This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
LDO Voltage Regulator -Adjustable Output, LoadDump Protection60 V, 100 mA
LM2931, NCV2931 SeriesThe LM2931 series consists of positive fixed and adjustable output
voltage regulators that are specifically designed to maintain properregulation with an extremely low input−to−output voltage differential.These devices are capable of supplying output currents in excess of100 mA and feature a low bias current of 0.4 mA at 10 mA output.
Designed primarily to survive in the harsh automotive environment,these devices will protect all external load circuitry from input faultconditions caused by reverse battery connection, two battery jumpstarts, and excessive line transients during load dump. This series alsoincludes internal current limiting, thermal shutdown, and additionally,is able to withstand temporary power−up with mirror−image insertion.
Due to the low dropout voltage and bias current specifications, theLM2931 series is ideally suited for battery powered industrial andconsumer equipment where an extension of useful battery life isdesirable. The ‘C’ suffix adjustable output regulators feature an outputinhibit pin which is extremely useful in microprocessor−based systems.
Features• Input−to−Output Voltage Differential of < 0.6 V @ 100 mA
• Output Current in Excess of 100 mA
• Low Bias Current
• 60 V Load Dump Protection
• −50 V Reverse Transient Protection
• Internal Current Limiting with Thermal Shutdown
• Temporary Mirror−Image Protection
• Ideally Suited for Battery Powered Equipment
• Economical 5−Lead TO−220 Package with Two Optional Leadforms
• Available in Surface Mount SOP−8, D2PAK and DPAK Packages
• High Accuracy (±2.5%) Reference (LM2931AC) Available
• NCV Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements; AEC−Q100Qualified and PPAP Capable
• Pb−Free Packages are Available
Applications• Battery Powered Consumer Products
• Hand−held Instruments
• Camcorders and Cameras
TO−92Z SUFFIX
CASE 29−10
FIXED OUTPUT VOLTAGE
Pin 1. Output2. Ground3. Input
TO−220T SUFFIX
CASE 221AB
Pin 1. Input2. Ground3. Output
DPAKDT SUFFIXCASE 369C
D2PAKD2T SUFFIXCASE 936
TO−220TH SUFFIXCASE 314A
ADJUSTABLE OUTPUT VOLTAGE
Pin 1. Adjust2. Output
Inhibit3. Ground4. Input5. Output
TO−220TV SUFFIXCASE 314B
TO−220T SUFFIX
CASE 314D
D2PAKD2T SUFFIXCASE 936A
See detailed ordering and shipping information in the packagedimensions section on page 12 of this data sheet.
ORDERING INFORMATION
See general marking and heatsink information in the devicemarking section on page 15 of this data sheet.
Transient Reverse Polarity Input Voltage −VI(�) −50− Vpk
1.0% Duty Cycle, � ≤ 100 ms
Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Class 2, JESD22 A114−C Machine Model (MM) Class A, JESD22 A115−A Charged Device Model (CDM), JESD22 C101−C
Operating Ambient Temperature Range TA −40 to +125 °C
Operating Die Junction Temperature TJ +150 °C
Storage Temperature Range Tstg −65 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be affected.1. DPAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance.2. SOP−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance
variation versus pad size.3. D2PAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance.4. NCV rated devices are subjected to and meet the AECQ−100 quality standards.
Output Voltage with Reverse Polarity Input(Vin = −15 V)
−VO −0.3 0 − −0.3 0 − V
5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.6. NCV devices are qualified for automotive use.
7. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.8. The reference voltage on the adjustable device is measured from the output to the adjust pin across R1.
Figure 13. Line Regulation Figure 14. Load Regulation
Figure 15. Reference Voltage versus Output Voltage Figure 16. Output Inhibit−Thresholds versus Output Voltage
APPLICATIONS INFORMATION
The LM2931 series regulators are designed with manyprotection features making them essentially blow−outproof. These features include internal current limiting,thermal shutdown, overvoltage and reverse polarity inputprotection, and the capability to withstand temporarypower−up with mirror−image insertion. Typical applicationcircuits for the fixed and adjustable output device are shownin Figures 17 and 18.
The input bypass capacitor Cin is recommended if theregulator is located an appreciable distance (≥ 4″) from thesupply input filter. This will reduce the circuit’s sensitivityto the input line impedance at high frequencies.
