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Since 1998, Intel and Kingston have jointly developed memory technology validation testing processes for PC133, RDRAM, DDR, DDR2, FB-DIMM, DDR3, LRDIMM, and DDR4.
DDR3 DRAM chip validation testing on new Advantest tester (DDR4 capable)
Checking early FB-DIMM prototype against specifications
• Memory Configurations for Intel server platforms
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Reliability: The Challenges of Memory Testing
Kingston Quality Standard: Zero bad cells 1 bad cell = defective module
1GB Over 8.5 billion cells
2GB Over 17 billion cells
4GB Over 34 billion cells
8GB Over 68 billion cells
16GB Over 136 billion cells
Memory Capacity Number of Cells
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Semiconductor Reliability
Early-Life Failures
Typically the first few months of usage
This curve of semiconductor failures over time is called a ‘bathtub’ curve
End-of-Life Failures
Nu
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Time
Ship out from Factory to user
Failure curve for lower-quality
semiconductor products
Useful Life Of Semiconductor
A typical useful life would be 20 years or more
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Kingston Production Testing and Dynamic Server Burn-In
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100% Testing
• No spot testing! Kingston memory is 100% tested prior to leaving our factories, as we have always done
Dynamic Server Memory Burn-In
• Shrinking DRAM lithography increases sensitivity to temperature, forcing higher error rates and exposing weak memory cells
• Kingston’s advanced burn-in process screens these by simulating 3 months of heavy server use at higher temperatures under full system environment and frequency stress
Proprietary Production Testers
• Kingston’s test engineers designed the first automated production testers in the memory industry
• New patented automated testers build upon our test engineering legacy to meet the more stringent demands of evolving memory technology
35 Quality Control Checkpoints
• Kingston uses AQL sampling methods to re-inspect and re-test every lot to ensure our quality standards are being met
Kingston holds 29 patents related to memory testing
Power 1.2V with improved refreshes, ½K page for x4 12V for NVDIMM (4-pins)
DRAM Densities/DIMM Capacities 4Gb, 8Gb, 16Gb (x4, x8, x16) Future DIMM capacities of 64GB, 128GB, 256GB
New Features 3D chip stacking support (up to 8 stacked dies) Point-to-Point Memory Channel addressing More stable than DDR3 with improved error correction code
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New Module Key Location
Slightly thicker for
improved performance
Curved edge for better
socket connection
“Low Voltage” (LV)
DDR3L = Low Voltage 1.35V JEDEC (industry spec)
• Modules are classified as PC3L-xxx
Reducing memory power consumption 10% by dropping module voltage requirement, lowering energy costs to data centers
Kingston DDR3L modules are dual-voltage supporting 1.35V / 1.5V
NVDIMM-F – An all FLASH memory module accessible by the memory controller.
NVDIMM-N – A DRAM memory module made persistent by the use of NAND flash silicon.
NVDIMM-N2 – Similar to NVDIMM-N but with system accessible Flash.
NVDIMM-M – MRAM based memory module accessible by the memory controller.
NVDIMM-x – New technology. PRAM? RRAM? HMC?
Kingston Memory Product Lines
ValueRAM
o Generic / JEDEC Specification
o Ideal for system builders or small
datacenters
System Specific
o Also known as “Branded”
o Guaranteed compatibility
o Ideal for users who want to upgrade
OEM machines
OEM / Private Label
o Customized in box solutions
o Contracted supply agreements
HyperX
o Enthusiast gaming market
o Overclocking
o Brand focused
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System Specific Memory
Guaranteed Compatible
• Testing conducted in the system in which the memory will be installed
Importance of Branded Memory
• Different chips provide varying performance levels
• Chip Compatibility can vary
• Possible constraints in module height or width
• Presence Detect Configuration
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ValueRAM Product Decoder
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• Kingston ValueRAM is built to industry standard specifications outlined by J.E.D.E.C., the Joint Electron Device Engineering Council, on which Kingston holds a seat. Intel, AMD, and other computing chipset architects adhere to these standards for industry agreement and cross-platform compatibility.
• J.E.D.E.C. provides the specifications for Pin Count, Form Factor, Speed, Power, and Memory Technology Types
Intel Certified intended specifically for customers who are using Intel branded server/workstation motherboards or systems
• Qualified and supported by Intel
• Controlled builds (BOMs)
• PCNs with 45-90 Day Notice
Server Premier intended for server builders with fully controlled BOM requirements (PCB, chip brand/die revision, etc) regardless of brand of motherboard used
• Fully BOM controlled
• PCNs with 45-90 Day Notice
• Easily manage what is ordered
• No price premium
ValueRAM Server Focused Programs
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ValueRAM Qualifications
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In addition to the strategic partnerships Kingston has with ODMs for submitting memory for qualification, we also work with independent memory test labs AVL and CMTL Labs for specific platform, motherboard, or system qualification. Test certificates are available on our website.
http://www.kingston.com/us/memory/valueram/server
Example:
• Optimizing Memory:
• DDR4 is NOT compatible with DDR3 based systems (module will not fit)
• Install memory in kits of identical modules according to memory architecture
• Configure all processors the same way for most bandwidth
• Do Not Mix Module Types within a server.
• Mixing DDR3 (1.5V) and DDR3L (1.35V) will default the memory to 1.5V.
• Ranks are virtual modules on a single DIMM, designed to save space on the motherboard
• Only one Rank is active at a time, the other ranks on the DIMM go into standby saving power
• 2R and 4R DIMMs consume less power than 1R DIMMs
• Memory lanes on the motherboard become congested with more memory loads, so server systems are limited by the number of ranks that can be used, as the memory slows down with more ranks populated, just line cars in heavy traffic
Single Rank (1R)
Quad Rank (4R)
Dual Rank (2R)
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64bits
64bits 64bits
64bits 64bits 64bits 64bits
Why Add Channels and Increase The Memory Speed?
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0
20
40
60
80
100
120
Single Channel(1 DIMM per CPU)2 x 16GB = 32GB
Dual Channel(2 DIMMs per CPU)
4 x 16GB = 64GB
Quad Channel(4 DIMMs per CPU)8 x 16GB = 128GB
DDR3 & DDR4 Aggregate Server Memory Bandwidth
DDR3-800
DDR3-1066
DDR3-1333
DDR3-1600
DDR3-1866
DDR4-2133
Benchmark by SiSoftware SANDRA 2013.05.19.44 on Intel DDR3 and DDR4 platforms
GB/s
Memory Supported Memory Configuration
Xeon 5500 Series DDR3-1333 Triple-Channel = K3 kits
Xeon 5600 Series DDR3-1333 / DDR3L Triple-Channel = K3 kits
Xeon E5 Series DDR3-1600 / DDR3L-1333 Quad-channel = K4 kits