DVD / CD PLAYER STOP OPEN/ CLOSE PLAY SKIP/ SCAN SKIP/ SCAN LCD TV SERVICE MANUAL CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS : ML-041D MODEL : 27LZ5RV-ZC website:http://biz.LGservice.com e-mail:http://www.LGEservice.com/techsup.html
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DVD / CD PLAYERSTOP
OPEN/
CLOSE
PLAY SKIP
/
SCANSKIP
/
SCAN
LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument'sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
- 4 -
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating thecircuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
- 5 -
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
- 6 -
1. Application rangeThis specification is applied to ML-041D chassis.
2. Requirement for TestTesting for standard of each part must be followed in belowcondition.
(1) Temperature: 25°C ± 5°C(2) Humidity: 65% ± 10%(3) Power: Standard input voltage (AC 100-240V, 50/60Hz)(4) Measurement must be performed after heat-run more than
30min.(5) Adjusting standard for this chassis is followed a special
standard.
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
3.General Specification(TV)
No Item Specification Remark
1. Video input applicable system PAL-D/K, B/G, I, NTSC-M, SECAM
NTSC 4.43
2. Receivable Broadcasting System 1) PAL/SECAM BG (ZE/TE)
2) PAL/SECAM DK EU/Non-EU
3) PAL I/I (PAL Market)
4) SECAM L/L'
5) NTSC M
6) PAL-N/M 6),7) South America Market
7) NTSC M 7) Except South America NTSC Market (RM)
3. RF Input Channel VHF : E2 ~ E12 PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S41
L/L' : B, C, D FRANCE
VHF : 2~13 NTSC
UHF : 14~69
CATV : 1~125
VHF Low : 1 ~ M10 JAPAN
VHF High : 4~S22
UHF : S23~62
4. Input Voltage AC 100 ~ 240 V/50Hz, 60Hz
5. Market Worldwide
6. Picture Size 603.22 mm 27 inch
7. Tuning System FVS 100 program PAL, 200 PR.(Option)
FS NTSC
8. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : 85 %
9. Storage Environment 3) Temp : -20 ~ 60 deg
4) Humidity : 85 %
10. Display LCD Module CMO
- 7 -
4.General Specification
NO Item Specification Unit Remark
1 Panel 27" TFT WXGA LCD
2 Frequency range H : 31 ~ 61Khz DVI-I input
V : 56 ~ 75Hz
3 Control Function 1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
5) Reset
4 Comoponent Jack 1 : Y Middle east
3 : Pb / NTSC Area
5 : Pr
7 : Line1 Ready
9 : LINE2
11: LINE3
13: Line3 Ready
D4 Jack 2 : Y GND JAPAN Only
(525i,525p,750p,1125i) 4 : Pb GND
6 : Pr GND
8 : LINE1
10:Line2 Ready
12:SWITCH GND
14: SWITCH
5 H/V-Sync Video Power consumption LED
Power ON ON/ON Active ≤ max 170W W Green
Stand by OFF/ON OFF ≤ 3.0W W Red
DPMS Mode ON/OFF OFF ≤ typ. 35W W Green
Power off - - - W *.
