Krishna Saraswa Stanford University ormance Analysis and Technology 3D ICs Krishna Saraswat Shukri Souri Kaustav Banerjee Pawan Kapur Department of Electrical Engineering Stanford University Stanford, CA 94305 [email protected]Funding sources: DARPA, MARCO
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Krishna Saraswat Stanford University Performance Analysis and Technology of 3D ICs Krishna Saraswat Shukri Souri Kaustav Banerjee Pawan Kapur Department.
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Krishna SaraswatStanford University
Performance Analysis and Technology of 3D ICs
Krishna SaraswatShukri Souri
Kaustav BanerjeePawan Kapur
Department of Electrical EngineeringStanford UniversityStanford, CA 94305
Introduction: Interconnect Delay Is Increasing Chip size is continually
increasing due to increasing complexity
Device performance is improving but interconnect delay is increasing
Chip sizes today are wire-pitch limited: Size is determined by amount of wiring required
Mark Bohr, IEDM Proceedings, 1995
Krishna SaraswatStanford University
Cu Resistivity: Effect of Line Width Scaling•Effect of Cu diffusion Barrier
•Barriers have higher resistivity•Barriers can’t be scaled below a minimum thickness
•Effect of Electron Scattering•Reduced mobility as dimensions decrease
•Effect of Higher Frequencies•Carriers confined to outer skin increasing resistivity
Problem is worse than anticipated in the ITRS 1999 roadmap
Krishna SaraswatStanford University
Cu Resistivity: Barriers Deposition Technology
Atomic Layer Deposition (ALD)
Ionized PVD
Collimated PVD
• 5 nm barrier assumed at the thinnest spot• No scattering assumed, I.e., bulk resistivity
Interconnect dimensions scaled according to ITRS 1999
525250
95 48
280133
ITRS 1999 Line width (nm)GlobelLocal
Krishna SaraswatStanford University
Cu Resistivity: Effect of Electron Scattering
• No barrier assumed• Diffuse electron scattering increases resistivity• Lowering temperature has a big effect
Elastic scattering
Diffuse scattering
ElasticDiffuse, GlobalDiffuse, Local
273 K
373 K
Diffuse, Local
Diffuse, Global
ElasticLower mobility
Krishna SaraswatStanford University
50 100 150 200 250
Technology Generation (nm)
0
10
20
30
p=0.600 p=0.625 p=0.650 p=0.675 p=0.700
As much as 27% of the chip area at 50 nm node is likely to be occupied by repeaters.
Fraction of chip area used by repeaters
Rent’s exponents
Krishna SaraswatStanford University
3D ICs with Multiple Active Si LayersMotivation
• Performance of ICs is limited due to R, L, C of interconnects• Interconnect length and therefore R, L, C can be minimized by stacking active Si layers• Number of horizontal interconnects can be minimized by using vertical interconnects• Disparate technology integration possible, e.g., memory & logic, optical I/O, etc.
Logic
n+/p+
n+/p+ n+/p+
Gate
Gate
T1
T2
M1
M2
M3
M4
n+/p+n+/p+
Gate
Repeatersoptical I/O devices
n+/p+
M’1
M’2
VILIC
Via
MemoryAnalog
Krishna SaraswatStanford University
Chip Size
Device Size Limited
• Memory: SRAM, DRAM
Wire Pitch Limited
• Logic, e.g., µ-Processors
PMOS
NMOS
Krishna SaraswatStanford University
Rent’s Rule
T = k N P
T = # of I/O terminalsN = # of gatesk = avg. I/O’s per gateP = Rent’s exponent
Number of Grain BoundariesNumber of Grain Boundaries0, Ge seeded1, unseeded2, unseeded3, unseeded
Single Grain Transistors in Ge Induced Crystallized Si
ID-VG of 0.1 µm NMOS Mobility
SGT
Krishna SaraswatStanford University
Ni Seeded Lateral Crystallization
• Initially transistor fabricated in -Si• Ni seeding for simultaneous crystallization and dopant activation • Low thermal budget (≤ 450°C) •Devices could be fabricated on top of a metal line
-SiCrystallized Si
Ni seedSiGe gate
substrate
SiO2
NMOS
Tmax = 450ºC
Krishna SaraswatStanford University
• Energy is dissipated during transistor operation• Heat is conducted through the low thermal conductivity dielectric,
Silicon substrate and packaging to heat sink• 1-D model assumed to calculate die temperature
SilicontSi
Passivation
TDie
Package
Tpkg
Heat SinkTsink
Heat FlowtPkg
GateVDie
V sink
RSi
I
R Pkg
V Package
a ) b)
40
60
80
100
120
140
160
180
0 50 100 150 200 250 300
Technology Node [nm]
Maximum Power Dissipation [W]
2
3
4
5
6
7
8
9
10
Chip Area [cm
2 ]
2-D Circuits
Power Dissipation for 2D
Thermal Behavior in 3D ICs
Krishna SaraswatStanford University
3D Examples for Thermal Study
• Case A: Heat dissipation is confined to one surface
Bulk Si
n+
p+ p+
Gate
Gate
T1
T2
M1
M2
M3
M4
n+
M’1
M’2
• Case B: Heat dissipation possible from 2 surfaces.
Value of Rn with current heat-sinking technology for (2-D) 250 nm nodeValue of Rn for a high-performance heat sinking technology [65]
Attainable die temperatures for 2-D and 3-D ICs at the NTRS based 50 nm node using advanced heat-sinking technologies that would reduce the normalized thermal resistance, R
Die Temperature Simulation
Krishna SaraswatStanford University
3D ICs: Implications for Circuit Design • Critical Path Layout: By vertical stacking, the distance between logic blocks on
the critical path can be reduced to improve circuit performance.
• Integration of disparate technologies is easier
• Microprocessor Design: on-chip caches on the second active layer will reduce distance from the logic and computational blocks.
• RF and Mixed Signal ICs: Substrate isolation between the digital and RF/analog components can be improved by dividing them among separate active layers - ideal for system on a chip design.
• Optical I/O can be integrated in the top layer
• Repeaters: Chip area can be saved by placing repeaters (~ 10,000 for high performance circuits) on the higher active layers.
• Physical Design and Synthesis: Due to a non-planar target graph (upon which the circuit graph is embedded), placement and routing algorithms, and hence synthesis algorithms and architectural choices, need to be suitably modified.
Krishna SaraswatStanford University
• Cu/low k will not solve the problems of interconnects.
• Modeling of interconnect delay shows significant improvement by transitioning from 2-D to 3-D ICs.
• Seeding and lateral crystallization of amorphous Si is a promising technique to implement 3-D ICs.
• Thermal dissipation in 3-D ICs may require innovative packaging solutions.