L I G H T W A V E L O G I C TM€¦ · L I G H T W A V E L O G I C TM 4 3 takeaways to remember today… •Photonics enables many things and is part of our lifestyles… •Photonics

L I G H T W A V E L O G I C TM

OTCQB: LWLG

PICs are enabling innovative products

Michael Lebby, CEO Lightwave Logic Inc

Powered by the Speed of Light® Copyright 2017 Lightwave Logic


L I G H T W A V E L O G I C TMSafe Harbor

The information in this presentation may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words "may," "will," "should," "plans," "explores," "expects," "anticipates," "continue," "estimate," "project," "intend," and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, general economic and business conditions, effects of continued geopolitical unrest and regional conflicts, competition, changes in technology and methods of marketing, delays in completing various engineering and manufacturing programs, changes in customer order patterns, changes in product mix, continued success in technological advances and delivering technological innovations, shortages in components, production delays due to performance quality issues with outsourced components, and various other factors beyond the Company's control.

L I G H T W A V E L O G I C TMAgenda

• Introduction

• Environment and markets

• Polymer PICs and PIC Platforms

• New opportunities for PICs

• Closing notes

NB: These green bars give a summary of each slide


4


3 takeaways to remember today…

• Photonics enables many things and is part of our lifestyles…

• Photonics will be integrated – just like ICs 50years ago and become the engine for new designs…

• Will integrated photonics drive new products?

Our thirst for smaller, lighter, faster will enable PICs…


OTCQB: LWLG

The Environment:Quick Review

® Copyright 2017 Lightwave Logic


L I G H T W A V E L O G I C TMVideo driving internet traffic…

Exa zetta yotta…

Source: Cisco VNI

Kilo = 103

Mega = 106

Giga = 109

Tera = 1012

Peta = 1015

Exa = 1018

Zetta = 1021

Yotta = 1024

Home Mbps Datacenter Gbps

Old phone Kbps

Front plates Tbps

Traffic Traffic today Traffic tomorrow

International Metric

IP traffic

Coming soon


OTCQB: LWLG

Global markets: photonics components




PIC based technologies• PIC technologies ~$30B by 2025 with 16% CAGR (20-25)

– PICs include InP, GaAs, Other/SiP/Polymer reach 69% by 2025

– PIC based technologies are expected to reach $5B in 2017 at 24% of the photonic components market

PIC based technologies become de facto by 2025

$43B

$30B, 69%

Source: Lightwave Logic, Oculi llc, PhotonDelta


Transceivers grow significantly

• Photonics Components achieve $43B in 2025

• Photonics Transceivers achieve $25B in 2025

9Fiber optic transceiver growth strong next decade

$43B

$25B, 58%



PIC transceiver forecast to 2025

• PIC TxRx forecast to $20B by 2025 with 17% CAGR (20-25)

– PIC based TxRx are expected to reach $3.2B in 2017

– PIC based technologies lead the segment by 2021

PIC transceivers surpass discrete TxRx ~2021

$3.2B

$20B



OTCQB: LWLG

Need To Address Datacenter Pain

Points® Copyright 2017 Lightwave Logic


L I G H T W A V E L O G I C TMDatacenter engineering headaches

LARGER

FASTER

GREENER

DENSER

SM fiber

400G plus

Less than 10pJ/bit

Integrated photonics and packaging

Marrying high volume, high performance polymer and SiP/InP platforms brings polymer economics solutions to the datacenter

ECONOMIC ~ $1/Gbps

Polymer photonics platform

Scalable PIC platform Will Win Datacenter Market


Datacenter

DC single mode fiber growth

500m 2km 10km

~100m

Volume in modern data center moving is up to longer distances 500m ~ 2km

STOP?

Multi Mode Fiber (SR)

Single Mode Fiber (LR)400G

100/400G becomes more ubiquitous using SM fiber…

400G

VCSEL laser

DFB laser

~200m

LARGER Single Mode Fiber


400Gbps, 800Gbps and beyond…

• While 10Gbps and 100Gbps are sweet spots (systems designed to these speeds), 400Gbps represents the next ‘sweet spot’ for network designers.

