Operating Instructions for the Jiggle Cell
Overview: The Jiggle cell is an especially useful test device
for controlling and/or trouble-shooting all types of electrolytic
nickel plating solutions. It is also uniquely well suited for
comparing the relative performance characteristics of different
addition agent systems. Perhaps the major advantage of the Jiggle
cell is that it uses a bent cathode test panel, rather than a flat
panel. The obvious benefit of this configuration is that it creates
shelf areas and recesses that correlate much more closely with the
situations platers actually encounter in production. Another
benefit is that the Jiggle cell utilizes a convenient solution
volume of 1000 ml. Thus, computing additions is straight-forward: a
1 ml. addition to the Jiggle cell is equivalent to adding 1 gallon
of material to a 1000 gallon production tank. Similarly, adding 7.5
grams of a powder is equivalent to adding 1 oz/gal to the main
solution. The larger cell volume also allows for more testing to be
done on a single sample of solution without significantly changing
operating conditions such as bath pH and addition agent
concentrations. The Jiggle cell can be used with just mechanical
agitation, just air agitation, or a combination of both types.
Equipment Required:
1000 ml Jiggle cell 0-10 amp Lab Rectifier Aquarium Size Air
Agitator (for Air Agitated Plating Baths) Electrolytic Nickel Anode
-- 1.5" x 8" Polypropylene Anode Bag 180 Grit Waterproof Silicon
Carbide Sandpaper (such as 3M #9047) Zinc Coated Steel Jiggle Cell
Panels Polished Brass Jiggle Cell Panels
Test Procedure: 1. Pour 1,000 ml. of solution to be tested into
Jiggle cell. 2. Plug in heater and agitation motor (and air source,
if air agitation is to be used),
and allow solution to reach normal operating temperature used in
production. 3. Attach red lead from rectifier to the anode, and the
black lead from the rectifier to
the cathode holder. 4. If leveling is to be measured, scratch
test panel (without removing protective zinc
coating) over entire surface that will face the anode in the
cell. Use sufficient pressure to ensure that the scratches are
through the zinc coating and into the base metal. If leveling is of
no concern, or if tests must be run over a polished surface, omit
this step.
5. Bend test panel to approximately duplicate configuration
shown in Figure 1. 6. Remove protective zinc coating by immersing
panel in a 30-50% vol.
Hydrochloric Acid solution. Be sure all zinc is removed;
otherwise it will create erroneous test results.
7. Wipe panel with a small wet sponge to remove any smut on the
surface of the
cathode. Pay particular attention to the recessed areas, since
residual smut in these areas will lead to erroneous results. Rinse
well.
8. Attach cleaned cathode to cathode holder and submerge in
solution. 9. Turn on rectifier and immediately adjust to proper
amperage. Typically, a
current of 3.5 amps will provide the most meaningful results. If
production conditions are atypical, i.e., significantly higher or
lower than normal current densities are used, select an amperage
that corresponds to actual plant conditions.
10. Plate panel for ten minutes, adjusting current as needed to
maintain the initial
preferred amperage during this time period. Normally the current
will increase slightly from the initial setting once the cathode
surface is completely coated with nickel.
11. Turn off rectifier at the end of the plating cycle, and
remove panel. 12. Rinse panel in fresh running water, and dry. 13.
Examine panel for overall appearance and changes from previous
panel(s).
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14. Label panel listing any additions made or changes in
operating conditions compared to last panel run. This will
facilitate selecting the optimum additions to be made in
production.
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Area #1 Intermediate current density area (35-40 ASF).
Demonstrates leveling with moderate thicknesses of nickel.
Area #2 Low current density area (5-20
ASF). Shows leveling with thin nickel deposits. Bottom shelf
area also useful for determining the presence of suspended
solids.
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Area #3 Very low current density area (