VEROTEC Km6-1_16.pdf · UK Tel: +44 (0)2380-246900 [email protected] USA Tel: 603.821.9921 [email protected] 1 KM6 Subracks 1.04 Guide clearance connector mounting holes

VEROTECElectronics Packaging

KM6 Subracks& Accessories

1.02 UK Tel: +44 (0)2380-246900 [email protected] Tel: 603.821.9921 [email protected]

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KS OVERVIEW 1-16

Anintroductiontosubracksystems 3

EurocarddimensionalcriteriaforKM6subracksystems 4

IEC60297-3dimensionalcriteria 5-6

IEEE1101.10/11dimensionalcriteria 7-11

AguidetoEMCscreeningsubracks 12

Shockandvibration 13

Subrackmaterialsandfinishes 14

Customisingoptions 15

AguidetoKM6subracksystems 16

KM6-II SUBRACK SYSTEM 17-48

IntroductiontoKM6-II 17

KM6-IIDimensionalcriteria 18

KM6-IIStandardsubracks 19-20

KM6-IIUniversalsubracks 21-22

KM6-IIEMCconversion 23-27

KM6-IISubrackpieceparts 28-32

KM6-IIAccessories 33-48

KM6-RF SUBRACK SYSTEM 49-77

IntroductiontoKM6-RF 49-52

KM6-RF:3U,StyleAsubracks 53-54

KM6-RF:3U,StyleBsubracks 55-56

KM6-RF:6U,StyleAsubracks 57-58

KM6-RF:6U,StyleBsubracks 59-60

KM6-RF:3U,6U&9U,StyleCsubracks 61-62

KM6-RFSubrackpieceparts 63-73

KM6-RFAccessories 74-77

KM6-EC SUBRACK SYSTEM 79-82

IntroductiontoKM6-EC 80

KM6-ECSubracks 80

KM6-ECAccessories 81-82

KM6-HD SUBRACK SYSTEM 83-87

IntroductiontoKM6-HD 83-84

KM6-HDSubracks 84

KM6-HDSubrackpiecepartsandaccessories 85-87

KM6-II subrack system

KM6-RF subrack system

KM6-EC subrack system

KM6-HD subrack system

KM6 Subrack - Index

1.03UK Tel: +44 (0)2380-246900 [email protected] Tel: 603.821.9921 [email protected]

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An introduction to subrack systems

THE SUBRACK pRInCIplEWhy would you choose to use an extrusion based subrack ?

Inaword,accuracy.TheneedtoprovideapreciseframeworkinwhichPCBsaresupportedandguidedintoconnectorpositionsismostefficientlyachievedusingaccurateextrusiontechnologyandhard-tooledendplatedesign.ThesubrackfunctionnowextendsfarbeyondthepuresupportroleandcoverssuchareasasRFIprotection,Shock and vibrationprotection,ESDprotectionandFireenclosuresafetytonamebutafew.Let’sexamineanumberofthefunctionalaspectsofthesubrackandlookatthealternativesolutionsavailable

RFI pROTECTIOn Thisisachievedbytheuseofcovers,EMCcontactfingersandconductivelyfinishedmatingparts.TheFaradaycageachievedwithsubrackscangiveveryhighlevelsofsignalattenuationacrossawidebandoffrequencies.ThenatureoftheconstructionalsoallowstheusertodefineabalancebetweenEMCandventilation.SelectiveRFIprotectionisanotheroption,withtheuseofpluginscreenedmodules.Thereareacoupleofalternatives,eithertheproblemcanbedesignedoutatboardlevel(thereissomedoubt,however,thatsusceptibilityproblemscanbedesignedoutthroughtrackingandlayoutchanges),ortheproblemareascanbe‘canned’,butagaintherearesomedoubtsregardingsusceptibility.

SHOCK AnD VIBRATIOnThisisachievedwiththeuseofsecurecardguides(screwedin),twopointextrusiontoendplatefixingandadditionalmountingattherearoftheframe.Itshouldberememberedthattheeffectivenessofthemountingisonlyasgoodastherack/systemintowhichtheframeismounted.ThereareonlycustomsolutionsforsecurelymountingPCBswithoutusingasubrackandthesearenormallylooselybasedaroundthesubrackprinciple.

