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JRA 23 (DPS-FA) G.Poggi Helsinki 19/09/2007 Q1 – The core activity of Digital Pulse Shape from FAZIA R&D Optimization of Silicon material for Pulse Shape Analysis applications. Presently the PSA technique is far from being fully exploited, because two non-intrinsic limiting factors, i.e. channeling and silicon doping non-uniformities. Channeling: proper choice of the cutting angle of the Silicon wafer eliminates the problem Doping non-uniformity: close co-operation with Silicon industries / detector manufacturers is necessary, together with the development of lab-based uniformity- test techniques Preliminary contacts with CANBERRA, TOPSIL, IRST/ITC confirmed the interest of specialized industries to co-operate Q1, Q2… refer to item1, 2 of the questionnaire
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JRA 23 (DPS-FA)

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JRA 23 (DPS-FA) ‏. Q1 – The core activity of Digital Pulse Shape from FAZIA R&D Optimization of Silicon material for Pulse Shape Analysis applications. - PowerPoint PPT Presentation
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Page 1: JRA 23 (DPS-FA)

JRA 23 (DPS-FA)JRA 23 (DPS-FA)

G.Poggi Helsinki 19/09/2007

Q1 – The core activity of Digital Pulse Shape from FAZIA R&D

Optimization of Silicon material for Pulse Shape Analysis applications.

Presently the PSA technique is far from being fully exploited, because two non-intrinsic limiting factors, i.e. channeling and silicon doping non-uniformities.

Channeling: proper choice of the cutting angle of the Silicon wafer eliminates the problem

Doping non-uniformity: close co-operation with Silicon industries / detector manufacturers is necessary, together with the development of lab-based uniformity-test techniques

Preliminary contacts with CANBERRA, TOPSIL, IRST/ITC confirmed the interest of specialized industries to co-operate

Q1 – The core activity of Digital Pulse Shape from FAZIA R&D

Optimization of Silicon material for Pulse Shape Analysis applications.

Presently the PSA technique is far from being fully exploited, because two non-intrinsic limiting factors, i.e. channeling and silicon doping non-uniformities.

Channeling: proper choice of the cutting angle of the Silicon wafer eliminates the problem

Doping non-uniformity: close co-operation with Silicon industries / detector manufacturers is necessary, together with the development of lab-based uniformity-test techniques

Preliminary contacts with CANBERRA, TOPSIL, IRST/ITC confirmed the interest of specialized industries to co-operate

Q1, Q2… refer to item1, 2 of the questionnaire

Q1, Q2… refer to item1, 2 of the questionnaire

Page 2: JRA 23 (DPS-FA)

JRA 23 (DPS-FA)JRA 23 (DPS-FA)

G.Poggi Helsinki 19/09/2007

CHANNELINGCHANNELING

Channeling directions: wildly fluctuating current shapes – to avoid for PSA

Random directions: narrow current shapes – good for PSA

For optimum PSA performances special cut of Silicon wafer is necessary, at the cost of limiting the angle covered by each individual crystal

Also standard ΔE-E identification technique will benefit of channeling removal (a too often overlooked issue)

Dig

itiz

edC

urr

ent

nsD

igit

ized

Cu

rren

tns

Current waveforms for 80Se @ 405 MeV stopped in Silicon (LNL, Legnaro)

Silicon detector mounted on a two-axis Goniometer

ions

“Pulse-Shape based Crystallography”

“Channeled” “Random”E

E

Page 3: JRA 23 (DPS-FA)

JRA 23 (DPS-FA)JRA 23 (DPS-FA)

G.Poggi Helsinki 19/09/2007

Non-uniformity of Silicon Doping

Non-uniformity of Silicon Doping

In beam test with 60Ni @ 700MeV Lab test with 5MeV α-particles (~standard)

Lab test with Pulsed UV laser scanning

Random

Selected area

More than a factor of 2 improvement

Full area

Risetime distribution for 58Ni @ 700 MeV as a function of the impact

point on a “random” oriented nTD-Silicon detector (LNL, Legnaro)Doping non-uniformity of Silicon: a

limiting factor for PSA and timing

Silicon Industries must improve striation control: even nTD silicon has significant residual resitivity striations

We will develop bench tests to control the doping, i.e. resistivity, uniformity

Current risetime distribution (PSA) for the demanding study case of 58Ni and 60Ni @ 700 MeV

Page 4: JRA 23 (DPS-FA)

JRA 23 (DPS-FA)JRA 23 (DPS-FA)

G.Poggi Helsinki 19/09/2007

Q3 – How European Nuclear Physics will benefit...

PSA in Silicon detectors is strategic in Nuclear Structure and Reaction studies (see many talks and posters during this meeting) existing Access Facilities, like GANIL, INFN (LNL-LNS), GSI, KVI will certainly benefit form this activity

Q2 – Is the JRA innovative?•Reduction of residual resistivity striations in the nTD Silicon of a few kcm would certainly constitute an important innovation in itself

•Resistivity measurements by pulsed UV laser scanning is a promising technique (and novel from many respects)

•Optimization of Pulse Shape Analysis in Silicon will give support to Nuclear Physics research

Page 5: JRA 23 (DPS-FA)

JRA 23 (DPS-FA)JRA 23 (DPS-FA)

G.Poggi Helsinki 19/09/2007

Q5 - Institutions expected to provide substantial support to JRA 23:CNRS-IN2P3 and GANIL (France), INFN (Italy), IFIN-HH (Romania), COPIN – Consortium of Polish Institutions (Poland), UNIVERSITY of HUELVA (Spain)

Q5 - Institutions expected to provide substantial support to JRA 23:CNRS-IN2P3 and GANIL (France), INFN (Italy), IFIN-HH (Romania), COPIN – Consortium of Polish Institutions (Poland), UNIVERSITY of HUELVA (Spain)

Q4 - Overlap with other EU activity....FAZIA is involved in WP5 of SPIRAL2 Preparatory Phase (now under negotiation). No support has been asked for that specific issue, i.e. optimization of Silicon Material for PSA

Q4 - Overlap with other EU activity....FAZIA is involved in WP5 of SPIRAL2 Preparatory Phase (now under negotiation). No support has been asked for that specific issue, i.e. optimization of Silicon Material for PSA

Page 6: JRA 23 (DPS-FA)

Thank you