L293D H Bridge

L293, L293DQUADRUPLE HALF-H DRIVERS

SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004

1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Featuring Unitrode L293 and L293DProducts Now From Texas Instruments

Wide Supply-Voltage Range: 4.5 V to 36 V

Separate Input-Logic Supply

Internal ESD Protection

Thermal Shutdown

High-Noise-Immunity Inputs

Functionally Similar to SGS L293 andSGS L293D

Output Current 1 A Per Channel(600 mA for L293D)

Peak Output Current 2 A Per Channel(1.2 A for L293D)

Output Clamp Diodes for InductiveTransient Suppression (L293D)

description/ordering information

The L293 and L293D are quadruple high-currenthalf-H drivers. The L293 is designed to providebidirectional drive currents of up to 1 A at voltagesfrom 4.5 V to 36 V. The L293D is designed toprovide bidirectional drive currents of up to600-mA at voltages from 4.5 V to 36 V. Bothdevices are designed to drive inductive loads suchas relays, solenoids, dc and bipolar steppingmotors, as well as other high-current/high-voltageloads in positive-supply applications.

All inputs are TTL compatible. Each output is acomplete totem-pole drive circuit, with aDarlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are activeand in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs areoff and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge)reversible drive suitable for solenoid or motor applications.

ORDERING INFORMATION

TA PACKAGE† ORDERABLEPART NUMBER

TOP-SIDEMARKING

HSOP (DWP) Tube of 20 L293DWP L293DWP

0°C to 70°CPDIP (N) Tube of 25 L293N L293N

0°C to 70°C

PDIP (NE)Tube of 25 L293NE L293NE

PDIP (NE)Tube of 25 L293DNE L293DNE

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.

Copyright 2004, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

HEAT SINK ANDGROUND

HEAT SINK ANDGROUND

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1,2EN1A1Y

2Y2A

VCC2

VCC1

4A4Y

3Y3A3,4EN

L293 . . . N OR NE PACKAGEL293D . . . NE PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

1,2EN1A1YNCNCNC

NCNC2Y2A

VCC2

VCC1

4A4YNCNCNC

NCNC3Y3A3,4EN

L293 . . . DWP PACKAGE(TOP VIEW)

HEAT SINK ANDGROUND

HEAT SINK ANDGROUND



2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description/ordering information (continued)

On the L293, external high-speed output clamp diodes should be used for inductive transient suppression.

A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation.

The L293and L293D are characterized for operation from 0°C to 70°C.

block diagram

10

3

4

5

6

7

8 9

10

11

12

13

14

15

161

210

1

10

2

4

3

M

M

M

10

10

10

VCC2

VCC1

NOTE: Output diodes are internal in L293D.

FUNCTION TABLE(each driver)

INPUTS† OUTPUTA EN

OUTPUTY

H H H

L H L

X L Z

H = high level, L = low level, X = irrelevant,Z = high impedance (off)† In the thermal shutdown mode, the output is

in the high-impedance state, regardless ofthe input levels.




logic diagram

ÁÁÁÁÁÁÁÁÁÁ

ÁÁÁÁÁÁ

ÁÁÁÁ

2

1

7

10

9

15

3

6

11

14

1A

1,2EN

2A

3A

3,4EN

4A

1Y

2Y

3Y

4Y

schematics of inputs and outputs (L293)

Input

VCC2

Output

GND

TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUT

VCC1

CurrentSource

GND




schematics of inputs and outputs (L293D)

Input

VCC2

Output

GND

TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUT

VCC1

CurrentSource

GND

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage, VCC1 (see Note 1) 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output supply voltage, VCC2 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output voltage range, VO −3 V to VCC2 + 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peak output current, IO (nonrepetitive, t ≤ 5 ms): L293 ±2 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peak output current, IO (nonrepetitive, t ≤ 100 µs): L293D ±1.2 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous output current, IO: L293 ±1 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous output current, IO: L293D ±600 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Notes 2 and 3): DWP package TBD°C/W. . . . . . . . . . . . . . . . . . . . . . .