ESD pROTECTIOnThisisachievedusinggroundingclipsinthecardguidesystemtodischargeElectrostaticbuildupfromthePCBeitherduringinsertionorduringthecourseofnormaloperationinsitu.AdditionalgroundingatthefrontpanelisnowseenasgoodESDpractiseandthisisachievedeitherwiththeuseofmetalinsertsorthroughthegroundingpininIEEE1101.10Injector/Ejectormechanisms.AlternativemethodsofESDarehardtodefine.Someclaimthatgoodproductionmethodsie.operatorsfittedwithdischargeclipsandproductstorageinanti-staticpackagingarehelpful.Othersclaimsufficientdischargethroughanallocatedpin(s)intheconnector.

VERSATIlITYTheSubrackconceptallowstheusertoconfiguretheusablespacetosuittheapplication,thusremovingthenecessityto‘tool’eachconfigurationasacustomsolution.Dividerkitsforthefrontandrearallowavarietyofheights,widthsanddepthswithinasingleenvelopesize.EventheorientationofthePCBscanbereadilychangedfromverticaltohorizontal,orindeedacombinationofthetwowithinthesameframe.Thealternativetothisistoproduceacustombasedsolution,whichmaywellproduceahightoolinginvestmentrequirement.Verotechavemadeasignificantinvestmentintoolingtoproducegoodquality,versatilesubrackproducts.

Ourmanufacturingfacilitieshavelongbeenattheforefrontoftechnologicaldevelopment,andtheircommitmenttotheprovidingofthemostfit-for-purposeproductsisdemonstratedbythefactthatwecurrentlymanufacturesomeofthemostadvancedpackagingsystemsandenclosuresavailable.Verotec’sfacilitiesarefullyequippedwiththelatestelectronicdesignandmanufacturingsystems,enablingcustomerstoaccessa“virtual”factoryfortheprocurementofproduct.

Wehavelongexperienceinthedesign,manufactureandsupplyofsubracksandenclosuresinbothstandardandcustomformsand,asaresult,wehaveexpertiseinsolvingawiderangeofproblemsencounteredbytheelectronicsindustrywhenhousingor‘packaging’componentsandsystems.Thispublicationreflectsboththatexperienceandexpertise.

Verotecsisdedicatedtobeingaworld-classproviderofacomprehensiverangeofstandardandcustomproduct,bornefromtheintegrateddesign,manufacturingandservicecapabilities,enablingittoprovideOEMswithrapiddeliveriesatcompetitiveprices.Webelievethateverycustomerisapriority,andcontactismaintainedbymeansofourowndedicatedsalesforcesandviaourtechnicalsalesandmarketingspecialists,whoareabletodrawuponglobalresource.

SUBRACKSTheKM6subrackrange;KM6-II,KM6-RF,KM6-ECandKM6-HD,isrecognisedworldwideasoneoftheleadingproductsinitsfieldhavingevolvedaroundanumberofinternationalstandardsandinresponsetoanumberoftrends.Principalamongthesetrendsareincreasedcomponentdensities,higherspeedbussystems,greaterconnectorcontactcounts,agreaterrangeofoperatingenvironments,EMCandelectricalsafetyregulationsand,ofcourse,economicpressures.

RFI protected subrack

Extrusion based subrack

UK Tel: +44 (0)2380-246900 [email protected] Tel: 603.821.9921 [email protected]

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Guideclearance

connectormountingholes

Guideclearance

SInGlE EUROCARD

frontpanel/mountingholescardejector

connectormountingholes

frontpanel/cardejectormountingholes

DOUBlE EUROCARD

Please note: Certain plastics can be adversely affected by organic solvents. Care

should be taken to avoid contamination by some cleaning agents, for instance.

With modified PPO's and PPE's such as Luranyl we recommend that when using

thread locking compounds they should be cyanoacrylate based, not anaerobic.

Eurocard dimensional criteria for KM6 subrack systems

InTRODUCTIOnKM6Subracksaredesignedaroundanumberofdimensionalstandardsthataimtoprovideabasiclevelofinterchangeabilitybetweendifferentversionsandbetweenmanufacturersofsimilarsystems.

The basis is the DIN41494 Eurocard standard.ThedimensionsforthehousingofEurocardsaredescribedinIEC60297section3SC48D.Plug-inunitsaremodularinconceptandarebasedonthefirstcardpositionbeing3,27mmfromthelefthanddatumlineoftheworkingaperture;subsequentcardpositionsareonmultiplesof5,08mm(1HP)fromthisfirstcardposition.

