso(GPIO4).
Figure 3-22. Sub-LCD EL Illumination
3.7.14 Indicator Illumination
Indicator LED control circuit can make 7 colors using multi-color LED. Multi-color LED consists ofRed LED, Green LED and Blue LED. The combination of these LEDs makes 7 colors
Figure 3-23. Indicator LED Illuination
In the case of power off mode(ON_OFF=Low), if TA is inserted, R509 is connected to VCHG and
I_LED1(Red LED) is turned-on. In other cases(ON_OFF=High), Multi-color LED is controlled bySUB_LED1, SUB_LED2 and SUB_LED3 signal of Calypso
4. SERVICE S/W AND CALIBRATION
- 37 -
4. SERVICE S/W AND CALIBRATION
4.1 Service S/W
4.1.1 Overview
This service S/W is used for Calibration and Standalone test.
4.1.2 Hardware and software environment
- More than 486 computer
- 16Mbyte RAM
- Remained more than 10Mbyte in Hard Disk Memory
- Under Microsoft windows 98 or more than
4.1.3 Software installation
Unzip the phones service software provided where folder you want there are some files extracted inthat folder. Start Setup.exe in Service software setup folder. RampTable.dat, default transmitramping table, and rf_original_L300.epm, default calibration data, are located in window systemfolder so that these files are loaded automatically, if you execute LaputaService.exe.
4.1.4 Common Properties of Service Software
When you execute this program, you’ll see the below user interface window titled
LAPUTA_Service Tool in figure 4-1. The LAPUTA_Service Tool has five main frames.
Figure 4-1. LAPUTA Service Tool
4. SERVICE S/W AND CALIBRATION
- 38 -
A. Target system frameThis is for initializing the target phone. When you use this program to test the phones, you haveto initialize target at first. To initialize target phone, select target (the phones is default) and COMport used at your computer and then click the Initialize button. If target initializing is endedsuccessfully, the box in red below the initialize button will turn into green.
B. Rx AGC Test frameAt this part, you can control receiver path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel. You can change thevalue by clicking arrow button by one step or just entering the number directly.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- AGC Value Setting
You can set AGC gain of phone. The number means gain of AGC amplifier in Rx path.
- Power Measurement
The number means channel index according to pre-defined ARFCN. There are 12 pre-definedARFCNs within Rx band. 4 ARFCNs are for GSM and others for DCS. Clicking arrow button tochange number, you can see TCH and BCH ARFCN changed automatically.
PM window displays the power level measured in baseband chip. PM value is useful tocalculate the received absolute power. The unit of PM is dBd.
- PM Start
You can measure Rx power that target received from test equipment. When you click thisbutton the result of power measurement displayed at PM blank in Power Measurement frame.You can measure PM for all 12-channel indexes by changing Number and clicking PM Start.
- Calculate
You have to do this work after measuring PM for all 12-channel indexes. When you click thisbutton, service software calculate the calibration data from measured 12 PM data.
- Standalone
This button makes target operate in Rx mode continuously. Target will be operated under thecondition that you set. During continuous receiving mode, label of Standalone button ischanged to Stop. If you want stop receiving mode operating, click this button one more.
4. SERVICE S/W AND CALIBRATION
- 39 -
C. Tx APC Test frameAt this part, you can control transmit path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- Power Level Setting
First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequencythat you selected before. Then select the Level and adjust the DAC value. Level meansGSM/DCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS. DAC value isa factor to determine output power. Its variable range is 0 to 1023.
- Uplink Normal Burst test
You can also control the traffic slot number be using by changing TCS value. Because GSMhas 8-time slot, TCS value varies 0 to 7. Patten is to select data format that is transmitted. Youcan send all data 0, or 1 or repeating of 1010. But it is good to you to using the default valuebecause data format doesn’t affect to RF characteristics.
- Test
Transmitting is started when you click this button. During Transmitting, label of Test button ischanged to Stop. If you want stop transmitting, click this button one more.