The next battle for datacenter will be at 400Gbps…

Source: Ethernet Alliance

FASTER 400G +

400G

800G

Next!

More commonly discussed now…


• Classic TxRx solution– High labor, assembly

costs– Precision alignment– Discrete components

• Polymer photonics IC

– With large format wafer scale manufacturing; FC InP/GaAs sources, 3D silicon design, integrated optics, CoB, SiOB…

Using silicon platform also enables scaling…

Polymer photonics enables integration

Source: Lucent, Entroptix, JDSU, Nortel

Integrated photonics and packagingDENSER


Smaller Box Quest Denser Faceplates

• Line cards today in the datacenter regularly achieve traffic transfer of 40Gbps x 10 transceivers, which totals 400Gbps or 0.4Tbps and 100Gbps x 10 = 1Tbps– Designs today are moving towards 22 QSFP28 x 100Gbps = 2.2Tbps

• Customers are requesting 50-100Tbps solutions…

• Integrated photonics (PICs) has the potential of 250 x 400Gbps = 100Tbps…

Integrated Photonics Enables Smaller Boxes…Higher Traffic

Source: www.cables-solutions.com

DENSERSmallest Footprint

(QSFP, uQSFP)


The challenge of bandwidth (BW) density• Bandwidth density growing at 1 decade per 7 years: SLOWER

than switch capacity growth!

OSFP = Octal SFP; QSFP = Quad SFP

Switch capacity growth(smaller <100G but greater >100G)

BW density Gap appearing

Concern: pluggable (?) optics needs to scale faster for 800G

Source: Google (2017)

DENSERSmallest Footprint

(QSFP, uQSFP)


Lower power critical for 800Gbps• Energy improvement ~1 decade of Energy/Bit every 10years

• Aggressive thermal management needed for 800Gbps…

Thermal management: critical issue to address

Source: Google (2017)

GREENER Less than 10pJ/bit

10pJ/bit


OTCQB: LWLG

What are today’s PIC options?



L I G H T W A V E L O G I C TMThree Technology Platforms

• Incumbent: –InP (Indium Phosphide)– GaAs (Gallium Arsenide)

• New challenger: –SiP (Silicon Photonics)

• New and common to InP and SiP–Polymer Photonics

Polymers can enable both Silicon and InP PICs

✔

✔✔

✔ ✔

✔

✔


InP laserSiP and PP photonicsSi driver/TIASi Semi-custom ASIC

PIC platform will become OEICs with electronics

Integrated photonics is critical for datacenters…

All InP (GaAs) combinations of technology All SiP

InP laserInP photonicsInP driver/TIAInP Semi-custom ASIC

Silicon photonics

✔✔✔

✔✔✔

InP (GaAs) compound semiconductor

Incumbent

?

Polymer/Dielectric photonics

Polymer WaveguidePolymer SSCPolymer ModulatorPolymer Mux/Demux

✔✔✔✔


OTCQB: LWLG

New challenger:Polymer Photonics



L I G H T W A V E L O G I C TMBrief polymer history…• <1980s

– Strong government funding for non-linear electro-optic organic polymers (DARPA, NSF, DOE, DoD etc.)

– Many papers, reports, books

• 1980s – 2000s– Heavy, focused, and increased gvt funding for non-linear EO organic

polymers (DARPA, NSF, DOE, DoD, USAirForce, USNavy, USArmy)– Industry R&D lab funding e.g. Du Pont, Dow, Akzo Nobel, IBM, Intel,

Boeing, Motorola, AT&T Bell Labs, GE, Lockheed etc.– Increase in papers, publications, conferences, and books

• 2000s – 2010s– Wane in government funding and industrial R&D lab activity – Limited commercialization in fiber based communications

• >2010s– Excellent progress on high speed performance (>100Gbps)– Resurgence?