This regulator series is not internally compensated andthus requires an external output capacitor for stability. Thecapacitance value required is dependent upon the loadcurrent, output voltage for the adjustable regulator, and thetype of capacitor selected. The least stable condition isencountered at maximum load current and minimum outputvoltage. Figure 22 shows that for operation in the “Stable”region, under the conditions specified, the magnitude of theoutput capacitor impedance |ZO| must not exceed 0.4 �. This
limit must be observed over the entire operating temperaturerange of the regulator circuit.
With economical electrolytic capacitors, cold temperatureoperation can pose a serious stability problem. As theelectrolyte freezes, around −30°C, the capacitance willdecrease and the equivalent series resistance (ESR) willincrease drastically, causing the circuit to oscillate. Qualityelectrolytic capacitors with extended temperature ranges of−40° to +85°C and −55° to +105°C are readily available.Solid tantalum capacitors may be a better choice if small sizeis a requirement, however, the maximum ⏐ZO⏐ limit overtemperature must be observed.
Note that in the stable region, the output noise voltage islinearly proportional to ⏐ZO⏐. In effect, CO dictates the highfrequency roll−off point of the circuit. Operation in the areatitled “Marginally Stable” will cause the output of theregulator to exhibit random bursts of oscillation that decayin an under−damped fashion. Continuous oscillation occurswhen operating in the area titled “Unstable”. It is suggestedthat oven testing of the entire circuit be performed withmaximum load, minimum input voltage, and minimumambient temperature.
Figure 19. (5.0 A) Low DifferentialVoltage Regulator
Figure 20. Current Boost Regulator withShort Circuit Projection
Figure 21. Constant Intensity Lamp Flasher
Vin
Input OutputVout
COIBGND
Cin0.1
LM2931-5.0FixedOutput
Switch Position 1 = Output “On", 2 = Output “Off"
LM2931CAdjustable
Output
Vin
Cin0.1
Vout
CO
OutputInput
51 k
1
2OutputInhibit Adjust
GND
IAdj
R1
R2IB
The LM2931 series can be current boosted with a PNP transistor. TheD45VH7, on a heatsink, will provide an output current of 5.0 A with an inputto output voltage differential of approximately 1.0 V. Resistor R inconjunction with the VBE of the PNP determines when the pass transistorbegins conducting. This circuit is not short circuit proof.
Input≥ 6.0 V
D45VH7
5.0 V @ 5.0 A
Output100
+100
+
68
LM2931-5.0
LM2931C
Input6.4 V to 30 V
2.0 k
8.2 k
100
+
CM#345
100+ 33 k
6.2 V
fosc = 2.2 Hz0
22.5�k� ��R1�R2
R1� �� R2Vout� �� Vref��1� ��
R2R1�� �� IAdj�R2
R
The circuit of Figure 19 can be modified to provide supply protection againstshort circuits by adding the current sense resistor RSC and an additional PNPtransistor. The current sensing PNP must be capable of handling the shortcircuit current of the LM2931. Safe operating area of both transistors must beconsidered under worst case conditions.
Figure 26. 3−Pin and 5−Pin D2PAKThermal Resistance and Maximum PowerDissipation versus P.C.B. Copper Length
Figure 27. SOT−223 Thermal Resistance and MaximumPower Dissipation vs. P.C.B. Copper Length
DEFINITIONS
Dropout Voltage − The input/output voltage differentialat which the regulator output no longer maintains regulationagainst further reductions in input voltage. Measured whenthe output decreases 100 mV from nominal value at 14 Vinput, dropout voltage is affected by junction temperatureand load current.
Line Regulation − The change in output voltage for achange in the input voltage. The measurement is made underconditions of low dissipation or by using pulse techniquessuch that the average chip temperature is not significantlyaffected.
Load Regulation − The change in output voltage for achange in load current at constant chip temperature.
Maximum Power Dissipation − The maximum totaldevice dissipation for which the regulator will operatewithin specifications.
Bias Current − That part of the input current that is notdelivered to the load.
Output Noise Voltage − The rms AC voltage at theoutput, with constant load and no input ripple, measuredover a specified frequency range.
Long−Term Stability − Output voltage stability underaccelerated life test conditions with the maximum ratedvoltage listed in the devices electrical characteristics andmaximum power dissipation.
