Lecture 4.2 and Lecture 6 : Introduction to Electronics

EE110300 Practice of Electrical and Computer Engineering

Lecture 4.2 and Lecture 6 : Introduction to Electronics

For undergraduate students ofthe college of EECS, NTHU電機工程系張慶元教授

n Electronic SystemTime domain analysisFrequency domain analysisEquivalent circuit

n Electronic DevicesPassive components

Active componentsSensors

n Integrated CircuitsSemiconductor properties

Fabrication technologiesSimulation tools

History Product

Source: Kang’s “CMOS Digital Integrated Circuits Analysis and Design, 2nd Ed. 2000, McGraw-Hall

IC Industry Structure in Taiwan

資料來源 : 工研院電子所 (March., 2001)

晶粒測試及切割

長晶晶圓切割

設計

導線架

測試封裝製造光罩

晶圓

光罩設計電路設計封裝

化學品

CAD

CAE

材料

設備儀器資金人力資源

服務支援

貨運

海關

科學園區•••

附註：數字表示公司家數，+表示2000年增加廠商家數

•140 (+13)

•4(-1)

•16 (+1)

•48(+6)

•37 (+4)

•8(+5)

•13(+2)

•20(+0)

成品測試

Source: Spectrum 99.7

n Enables system-level integration (SLI)n Drives system-on-chip (SOC) development

IC Fabrication Roadmap

Shrinking Geometries (<0.18u) AllowMore Functionality On-Chip

uP FPGA

MPEGASIC

ATM

ROM

ROM

SW SW

SWSW

PCB

SOC

nDesign shifts from ASIC/board to systemnIP from multiple sourcesnSoftware a key part of

system nMixed hardware and

software, logic and memory, digital and analognVerification and testing

uP Core SRAM

ROM

ATMMPEG

ROM

FPGA

Glue Logic

A/D Block

Source: Cadence

Inputsignal

Signalprocessing

Calculation,Analysis,

Judgment,Decision making

Signalprocessing

outputsignal

EM Wave

Light

Pressure

Chemical element

Displacement

Key board

Frequency domain

Time domain

ADCRotation

Temperature

DAC

Power amplification

Load

Control motion

Time domain processing

n Small signal amplification ( 放大 )

n Rectifying ( 整流）

n Clipper/Limiter （截波/ 限波）

t OR

Waveform （波形）

time

t

t

t

t

t

Frequency domain processing

n Sinusoidal signal

n Periodic signal

n Non-periodic signal

frequencyf1

n Sinusoidal signal

n Periodic signal

n Non-periodic signal

n Sinusoidal signal

n Periodic signal

n Non-periodic signalfrequencyf1 2 f1 3f1

Line spectrum

frequency

Continuous spectrum

（頻譜）

t

t

t

Frequency domain processing

n Filter （濾波器）Low pass filter （低通）High pass filter （高通）Band pass filter （帶通）Band reject filter （帶拒）

n Mixer （混波器）

fo (LPF) fo (HPF)

f1 f2 (BPF) f1 f2 (BRF)

f f

f f

f1

f2

f1+f2, f1-f2, 2f1-f2, ----

( nf1-mf2 )BPF Desired

frequency

Mixer

Equivalent circuits

n All circuits are said equivalent if their input and output I-V characteristics are identical. (The relationship between I1(t), I2(t), V1(t), and V2(t).)

n Complex circuits may be replaced by equivalent circuits with simple structures.

I1(t) I2(t)+

V1(t)_

+V2(t)_

Electronic Devices

Passive components

Active componentsSensors

Passive Components

n Components that absorbs energyResistors, R Inductors, LCapacitors, CTransformer

Active Components

n Devices that are capable of delivering energy¨ Batteries¨ Diodes¨ Transistors:

n BJT, Bipolar junction transistorsn FET, Field effect transistors

¨ JFET, Junction field effect transistors¨ MOSFET, Metal-oxide-semiconductor field

effect transistors

Sensors

MeasurandsForm of signal

Thermal Temperature, heat.

Radiation Gamma rays, X-rays, visible, infrared.

Mechanical Displacement, velocity, force, torque, pressure

Magnetic Magnetic field, flux, magnetic permeability.

Chemical Humidity, pH level, odors, toxics, pollutants.

Biological Sugars, proteins, hormones.

Electrical Charge, resistance, capacitance, frequency.

Diode Circuit

n Ideal¨ If VD>0 : ‘On’short¨ IF VD<0: ‘OFF’Open

n Symbol and Models

n Half-wave Rectifier

Rf

+VD -

VfVi Vo

Device Modeling

n A real device may contain many parasitic components,in order to accurately analyze a circuit, usually, a device is presentedby a equivalent circuit. This process is called device modeling.

≡i b

βi bB

C

E

B

E

C

i b

Component Connection

n The circuit properties depend on what components are used and how they are connected. Same components connected in different manner yields different circuit properties.

Input output

Input output

Integrated Circuits

n Most of the electronic systems contains more than one integrated-circuit sub-system.

n Advantages of integration include: miniaturization, improved reliability, increased speed, cost reduction, etc..

n According to application, ICs are categorized into linear (analog) IC, digital IC, and mixed mode IC.

n IC fabrication technology includes: bipolar technology, complementary MOS (CMOS) technology, and BiCMOS technology.

Semiconductor properties

n Semiconductors have electrical conductivity in between metals and insulators. This conductivity can be changed over orders of magnitude by changes in temperature, incident light, and dopant.

n Elemental semiconductor: Si and Ge.Compound semiconductor

Binary: GaAs, InP, InSb, ------.Ternary: AlxGa1-xAs, InAsyP1-y, ------.Quaternary: InxGa1-xAsyP1-y,

Fabrication technologies

n Semiconductor process technologies includes:thermal oxidationdiffusionrapid thermal processingion implantationchemical vapor deposition (CVD)photolithographyetchingmetallizationetc.

Fabrication(Inverter)


Vin Vout

Vin Vout

0 11 0

Symbol

Truth Table

Process (1)


Process (2)

Self-Align Doping


field oxidemetal-poly insulatorthin oxide

Process (3)


GND

Process (4)


Simulation tools

n Process simulationn Device property simulationn Device parameters extractionn Circuit simulationn Layout tools

Gate Level - 邏輯設計


x = (AB+BC+CA)sum = ((A+B+C) x + ABC)

Transistor level -數位電路分析與設計 (電子三)

x

x


Layout level - 積體電路設計導論


31

Simulationx = (AB+BC+CA)sum = ((A+B+C) x + ABC)

Lecture 4.2 and Lecture 6 : Introduction to Electronics

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