22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected]www.systemplus.fr Intel’s Embedded Multi - Die Interconnect Bridge (EMIB) First Consumer application in the Intel Core 8 th generation i7-8809G PACKAGING report by Stéphane ELISABETH October 2018 – Version 1 REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
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Intel’s Embedded Multi-Die Interconnect Bridge (EMIB ...... · Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) ... • We have analyzed the Intel Core i7-8809G which is
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• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and sellingprice of the Intel Core i7-8809 with EMIB technology.
• We have analyzed the Intel Core i7-8809G which is the eight generation of Intel core i7 processor. The Processor features a computer processor unit (CPU), a discrete graphics processor unit (GPU) and a second generation of high bandwidth memory (HBM2) on the same package. The GPU has an 4GB high bandwidth cache assembled from one 4-Hi HBM2 stacks giving almost 200 GB/s of bandwidth.
• Focusing on the GPU and HBM integration, the report shows that in a small package area 29x19 mm 12-layer flip-chip ball grid array (fcBGA) package, the component uses almost 700 mm² of silicon, an impressive silicon-to-package ratio. Regarding the HBM2, only one stacks of 1GB are used to obtain the 4GB capacity. As for NVIDIA’s GPUs, Samsung is the provider of the HBM2 stacks. The 4GB HBM2 consists of four 1GB HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnected by TSVs and microbumps.
• Compared to NVIDIA or AMD which uses Interposer, with via-middle Through Silicon Vias (TSVs), the Intel product uses EMIB technology which consist in a silicon bridge buried in the PCB substrate making the interconnection between the HBM2 stacks and the GPU. This approach has some inherent advantages such as the ability to implement high density interconnect without requiring TSVs and to support the integration of many large dies in a high area. The only other application available on the market is into a high-end FPGA, the Stratix X.
• The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding processes, equipment and materials. Also, the complete manufacturing supply chain is described, and manufacturing costs are calculated.
• The report compares the Intel solution with AMD’s Radeon Vega Frontier solution and NVIDIA’s Tesla P100, highlighting the integration choices made by both companies.
Manufacturing Process Flowo Global Overviewo GPU FE Process & Fab. Unito HBM2 FE Process & Fab. Unito HBM2 Stacking Process Flowo Silicon Bridge FE Process & Fab.
Unito PCB Substrate Process Flowo PCB Substrate Fab.Unito Final Test & Assembly Unit
Hypotheseso GPU Wafer & Die Costo HBM2 Wafer & Die Costo Silicon Bridge FE Costo Silicon Bridge Die Costo PCB Substrate Mnf. Costo EMIB cost per process stepso Component Cost
Hypotheseso GPU Wafer & Die Costo HBM2 Wafer & Die Costo Silicon Bridge FE Costo Silicon Bridge Die Costo PCB Substrate Mnf. Costo EMIB cost per process stepso Component Cost
Hypotheseso GPU Wafer & Die Costo HBM2 Wafer & Die Costo Silicon Bridge FE Costo Silicon Bridge Die Costo PCB Substrate Mnf. Costo EMIB cost per process stepso Component Cost
PACKAGING• AMD Radeon Vega Frontier Edition• NVIDIA Tesla P100 GPU with HBM2• Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• Status of the Advanced Packaging Industry 2018• Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrate Like PCB Trends• 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
In the last few years, as the central andgraphics processing unit (CPU and GPU)technology has advanced, the need forhigh DRAM memory bandwidth has led toan increased focus on high bandwidth on-package links. And so, localized high-density interconnects devices betweentwo or more dies has been investigated toprovide high bandwidth signaling in orderto open up new opportunities forheterogeneous on-package integration.The typical proposed devices areinterposers in glass, organic or siliconsubstrates. Intel has developed its ownapproach called an Embedded Multi-dieInterconnect Bridge (EMIB), which offerssimpler integration.
We have analyzed the Intel Core i7-8809G, which is the eight generation ofIntel core i7 processor. The processorfeatures a CPU, a discrete GPU andsecond generation high bandwidthmemory (HBM2) on the same package.The GPU has a 4GB high bandwidth cacheassembled from one 4-Hi HBM2 stack offour DRAM dies, giving almost 200GB/s ofbandwidth.
Whereas NVIDIA and AMD both useinterposers with via-middle TSVs, the Intelproduct uses EMIB technology. Thisconsists of a silicon bridge buried in theprinted circuit board (PCB) substrate,making the interconnection between theHBM2 stack and the GPU. The approachhas some inherent advantages, such asthe ability to implement high-density in
interconnect without requiring TSVs andto support the integration of many largedies in a large area.
Focusing on the GPU and HBMintegration, the report shows that in asmall 29mm x 19mm area 12-layer flip-chip ball grid array (fcBGA) package, bothcomponents use under 700mm² of silicon,an impressive silicon-to-package ratio.
This report includes a complete physicalanalysis of the packaging process, withdetails of all technical choices regardingprocesses, equipment and materials. Also,the complete manufacturing supply chainis described, and manufacturing costs arecalculated.
The report compares the Intel solutionwith AMD’s Radeon Vega Frontier andNVIDIA’s Tesla P100, highlighting theintegration choices made by allcompanies.
COMPLETE TEARDOWN WITH
• Detailed photos and cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Physical comparison with NVIDIA Tesla and TSMC CoWoS, and AMD Radeon Vega and SPIL CoW
First consumer application in the Intel Core 8th Generation i7-8809G, theworld’s first On-Package CPU and GPU with High Bandwidth Memory.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
AMD Radeon Vega Frontier EditionThe first SiC power module in commercialized electric vehicles.November 2017 - EUR 3,490*
NVIDIA Tesla P100 GPU with HBM2TSMC CoWoS – Samsung HBM2 – 2.5D and 3D Packaging.February 2018 - EUR 3,490*
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone XThe latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC’s updated inFO packaging.June 2017 - EUR 3,490*
Véronique Le Troadec hasjoined System Plus Consultingas a laboratory engineer.Coming from Atmel Nantes,she has extensive knowledge infailure analysis of componentsand in deprocessing ofintegrated circuits.
Dr Stéphane Elisabeth has joinedSystem Plus Consulting's team in2016. He has a deep knowledgeof Materials characterizationsand Electronics systems.He holds an Engineering Degreein Electronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.
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