1 KEY BENEFITS OF THE CARBON FIBER KEY BENEFITS OF THE CARBON FIBER COMPOSITE IN A PRINTED CIRCUIT COMPOSITE IN A PRINTED CIRCUIT BOARD AND A SUBSTRATE BOARD AND A SUBSTRATE PRESENTED BY: KRIS VASOYA, VP Engineering (THERMALWORKS) ON BEHAF OF HUNTER TECHNOLOGY NASA/JPL Science Forum, August-06
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KEY BENEFITS OF THE CARBON FIBERKEY BENEFITS OF THE CARBON FIBERCOMPOSITE IN A PRINTED CIRCUITCOMPOSITE IN A PRINTED CIRCUIT
BOARD AND A SUBSTRATEBOARD AND A SUBSTRATE
PRESENTED BY:
KRIS VASOYA, VP Engineering (THERMALWORKS)
ON BEHAF OF HUNTER TECHNOLOGY
NASA/JPL Science Forum, August-06
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Outline
Electronics Challenges
What is Carbon Fiber Composite Material
Test data of the Carbon Fiber Composite
How to use Carbon Fiber Composite in PCBs
Benefits of the Carbon Fiber Composite in PCBs
Conclusion
NASA/JPL Science Forum, August-06
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Challenges of the Electronics
The electronics Industry is facing challenges such asHOT SPOT
CTE mismatch,solder joint stress,
thermal fatigue failureshock and vibration issues,
“SMALLER, FASTER, LIGHTER”
NASA/JPL Science Forum, August-06
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Thermal & Thermo-mechanical material
Carbon Fiber Composite is used today in PrintedCircuit Boards and Substrate to address these issues.
Carbon Fiber Composite is also known asSTABLCOR® Laminates
NASA/JPL Science Forum, August-06
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What is Carbon Fiber Composite?
Made of Continuous Carbon Fiber reinforced with resin matrix
It is a thermally & Electrically Conductive Composite Material
It has very good In-plane Thermal Conductivity
It has low In-plane CTE (1-5 ppm/C)
It can be used as a plane layer, Preferably GND plane
Carbon Composite core
Copper
Copper
CCL
NASA/JPL Science Forum, August-06
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CTE – Carbon Composite
In-Plane CTE
CTE vs TemperatureMaterial: ST325-EP450 Unclad
-4-202468
1012141618
-60 -40 -20 0 20 40 60 80 100 120 140
Temperature (C)
CT
E(p
pm/C
)
X1 Direction X2 Direction Linear (X2 Direction) Linear (X1 Direction)
Composite CTE (0-3 ppm) overTemp. range of -50C to +130C
12 to 16Non-PTFE Ceramic(RO4000)
17.00PTFE Ceramic (RO3000)
9 to 12Non Woven Aramid/Epoxy
15 to 19Polyimide/E-glass
16 to 20FR-4 / E-glass
In Plane CTE(ppm/C)DIELECTRIC MATERIAL
NASA/JPL Science Forum, August-06
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CTE – Carbon Composite
209.57°C145.35°C
Alpha=42.1µm/(m·°C)
254.48°CAlpha=102µm/(m·°C)
Tg
-0.002
0.000
0.002
0.004
0.006
0.008
0.010
Dim
ens
ion
Ch
ange
(mm
)
0 50 100 150 200 250 300
Temperature (°C)
Sample: Tg and CTE test for CCLSize: 0.7159 mmMethod: Ramp TMA
For no underfill test, theFor no underfill test, thechips on Carbon Compositechips on Carbon Compositesubstrate remain attached atsubstrate remain attached at353 cycles. Most of the chips353 cycles. Most of the chipsdetached from the other testdetached from the other testboards at 353 cyclesboards at 353 cycles
With no underfill, theWith no underfill, thecharacteristic (63.2%) life ofcharacteristic (63.2%) life ofthe FRthe FR--4/NELCO is about 204/NELCO is about 20cycles . The carboncycles . The carboncomposite board is aboutcomposite board is about173 cycles173 cycles