D. RF Parameter Download frame- Saving epm file into Flash
When you have a epm file, contains calibrated data, and you want to download into targetFlash, check Flash and click File Download button. Then you can see RF parameters Savewindow. Select epm file you want to save into Flash then click Open. During saving file intoFlash, The statement bar indicating download process is displayed under the RF ParameterDownload frame. As successfully ending download, information box will be appeared. Click Ok.
- Saving Cal. Data to Flash
After Rx or Tx calibration, you can save the calibration results into Flash and epm file. CheckFlash and click Calib Save button. Then you can see RF parameters Save window. Write thefile name and click Save button.
E. User Command and Results frameWhenever you click button or make some event in service software, every ordered event isdisplayed in this frame. You can also see calibration results here.
F. Ramp Shape buttonThis button is for burst shape table. But it is deactivated in service software.
4. SERVICE S/W AND CALIBRATION
- 40 -
4.2 Calibration
4.2.1 Overview
All tuning operations of the phone are carried out using the service software. The service softwareturns the phone into the locals mode, in which the phone can be outwardly controlled via the testJig.The calibration values of the phone reside on the Flash. The contents of the Flash can be read bythe service software and saved as a file. This is advisable when there is need to retain thatinformation, e.g. in view of replacement of the circuit. The program also enables writing the defaultparameters on the Flash, in which case all calibration steps should be carried out. The servicesoftware can’t control the equipment, so only manual calibration process is possible.
4.2.2 Equipment List
Table 4-1. Calibration Equipment List.
Equipment for Calibration Type / Model BrandWireless Communication HP8960,HP8922, CMU200, any other call equipmenTest Set
RS-232 Cable and Test JIG
RF Cable
Power
Service SW (LAPUTA)
Test SIM Card
PC(for Software Installation) Pentium II class above 300MHz
4. SERVICE S/W AND CALIBRATION
- 41 -
4.2.3 Equipment Setup
Figure 4-2. Calibration Equipment Setup
+ -
+
-
- 42 -
4. SERVICE S/W AND CALIBRATION
4.2.4 Calibration Steps
A. RX CalibrationIn order for the RSSI measurements to be within the GSM specifications, some calibration isnecessary. Also, due to AGC implementation, some AGC specific constants need calibration. Intotal, three calibrations are required per receive band, AGC calibration, channel compensationand temperature compensation. Of these, temperature compensation is not needed inreplacement of the circuit. In AGC calibration the reference power fed into the phone viapermanent antenna connector is –74dBm. In channel compensation, the channel numbers in Rxband are;
E-GSM band : 0, 40, 124, 975, and 1023.
DCS band : 512, 574, 636, 700, 760, 822 and 885.
- Procedure
a) Initialize phone by clicking Initialize button.
b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment ‘0’, samewith phone.
c) Set the power of GSM test equipment ‘–74dBm’.
d) Click the PM Start button, then the value, received power by phone, is displayed in PMmeasurement window at service software.
e) Change the BCH and TCH of phone by clicking the Number button and set the channel(BCH & TCH) of equipment to be same.
f) Click the PM Start button.
g) Repeat above procedure until the displayed number in Power Measurement window is 12.
h) Click the Calculate button, then the service software calculate the channel compensationparameters.
i) Saving updated calibration data into phone by clicking Calib Saving button.
NOTE
If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels forDCS1800, the service software reports, “Please execute after measuring the PM”.
B. TX CalibrationIn order for the Tx power to be within the GSM specifications for each Tx level, some calibrationis necessary. In total, four calibrations are required per transmit band, power calibration, channelcompensation, temperature compensation and low voltage compensation. Of these, temperaturecompensation and low voltage compensation are not needed in replacement of the circuit andchannel compensation is not needed because the transmit power is in GSM specification withenough margin.In power compensation, the channel numbers used in Tx band are;
E-GSM band : 62.
DCS band : 699.