N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . NE package TBD°C/W. . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltage values are with respect to the network ground terminal.2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable

ambient temperature is PD = (TJ(max) − TA)/JA. Operating at the absolute maximum TJ of 150°C can affect reliability.3. The package thermal impedance is calculated in accordance with JESD 51-7.




recommended operating conditions

MIN MAX UNIT

Supply voltageVCC1 4.5 7

VSupply voltageVCC2 VCC1 36

V

V High level input voltageVCC1 ≤ 7 V 2.3 VCC1 V

VIH High-level input voltageVCC1 ≥ 7 V 2.3 7 V

VIL Low-level output voltage −0.3† 1.5 V

TA Operating free-air temperature 0 70 °C† The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels.

electrical characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°CPARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOH High-level output voltageL293: IOH = −1 AL293D: IOH = −0.6 A

VCC2 − 1.8 VCC2 − 1.4 V

VOL Low-level output voltageL293: IOL = 1 AL293D: IOL = 0.6 A

1.2 1.8 V

VOKH High-level output clamp voltage L293D: IOK = −0.6 A VCC2 + 1.3 V

VOKL Low-level output clamp voltage L293D: IOK = 0.6 A 1.3 V

I High level input currentA

V 7 V0.2 100

AIIH High-level input currentEN

VI = 7 V0.2 10

µA

I Low level input currentA

V 0−3 −10

AIIL Low-level input currentEN

VI = 0−2 −100

µA

All outputs at high level 13 22

ICC1 Logic supply current IO = 0 All outputs at low level 35 60 mAICC1 Logic supply current IO 0

All outputs at high impedance 8 24

mA

All outputs at high level 14 24

ICC2 Output supply current IO = 0 All outputs at low level 2 6 mACC2 p pp y O

All outputs at high impedance 2 4

switching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C

PARAMETER TEST CONDITIONSL293NE, L293DNE

UNITPARAMETER TEST CONDITIONSMIN TYP MAX

UNIT

tPLH Propagation delay time, low-to-high-level output from A input 800 ns

tPHL Propagation delay time, high-to-low-level output from A inputC = 30 pF See Figure 1

400 ns

tTLH Transition time, low-to-high-level outputCL = 30 pF, See Figure 1

300 ns

tTHL Transition time, high-to-low-level output 300 ns

switching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C

PARAMETER TEST CONDITIONS

L293DWP, L293NL293DN UNITPARAMETER TEST CONDITIONS

MIN TYP MAXUNIT

tPLH Propagation delay time, low-to-high-level output from A input 750 ns

tPHL Propagation delay time, high-to-low-level output from A inputC = 30 pF See Figure 1

200 ns

tTLH Transition time, low-to-high-level outputCL = 30 pF, See Figure 1

100 ns

tTHL Transition time, high-to-low-level output 350 ns




PARAMETER MEASUREMENT INFORMATION

Output

CL = 30 pF(see Note A)

VCC1

Input

3 V

TEST CIRCUIT

tf tr3 V

0

tPHL

VOH

tTHL tTLH

VOLTAGE WAVEFORMS

tPLH

Output

Input

VOL

tw

NOTES: A. CL includes probe and jig capacitance.B. The pulse generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω.

PulseGenerator

(see Note B)

5 V 24 V

VCC2

A

EN

Y90% 90%

50%

10%

50%

10%

90% 90%

50%

10%

50%

10%

Figure 1. Test Circuit and Voltage Waveforms




APPLICATION INFORMATION

24 V5 V

10 kΩ

VCC1VCC2

Control A

Control B

4, 5, 12, 13

GND

ThermalShutdown

Motor

16 8

3

6

11

14

4Y

3Y

2Y

1Y

1,2EN

1A

2A

3,4EN

3A

4A

15

10

9

7

2

1

Figure 2. Two-Phase Motor Driver (L293)