6 LCD Module Type CMO 637.55 x 379.8 x 40.7 mm (H) x (V) x (D)
Size
Pixel Pitch CMO 0.1455 x 0.4365 x RGB mm
Pixel Format 1366 horiz. By 768 vert. Pixels
RGB strip arrangement
Coating Hard coating(3H), Anti-glare
treatment of the front polarizer,
Back Light CMO CCFL
- 8 -
5.Optical Feature(LCD Module)
No Item Specification Remark
CMO
1 Viewing Angle R/L, U/D 176,176
<CR 10>
2 Luminance Luminance (cd/m2) 550 Typical
Variation 1.3 MAX / MIN
3 Contrast Ratio 1000 All white / All black
4 CIE Color Coordinates White WX Typ. 0.284 CMO
WY Typ. 0.295
RED Xr Typ. TBD
Yr Typ. TBD
Green Xg Typ. TBD
Yg Typ. TBD
Blue Xb Typ. TBD
Yb Typ. TBD
6.Feature and Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Teletext
REMOCON
AV input
S-AV input
Component input
PERI TV connector
PERI TV connector
RGB input
RS-232
Discrete IR
D-sub audio input
2 Carrier stereo
NICAM stereo
2 Carrier dual
NICAM dual
DW(Double Window) mode
MW(Multi Window) mode
Film mode
Noise reduction
Progressive scan
Motion detection
SRS WOW
Swivel Speaker
EZ-pip
Local Key
Local key(DVD)
TOP, FLOF
NEC code
1
1
2
Half SCART: 1
Full SCART: 1
1
1
1
1
BG,DK
BG,I,LL’
BG,DK
BG,I,LL’
X
X
O
X
O
O
X
X
X
Pr+/-, vol+/-, ok, menu, tv/av, power
OPEN/CLOSE, PALY, STOP, SKIP/SCEN
Item Specification RemarkNo.
Top(option)
PAL/NTSC
Rear(TC/MC)
Side
Side, Rear(TC/MC)
Rear(ZC)
Rear(ZC)
DVI
D-Sub 9 pin(MC)
(MC)
Stereo
- 9 -
7. Component Video Input (Y, PB, PR)
8. PC INPUT Mode table[Timming chart of Receivable Mode]
No Specification Proposed
Resolution H-freq(kHz) V-freq(Hz)
1. 640x480 15.73 60 SDTV, DVD 480i
2. 640x480 15.63 59.94 SDTV, DVD 480i
3. 720x576 15.625 50.00 SDTV, DVD 625 Line
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
DVI-PC, Analog RGB, Digital RGB
1 640x480 31.469 59.94 25.17 VESA(VGA)
2 800x600 37.879 60.31 40.00 VESA(SVGA)
3 1024x768 48.363 60.00 65.00 VESA(XGA)
4 1280x768 47.693 60.00 80.125 VESA(WXGA)
5 1360x768 47.649 59.936 84.625 VESA(WXGA)
6 1920x1080 33.75 60.00 86.375 HDCP DVI Digital 1080i(MC only)
7 1280x720 45.00 60.00 74.375 HDCP DVI Digital 720p (MC only)
- 10 -
9. Customer Menu Setup [shipped condition: PAL]
No Item Condition Remark
1 Power Off
2 Volume Level 30
3 Main Picture Input TV
4 Main Last Channel Pr 01
5 Mute Off
6 ARC 16 : 9
7 Station Auto Program
Manual Program
Program Edit
Favorite Program None
8 Picture PSM Dynamic
Dynamic Contrast 80
Brightness 40
Colour 70
Sharpness 70
Tint 0 NTSC OPTION
9 Sound SSM Flat
AVL Off
Balance 0
10 Special Input TV
Child Lock Off
Auto sleep Off
Language English(Area Management)
11 PC H-Position
V-PositionVariable by each mode
Clock
Phase
Auto Configue
- 11 -
ADJUSTMENT INSTRUCTION
1. Application ObjectThis instruction is for the application to the LCD TV.
2. Designation2.1 The adjustment is according to the order which is
designated and which must be followed, according to theplan which can be changed only on agreeing.
2.2 Power Adjustment : Free Voltage2.3 Magnetic Field Condition: Nil.2.4 Input signal Unit : Product specification standard2.5 Reserve after operation : Above 2 hours2.6 Adjustment equipments : Pattern Generator( MSPG925F),
3.2.2 Adjust data save* Save the adjusted data to the EEPROM with defaultvalue
3.2.3 Adjust OK
3.2.4 Screen Adjustment Instruction FormsCMD1 CMD2 SetID(0) Value a. CMD1,CMD2 : Instructions operated by Monitorb. SetID L 0h Set always 0 in Adjustmentc. VALUE : Adjustment Value
3.3 PC signal Gain/Offset Adjustment 3.3.1 Adjustment Preparation
- Execution of RF no signal during Heat Run over30min
- Pattern generator signal is connected to the DVI-IJack of LCD TV.