$

✔ROI (return on investment) lower than anticipated

$$$$

---

L I G H T W A V E L O G I C TMWhy did polymers wane?

• Telecom was a directed application & customer– Demands in the 1990s, 2000s+ included:

Telcordia GR-468, and 10year lifetimes, together with temperature ranges that exceeded 100C (even military specifications of -40C to +130C)

– Most polymers failed to achieve long lifetimes with these temperature requirements• Polymers that did achieve GR-468* were turned

down by Telco purchasing and did not achieve AVL status

• Limited commercial implementation – After hefty investments by government &

industry super volume markets never materialized (optical storage, telecom, optical computing)

– Some success in Test and measurement markets

Source: Jin et al, “EO polymer modulators reliability study” SPIE Proceedings Volume 7599, Organic Photonic Materials and Devices XII; 75990H (2010); doi: 10.1117/12.837418

Limited commercial acceptance

*Br Photonics achieved GR-468 qualification

Telecom…

https://www.spiedigitallibrary.org/conference-proceedings-of-spie/7599.toc

L I G H T W A V E L O G I C TMPolymers achieved great results…

• Key achievements included:– Extensive material characterization

• Low loss, high r33, 1550nm, spin-on fabrication techniques, waveguiding

– High performance devices • >100Gbps Modulators (slot, Mach-Zehnder

devices, waveguides, passive optics)• Examples would be: SiOH GigOptix polymer

modulator– “E/O polymer modulators reliability study”

(2010) looking at 85C for 25 years (see source)

• Unfortunately not enough for Telecom…temperature

Source: Jin et al, “EO polymer modulators reliability study” SPIE Proceedings Volume 7599, Organic Photonic Materials and Devices XII; 75990H (2010); doi: 10.1117/12.837418

With one issue: temperature stability

https://www.spiedigitallibrary.org/conference-proceedings-of-spie/7599.toc

L I G H T W A V E L O G I C TMEven outperforming LiNbO3 in telecom

• Frequency response of CPqD and LiNbO3 Modulators

Unfortunately, temperature of operation is the issueSource: ECOC 2016, CPqD, KIT


27

Where performance is impressive…

Unfortunately, temperature remains a problem (@ 85C)Source: UoA (Norwood)

L I G H T W A V E L O G I C TMIn spite of excellent technical progress...

• Silicon-Organic Hybrid (SOH) devices– Modulators (MZ @ 40Gbps, 16QAM, fJ/bit)

– Koos et al, OFC conference March 2015 (KIT, ETH, Uni of Washington, Ghent Uni, AMO)

• SSF EO polymer modulators for telecom– Modulators 40Gbps (small size, low Vπ 2.4V, >34GHz BW, zero chirp)

– Yu eta al, OFC/NFOEC Technical Digest 2012 (Gigoptix)

• Next gen PON using polymer-based components– WDM PON 8ch OLT Tx & Rx polymer AWGs, 40nm tunable InP/polymer Bragg grating laser for colorless ONUs (10 and

25Gbps)

– Keil et al, OFC/NFOEC Technical Digest 2013 (Fraunhofer HHI)

• EO polymer modulators– EO Modulators with dual drive with 100Gbps MZ operation for NRZ-DPSK & OOK

– Willner et al, OFC/NFOEC Technical Digest 2012 (USC & Aerospace Corp)

• 100Gbps Polymer MZ modulator– Polymer MZ modulator at 100Gbps with NRZ-OOK, BW -7dB @110GHz & chirp -0.02, BER 1e-9

– Huang et al, OFC/NFOEC Technical Digest 2012 (USC, Gigoptix, Aerospace Corp, UCB)

• Silicon Organic Hybrid (SOH) modulator – Polymer modulator with 28 GBd BPSK, 4-ASK & 8-ASK up to 84Gbps

– Palmer et al, OFC/NFOEC Technical Digest 2013 (KIT, AMO, Gigoptix)

Many folks have kept up the intensity to improve polymers

2015

2012

2013

2012

2012

2013


OTCQB: LWLG

So what’s different today?