Toallowforauniformworkingclearancebetweenfrontpanels,whenused,theoverallwidthofafrontpanelis0,4mmlessthanthenominalHPx5,08dimensionsgenerallyquoted.

HeightsarenominallyquotedinU’s(multiplesof44,45mm)butitshouldbeborneinmindthatadevicequotedasnUhighwillnotbenx44,45mminoverallheight.

KM6-subrackscanaccommodateconnectorstoIEC130-4,DIN41612andVG95324specificationsormotherboardstotheIEC60297-3specification

Inaddition,referencewillbefoundtotheIEEE1101.1,.10and.11whichexpandontheabovespecificationsandforwhichKM6-RFprovidessuitableproduct.ThesedescribeanumberoffeaturesparticularlyrelevanttoVME64x,CompactPCI®andPXIbusstructures.

EUROCARDS - CRITICAl DIMEnSIOnSAswiththerestofthesystemtheprintedcircuitboardsizesarestandardised.AllPCBsshouldbeoftheEurocardsizeandconformtothelayoutshown.

A2,50mmwideborderisnecessaryatthetopandbottomofprintedcircuitboardstoallowclearanceforfittingintocardguidesandformountingintoplug-inunitguiderails.

OnthedoubleheightEurocard,owingtotheoverallsizeandpositionoftheconnectors,itisrecommendedthatwhenfittingcomponentstothefrontpanelsthegridaslaidouthereisadopted.Thiswillallowconsistencybetween3Uand6Uheightfrontpanelsifmixedconfigurationsareutilised.

USEFUl FROnT pAnEl AnD CIRCUIT BOARD DIMEnSIOnSThesedimensionsareusefulwhenaEurocardistobeattachedtoaKM6frontpanelusingcardmountingbrackets.

Connectortype(DIN41612) B C D E F G HDIMX 7,6 9,4 9,4 14,4 11,3 16,3 11,3

Carddepth+9,93(contypesB,C,D)+11,93(contypesF,G,H)

Normalposition

Adjacentfrontpanelpositions

Subrack front section features


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IEC 60297-3 dimensional criteria

A

A

3

10,16 6

<449

11,75

>22

'Y'

'X'

2,54

2

3,27

2,54

TheseillustrationsshowdimensionsextractedfromIEC60297-3.Theyarenotcomprehensive,butshouldprovegenerallyinformative

Subrackdimensionsshownarefor3Ux84HPandsingleEurocardsHeightsincrementby44,45mm(1U)Widthsincrementby5,08mm(1HP)

Scrapviewof6Ushowingdimensionsavailablefor

centrerearextrusionwith6Uplug-inunits

ToaccommodatePCB1,6mm±0,2Pi

tch

line

Detail'X'

Rear

atta

chm

entp

lane

Detail'Y'

Pitc

hlin

e

5,08Typ

Firs

tfa

sten

ing

loca

tion

3U=

133

,35

Nom

inal

PCBPositionsincrementallyby5,08multiples

482,6Nominal

Aperture>84x5,08

Cent

reli

nefi

rst

PCB

EurocardCompatible

100+0/-0,30

Aper

ture

M1

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PCB

'V'

84x5,08

3,55

0,30,3

5,63

2,54

'W' 'Z'

6

175,24*

1,5

175,24*175,24*

2,5

2,54

4,07

8,8

3,62,7

M2,5

'U'7,62

nx5,08nx5,08

7,5

7,62

ab abc

128,

7+0

/-0,

3

90

122,

5±0,

2

IEC 60297-3 dimensional criteria

Detail'W' Alternativedetail'W'Optionalspacerm3

DIn 41612 connector mounted

on motherboard

Alternative for direct mounting of DIn 41612

connectors

*Rearattachmentplane(i.e.ConnectorMountingFace)ForDIN41612typesBCDMQRS

FortypesFGUVadd10mm

Motherboard

fixingcentres122,5

Guide

Fron

tpan

elfi

xing

ce

ntre

s12

2,5

Detail'Z'

Frontattachmentplane

Section'A-A'

Fixingholesincrementingonmultiplesof5,08asrequired

Fixingholesonmultiplesof5,08

MotherboarddimensionsshowingType'B'&'C'DIN41612

connectorpositionsFrontview

Detail'U'

Pitc

hlin

e


Pitc

hlin

e

Detail'V'

Limitofcomponentmountingarea

Pitchline

2,5

90

122,

512

8,7

Type

‘B’

Type

‘C’

Pitc

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e2,

54

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InTRODUCTIOn

IEEE1101.1islargelyareiterationofthebasicIEC60297-3standard,withsomechangestoreflect.10and.11

IEEE110.10wasdrivenbyanumberofrequirements:ThestandardisationofEMCfrontpanelgeometrytoensurecompatibilitybetweenvariousmanufacturers’products.

