JRA 23 (DPS-FA) G.Poggi Helsinki 19/09/2007 Q1 – The core activity of Digital Pulse Shape from FAZIA R&D Optimization of Silicon material for Pulse Shape Analysis applications. Presently the PSA technique is far from being fully exploited, because two non-intrinsic limiting factors, i.e. channeling and silicon doping non-uniformities. Channeling: proper choice of the cutting angle of the Silicon wafer eliminates the problem Doping non-uniformity: close co-operation with Silicon industries / detector manufacturers is necessary, together with the development of lab-based uniformity- test techniques Preliminary contacts with CANBERRA, TOPSIL, IRST/ITC confirmed the interest of specialized industries to co-operate Q1, Q2… refer to item1, 2 of the questionnaire
JRA 23 (DPS-FA) . Q1 – The core activity of Digital Pulse Shape from FAZIA R&D Optimization of Silicon material for Pulse Shape Analysis applications. - PowerPoint PPT Presentation
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
JRA 23 (DPS-FA)JRA 23 (DPS-FA)
G.Poggi Helsinki 19/09/2007
Q1 – The core activity of Digital Pulse Shape from FAZIA R&D
Optimization of Silicon material for Pulse Shape Analysis applications.
Presently the PSA technique is far from being fully exploited, because two non-intrinsic limiting factors, i.e. channeling and silicon doping non-uniformities.
Channeling: proper choice of the cutting angle of the Silicon wafer eliminates the problem
Doping non-uniformity: close co-operation with Silicon industries / detector manufacturers is necessary, together with the development of lab-based uniformity-test techniques
Preliminary contacts with CANBERRA, TOPSIL, IRST/ITC confirmed the interest of specialized industries to co-operate
Q1 – The core activity of Digital Pulse Shape from FAZIA R&D
Optimization of Silicon material for Pulse Shape Analysis applications.
Presently the PSA technique is far from being fully exploited, because two non-intrinsic limiting factors, i.e. channeling and silicon doping non-uniformities.
Channeling: proper choice of the cutting angle of the Silicon wafer eliminates the problem
Doping non-uniformity: close co-operation with Silicon industries / detector manufacturers is necessary, together with the development of lab-based uniformity-test techniques
Preliminary contacts with CANBERRA, TOPSIL, IRST/ITC confirmed the interest of specialized industries to co-operate
Q1, Q2… refer to item1, 2 of the questionnaire
Q1, Q2… refer to item1, 2 of the questionnaire
JRA 23 (DPS-FA)JRA 23 (DPS-FA)
G.Poggi Helsinki 19/09/2007
CHANNELINGCHANNELING
Channeling directions: wildly fluctuating current shapes – to avoid for PSA
Random directions: narrow current shapes – good for PSA
For optimum PSA performances special cut of Silicon wafer is necessary, at the cost of limiting the angle covered by each individual crystal
Also standard ΔE-E identification technique will benefit of channeling removal (a too often overlooked issue)
Dig
itiz
edC
urr
ent
nsD
igit
ized
Cu
rren
tns
Current waveforms for 80Se @ 405 MeV stopped in Silicon (LNL, Legnaro)
Silicon detector mounted on a two-axis Goniometer
ions
“Pulse-Shape based Crystallography”
“Channeled” “Random”E
E
JRA 23 (DPS-FA)JRA 23 (DPS-FA)
G.Poggi Helsinki 19/09/2007
Non-uniformity of Silicon Doping
Non-uniformity of Silicon Doping
In beam test with 60Ni @ 700MeV Lab test with 5MeV α-particles (~standard)
Lab test with Pulsed UV laser scanning
Random
Selected area
More than a factor of 2 improvement
Full area
Risetime distribution for 58Ni @ 700 MeV as a function of the impact
point on a “random” oriented nTD-Silicon detector (LNL, Legnaro)Doping non-uniformity of Silicon: a
limiting factor for PSA and timing
Silicon Industries must improve striation control: even nTD silicon has significant residual resitivity striations
We will develop bench tests to control the doping, i.e. resistivity, uniformity
Current risetime distribution (PSA) for the demanding study case of 58Ni and 60Ni @ 700 MeV
JRA 23 (DPS-FA)JRA 23 (DPS-FA)
G.Poggi Helsinki 19/09/2007
Q3 – How European Nuclear Physics will benefit...
PSA in Silicon detectors is strategic in Nuclear Structure and Reaction studies (see many talks and posters during this meeting) existing Access Facilities, like GANIL, INFN (LNL-LNS), GSI, KVI will certainly benefit form this activity
Q2 – Is the JRA innovative?•Reduction of residual resistivity striations in the nTD Silicon of a few kcm would certainly constitute an important innovation in itself
•Resistivity measurements by pulsed UV laser scanning is a promising technique (and novel from many respects)
•Optimization of Pulse Shape Analysis in Silicon will give support to Nuclear Physics research
JRA 23 (DPS-FA)JRA 23 (DPS-FA)
G.Poggi Helsinki 19/09/2007
Q5 - Institutions expected to provide substantial support to JRA 23:CNRS-IN2P3 and GANIL (France), INFN (Italy), IFIN-HH (Romania), COPIN – Consortium of Polish Institutions (Poland), UNIVERSITY of HUELVA (Spain)
Q5 - Institutions expected to provide substantial support to JRA 23:CNRS-IN2P3 and GANIL (France), INFN (Italy), IFIN-HH (Romania), COPIN – Consortium of Polish Institutions (Poland), UNIVERSITY of HUELVA (Spain)
Q4 - Overlap with other EU activity....FAZIA is involved in WP5 of SPIRAL2 Preparatory Phase (now under negotiation). No support has been asked for that specific issue, i.e. optimization of Silicon Material for PSA
Q4 - Overlap with other EU activity....FAZIA is involved in WP5 of SPIRAL2 Preparatory Phase (now under negotiation). No support has been asked for that specific issue, i.e. optimization of Silicon Material for PSA