3.3.1 Auto Gain/Offset Adjustment .- To use Pattern Generator(MSPG-925FS), Apply
Model 37, Patten 19 XGA(1024 X 768)60Hz, Halfbalck and Half white signal (Don't apply 16 graysignal)
- Press IN-START Key by using the RemoteController(SVC) , after converting to Adjustment-Mode, press VOL+ Key consecutively in Auto-GainMenu.
- After adjustment is complete, pressing enter key,stores and completes the process.
* Note) : PC Adjustment must be completed before autoadjustment.
3.4 Video signal Gain/Offset Adjustment(Auto adjustment)- Execution of White Pattern during Heat Run over 30min- Connect to the LCD TV AV1 Scart input terminal with
Patten Generator(MSPG-925FS)- Convert INPUT MODE to Video&Confirm whether PSMMode is Standard
- Connect RS-232C Communication Cable to the AutoAdjustment Equipment and SET's upgrade Port
- Check weather color-coordinates (x:0.283, y:0.298,±0.005) is operated by using CA-110 equipment
- If color-coordinates is not in Spec, adjust color-coordinates(x:0.283, y:0.298, ±0.005)by adjustingRed Offset, Blue Offset
- All adjustment takes color-coordinates with based onG, changing R and B. If it is not adjusted, adjust withfixed B, changing G and R.
3.5 Component signal Gain/Offset Adjustment(Auto adjustment)- Execution of RF no signal during Heat Run over 30min- Connect to the LCD TV Component1 terminal with Patten
Generator(MSPG-925FS)- Convert INPUT MODE to Component1.& Confirm whether
PSM Mode is Standard- Connect RS-232C Communication Cable to the AutoAdjustment Equipment and SET's upgrade Port
using Patten Generator(MSPG925FS)- Check whether color-coordinates (x:0.280, y:0.280,
±0.005) is operated by using CA-110 equipment- If color-coordinates is not in Spec, adjust color-
coordinates(x:0.280, y : 0.280, ±0.005) by adjusting RedOffset, Blue Offset
3.5.2 White Balance Adjustment - Apply full White (Model : 210, pattern : 47) signal by
using Patten Generator(MSPG925FS)- Check whether color-coordinates (x:0.280, y:0.280,
±0.005) is operated by using CA-110 equipment- If color-coordinates is not in Spec, adjust color-
coordinates (x:0.283, y:0.298, ±0.005)by adjusting RedGain, Blue Gain
- All adjustment takes color-coordinates with based on R,changing G and B If it is not adjusted, adjust with fixedG, changing R and R.
ai - 0 - 00
ak - 0 - 00
- 12 -
3.6 EDID (The Extended Display Identification Data) - Connect D-Sub to DVI-I Cable to DVI-I Jack.- Confirm the pc display by inputting the Analog signal.- After displayed, input the Analog EDID data.- Connect DVI D Cable to DVI Jack.- Confirm the pc display by inputting the Digital signal.- After displayed, input the Digital EDID data.
3.6.1 EDID DATA<DDC DATA Analog Set>
< DDC DATA Digital Set>
3.7 HDCP (High-Bandwidth Digital Contents Protection) Setting3.7.1 When transmitting HD video source of HD STB through
DVI(Digital Visual Interface), HDCP function is to executeDisplay & copy protection for securing contents security.
3.7.2 Confirm whether HDCP function is operated properly byconnecting DVI Cable, after storing HDCP Key value onEEPROM(AT24C16)[address 0x4EE] (Refer to WorkingOrder for Detailed work content ).
* Reference : HDCP adjustment is not use. We are planningHDCP adjustment from NTSC.