And the target powers in dBm for each power level are;
- 43 -
Table 4-2. Tx targer powers
-Procedure
a) Initialize phone by clicking Initialize button.
b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause youhave to match test equipment’s BCH and TCH ARFCN with this value. For each power level,adjust the DAC value to get target power and click Test button. Then you can see the outputpower displayed on test equipment.
c) Saving updated calibration data into phone by clicking Calib Saving button.
4. SERVICE S/W AND CALIBRATION
Power level GSM DCS
0 29
1 28
2 26
3 24
4 22
5 32 20
6 31 18
7 29 16
8 27 14
9 25 12
10 23 10
11 21 8
12 19 7
13 17 6
14 15 5
15 13 4
16 11
17 9
18 7
19 6
4.2.5 Test JIG Operation
Table 4-3. JIG Power
Table 4-4. JIG DIP Switch
Table 4-5. LED Description
- Operation1) Connect the RS232 Serial Cable between COM port of notebook and MON port of test JIG in
general.
2) Set the Power Supply 4.0V. Also DC adapter may be used.
3) Set the 3rd of DIP SW ON state. In case of DC adapter, set 4th ON state.
4) Press the Phone power key. If the Remote Power On is used, switch the 1st of Dip Switch ON.
4. SERVICE S/W AND CALIBRATION
- 44 -
Description
Power Supply Usually 4.0 V
DC Adaptor 9.5V, 500mA
Switch Number Name Description
Switch 1 RPWRON In ON state, phone is awaked.
Switch 2 HF_DETECT Turn on for AUDIO TEST.
Switch 3 Power Supply Power is provided for phone from Power Supply.
Switch 4 D.C power Power is provided for phone from DC adaptor.
LED Number Name Description
LED 1 POWER Power is provided for Test Jig
LED 2 CHARGER Indicate charging state of the Phone Battery with TravelCharger.
LED 3 UART IRDA Indicate date transfer state through the UART IRDA.
LED 4 UART MODEM Indicate date transfer state through the UART MODEM.
- 45 -
5. DOWNLOAD
5. DOWNLOAD
5.1 Download Setup
5.1.1 Download Equipment
1) Data Kit
2) Desktop or Notebook PC
3) Download Monitor Program
4) The phones mobile phone
+ -
5.2 Download Procedure
5.2.1 General Purpose
This document gives a guideline for upgrading software of the phones using UART port.
5.2.2 Download Environment
In order to download software of the phones, the following working environments should beprepared: the phones Data Link Kit, DK-10G that is connected to COM1 or COM2 serial port in theDesktop or Notebook PC.
The phones Data Kit Download Monitor Program that is copied to Desktop PC or Notebook PC.
Target SW* downloaded to the phones mobile phone.
Note : Target SW* means any necessary software to be downloaded to the mobile phone.
- 46 -
Warning
You must use the Data Link Kit(DK-10G) and UART Download Monitor program that are providedfrom LGE. Otherwise downloading process won’t properly
5. DOWNLOAD
5. DOWNLOAD
- 47 -
5.2.3 Download Procedure
A. Unzip the phones UART Download monitor program(monitor 663.zip) in PC.
B. Execute monitor663.exe. And then select the “Target” Menu shown in Figure 5-1. Then, choose“Connect” in the Target Menu.
Figure 5-1.
C. A table will be displayed as shown in Figure 5-2. Then press the arrow-button and choose acorrect serial port. And press “OK” button.
Figure 5-2.
- 48 -
5. DOWNLOAD
D. As the following window shown in Figure 5-3. is displayed, connect the phones Phone to DataLink Kit, DK-10G and power on the phones. If the connection is succeeded, the following screenwill show the contents as shown in Figure 5-4.
Figure 5-3.
Figure 5-4.
5. DOWNLOAD
- 49 -
E. Click on “Flash” on the top menu and select “Get type” item as shown in Figure 5-4. and select“Erase and Program Appli Only+Boot” item as shown in Figure 5-5.
Figure 5-5.
F. Finally choose the target SW that you want to download. And then you can see the followingwindow in Figure 5-6.
Figure 5-6.
5. DOWNLOAD
- 50 -
G. If the downloading procedure is succeeded, then the following window is shown.
Figure 5-7.