Theintroductionofthefive-rowDIN41612connectorintoVMEandtheincorporationofMetricstandardconnectors.Bothhaveveryhighpincountsandresultanthighinsertion/withdrawalforcesthatrequireastandardinjector/extractorhandlegeometry.

Thestandardalsoaddressestheproblemsofelectrostaticprotectionandaneedtocodeplug-inunitstopreventincorrectplug-up,wheresuchactionscouldhavecatastrophicresults(inparticularinliveinsertionsituations).

IEEE1101.11standardisesthegeometryofrearplug-up(transition)moduleswherenopreviousstandardexisted.Rearplug-up-ortransition-isusedandrequiredwithinthecorespecificationsofmajoropen-architecturebusstructureswhereamidplaneisusedtoprovidearearI/Ointerface.

IEEE 1101.10/11 dimensional criteria

3,5

2,5

10 5,5

2,54

3x5,08 5,08

10,165,082,5l

2,0

max

0,5min

1,0max

4x5,08

15,24

Injector/Extractoroperatingfeature

EMCseals

Infill(blank)panel

Coding/ESDfeature

Injector/Extractor

Boxtypepluginunit

ConductivesurfacesorEMCgasket

Typical arrangement of 1101.10 subrack

Subrack conductive areas

Subrack Injector / extractor operating feature

3,4Ø(dia)

2,54 2,54 2,54

Subrack mounted coding / ESD feature

2,54

2,54

5,08

5,08

2,5

min


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Typicalplug-inunitshowinginjector/extractorcoding,ESDandfrontpanel

geometry

4max

(1,6)

(1,5)

(1,32)

(13,71)(maxcomponent

height)

(2,54)

14,1

2,5

2,0

max

3,8

max

1,15max

0,5min

1,0max

3,8

max

2,5

min

1,26

plug-in unit detail

Protectivecover(optional)

4HP(4x5,08)Typical

10

2,5

m14,5

m38

3,8

1,5

Test

dim

ensi

on(N

xU

)-4

,35

+0,

55

-0

,0

Detail for extractor

23max

Usab

lec

ompo

nent

spa

ce

location ESD detail

106

(3U)

239.

35(6

U)37

2.7

(9U)

4,9

3,1

3,14,75

13,0

4,4

7,64,62,4

2,4

2,1

1,0

Coding key

Interaction of coding key


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A B C AC B

DEF FED

(160) (160)

2,76

0,5

153,67 (153.67)M70

1,5

2,5

2,76

0,5 5

0,5

Subrackfrontview

Alignment/ESDfeature

Alignment/ESDpin

1234Empty

Keyingchamber(subrackmounted) Keyingchamber

frontpanel

PrintedBoard

BoardtypePlug-inunitRearView

KeyingOptions

FrontExtrusion

Guiderail


GuiderailESDcontactarea

Rear Rear

Componentside Componentside

ESDcontactbreaksbeforeconnectorengagement ESDcontactmaintainedduringconnectorengagement

pCB ESD Contact strips top / bottom

1234Empty

1234Empty

1234Empty


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153,67

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Da

400340280220160100 6080100120140160

Rear

Dimensionsreferto160unit

Front rear plug-up options

In line configuration for rear (transition) plug-up EMC panels.

EMCseals

Injector/extractoroperatingfeature

EMCseals

Infill(blank)panel

CodingESDfeature

Injector/extractor

Rear(transition)plug-upunit

Typical arrangement of 1101.11 subrack with rear plug-up

Midplane

Front

Midplane

1003U233,356U366,79U

Rear(transition)plug-upunit/frontpanel

Midplane

Front(transition)plug-upunit/frontpanel

1.10


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max6170.3(IEC603-2)

InspectionDimension

Rear(transition)plugupdetail3Ushown

ESD/Electricalsafetyground

Framemountedcoding/ESD/location/electricalsafetygroundfeature

Midplane

Rearplug-updimensions(160shown)

SeeIEEE1101.1

Frontfixedconnector

Rearfixedconnector

Rearfreeconnector

Spacer(userdefined)

LockinginterfaceSeeIEC603-21

1076-4-x

Attachmentplane

(160shown)169.88(IEC603-2)172.38(IEC1076-4-x)

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A guide to EMC screening subracks

A GUIDE TO THE EMC SCREEnInG SUBRACKS

Please note that any reference in this section to attenuation figures is theoretical,

and examples have been obtained under laboratory conditions only.