L I G H T W A V E L O G I C TMNew markets; new applications

• Customers are not only telecom– New opportunities include: datacommunications data

centers, high performance computing, short distance interconnects (heavy data)

– Non-communications opportunities such as: healthcare, instruments, industrial, IoT

• Rare event in the tech world…– Customers are more open to new innovative solutions that

meet or beat their cost performance targets– Specifications for polymers have changed

• Fork lift upgrades allow lifetimes to reduce to 3-5yrs (from 10-20yrs)• Temperature specifications are more reasonable (<100C)• Integrated photonics is required (miniaturization, power)

Goalposts have moved…

Datacom…


Source: Lightwave Logic (LWLG)

Lightwave Logic’s polymers addresses temperature

• New proprietary polymer: Perkinamines™

– Higher thermal stability (>100C)

– Multi-chromophore process

– Optimized loading

– Increase EO activity

– Increased durability

– Low voltage

Temperature is the key to open new markets

L I G H T W A V E L O G I C TMLightwave’s polymer philosophy

• Designs focus on stability, high temperature, scalability, and reliability

– Ability to quickly synthesize new materials

– Have extremely high purity & consistency

– Scalable for commercial scale quantities

High r33 polymer materials Source: Lightwave Logic (LWLG)


Computer Modeling

Chromophore

Thermal Stability

Thermal Aging*

Photochemical

Stability**

DEVICE

2400C

> 2,000 Hrs.

* In Solution

> 4,000 Hrs.

1100C

** Outside a device

Stable, reliable polymer materials

• Stability and lifetime• Modeling and simulation

– Predicting material EO properties– Speeds selection and development of

material candidates

Optimizing the materials…



OTCQB: LWLG

Driving performance with our Polymer PIC

(P2IC) platform® Copyright 2017 Lightwave Logic



35

• Design for >50 Gbps showing plan, cross-section and metal layout for the modulator

RF design critical for high speed modulator

RF design for RWG modulator


36

• High speed (>50GHz) RF and optical test and measurement capability

• Measured EE S21 supports 50Gbps

• EE plot allows rf attenuation to be determined (which is then used in EO simulations) 0.65dB/cm(Sqrt(GHz))

RF design critical for high speed modulator

High speed test & measurement


MZ modulator enables 100Gbps (4x28Gbps) markets

RWG 28Gbps capability

26GHz



Potential to 800Gbps 4 x 100Gbps (PAM-4)

RWG simulation show potential for 800Gbps

• 400Gbps+ using 4x50Gbps with PAM-4 modulation


✔ ✔✔


Advantages for Polymer Modulators

• Advantages (LWLG material)– High electro-optic efficiency

• Low power

• Low insertion loss

• Small size

– Very high bandwidth (>100 GHz) potential• Simulations show 100Gbps and beyond

– Robust material for ‘heavy data’ markets• High stability

• High operating temperature

• Compatible with photonic integration

Polymers can complete competitively…

✔

✔✔



OTCQB: LWLG

One challenge for PICs…



L I G H T W A V E L O G I C TMBeating customer expectations…

• Customers want $1/Gbps at 400Gbps…

– This is $400 per link ($200 per TxRx) at 400Gbps

– Industry expected to fall behind gap appears

– By 2025 industry-customer gap widens…problem

Gap in $/Gbps$1/Gbps

Source: Oculi llc

Industry lagging innovation needed

L I G H T W A V E L O G I C TMInnovation drives scaling to $1/Gbps

Meet customer expectations using silicon economics

Acceleration path from a PIC platform

Source: Oculi llc

Innovation needed to accelerate path to $1/Gbps


OTCQB: LWLG

Achieving ~$1/Gbpsmetric will open new

PIC markets® Copyright 2017 Lightwave Logic


L I G H T W A V E L O G I C TMPIC opportunities are broad…

44PICs many applications

Source: Mitsubishi Electric, Luxtera


Medical Applications:Optical Coherence Tomography

Integration Enables Miniaturization Visible λ PIC?

