La ricerca in Alcatel-Lucent Italia e le sfide del futuro · La ricerca in Alcatel-Lucent Italia e le sfide del futuro ... 1641SM 1660SM 1678MCC 1850TSS 1a Gen.
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� TLC markets is accelerating evolutions and requires a strong innovation capacity (product architecture, technology, throughput)
� Product life cycle is decreasing faster & faster:�To sustain competitiveness in benefit/costs�To maintain technology leadership in front of competition
� Prestigious internal and external acknowledgments and awards. For example:
� Last family product 1850 TSS1850 TSS has been acknowledge best product in last two years. It received also Bell Labs Award in 2007
� Alberto Lometti of Alcatel-Lucent Italy has become “Bell Labs Fellow this year. Iit is the highest honour assigned by Bell Labs for individual contribution for TLC technology innovation
Innovation in ALU Italy has international acknowledgmentsInnovation in ALU Italy has international acknowledgments
Innovation in functionality:� System innovation (P2P Multiplexers to high capacity XC, from single technology
SDH to Multi Service Node (SDH, ATM, Ethernet, WDM integrated)� Electronic Integration (ASIC, FPGA)� Standard drivers to move SDH intrinsic high QoS, OAM & Protection to packet (T-
MPLS leader in ITU now migrating to IETF with relevant editorship in MPLS-TP
Innovation in Technology:� Optical Technologies:
– from 155Mbps to 40Gbps (new electronic technologies and materials (GaAs, SiGe,InP,) .. and 100Gbps is on the way
– New modulation formats (from NRZ to multi-level signals, phase modulation, adaptive modulation)
– From SDH to Ethernet– Optical fibre spectrum utilization (WDM system from 200GHz grid to
50GHz�80@40Gbps is a reasonable target), from C-band to L-band– Enhanced FECs (various patents registered) – Reconfigurable Optics (tuneable lasers, ROADM..)
– Synchronous streams (PDH, SDH, OTN) and Asynchronous stream (Ethernet) heterogeneous signal wrapping (SDH, OTN, Ethernet),
– Complex ASICs and FPGA (for FEC, Bit Error rate monitoring, fault management, channels switching)
– Packet management (x10 complexity vs synchronous CBR streams)
– Reduce footprint & increase performances (new devices with 90 & 65nm CMOS technology)
– Solutions for very high power consumption & dissipation (new material to reduce thermal resistance, heat pipes, Ball Grid Array
– New power distribution architecture & devices
� Backplane design:– Connector evolutions: From simple Ohmic interconnection to complex shielded pairs
– I/O buffers evolved from pure current sources to sophisticated analogue and digital processing elements (tuneable Pre-emphasis and equalization, mullti-level signals
– From 38Mbps in late ’80’s to 3Gbps per connection (and 6Gbps is coming), up to 80/160Gbps per slot
– The new challenge: optical backplanes with low cost/high performance optics.
� Reduce the number of boards and product family concept to reduce inventory costs
� NM for Element and Network Layer management to save Opex
� The new challenge:– Photonic Integrated Circuits for cost-effective, high port density and higher capacity
optical communications systems
– “green” equipment that a the end of their life can be ecologically dismissed and without hazardous substances
– Lower power consumption (back to “old days” 300W per shelf without forced cooling)
To know more innovation in Optics, ref to To know more innovation in Optics, ref to Special Issue of USA MagazineSpecial Issue of USA Magazine““FiberFiber and Integrated Opticsand Integrated Optics”” on Optical Communications in Italyon Optical Communications in Italy
Market drives for steadily cost per bit drop:� new optical components and equipment architecture are key for Operator sustainable
investmentsVery high Broadband Access (>100Mbps) requires new generation Optical equipments:
� key technology innovations to reduce foot-print, provide scalable solutions, Photopic & Electronic Integration, lower power consumptions
� Flexible&low cost Optical components (e.g. PIC’s) & Carrier Class packet (MPLS-TP) integration with multi-vendor Network Management integration
Core network requires x10 performances:� new 100G line rates with LH non-regenerated span (>1000Km), low cost optical
backplanesKeep National Optics attractiveness: � Optical innovation requires investment synergies beyond single company. National
photopic coordination of Research Centers, Universities, Component vendor and System Vendor is a must for National competitiveness in TLC. PHORIT initiative is a good example to coordinate R&D (e.g. for new materials, common foundries, reduced overlapping in basic research) and motivate public/private investments
� TLC public investments and financial support (e-g. “Decreto MiSE” and “Industria2015”-including ICT- are good signals to maintain the competitiveness levels as in others countries (e.g., Korea, Japan, Germany, France) where ICT is a primary country target