Byitsnature,anemptyenclosuredoesnotfallwithinthescopeofanyEMCperformanceregulation,sincealltheexistingstandardsareapplicablesolelytoelectrical/electronicequipment;anymodificationtoeithertheenclosureoritscontentswillhaveaneffectuponitsEMCperformance.

WhileKM6-RFissuppliedwithfulllinecapabilityasstandard,somesizesofKM6-II,KM6-ECandKM6-HDcanberetrospectivelyscreenedbytheadditionofcovers,frontpanelsandassociatedcomponents.Thesecanbefoundbyreferencetothevariousdetailsinthiscatalogue.

ThekeytogoodscreeningperformanceintheE(electrical)fieldistolimitthesizeofanyholesandthereal-estatebetweenthem,andtoreducethelengthofslots,onthebasisthattheshortertheslot,thebettertheperformanceathigherfrequencies.TheH(magnetic)fieldperformanceismoreafunctionofmaterialandthickness-henceasteelcoverwouldoffersomeimprovementinthisarea.

Thecoverkitsareavailableinventilatedandunventilatedformandtheirtypicalperformancecanbefairlyaccuratelyforecast,assumingthattheyarefittedintherecommendedway.Theobviousdifferenceisthattheunventilatedversionoffersahigherlevelofattenuation.Despitethefactthataluminiumhasgoodthermalproperties,however,itmustbeacceptedthatyoumayhaveheatdissipationproblems.ThechoiceofventilationholesisnecessarilyacompromisebetweenEMC,thermalandmanufacturingconsiderations.Wehavechosenwiththeseinmind.Apartfromthis,theonlymeansthatcaneasilybeusedtofurtherenhancethestandardscreeningperformanceinthisareaistoapplyanappropriateEMCgasketaroundalledges,thusreducingslotstotheminimum;underlaboratoryconditionsweachievedanimprovementofapproximately15dBusingsealsinthismanner.Forthissortofapplicationthereareself-adhesivestainlesssteelorcopperalloygasketstripsreadilyavailablefromEMCsealsuppliers.

TheareaofEMCshieldingwhichismostopentovariablesisinthesealingofthefrontandrearpanels.Here,adjustingthespacingoftheRFIfingerscanproducesignificantlydifferentperformancesandwhilstthisguideisnotallencompassinginthismatter,itwillassistyou.Hence,allotherfactorsbeingequal,maximumperformancecanbeachievedbyusingfullwidthfrontpanels,thusreducingthenumberofpotentialleakagepoints.

Shownhereisasetoftypicalplotsobtainedundertestconditionsusingvariousfingerconfigurations,fromsmallgroupsatvaryingintervalsuptoafullstripoffingers.Thesubrackwasfittedwithunventilatedtopandbottomcoversthroughoutthetest.The11mmcurveisanomalousat300MHzwhichisduetoafunctionofthegeometryoftheparticularenclosureundertest.Figuresareaveragedfromfrontandrear.Ventilatedcoversreducetheattenuationbyanaverageof15%undertestconditions.Thelowerattenuationsat100MHzarearesultofthemeasurementmethod,anddonotreflectaninferiorlevelofshielding.Theeffectofslotlengthisclearlyshownatincreasingfrequencies.EMCfingerscanaddsignificantcosttothescreeningofasystemandforthisreason,wedonotincludefingersinsomeinstances;instead,youshouldselecttheconfigurationmostsuitableforyourparticularapplication,afterconsiderationofthevariablesdetailedinthissection.TheEMCfingerstripscanbeeasilycuttolengthwithapairofsharpscissors,takingcaretoavoidcrushingtheraisedfingers.

Continuous

Atte

nuat

ion

(dB)

Effect of Be Cu Spacing on single front and rear panels solid top and bottom covers withdimplesat20mmspacingBeCuIN4-fingerblocks

PublishedData

Frequency-MHz

Continuous 11mmSpacing 27mmSpacing 44mmSpacing

Spacingoffingersshouldbeconsistentthroughout.Theyshouldbeplacedtocoincidewiththoseonthefrontandrearpanels.

