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Process and Equipment engineers are here to assist you
Each tool has assigned engineers
Process/Equipment Engineer 1 is in charge of that equipment
Process Engineer 1 approves special processes on equipment
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Plan Your Work !
Some tools are heavily reserved
Plan ahead one week – minimize idle time
Time = Money
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Working in the NanoLab
Nanolab Rule #1:
NEVER WORK ALONE
3rd to last person to leave must go notify the other two!
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Working in the NanoLab
Entrance Checklist:
Passed the Safety Quiz There are no announcements preventing lab access The HazMat alarm is not active Have blue shoe covers on No food or drink on person
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Gowning Procedure: Top Down
Shoe Covers Enter Gowning Bouffant Cap Bunny Suit
Shoe Covers Gloves Safety Glasses Complete
De-gowning occurs in reverse order
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Entering the Lab Area
Gowning Checklist:
No chemicals in storage box Safety Glasses on Name tag visible on coverall Changed damaged or stained coveralls/shoes/other gear Using proper size coverall and shoe cover Log on at the computer terminal before entering lab
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Equipment Qualification
Read the Manual
Take Equipment Test(520 SDH Front
Desk)
Get Training (Any Qualified
Member)
Complete Prerequisite
Requirements
Oral Qualification(Superuser)
When in doubt – ASK STAFF
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Complete Prerequisite Qualifications
• Many equipment sets have prerequisite qualifications and/or classes offered by staff
• Evaporation, SEM, E-beam Litho, and confocal microscopy classes are offered periodically
• Some toolsets have gateway tools (e.g. msink 6/8, tystar1-4, Leo SEM)
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Read the Manual
All major equipment has a lab manual on website
Process engineers update manual – send any suggestions to us!
Manual inconsistencies are reported on Mercury as process faults
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Training – All qualified can train!
Check reservations for the tool
Find a member using equipment
E-mail: <membername>@silicon.eecs.berkeley.edu
Request to observe run and get training
Each One Teach One – Train someone at least 1x per semester
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Take Equipment Test
Equipment tests available at 520 SDH (Front Desk)
Usually available online via Mercury
Specific tests are written only – copies at front desk
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Oral Qualification – Superuser Only
Check Mercury for superuser names/email
E-mail: <membername>@silicon.eecs.berkeley.edu
Request qualification. Make reservation with superuser
Sometimes process staff are the only superusers
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Quality Monitoring
• Quality Monitor tracks processes
• Data is posted monthly on MercuryWeb
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Quality Monitoring
• Quality monitor reports show valuable data trends• Reports also show standard process conditions for the monitor
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Material and Process Compatibility
• The Nanolab is a diverse processing environment
• Nanolab materials restrictions are as open as possible
• Many processes are very sensitive (e.g., Sinks/Furnaces)
• Duplicate process capability allows separation of materials
• Materials restrictions are given by tool and group
• Materials restricted by: • Substrate, Process, and Maintenance
msink6 (8") Final Piranha - MOS clean sink 386No metals allowed- MOS clean sink
msink7 (6")Hot phosphoric, HF, silicon etch
386 No metals, PR coated wafers allowed
msink8 (8")Piranha clean,
BHF, aluminum etch386
No metals except aluminum in the aluminum etch tank, no PR coated wafers
msink16 (N/A) General clean - beaker process/part clean 582A Metal contaminated sink - Note 1
msink18 (N/A) General clean - beaker process/part clean 582A Metal contaminated sink - Note 1
Note 1 - Wafers processed at this sink are metal contaminated, ARE NOT ALLOWED to return to msink6, msink7, msink8.Note 2 - Gold, copper and or other highly diffusive metals ARE NOT ALLOWED at this sink.
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Ch 2 - Working at the Sinks• PPE must be worn when working at the sinks!
• Chemically resistant gloves• Face shield• Chemically resistant apron
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Ch 2 - Working at the Sinks
• Mixing chemistry can get HOT!
• Always use caution when adding chemicals and be aware of exothermic reactions
• Working at general purpose sinks (MSink16/18)
• You MUST be qualified• Describe your processes to each other• Process Tag all work at the station• Do not heat up a solvent directly on the heater chuck
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Ch 2 - General Wet Chemistry Cabinets
• Located in 582A, 381/383
• Standard chemicals available to members at no charge
• Special chemical storage needs pre-approval and label
• Use partial bottles first!
If empty – ask staff to restock
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Ch 2 - Changing Organic Bottles
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Ch 2 - Chemical Waste ManagementLog Sheet
Every pour requires an entry with a volume!
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Ch 3 - Mask Making at MNL
MNL provides in-house mask making• L-Edit Layout Software• GCA 3600 Pattern Generator• Refer to MNL Chapter 3 for complete details• Contact Process Engineer Jeff Clarkson for assistance
1. Furnaces are divided into MOS & non-MOS.2. Substrates must be cleaned before furnace use. Last pre-furnace step:
Msink6 for non-metal substrates, and,Msink1 for metal substrates going into metal approved furnaces.
3. III-V compounds are not allowed in any furnace.
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Ch 5 - Rapid Thermal Processors
RTP1 – III-V, PZT, metals; up to 6” wafersRTP2 – III-V; process up to 6” wafers
RTP3 – Si non-MOS, metals; up to 6” wafersRTP4 – Si MOS, silicidation; up to 6” wafers
RTP8 – Si MOS Gate Oxidation;Process up to 8” wafers
Rapid Thermal Processing has time scales on the order of seconds to reach up to 1100ºC. Applications include thermal oxidation, anneal, dopant activation and metal reflow.
MNL has a wide range of test and inspection equipment. See Chapter 8 in the MNL Manual for a complete list. Contact MNL Process Engineer Jeff Clarkson for assistance.