LM2931AD−5.0R2 5.0 V �3.8% SOIC−8 2500 / Tape & Reel
LM2931AD−5.0R2G5.0 V �3.8%
SOIC−8(Pb−Free)
2500 / Tape & Reel
LM2931ADT−5.0 5.0 V �3.8% DPAK 75 Units / Rail
LM2931ADT−5.0G5.0 V �3.8%
DPAK(Pb−Free)
75 Units / Rail
LM2931ADT−5.0RK 5.0 V �3.8% DPAK 2500 / VacPk Reel
LM2931ADT−5.0RKG5.0 V �3.8%
DPAK(Pb−Free)
2500 / VacPk Reel
LM2931AD2T−5.0 5.0 V �3.8% D2PAK 50 Units / Rail
LM2931AD2T−5.0G5.0 V �3.8%
D2PAK(Pb−Free)
50 Units / Rail
LM2931AD2T−5.0R4 5.0 V �3.8% D2PAK 800 / VacPk Reel
LM2931AD2T−5R4G5.0 V �3.8%
D2PAK(Pb−Free)
800 / VacPk Reel
LM2931AT−5.0 5.0 V �3.8% TO−220 50 Units / Rail
LM2931AT−5.0G5.0 V �3.8%
TO−220(Pb−Free)
50 Units / Rail
LM2931AZ−5.0 5.0 V �3.8% TO−92 2000 / Inner Bag
LM2931AZ−5.0G5.0 V �3.8%
TO−92(Pb−Free)
2000 / Inner Bag
LM2931AZ−5.0RA 5.0 V �3.8% TO−92 2000 / Tape & Reel
LM2931AZ−5.0RAG5.0 V �3.8%
TO−92(Pb−Free)
2000 / Tape & Reel
LM2931AZ−5.0RP 5.0 V �3.8% TO−92 2000 / Ammo Pack
LM2931AZ−5.0RPG5.0 V �3.8%
TO−92(Pb−Free)
2000 / Ammo Pack
LM2931D−5.0 5.0 V �5.0% SOIC−8 98 Units / Rail
LM2931D−5.0G5.0 V �5.0%
SOIC−8(Pb−Free)
98 Units / Rail
LM2931D−5.0R2 5.0 V �5.0% SOIC−8 2500 / Tape & Reel
LM2931D−5.0R2G5.0 V �5.0%
SOIC−8(Pb−Free)
2500 / Tape & Reel
LM2931D2T−5.0 5.0 V �5.0% D2PAK 50 Units / Rail
LM2931D2T−5.0G5.0 V �5.0%
D2PAK(Pb−Free)
50 Units / Rail
LM2931D2T−5.0R4 5.0 V �5.0% D2PAK 800 / VacPk Reel
LM2931D2T−5.0R4G5.0 V �5.0%
D2PAK(Pb−Free)
800 / VacPk Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe-cifications Brochure, BRD8011/D.
*NCV2931: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Siteand Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
LM2931ACTV Adjustable �2.0% TO−220 50 Units / Rail
LM2931ACTVGAdjustable �2.0%
TO−220(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe-cifications Brochure, BRD8011/D.
*NCV2931: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Siteand Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
NCV2931D−5.0R2* 5.0 V �5.0% SOIC−8 2500 / Tape & Reel
NCV2931D−5.0R2G*5.0 V �5.0%
SOIC−8(Pb−Free)
2500 / Tape & Reel
NCV2931ADT−5.0RK* 5.0 V �3.8% DPAK 2500 / Tape & Reel
NCV2931ADT5.0RKG*5.0 V �3.8%
DPAK(Pb−Free)
2500 / Tape & Reel
NCV2931DT−5.0RK* 5.0 V �5.0% DPAK 2500 / Tape & Reel
NCV2931DT−5.0RKG*5.0 V �5.0%
DPAK(Pb−Free)
2500 / Tape & Reel
NCV2931ACD2TR4G* Adjustable �2.5%D2PAK
(Pb−Free) 800 / VacPk Reel
NCV2931D2T−5.0R4* 5.0 V �5.0% D2PAK 800 / VacPk Reel
NCV2931D2T5.0R4G*5.0 V �5.0%
D2PAK(Pb−Free)
800 / VacPk Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe-cifications Brochure, BRD8011/D.
*NCV2931: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Siteand Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98AON23085DDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98AON52857EDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98AON52857EDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
XXXX = Specific Device CodeA = Assembly LocationL = Wafer LotY = YearW = Work Week� = Pb−Free Package
*This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “�”, mayor may not be present. Some products maynot follow the Generic Marking.
