TM Americas 1.855.426.6766 • EMEA & ROW +44 (0) 1603 788967 • China +86 21 5459 1970 • [email protected] • www.micross.com April 25, 2019 • Revision 2.0 Micross is the global one-source provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, our extensive hi-reliability capabilities serve the Aerospace & Defense, Space, Medical and Industrial markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. Authorized by over 25 major semiconductor manufacturers with access to thousands of different part types, Micross offers unparalleled in-house knowledge coupled with the flexibility to adapt our suppliers’ standard products to a customer’s specific device or system requirement, even the most challenging. Micross Americas Britney Wolfe Product Line Manager Global Die +1 407.296.5618 [email protected] Jeffrey Weiss US Director of Sales +1 407.296.5658 [email protected] Micross EMEA & ROW Richard Gibbs Managing Director +44 1603 788967 ext: 290 [email protected] Joanne Johnson Product Line Manager +44 1603 788967 ext: 200 [email protected] Micross China and India Eric Zhang Country Manager, China +86 21 5459 1970 [email protected] Anand Panneer Country Manager, India +91 7760 990 545 [email protected] Leading Global Source for Bare Die, Wafer & Value-Added Services Wafer Processing Chip Scale Packaging Die Banking Lot Qualifications Flip Chip Technologies Kitting Engineering Solutions Wafer Probing