RFIfingersfittedatallverticalcorners

RFIfingersfittedonfrontand/orrearextrusionswhenusingoverallclosingpanels.

End plate angles omitted for clarity


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Shock and vibration

Theincreasinguseofelectronicsinsuchapplicationsasmobile,roadside,factoryandearthquakeenvironmentshasledtoanincreasedawarenessoftheeffectsofshockandvibrationonfullsystems.

Theuseofsubracksintheseconditionsisgenerallylimitedbyanumberoffactors.

1) Theloading-bothtotalweightanditsdistribution;increasedheightto someextentimprovestheverticalstability;increasingwidthadversely affectsitsresistancetovibrationintheverticalaxisandthedeflectionof horizontalcomponents;increasingdepthencourages‘parallelogramming’ insidewaysshockandvibration.Placingheaviercomponentsascloseas possibletothemajorfixingpointswillalsohelpinallaxes.

2) Theoverallconstruction-aboxstructure(ieonewhichhassecurely fittedtopandbottom,frontandrearcovers)willbemuchmorerigidthan asimpleframework.Here,backplanes,frontandrearpanelswithmultiple fixings,offerconsiderablebenefit.

3) Constrainingtheassemblyattherear,aswellasthefront,providesan extremelygoodreturnfortheeffort.Carefuldesignherecanprevent movementinsidewaysandverticaldirections.

4) Positiveretentionofguidesaddstothecapabilityoftheassembly.Itis recommendedforparticularlyheavyplug-inssuchaspowersupplies, especiallyintransit,whereitmaybesubjectedtovibrationandshockon stifflysuspendedtrucksorduringhandling.

5) Themostdifficultproblemforthesubrackmanufactureristoadd asmuchmaterialtoextrusionswhilstmaintainingintegritywiththedimensionalstandardssuchasIEEE1101.1,ataslowacostaspossible andwithoutrestrictingairflowtoomuch.

6) LargePCBswillreactbadlytosidewaysvibrationandmayrequirethe incorporationofstiffeningdevicessecurelyfixedatcloseintervalsto prevent‘snaking’or‘panting’,bothofwhichputconsiderablestresson componentconnections.

Therearealargenumberofspecificationsandstandardswhichcanbeinvokedtoexpressthetestingrequirements,someofwhichareveryspecific,someextremelywidelydrawn.Amongthelatteryoumayfindmilitaryspecificationswhichareintendedtocoverawiderangeofenvironmentsfromstorageandtransport,throughship-borne,toairborneandmissileapplications.

Itisimportanttonotethatwhilst,Veroteccanmeetmostrequirements,overspecifyingtestanalysiswillinevitablycanleadtounnecessarycostpenalties,withlittleoverallagainattheendoftheprocess.

Inordertoensurethatyouselecttherightsubrack,orrequestthecorrecttestsetbeforeinstallingyoursystems,adiscussionofyourneedswithoneofourapplicationsspecialistsmaybebeneficial.

ForfurtherdetailspleasecontactourApplicationsSupportTeam

Subrack shock and vibration


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Subrack materials and finishes

Althoughaluminiumcanbeseenasamoreexpensivematerialthan,forinstance,steel,itoffersseveralbenefitsinthedesignandconstructionofsubrackswhichmakesithighlysuitable.Thereductioninweightwhichitoffersisparticularlyusefulfor‘one-man’handlinginrestrictedspaceandlessthanidealheights.Additionally,ithasexcellentheatconductionproperties.

Inextrudedform,itispossibletodesign-inawidevarietyoffeatureswhichwouldbedifficultandexpensivetoincorporateintoformedandmachinedmaterials.Italsopermitseasychangesoflength.

Thereareanumberofwaysofspecifyingtheactualmaterial-weuseBS1474.6063T6extrusion.

Insheetform,aluminiumcanoffergoodrigidityforitsweightandisrelativelyeasytopunchandhalfshearaccurately,withminimumtoolwear.OuraluminiumsheetisBSEN485-25251(H12-H26).

Ideally,fromthepointofviewofcorrosionandscuffresistanceandforagooddecorativefinish,anodisingisexcellent.Ourin-houseanodisingistoourownspecificationandwearerightlyproudoftheexcellentappearanceitproduces.