To turn the TV on or offTo turn the TV on automatically if the power is supplied to the TV. (Use thePOWER key to deactivate): It should be deactivated when delivered.To activate the mute function.To check TV screen image easily.To check TV screen sound easilyTo select size of the main screen (Normal, Spectacle, Wide or Zoom)Switch to closed caption broadcastingTo toggle on/off the teletext modeTo select an external input for the TV screenTo start turbo soundTo start turbo pictureTo enter adjustment mode when manufacturing the TV sets.To adjust the screen voltage (automatic): In-start mute Adjust AV(Enter into W/B adjustment mode)W/B adjustment (automatic):After adjusting the screen W/B adjustment Exit two times (Adjustment completed)To enter into the adjustment mode. To adjust horizontal line and sub-brightness.To select the multiple sound mode (Mono, Stereo or Foreign language)To release the adjustment modeTo easily adjust the screen according to surrounding brightnessTo easily adjust sound according to the program typeTo check component inputTo check the front AVTo move channel up/down or to select a function displayed on the screen.To adjust the volume or accurately control a specific function.To set a specific function or complete setting.To move the channel down in the PIP screen.To use as a red key in the teletext modeTo move the channel in the PIP screenTo use as a green key in the teletext modeTo switch between the main and sub screensTo use as a yellow key in the teletext modeTo select the input status in the PIP screenTo use as a blue key in the teletext modeTo set a function that will automatically adjust screen status to matchthe surrounding brightness so natural color can be displayed.To select the functions such as video, voice, function or channel.To set the delivery condition status after manufacturing the TV set.To halt the main screen in the normal mode, or the sub screen at the PIP screen.Used as a hold key in the teletext mode (Page updating is stopped.)Displays the teletext time in the normal modeEnables to select the sub code in the teletext modeUsed as the size key in the PIP screen in the normal modeUsed as the size key in the teletext modeUsed as the index key in the teletext mode (Top index will bedisplayed if it is the top text.)To select the position of the PIP screen in the normal modeUsed as the update key in the teletext mode (Text will bedisplayed if the current page is updated.)Used as Mode in the teletext modeTo select the simultaneous screenTo adjust screen tiltTo manually select the channel.
Shortcut keys
Shortcut keys
Shortcut keys
Use the AVkey to enterthe screenW/Badjustmentmode.
Shortcut keys
Shortcut keys
Shortcut keys
- 15 -
TROUBLESHOOTING
No power (LED indicator off)
No Power (LED indicator off)
Change IC1300, IC4 or IC6
Change LED Assy
Check 24V or 12V of Power B/D
Check Output of IC1300, IC4 or IC6
Check LED Assy
Check P101 Connector
Faill
Faill
Change L3, L1300Check Output of L3, L1300 Faill
Faill
Pass
Pass
Pass
:[A]Process
- 16 -
No Raster
Check LED Status on display unit
Check the input/Output of IC901
Check L900,L901L902,L903
Check inverterConnector or inverter
Check input source cable and jack
Repeat A PROCESSFaill
Change L900,L901,L902,L903Faill
Change IC901Faill
Change inverterconnector or inverterFaill
Change panel linkcable or moduleFaill
Change moduleFaill
Check panel link Cable or module
Pass
Pass
Pass
Pass
:[B]Process
- 17 -