24 V5 V

10 kΩ

VCC1 VCC2

16 8

1,2EN1

1A2

2A

7

3,4EN

9

3A10

4A15

Control A

Control B

4, 5, 12, 13

GND

ThermalShutdown

Motor

1Y

3

2Y

6

3Y

11

4Y

14

Figure 3. Two-Phase Motor Driver (L293D)





EN 3A M1 4A M2

H H Fast motor stop H Run

H L Run L Fast motor stop

L XFree-running motorstop

XFree-running motorstop

L = low, H = high, X = don’t care

EN 1A 2A FUNCTION

H L H Turn right

H H L Turn left

H L L Fast motor stop

H H H Fast motor stop

L X X Fast motor stop

L = low, H = high, X = don’t care

VCC2 SES5001

1/2 L293

4, 5, 12, 13

10

SES5001

VCC1

EN

1511 14

16

9

M2

M1

3A 4A

8

Figure 4. DC Motor Controls(connections to ground and to

supply voltage)

GND

2 × SES5001

1/2 L293

4, 5, 12, 13

367

8

1

216

VCC2

2 × SES5001

2A 1A

VCC1

EN

M

Figure 5. Bidirectional DC Motor Control

GND





3

4

5

6

7

8

1

2

9

10

11

12

13

14

15

16

+

+

+

+

D7

D8 D4

D3

L2 IL2

C1

D5 D1

D6 D2

VCC1L293

IL1/IL2 = 300 mA

0.22 µF

VCC2L1 IL1

D1−D8 = SES5001

Figure 6. Bipolar Stepping-Motor Control

mounting instructions

The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printedcircuit board or to an external heat sink.

Figure 9 shows the maximum package power PTOT and the θJA as a function of the side of two equal squarecopper areas having a thickness of 35 µm (see Figure 7). In addition, an external heat sink can be used (seeFigure 8).

During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12seconds.

The external heatsink or printed circuit copper area must be connected to electrical ground.





Copper Area 35-µm Thickness

Printed Circuit Board

Figure 7. Example of Printed Circuit Board Copper Area (used as heat sink)

11.9 mm

17.0 mm

38.0 mm

Figure 8. External Heat Sink Mounting Example(θJA = 25°C/W)





3

1

0

2

0 10 20

P

4

MAXIMUM POWER AND JUNCTION vs

THERMAL RESISTANCE

30

TOT

− P

ow

er D

issi

pat

ion

− W

60

20

0

40

80

θ JA

− T

her

mal

Res

ista

nce

−°C

/W

40

Side − mm

Figure 9

θJA

PTOT (TA = 70°C)

50

5

3

1

0

2

−50 0 50

4

MAXIMUM POWER DISSIPATIONvs

AMBIENT TEMPERATURE

100

TA − Ambient Temperature − °C

With Infinite Heat Sink

Free Air

Heat Sink With θJA = 25°C/W

Figure 10

150

PTO

T−

Po

wer

Dis

sip

atio

n −

W

PACKAGE OPTION ADDENDUM

www.ti.com 26-Jan-2014

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

L293DNE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE

L293DNEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293DNE

L293DWP OBSOLETE SOIC DW 28 TBD Call TI Call TI 0 to 70 L293DWP

L293DWPG4 OBSOLETE SOIC DW 28 TBD Call TI Call TI 0 to 70

L293DWPTR OBSOLETESO PowerPAD DWP 28 TBD Call TI Call TI 0 to 70

L293N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 L293N

L293NE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293NE

L293NEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 L293NE

L293NG4 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

http://www.ti.com/product/L293D?CMP=conv-poasamples#samplebuy

http://www.ti.com/product/L293D?CMP=conv-poasamples#samplebuy

http://www.ti.com/product/L293?CMP=conv-poasamples#samplebuy

http://www.ti.com/product/L293?CMP=conv-poasamples#samplebuy

http://www.ti.com/productcontent

PACKAGE OPTION ADDENDUM

www.ti.com 26-Jan-2014

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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L293D H Bridge

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