Source: USDHHS, Topcon, Envisonoptical, Wikiepedia, Photonics.com, GE, Intel

Sarcoma

Eye

Integrated chip


Medical Applications:Cytometry & Detection

• Measurement & characterization of cells

Integration Enables Miniaturization Visible/IR λ PIC?

Flow cytometer

SpectrophotometerHybridization arrays

Source: Becton-Dickinson, Affymetrix, ATI, Wikiepedia

Integrated chip


Mid Infra-red Applications: Spectroscopy

Integration Enables Miniaturization IR λ PIC?

FTIR (Fourier transform infrared spectroscopy)

Source: Nature, Wikiepedia, Agilent, Ocean Optics, Robertsbiology

Integrated chip

L I G H T W A V E L O G I C TMCapsule endoscopy using photonics

Source: NIH-NCI, www.givenimaging.com

Integration enables miniaturization PIC intelligence?

L I G H T W A V E L O G I C TMMilitary applications for biophotonics

• Battle space• CB agent detection• Biowarfare defense (BWD)• Food safety• Field intelligence• Explosives & landmine detection• Intrusion detection• Water quality• Biomonitoring

• Medical

• Diagnostics

• Forensics

• Infectious disease detection

• Therapeutics

• Drug & vaccine development

• Homeland Defense

• CB agent detection

• Intrusion sensors

• Littoral & border protection

• Explosives detection

• Building & structural monitoring

• Water supply monitoring

• Immune Buildings

• Law enforcement

Source: MCH Engineering

Broad opportunities for PICs in defense…

http://www.ausaid.gov.au/keyaid/medical.jpg

http://www.173rdairborne.com/images/iraq-3 soldiers.jpg


50


PICs and flexible OLED displays: enables many new applications

Sources: Prof. Changhee Lee, SNU, Korea, PI-Scale

PI-Scale pilot line (EU commission)

Applications drive different solutions to photonics


51


GaAs PICs in mobile phones: VCSELs for 3D sensing

VCSEL arrays (200x150) 850nm

Public documents show huge mobile opportunities…

Volumes growing to ~2B units in the next few years probably the best example of PICs in consumer applications


OTCQB: LWLG

Closing notes




53


Closing notes

• Internet still growing quickly driven by video– New applications are being enabled through miniaturization

• Integrated photonics markets are strong

– Photonics comp $43B by 2025 with PIC penetration 69%

– Transceivers $25B by 2025 with PIC penetration 80% ($20B)

– PICs surpass discretes in TxRx around 2021

• PICs are here to stay– Trend to integrate electronics with photonics for smaller real estate

– III-V InP (GaAs), silicon photonics, polymer photonics, dielectric PICs

– PICs will impact broader markets and generate competitive advantage

• Role of polymers will accelerate quickly– Expect a resurgence of polymers as specifications have eased

Metrics for PICs are looking good (polymers also)…and


54


3 takeaways to remember today…

• Photonics enables many things and is part of our lifestyles…clearly…from ‘heavy data’ today to consumer, health, bio, defense, auto…

• Photonics will be integrated – just like ICs 50years ago and become the engine for new designs… absolutely…it will be the next generation IC…

• Will integrated photonics drive new products? No question…and polymers are back!