No Raster on Component signal
ChangeQ310,Q315,Q316
Check the signal ofQ310,Q315,Q316
Repeat[A] Process
Check the input/output of IC800
Check the input/ output of IC500
Check input source cable and jack
Faill
Re-soldering or Change the defect part Check IC800Faill
Re-soldering or Change the defect part Check IC500,X500,IC501Faill
Pass
Pass
Pass
Check the input/ output of IC901
Re-soldering or Change the defect part Check X900Faill
Pass
Check the input/ output of IC600
Re-soldering or Change the defect part Check IC600Faill
Pass
Pass
:[C]Process
- 18 -
No Raster on AV Signa(Scart1.Scart2,S-Video)
No Raster on TV(RF) signal
ChangeQ317,Q318,Q308,Q313
Check the signal of Q317,Q318,Q308,Q313
Repeat[A] Process
Check the output ofTU1000
Faill
Faill Faill
Check 5V,33V of TU1000, Re-soldering of Change the defect part
Pass
Pass
:[C]Process
- 19 -
No Raster on DVD Signal
Check the signal of R1211,R1212,R1213
Repeat[A] Process
FaillCheck P1200,P1202 or DVD Cable
Pass
Pass
:[C]Process
- 20 -
No Sound(RF,SIDE AV) No Sound(Scart1/2,DVD,PC)
Check the speaker wire
Change source inputCheck the
input source Faill
Pass
Re-soldering or Change the defect part Check X11
Check the input/output of IC1 Faill
Pass
Re-soldering or Change the defect part Check IC403,X601
Re-soldering or Change the defect part Check IC400
Check the input/ output of IC401 Faill
Pass
Check the input/ output of IC400 Faill
Pass
Change the speakerCheck the speakerFaill
Pass
BLOCK DIAGRAM(26LZ5RV-ZC)
- 21 -
BLOCK DIAGRAM(26LZ5RV-TC)
- 22 -
Tun
er
TU
1000
Tu
ner
T
U10
00
GM
5221
IC90
1G
M52
21IC
901
DV
ID
VI
IF+
,-
PC
SIDE_Comp.
AU
DIO
VY
Pb
Pr
LR
LVDS 30 pin
PO
WE
R
FL
I230
0IC
500
FL
I230
0IC
500
SIDE_L,R
VC
TI
IC1
VC
TI
IC1
AN
1586
5AIC
800
AN
1586
5AIC
800
RA
MIC
501
RA
MIC
501
MS
T98
83
IC60
0M
ST
9883
IC
600
S-VHS
RO
MIC
900
RO
MIC
900
MS
P44
10K
IC40
1M
SP
4410
KIC
401
DVD_POWER & Y,Pb,Pr
RL
VC
TI
soun
d_ L
R
Comp 1_L,R
PC_L,R
AV_L,R
DV
D_
LR
R,G
,B
DV
D_Y
,Pb,
Pr
TP
A30
08A
MP
TP
A30
08A
MP
SIDE_Y,Pb,Pr(Comp2)
Comp1_Y,Pb,Pr
PC
_R,G
,B &
H/V
syn
c
R,G
,B
R/8
G/8
B/8
AD
C_H
/V_s
ync
R,G,B
FLI_H/V_sync
R,G
,B
H/V
_syn
c
DVI
LR
BLOCK DIAGRAM DESCRIPTION
- 23 -
1. Video Controller Unit & Display Data Conversion UnitThe video controller unit receives the video signals inputted through the tuner, AV port, and converts them intoan ITU656 signal through the microcomputer (VCTI) combined with the video decoder that integrates variousfunctions in one chip.Either the analog RGB(FLI2300) signal or PC RGB signal is selected by the switching IC and inputted to ascaler (GM2221), which is sent to the LCD module after being modified to an RGB signal through the integratedLVDS Cable.VCTi is the main microprocessor that handles video signal processing and sound signal processing.It also manages the RF signals received from the tuner.The scaler can control timing to fit into the LCD panel, and can also control the size and position of theinputsignal.
2. Power Supply UnitThe power supply unit provides 24V, 12V and 5V DC power to the mainboard.The PWM Step-Up DC/DC Converter circuit is used to generate the 33V used for the tuner.Supplied 24V power is descended by the 13.5V step-down DDC. 13.5V provides source to sound amplifier IC.24V power is also used to generate 5V and 3.3V power through the Step-Down DC/DC Converter and supplied12V. 5V power is converted to 3.3V and 1.8V power through the regulator, which in turn supplies electrical power forICs such as VCTI and scaler.