6. TROUBLE SHOOTING
- 51 -
6. TROUBLE SHOOTINGFigure 6-1. shows a measurement set-up.
Figure 6-1. Measurement set-up
6. TROUBLE SHOOTING
- 52 -
6.1 Rx Trouble (EGSM)
6.2 Rx Trouble (DCS)
6. TROUBLE SHOOTING
- 53 -
6. TROUBLE SHOOTING
- 54 -
6.3 Tx Trouble
1111
U200 : CALYPSO(BB Digital Main Chip)
U201 : NAUSICA CS(BB Analog Main Chip)
U601 : PAM (PF08122B)
U604 : RF Main Chip (TRF6150)
U600 : TXVCO (ENFVZ4LO7)
U603 : Antenna S/W(SHS-M090B)
N600 : Directional coupler(LDC15D 190A0007A)
D600 : Shottky Diode(BAT 15-099)
6. TROUBLE SHOOTING
- 55 -
111
6.4 Voice Function TroubleA. Receiver
B. Speaker
6. TROUBLE SHOOTING
- 56 -
C. Microphone
6. TROUBLE SHOOTING
- 57 -
6.5 Display Function TroubleA. LCD
6. TROUBLE SHOOTING
- 58 -
6. TROUBLE SHOOTING
- 59 -
B. Indicator LED
6. TROUBLE SHOOTING
- 60 -
6.6 Other Function TroubleA. Vibrator
6. TROUBLE SHOOTING
- 61 -
B. Charger
7. STAND ALONE TEST AND TEST POINTS
7.1 Testing Set-up
7.1.1 Received RF Level and Checks
This section shows the typical RF levels expected throughout the receiver path. A block diagramshowing the locations of the RF measurement points and levels is shown in Figure 7-3.
Receiver Testing Set-upTo check the receiver the following conditions have to be set:
1. On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm ateither: 947.4 MHz (CH62) when testing the GSM RX path or 1842. 6 MHz (CH699) when testingthe DCS RX path.
2. Set the DC power supply to 4.0 V.
Note: All RF values shown are only intended as a guide figure and may differ from readings takenwith other test equipment and leads. Lead and connector losses should always be taken intoaccount when performing such RF measurements.
Testing ReceiverUsing a suitable high frequency probe measure the RF levels at the relevant points shown in Figure 7-2. and compares your measurements with those shown in the diagram. If there are anymajor difference between the readings taken and those indicated then further investigation of thatparticular point will be required. It will also be necessary to ensure that all the following powersupplies and signals are present which control this part of the receiver circuit:
1. The Control Signal of Antenna switch (see Figure 7-9,10,11 )
2. Vreg 1,2,3 (see Figure 7-7 )
3. 2V85_VCTCXO (see Figure 7-8)
4. 13MHz(see Figure 7-12)
5. CLK, DATA, EN (see Figure 7-13)
6. RX IP, IN, QP, QN (see Figure 7-16,19)
7. Vtune(see Figure 7-17,18)
7. STAND ALONE TEST AND TEST POINTS
- 62 -
7.1.2 Transmitted RF Level and Checks
This section shows the typical RF levels expected throughout the transmitter path. A block diagramshowing the locations of the RF measurement points and levels is shown in Figure 7-5.
Transmitter Testing Set-upTo check the transmitter the following conditions have to be set:
1. Configure the testing equipments as Figure equipment setup.
2. Set the GSM/DCS test equipment to be stand-alone mode (asynchronous mode).
3. Set the BCH and TCH ARFCN ‘62’ for EGSM900 or ‘700’ for DCS1800 on GSM/DCS testequipment.
4. Set the DC power supply 4.0volts.
5. Initialize target on service software.
6. Set TCH and BCH value to be same with GSM/DCS test equipment on service software.
7. Select GSM or DCS mode on service software.
8. Set DAC ‘600’ for EGSM900 or ‘700’ for DCS1800 on service software.
9. Click Test.
Note: All RF values shown are only intended as a guide figure and may differ from readings takenwith other test equipment and leads. Lead and connector losses should always be taken intoaccount when performing such RF measurements.