The era of the PIC is upon us…


OTCQB: LWLG

END® Copyright 2017 Lightwave Logic



OTCQB: LWLG

BACK UP® Copyright 2017 Lightwave Logic



OTCQB: LWLG

Potential roadmap for PICs




58

New draft industry roadmap – data rates added

2017 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Industry plan

Typical link reach

Ind wish (@400Gbps)

Industry plan

25G PIC/OEIC M/Ch 100Gbps OEICNH 25GHz PIC OSA NH100Gbps OEIC OSA (SiP or C/S)

SiP PIC stk 10-25GHz TSV+3D stk 50GHz OEIC (SiP or C/S) 3D-baseline 3D 25GHz PIC 3D 50GHz PIC

Purple Brick Wall = Technology cost barrierSlanted Red Font: Major industry efforts are required for commercialization

100Gbps 400Gbps 1000Gbps

<10km <10km <2km <2km <2km

10 Tbps/1U 25Tbps/1U 100Tbps/1U 400Tbps/1U

$5/Gbps $2/Gbps <S0.5/Gbps

<$5/Gbps $0.5/Gbps$1/Gbps>$10/Gbps (<2km)

10-100m 5-50m 1-25m<$1/Gbps <$0.5/Gbps <$0.25/Gbps <$0.05/Gbps

$1/Gbps $0.25/Gbps <$0.15/Gbps

10-25Gbps 50Gbps 100Gbps >1000Gbps Disc Driver/TIA OEIC 100Gbps int Driver/TIAInt TIA OEIC int Driver/TIA 50Gbps

QSFP =DSFP =SFP+ (new)

20pJ/b 10pJ/b 4pJ/b 2pJ/b 0.5-1pJ/b

25GHz FlipChip; 50GHz FlipChip 100GHz Flip Chip

25Gbps/Ch 50Gbps/Ch 100Gbps/Ch

CFP4/1D array QSFP and 2D array SFP & 2D array

100/mm2 500/mm2 1000/mm2 10,000/mm2

10Gb/mm2 40Gb/mm2 (inc driver/TIA) 80Gb/mm2 120Gb/mm2

300m 10G (1D array) 100m 25G (2D array/MCF)

NRZ NRZ/PAM4 NRZ/PAM4/8 NRZ/PAM4-16

10-25G 50G 100G

Std Bellcore Adv R&QA process R&QA C/S & SiP manf product

$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

=Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall Coherent?

3D 50GHz OEIC Purple Brick Wall 3D 100GHz OEICPurple Brick WallTSV+3D stk PIC 25GHz

Purple Brick WallNH 50Gbps OEIC OSA (SiP or C/S)10Gbps PIC Purple Brick WallM/Ch 50G OEIC50G PIC/OEIC

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall 50m 50G (1D/MCF) 100m 25G (1D/MCF)

Purple Brick Wall

Purple Brick Wall DSFP and 2D array

Purple Brick WallR&QA C/S and SiP for prototype

Source: Lightwave Logic

2024 2026

Purple brick wall expected by 2020-2022

$1/Gbps industry wish expected by 2021 for short links (2km)

$0.25/Gbps industry wish expected by 2021 for very short links (25m)

mircoQSFP

Purple brick wall now 2020-22


10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps 100Gbps 400GbpsPIC WDM Tx & Rx OEIC Int driver/TIA 50Gbps OEIC Int driver/TIA 100Gbps (serial) OEIC ASIC 50GbpsNRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side6” Wafer/fab 8” Wafer/fab 8 & 12” Wafer/fab 15” Wafer/fab?


New draft industry roadmap – technologies added

2017 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Industry plan

Typical link reach

Ind wish (@400Gbps)

Industry plan

InP Monolithic

SiP & InP/SiGe hybrid

Polymer Photonics

Dielectric Photonics

GaAs (VCSEL)



<10km <10km <2km <2km <2km






QSFP DSFP SFP+ (new)

$1/Gbps

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall


2024 2026

mircoQSFP5 Key technologies: InP, SiP, Polymer, Dielectric, GaAs

Metrics: Level of integration, base data rate, function, electronic modulation, wafer size/fabrication

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps (Laser-Mod) 100Gbps (laser-Mod) 400GbpsPIC WDM/MZ Mod Tx & Rx OEIC Int driver/TIA (SiP/InP) 50Gbps OEIC Int driver/TIA (Sip/InP) 100Gbps (serial)