GENERICMARKING DIAGRAM*
XXXXXXXXXXALYW�
�
(Note: Microdot may be in either location)
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98AON52857EDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98ASB42218BDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
A = Assembly LocationWL = Wafer LotY = YearWW = Work WeekG = Pb−Free Package
GENERICMARKING DIAGRAM*
*This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “ �”,may or may not be present.
XXXXXXXXXXXAWLYWWG
1
−Q−
1 2 3 4 5
U
K
DG
A
B1
5 PL
JH
L
EC
MQM0.356 (0.014) T
SEATINGPLANE−T−
DIM MIN MAX MIN MAXMILLIMETERSINCHES
A 0.572 0.613 14.529 15.570B 0.390 0.415 9.906 10.541
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.DIMENSION D INCLUDING PROTRUSION SHALLNOT EXCEED 10.92 (0.043) MAXIMUM.
B1 0.375 0.415 9.525 10.541
BDETAIL A-A
B1
B
DETAIL A−A
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98ASB42220BDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
A = Assembly LocationY = YearW = Work WeekXXXXX = Specific Device Code� = Pb−Free Package
GENERICMARKING DIAGRAM*
AYWXXXXX�
�
(Note: Microdot may be in either location)
*This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “�”, mayor may not be present. Some products maynot follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98ASH70634ADOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
*This information is generic. Please referto device data sheet for actual partmarking.
*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H 0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.114 REF 2.90 REFL2 0.020 BSC 0.51 BSC
A1
HDETAIL A
SEATINGPLANE
A
B
C
L1L
H
L2 GAUGEPLANE
DETAIL AROTATED 90 CW�
eBOTTOM VIEW
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
ALTERNATECONSTRUCTIONS
NOTE 7
Z
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98AON10527DDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
XXXXX = Specific Device CodeA = Assembly LocationL = Wafer LotY = YearW = Work Week� = Pb−Free Package
GENERICMARKING DIAGRAM*
1
8
XXXXXALYWX
1
8
IC Discrete
XXXXXXAYWW
�1
8
1.520.060
7.00.275
0.60.024
1.2700.050
4.00.155
� mminches
�SCALE 6:1
*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
Discrete
XXXXXXAYWW
1
8
(Pb−Free)
XXXXXALYWX
�1
8
IC(Pb−Free)
XXXXXX = Specific Device CodeA = Assembly LocationY = YearWW = Work Week� = Pb−Free Package
*This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “�”, mayor may not be present. Some products maynot follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98ASB42564BDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98ASB42564BDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
F 0.051 REF 1.295 REFG 0.100 BSC 2.540 BSCH 0.539 0.579 13.691 14.707J 0.125 MAX 3.175 MAXK 0.050 REF 1.270 REFL 0.000 0.010 0.000 0.254M 0.088 0.102 2.235 2.591N 0.018 0.026 0.457 0.660P 0.058 0.078 1.473 1.981RS 0.116 REF 2.946 REFU 0.200 MIN 5.080 MINV 0.250 MIN 6.350 MIN
�
A
1 2 3
K
F
B
J
S
H
DM0.010 (0.254) T
EOPTIONALCHAMFER
*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.380
5.080DIMENSIONS: MILLIMETERSPITCH
2X
16.155
1.0162X
10.490
3.504
XXXXXXGALYWW
GENERICMARKING DIAGRAM*
XXXXXX = Specific Device CodeA = Assembly LocationL = Wafer LotY = YearWW = Work WeekG = Pb−Free Package
*This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “ �”,may or may not be present.
BOTTOM VIEWOPTIONAL CONSTRUCTIONS
TOP VIEW
SIDE VIEWDUAL GAUGE
BOTTOM VIEW
L
T
P
R DETAIL C
SEATINGPLANE
2XG
N M
CONSTRUCTION
D
C
DETAIL C
EOPTIONALCHAMFER
SIDE VIEWSINGLE GAUGECONSTRUCTION
S
C
DETAIL C
TT
D
E 0.018 0.026 0.457 0.660S
8� 0� 8�
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98ASH01005ADOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
*This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “�”, mayor may not be present. Some products maynot follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98ASH01006ADOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patentcoverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/orspecifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customerapplication by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are notdesigned, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classificationin a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorizedapplication, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if suchclaim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. Thisliterature is subject to all applicable copyright laws and is not for resale in any manner.