Testing TransmitterUsing a suitable high frequency probe measure the RF levels at the relevant points shown in Fig. 7-4 and compare your measurements with those shown in the diagram. If there are any majordifference between the readings taken and those indicated then further investigation of thatparticular point will be required. It will also be necessary to ensure that all the following powersupplies and signals are present which control this part of the transmitter circuit:
1. The Control Signal of Antenna Switch(see Figure 7-9, 10, 11)
2. Vreg 1,2,3 (see Figure. 7-7)
3. 2V85_VTCXO (see Figure. 7-8)
4. 13 MHz (see Figure. 7-12)
5. PA_ON, PA_LEVEL, Vapc (see Figure. 7-14)
6. TX IP, IN, QP, QN (see Figure. 7-15)
7. STAND ALONE TEST AND TEST POINTS
- 63 -
7.2 Testing Points
7.2.1 RF components (Component Side)
Figure 7-1. RF components (Component Side).
Table 7-1. RF components
7. STAND ALONE TEST AND TEST POINTS
Reference Reference
U604 RF main chipset U600 Dual RF VCO
U603 Antenna Switch U606 VCTCXO
U601 PAM U602 Balun
N600 Coupler BPF601 GSM RF SAW Filter
U607 NOR Gate BPF600 DCS RF SAW Filter
U629 Inverter SW600 Mobile Switch
U605 LDO D600 Dual Schottky Diode
D601 Varactor Diode D602 Varactor Diode
- 64 -
U604
U600
U601
SW600
N600 D600
D601
U605
U606
U629
D602
U603
U607
BPF600
BPF601
U602
7. STAND ALONE TEST AND TEST POINTS
- 65 -
7.2.2 Test point of Rx Levels
Figure 7-2. Test point of Rx Levels.
1
6
4
3
2
5
2
7. STAND ALONE TEST AND TEST POINTS
- 66 -
GS
M:
CH
.62,
-60
dB
mD
CS
: C
H.6
99, -
60d
Bm
Fig
ure
7-3
. Rec
eive
r R
F L
evel
s
7.2.3 Test point of TX Levels
Figure 7-4. Test point of TX Levels.
7. STAND ALONE TEST AND TEST POINTS
- 67 -
6
12
11
1, 7
2, 8
13 5
4
10
9
3
7. STAND ALONE TEST AND TEST POINTS
- 68 -
GS
M:
Pw
r L
vI 5
, Ch
.62,
-32
dB
mD
CS
: P
wr
LvI
0, C
h.7
00, -
29d
Bm
Fig
ure
7-5
. Tra
nsm
itte
r R
F L
evel
s
7. STAND ALONE TEST AND TEST POINTS
- 69 -
7.2.4 Control signal test points
Figure 7-6. Control signal test points
VC1
VC2
VAPC
LB_SW
HB_SW
TXRX_SW
PA_LEVEL PA_ON CLK, DATA, EN
Vtune
Vtune
I / Q
Regulator 2V85
13MHz
Figure 7-7. 2V85_Vreg 1, 2, 3 Output
Figure 7-8. 2V85_VCTCXO Supply Voltage
7. STAND ALONE TEST AND TEST POINTS
- 70 -
7. STAND ALONE TEST AND TEST POINTS
- 71 -
Figure 7-9. Antenna S/W control voltage in EGSM_TX
Figure 7-10. Antenna S/W control voltage in DCS_TX
8. DISASSEMBLY INSTRUCTION1. Remove the battery and screws.
Figure 8-1. Removing Screws
8. DISASSEMBLY INSTRUCTION
- 77 -
1
2
8. DISASSEMBLY INSTRUCTION
- 78 -
2. Use a thin plastic sheet to slide and open the gap between front and rear covers, and detachthem carefully with both hands.