Aprocessknownas‘sub-surfaceprinting’isidealwhereapermanentwearandchemicalresistancearecalledfor,consistingofidentificationprintingbeforetheapplicationoftheanodicfilm.

Anodicfilm,whichiselectrolyticallyappliedisanexcellentinsulator.Itisthereforeunsuitableinmodernsubracksystemswhichneedtobeelectricallybondedduetoproblemsfromelectrostatics;theyalsofrequentlyhavetobeEMCscreenedbytheapplicationofcoversandpanelswhichmustallbeelectricallycontinuousasfaraspossible.

Forthatreason,mostofVerotec’ssubracksystemcomponentsarenowfinishedbymeansofachromateconversionprocess(typicaltradetermsareIrridite,Alocrom,Alodine).Thisprocessensuresthatthealuminiummaterialshaveagooddegreeofcorrosionresistance,whichinturnprevents‘selfanodising’overtime.Clearchromatehaslowsurfaceresistivity(lowerthanthecolourtypes)butbecauseitisonlyasurfacefilmcanbeaffectedbyscuffingandfinger-marking.Forthatreason,careshouldbetakenduringhandling.However,ithasagoodappearance.Fromaproductionpointofview,theuseofsteelinKM6-RFcoversoffersbenefitsinthatitprovidesstiffnessatlowerthicknesses.WeusemildsteelsheetCR4toBSEN10130

IncommonwithmoststeelcomponentsandfixingsthroughouttheVerotecsubrackrange,weuseclearpassivatedzincplatingtoprovidecorrosionresistancewithanacceptableappearance-althoughthecolourpassivationusedontappedstripsprovidesmuchgreaterprotectionagainstfrontpanelfixingscrews‘freezing’inprolongeduseorharshclimaticenvironments.

Mouldedplasticsareusedwherecomplexshapedcomponentsareusedinlargevolumes.Thereisahugerangeofbasicmaterialsavailable,butingeneralwearelookingforacosteffectiveplasticthathasgoodmouldingproperties,ismechanicallyanddimensionallystableoverafairlywiderangeoftemperaturesandhumidities,andconformstomodernrequirementsinfireresistance.ThelatterisusuallyexpressedasUL94-V*

(V0isthehighestlevel,V1beinggenerallyaslowaswewouldaccept).ItisimportanttonotethattheUL94testhasanumberofgradationsinthicknessandtestapplication.

Oneofthemajorproblemsassociatedwithplasticsistheirsusceptibilitytoattackbychemicalsolventsandwemakefrequentreferencetothis.Thiskindofdamagefrequentlyonlyshowswhenthematerialisunderstress(whenitisscreweddown,forinstance)andiscommonlycausedbythreadlockcompoundsorcleaningsolvents.Wherebreakagesoccur,asampleoftheitemconcernedcanusuallyestablishthenatureoftheproblem.

Itisimportanttonotethatmostplasticcomponentshavefine‘knitlines’wherethematerialflowsjoinduringthemouldingprocess-theyarenotnormallydeleterioustoperformancealthoughtheyarefrequentlymistakenforincipientcracks.

Theadditionofglassfibresaddstothestrengthofmouldedcomponents,andistypicallyusedinapplicationslikeinjector/extractors.Itisusedjudiciouslybecauseittendstoacceleratetoolwear.

MostofourmouldedsubrackcomponentsareproducedinmodifiedPPO(PolyphenyleneOxide)-typicallyunderthetradenamesLuranylorNoryl,orPolycarbonates-Makrolonforinstance.Thelatterisalsosuppliedinsheetformfortransparentpanels.

IntheareaofEMCseals,thereisageneraltrendtostainlesssteel,awayfromBerylliumCopper.Thelatterhasexcellentforming,spring,andconductiveproperties,butthereisconcernaboutitsdisposalattheendofequipmentlifecycles.

Subrack material and finishes


1 KM

6 S

ub

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1.15

CUSTOMISInG SERVICE

Verotechasmanyyearsofexperienceinthedesignandproductionofcustomisedsubracks.

Mostofourstandardsubracksareeasilymodifiedinordertosuitawiderangeofapplications.

ThelistbelowgivesthecustomisingoptionsavailableoneachofourKM6systems.Alsoillustratedareexamplesofmodifiedsubrackswhichwecurrentlyproduceforvariouscustomers.

Pleasecontactusforfurtheradviceandassistance.