OEIC ASIC 50GbpsNRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 4” Wafer/fab 4 & 6” Wafer/fab 8” Wafer/fab

100 devices 1000 devices 10,000 devices 100,000 devices25Gbps 50Gbps 100Gbps 400GbpsPIC Tx & Rx OEIC Int driver/TIA 50Gbps OEIC Int driver/TIA 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side6” Wafer/fab 8” Wafer/fab 8 & 12” Wafer/fab 15” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps 100Gbps (VCSEL-Mod) 400Gbps (VCSEL-Mod) VCSEL PIC 25Gbps VCSEL PIC 50Gbps VCSEL PIC 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 6” Wafer/fab 8 ” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall




New draft industry roadmap

2017 2018 2020 2022

Modules/TxRx

Data rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Industry plan

Typical link reach

Ind wish (@400Gbps)

Industry plan

InP Monolithic

SiP & InP/SiGe hybrid

Polymer Photonics

Dielectric Photonics

GaAs (VCSEL)



<10km <10km <2km <2km <2km






QSFP DSFP SFP+ (new)

$1/Gbps

Micro-SFP


2024 2026

mircoQSFP

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps (Laser-Mod) 100Gbps (laser-Mod) 400GbpsPIC WDM/MZ Mod Tx & Rx OEIC Int driver/TIA (SiP/InP) 50Gbps OEIC Int driver/TIA (Sip/InP) 100Gbps (serial) OEIC ASIC 50GbpsNRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 4” Wafer/fab 4 & 6” Wafer/fab 8” Wafer/fab

100 devices 1000 devices 10,000 devices 100,000 devices25Gbps 50Gbps 100Gbps 400GbpsPIC Tx & Rx OEIC Int driver/TIA 50Gbps OEIC Int driver/TIA 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side6” Wafer/fab 8” Wafer/fab 8 & 12” Wafer/fab 15” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

10 devices 100 devices 1000 devices 10,000 devices25Gbps 50Gbps 100Gbps (VCSEL-Mod) 400Gbps (VCSEL-Mod) VCSEL PIC 25Gbps VCSEL PIC 50Gbps VCSEL PIC 100Gbps (serial)NRZ/PAM4 NRZ/PAM4-8 NRZ/PAM4-16 Coherent client-side3-4” Wafer/fab 6” Wafer/fab 8 ” Wafer/fab

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Performance has been increasing…

• ECOC 2016 key polymer modulator results

– Signaling is PAM-4

– CPqD device is inverted rib

– Slot based SiOH modulator (KIT University)

Organization

Vpi f 3dB (GHz) IL (dB) Data Rate (Gb/s)

CPqD 3.4 56 14* 112

KIT 2.2 60 18 120

* At Optimum Bias Point

Data rates of 100Gbps+ achievedSource: ECOC 2016, CPqD, KIT


With impressive results >100Gbps• Experiment for CPqD 40 x 112Gbps interconnect

Polymers provide excellent 100Gbps operationSource: ECOC 2016, CPqD, KIT


63

Key is the material performance…

High r33 polymers materials allow high performance Source: UoA (Norwood)


Drive RWG optimization for 50Gbps and beyond

Ridge Waveguide Modulator

Si Substrate

Cladding

LWLG Core

Cladding

Ridge Waveguide Modulator

Si Substrate

Cladding

LWLG Core

Cladding

Inverted Ridge Waveguide Modulator

Advance RWG polymer structure for high performanceSource: Lightwave Logic (LWLG)


• Mask design with various modulator layouts to aid diagnosis and high performance tuning

65Modulator layout designs to fine tune performance

Ridge waveguide wafer design

L I G H T W A V E L O G I C TM€¦ · L I G H T W A V E L O G I C TM 4 3 takeaways to remember today… •Photonics enables many things and is part of our lifestyles… •Photonics

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