3. Then carefully remove the rear cover from the hooks as shown in Figure 8-2.
Figure 8-2. Disassembling covers
4. Unlock the PCB and remove other components as shown in Figure 8-3.
Figure 8-3. Unlocking and removing the PCB
2
1
1
2
8. DISASSEMBLY INSTRUCTION
- 79 -
5. Firstly, insert one side of FPCB carefully into the slot.Then place the PCB under the hook 1 first and push the other end of PCB under the hook 2
Figure 8-4. Assembly of PCB with the cover
2
1
8. DISASSEMBLY INSTRUCTION
- 80 -
6. Remove the antenna and use a sharp awl to push away the antenna-bushing.
Figure 8-5. Removing antenna-bushing
1
2
3
8. DISASSEMBLY INSTRUCTION
- 81 -
7. Use a tweezers to remove the battery locker.
Figure 8-6. Removing battery locker
8. When removing the side button from the main front, please see the insert-nut next to the buttonand carefully remove it.
Figure 8-7. Removing a side button
1
12
3
Insert-nut
8. DISASSEMBLY INSTRUCTION
- 82 -
9. Push away the hinge to remove the folder.
Figure 8-8. Removing Folder
10. Remove the hinge, and detach screw caps by using a pin.
Figure 8-9. Removing hinge and screws
8. DISASSEMBLY INSTRUCTION
- 83 -
11. Use a thin plastic sheet to slide and open the gap between the folders.Then detach them carefully with both hands.
Figure 8-10. Disassembling Folders
12. Finally detach the rest components as shown in Figure 8-11.
Figure 8-11. Disassembly of the rest components
8. DISASSEMBLY INSTRUCTION
- 84 -
9. BLOCK DIAGRAM
- 85 -
9. BLOCK DIAGRAM
9.1 Main BoardThe phones is made up of two PCBs. In lower part of the folder, there is a main board. And in theupper part of the folder, there is a FPCB. Below you can see the block diagram of both PCBs.
No. Location No. Part No. Description QTY Specification Color Sevice RemarkM1 MWAF00 MWAF0005701 WINDOW,LCD(SUB) 1 G7020 G7028 Common use (ALL BRAND) YM2 ACGJ00 ACGJ0016302 COVER ASSY,FOLDER(UPPER) 1 Cobalt Blue Y
ACGJ0016301 COVER ASSY,FOLDER(UPPER) 1 Metal Silver YACGJ0016303 COVER ASSY,FOLDER(UPPER) 1 Red Y
<Mechanic components>Level Location No. Part No. Description QTY Specification Service Color Remark
3 ABGA00 — BUTTON ASSY,DIAL 1 Please refer to the 'Exploded View' Y M203 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Cobalt Blue M353 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Metal Silver3 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Red4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M114 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Red5 MBHY00 — BUMPER 2 Please refer to the 'Exploded View' Y M144 MCCH00 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Cobalt Blue M134 MCCH01 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Metal Silver4 MCCH02 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Red5 MCJH00 MCJH0004203 COVER,FOLDER(LOWER) 1 N5 MDAF00 MDAF0000702 DECO,FOLDER(LOWER) 1 N Cobalt Blue5 MDAF00 MDAF0000703 DECO,FOLDER(LOWER) 1 N Metal Silver5 MDAF00 MDAF0000704 DECO,FOLDER(LOWER) 1 N Red5 MDAH01 MDAH0000201 DECO,RECEIVER 1 G7000 N5 MFBB00 MFBB0001901 FILTER,RECEIVER 1 G7000 N5 MPBG00 MPBG0004801 PAD,LCD 1 G7000 N5 MPBJ00 MPBJ0003201 PAD,MOTOR 1 G7000 N5 MTAA00 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Pearl White5 MTAA00 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Metal Silver5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N Red5 MTAA01 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Pearl