CUSTOMISInG OpTIOnS

n Height

n Width

n Depth

n Punching/Drilling n SurfacePrinting n SubsurfacePrinting n Engraving n Alocrom/Irridite n Painting n Plating n Assembly n Wiring n BackplaneAssembly n Cooling n Kitting n BulkPacking n RFICapability n Anodising

Customising options

Customised/printed front panels

Special subrack

Customised KM6-II subrack

Customised side panelCustomised KM6-subrack


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1.16

A guide to KM6 subrack systems

KM6-II subrack system

KM6-RF subrack system

KM6-EC subrack system

KM6-HD subrack system

InTRODUCTIOn

In order to meet the diverse mechanical, electrical and environmentalrequirementsthattoday’smarkets&applicationsdemand,Verotecofferfourdistinct subrack ranges. All are designed around a number of dimensionalstandards that aim to provide a basic level of interchangeability betweendifferentversionsandbetweenmanufacturesofsimilarsystems.Thebasisis theDIN41494Eurocardstandardand thedimensions for thehousingofEurocardsaredescribedinIEC60297-3,towhichKM6-IIisdesigned.KM6-RFtooisdesignedaroundthisspecificationbutalsomeetstherequirementsofIEEE1101.10/11whichbuildsonIEC60297-3toofferadditionalfunctionality.For high volume and price sensitive applications such as infrastructureprojects,thelowcostKM6-ECisanidealsolution.Verotec’sanswertoheavyduty applications is the KM6-HD subrack which is designed to meet MIL-STD-167andthereforemakesitsuitableforapplicationswhereresistancetoexcessshockandvibrationisrequired.

KM6-II SUBRACK SYSTEM

Fully compatible with DIN 41494 part 5 and IEC 60297-3, KM6-II subracksarestrong,versatileandeasytoassemble.Alltiebarshavetwoscrewfixingpositionsmakingtheconstructionrobustyetaccurateandwellsuitedtolightandmediumduty applications. The range is extensive, offering3U,4U,6Uand9Uheightsinwidthof24,42,60&84HPanddepthsof160,240,300,360&420mm.KM6-IISubracksaresuppliedeitherinkitformorindividualcomponent parts and are complimented by a wide range of accessories,includingEMCconversionkits,guides,frontpanelsandplug-inmodules.

KM6-RF SUBRACK SYSTEM

The KM6-RF subrack range meets the requirements of IEEE 1101.10 & 11,whichexpandsonIEC60297toaddfunctionalityrequiredformodernindustrialcomputingapplications.ThisincludesRFIshielding,areartransitionarea,frontpanelESD/codingandhandleswithaninjector/extractoroperatingfeature.KM6-RFisthereforewellsuitedtoVME64x,CompactPCIandPXIapplications,serving typical markets such as Telecoms, Medical and Instrumentation.Therangecatersforvariouscombinationsofheight,widthanddepthandiscomplimentedbyawiderangeofaccessories,includingguides,frontpanelsandplug-inmodules.KM6-RFsubracksaresuppliedincompletekitsorintheircomponentparts.

KM6-EC SUBRACK SYSTEM

KM6-ECsubrackshavebeendesignedandaresuitableforhighvolume,costsensitiveapplications.Whilsttheyarestillversatileandfullyconformtotherequirements of IEC60297, care has been taken to remove certain featuresfound in theKM6-II range to reduce themanufacturingcost.These includelighterextrusionprofiles,single-pointtiebarfixings(ratherthandouble)andZintecsideplates(ratherthanaluminium).TheyarebackwardcompatiblewithmanyofthestandardKM6-IIaccessoriesincludingcardguides,frontpanels,plug-inmodulesandcovers.

KM6-HD SUBRACK SYSTEM

The KM6-HD subrack system although primarily designed for military use,wouldsuitanyruggedapplicationwherearesistancetoshockandvibrationis required. Built to meet MIL-STD-167, its features include positive guideretention,heavytwoscrewfixingtiebars,3mmthicksideplates&rackanglesandaconductive finish throughout.TheKM6-HDsubrackacceptsstandardEurocards in3U,6U&9Uheights anddepthsofup to400mm inboth theIEC297andIEEE1101.10standards.TheyaresuppliedfullyassembledandcomplimentedbythestandardrangeofKM6accessories.

VEROTEC Km6-1_16.pdf · UK Tel: +44 (0)2380-246900 [email protected] USA Tel: 603.821.9921 [email protected] 1 KM6 Subracks 1.04 Guide clearance connector mounting holes

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