The IX-6655 is optimized for high repetition rate Laser Lift-Off (LLO) process that is indepen- dent of die size, with additional capability for multi-purpose UV laser micromachining. The system combines a Class-1 workstation with an externally mounted laser, select grade homog- enizer optics to provide uniform beam size adjustable to 500 x 500µm, dual beam profilom- etry, pulse-to-pulse energy monitor with data logging and wafer map. The IX-6655 is optimized for demanding 24/7 high volume production applications. Featuring optional automation with cassette load/unload ports, robotics, wafer pre-aligner, and machine vision the system is capable of multiple wafer sizes up to 200mm. The laser system provides high throughput with the lowest Cost Of Ownership (COO) resulting from extended lifetimes and cleaning intervals. Laser Liſt-Off System IX-6655 System Features LLO Benefits Opmized for high throughput LLO (Laser Liſt-Off) applicaons. Homogenous beam size adjustable to 500 x 500µm. 248nm or 193nm laser opons available Dual Magnificaon, vision system with sub-micron part alignment High accuracy: linear air bearing stages provide accuracies to <3µm Die-size independent Increased Process Window Reduced Cost Of Ownership Fully Auotmated Opons +1 (603) 518-3200 [email protected] www.ipgphotonics.com Legal noces: All product informaon is believed to be accurate and is subject to change without noce. Informaon contained herein shall legally bind IPG only if it is specifically incorporated into the terms and condions of a sales agreement. Some specific combinaons of opons may not be available. The user assumes all risks and liability whatsoever in connecon with use of a product or its applicaon. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics Corporaon. © 2014 IPG Photonics Corporaon. All rights reserved. +1 (603) 518-3200 [email protected] www.ipgphotonics.com Legal noces: All product informaon is believed to be accurate and is subject to change without noce. Informaon contained herein shall legally bind IPG only if it is specifically incorporated into the terms and condions of a sales agreement. Some specific combinaons of opons may not be available. The user assumes all risks and liability whatsoever in connecon with use of a product or its applicaon. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics Corporaon. © 2014 IPG Photonics Corporaon. All rights reserved. Laser Liſt-Off System IX-6655 Moon Control Electronics Up to 12-axes of Servo or Step Motor Control, integrated into a single interface for all motorized components as well as the laser fire mechanism Part Handling X-Y Stage Specificaons Travel: Up to 200 mm diameter processing area Oponal Stages: Compable up to 300mm wafer processing Resoluon: 0.1 µm Accuracy: <3 µm over 125 mm x 125 mm area Repeatability: <1 µm (bidireconal) Z-axis Specificaons Travel: 10 mm Resoluon: 0.25 µm Accuracy: 5.0 µm Repeatability: 1.5 µm (bidireconal) Theta-axis Specificaons Travel: ±175 ° Resoluon: 3.6 µrad Accuracy: 300 µrad overall. 25 µrad/per ° Repeatabiility: ±5.0 µrad Programmable Rectangular Variable Aperture Enabling connuously adjustable size of rectangular shaped beam. Standard Openining: 0-15mm Vision System and Alignment Dual Camera MicroTech Vision System with 8.3 and 0.12 µm/pixel process and inspecon cameras Programmable Illuminaon Programmable lighng intensity control for automated opmizaon of imaging and alignment Oponal Equipment Automated Cassee Load/Unload System Wafer Pre-aligner Features Vision System Database Connecvity Soſtware Laser Calibraon Power Meter/Beam Stop Debris Management System Frame and Enclosure Fully enclosed Class 1 laser system, heavy duty weldment frame with integrated beam delivery system and control electronics in a 1.7 m x 2 m footprint with an externally mounted laser (included in foot print). Beam Delivery System All Granite Beam Delivery Support Structure; Vibraon isolang mounng plaorm for wafer stages and beam delivery opcs; Siffness and large thermal mass of granite structure prevent changes in beam delivery system alignment over me; Pnuemac, 2 posion laser beam stop; Precision opc mounts for stability and ease of adjustment; select grade UV Homogenizer opcs. System Specificaon IX-6655 Laser Lift-Off System with Automation Sapphire Picker Dual Beam Profilometry On-Target Power Meter Pulse Energy Monitor Motorized Mask Changer Lathe Stage Oponal Features