White5 MTAA01 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Metal Silver5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N Red5 MTAD00 MTAD0010301 TAPE,WINDOW 1 NITTO No.5000NS (t=0.16) N4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M24 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Red5 ADBY00 ADBY0001202 DECO ASSY 1 Y Cobalt Blue5 ADBY00 ADBY0001201 DECO ASSY 1 PROJECTION ASSY (RUSSIA) Y Metal Silver5 ADBY00 ADBY0001203 DECO ASSY 1 Y Red6 MDAE00 MDAE0009802 DECO,FOLDER(UPPER) 1 N Cobalt Blue6 MDAE00 MDAE0009801 DECO,FOLDER(UPPER) 1 PROJECTION N Metal Silver6 MDAE00 MDAE0009803 DECO,FOLDER(UPPER) 1 N Red6 MFBC00 MFBC0001901 FILTER,SPEAKER 1 G7010,G7020 COMMON USE N6 MTAA00 MTAA0016601 TAPE,DECO 1 UPPER DECO(LEATHER ASSY) N5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Cobalt Blue M345 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Metal Silver5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Red5 MCJJ00 MCJJ0010202 COVER,FOLDER(UPPER) 1 N Cobalt Blue5 MCJJ00 MCJJ0010201 COVER,FOLDER(UPPER) 1 G7028 (EASTCOM BRAND) N Metal Silver5 MCJJ00 MCJJ0010203 COVER,FOLDER(UPPER) 1 N Red5 MDAE00 MDAE0008403 DECO,FOLDER(UPPER) 1 W7020 LG-COLOR DISPLAY (RUSSIA) N5 MDAY00 MDAY0004201 DECO 1 G7020 G7028 Common use (SUS) N5 MIAA00 MIAA0006701 INDICATOR,LED 1 G7020 G7028 COMMON USE N5 MICA00 MICA0001201 INSERT,FRONT 2 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N5 MMAA00 MMAA0000901 MAGNET,SWITCH 1 G7000 12x2x0.7t N5 MPBQ00 MPBQ0005501 PAD,LCD(SUB) 1 G7010 & G7020 SUB LCD PAD N5 MPBZ00 MPBZ0017401 PAD 1 G7010, G7020 INDICATOR PAD (Common use) N5 MPFD00 MPFD0001001 PLATE,GROUND 1 G7010 N5 MTAA00 MTAA0015501 TAPE,DECO 1 G7020 folder uppper (Electro Forming) ) N5 MTAA01 MTAA0015601 TAPE,DECO 1 G7020 FOLDER UPPER SUS (#615 OR#668) N5 MTAE00 — TAPE,WINDOW(SUB) 1 Please refer to the 'Exploded View' Y M335 MTAZ00 MTAZ0005401 TAPE 1 G7000 MAGNET SWITCH N
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12. EXPLODED VIEW & REPLACEMENT PART LIST
Level Location No. Part No. Description QTY Specification Service Color Remark4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Cobalt Blue M174 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Metal Silver4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Red5 ABGC00 — BUTTON ASSY,SIDE 1 Please refer to the 'Exploded View' Y M165 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Cobalt Blue M195 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Pearl White5 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Red5 MCJK00 MCJK0006602 COVER,FRONT 1 N Cobalt Blue5 MCJK00 MCJK0006603 COVER,FRONT 1 N Metal Silver5 MCJK00 MCJK0006604 COVER,FRONT 1 N Red5 MDAC00 — DECO,SIDE 2 Please refer to the 'Exploded View' Y M185 MDAG00 MDAG0000902 DECO,FRONT 1 N Cobalt Blue5 MDAG00 MDAG0000903 DECO,FRONT 1 N Metal Silver5 MDAG00 MDAG0000904 DECO,FRONT 1 N Red5 MICA00 MICA0001201 INSERT,FRONT 4 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N5 MPBH00 MPBH0001101 PAD,MIKE 1 G7000 FRONT N5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N4 GMZZ00 — SCREW MACHINE 2 Please refer to the 'Exploded View' Y M124 MGAD00 MGAD0006001 GASKET,SHIELD FORM 2 G7000 10x5x1.5t N 4 MHFD00 — HINGE,FOLDER 1 Please refer to the 'Exploded View' Y M34 MTAB00 MTAB0005101 TAPE,PROTECTION 1 G7000 FOLDER UPPER PROTECTION TAPE Y4 MTAB01 MTAB0005001 TAPE,PROTECTION 1 G7000 MAIN LCD WINDOW PROTECTION TAPE N4 MTAB02 MTAB0005201 TAPE,PROTECTION 1 G7000 sublcd window tape N4 MWAC00 — WINDOW,LCD 1 Please refer to the 'Exploded View' Y M154 MWAF00 — WINDOW,LCD(SUB) 1 Please refer to the 'Exploded View' Y M14 SACY00 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M95 SACY00 — RECEIVER 1 Please refer to the 'Exploded View' Y M65 SBCL00 — BATTERY,CELL,LITHIUM 1 Please refer to the 'Exploded View' Y M85 SJMY00 — VIBRATOR,MOTOR 1 Please refer to the 'Exploded View' Y M75 SPCY00 SPCY0007304 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 Receiver N5 SUSY00 — SPEAKER 1 Please refer to the 'Exploded View' Y M54 SACY01 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M105 ENBY00 ENBY0011001 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (SOCKET) N5 ENBY01 ENBY0010901 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER) N5 SPCY00 SPCY0007202 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 LCD N4 SPCY00 SPCY0013401 PCB,FLEXIBLE 1 FR-1 ,0.07 mm,DOUBLE ,GND FPCB N4 SVLM00 — LCD MODULE 1 Please refer to the 'Exploded View' Y M43 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Cobalt Blue M273 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Metal Silver3 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Red4 ACFY00 — CONTACT ASSY,ANTENNA 1 Please refer to the 'Exploded View' Y M295 MBIA00 MBIA0000301 BUSHING,ANTENNA 1 G7000 (KS-D-5101 C3603B ), N3 MCCF00 MCCF0002002 CAP,MOBILE SWITCH 1 Please refer to the 'Exploded View' Y Cobalt Blue M303 MCCF01 MCCF0002003 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Metal Silver3 MCCF02 MCCF0002005 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Red5 MCIA00 MCIA0003701 CONTACT,ANTENNA 1 G7000 N4 MCJN00 MCJN0005402 COVER,REAR 1 N Cobalt Blue4 MCJN00 MCJN0005403 COVER,REAR 1 N Metal Silver4 MCJN00 MCJN0005404 COVER,REAR 1 N Red4 MGAD00 MGAD0011901 GASKET,SHIELD FORM 1 (2.8X7.5X0.3t) N4 MGAD01 MGAD0012001 GASKET,SHIELD FORM 1 (6.0X6.0X3.0t) N4 MIDZ00 MIDZ0008001 INSULATOR 1 G7000 BB INSULATOR N4 MIDZ01 MIDZ0008101 INSULATOR 1 G7000 RF INSULATOR N4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Cobalt Blue M25
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Level Location No. Part No. Description QTY Specification Service Color Remark4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Metal Silver4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Red4 MPBH00 MPBH0001201 PAD,MIKE 1 G7000 BACK N4 MSAZ00 MSAZ0007603 SHEET 1 FDK Company(PE72 11.0*11.0*0.25t) N4 MSAZ01 MSAZ0007602 SHEET 1 FDK Company (PE72 4.2*11.8 0.25t) N4 MSDB00 MSDB0001701 SPRING,COIL 1 G7000 N4 MWAZ00 — WINDOW 1 Please refer to the 'Exploded View' Y M263 ADCA00 — DOME ASSY,METAL 1 Please refer to the 'Exploded View' Y M213 GMZZ00 — SCREW MACHINE 4 Please refer to the 'Exploded View' Y M313 MLAK00 MLAK0006301 LABEL,MODEL 1 LG (30.5x21.54-1R) Y3 SAKY00 — PCB ASSY,SIDEKEY 1 Please refer to the 'Exploded View' Y M223 SUMY00 — MICROPHONE 1 Please refer to the 'Exploded View' Y M242 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Cobalt Blue M322 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Metal Silver2 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Red2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Cobalt Blue M282 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Metal Silver2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Red