Intel Supplier Forum, IMEC Sept 2010 1 Semiconductor E&M & Manufacturing in Europe – Quo Vadis? Georg Kelm European Commission, DG INFSO, Nanoelectronics.

Intel Supplier Forum, IMEC Sept 2010 ••• 1

Semiconductor E&M & Manufacturing in Europe –

Quo Vadis?

Georg Kelm

European Commission, DG INFSO, Nanoelectronics


1. SC Industry -What is the Situation Now?

2. Dialogue Between Industry and Policy

3. What Can and Will Policy Do?After Lisbon: EU2020 and Digital Agenda

5. SC E&M & Manufacturing in Current R&D Programmes

6. Last Words

Disclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission

Outline


Pessimists (realists?) say:- European semiconductor manufacturing capacity dropped 25% from 2005-2008- 95% of global investments in semiconductor manufacturing now outside Europe

Why?- Unfair competition for European semiconductor ecosystem

But:- Is this the main reason why Qimonda went bankrupt?- Why is R&D efficiency so much lower than in the US?- Also: there are still investments–e.g. Crolles or Dresden

What is the Situation in Europe now?


Optimists (idealists?) say:-We still have IDMs, more foundries, world leading institutes, well developed E&M industry in selected areas-Imposed paradigm shift has advantages: Why?Healthier mix MM and MtM, better use of technologyShift to MtM: emphasis of European strengths But:- Existing base needs support, private and public- Triangle of Education-R&D-Innovation decisive - Synergy of policies mandatory, national and EU

What is the Situation in Europe now?


Past 5 years–intensive interaction between Industry, Research and EC:- e.g. ESIA reports and TF, SEMI White Paper issued

Common understanding at all levels:- No Knowledge Society w/o R&D and Innovation - Semiconductor devices are a driving force for innovation in Europe's key industries - SC technology addresses societal issues as climate change, renewable energy, security or health care

Actions at European level – Result of Dialogue:- 2008: Strategic Initiatives Eniac and Artemis launched- 2009: Communication on Key Enabling Technologies- 2009: European 450 mm E&M initiative (EEMI450)E

U2020 and Digital Agenda

Dialogue


ENIAC Joint Undertaking as Public-Private Partnership

Industry and R&D actors

Commission and Public

Authorities

Executive Dir. and secretariat

Se

curity &

Sa

fety

He

alth

& W

elln

ess

En

erg

y & E

nviro

nm

en

t

Tra

nsp

ort &

Mo

bility

e-S

ocie

ty

Co

mm

un

icatio

n

7. Design Methods & Tools

8. Equipment & Materials


Identified Key Enabling Technologies (KET)

• Nanotechnology holds the promise of leading to – among others - the development of smart nano and micro devices and systems;

• Micro- and Nanoelectronics, including semiconductors, are

essential for all goods and services which need intelligence and functionality;

• Photonics provides the technological basis for the conversion of sunlight to

electricity which is important for the production of renewable energy and for a variety of electronic components and equipment such as photodiodes,

• LEDs and lasers.

• Advanced Materials such as lightweight materials facilitate lowering the carbon footprint and energy demand as well as limiting the need for raw materials;

• Biotechnology brings cleaner and sustainable process alternatives for industrial and agrifood operations


EEMI450 Initiative: Long-term Objectives

• To improve the competitiveness of the European semiconductor E&M industry, increase their chances to be selected by the tier 1 semiconductor companies in their future 450mm operations.

• To stimulate a European infrastructure that is leading in 450mm E&M development and as a result will induce tier 1 companies to cooperation programs and possibly to equip 450mm fabs in Europe.


EEMI450 Project

• The EEMI450 ENIAC project represents the start of 450mm E&M efforts in Europe

• The project has 26 participants out of 7 countries: Austria, Belgium, France, Germany, Hungary, Ireland, Netherlands

and United Kingdom

• The project targets 450mm proof-of-concept of wafer manufacturing, waferhandling plus automation, process plus litho modules and metrology




3. What Can and Will Policy Do?After Lisbon: EU2020 and Digital

Agenda


6. Last Words


Outline


Lessons from Lisbon Strategy

Strong convergence on direction of reforms ...- Concrete results before crisis - employment grew moderately- « Lisbonisation » of structural funds

... But a delivery gap has built up:- Uneven progress between Member States- Key targets - R&D + employment - not reached- Lack of ownership; weak communication - Regions not sufficiently involved- Too EU-inward looking

• UPDATE VISION TO POST-CRISIS WORLD • IMPROVE DELIVERY


3 priorities:• Smart Growth: knowledge and innovation economy• Sustainable growth: greener and competitive economy• Inclusive growth: high employment, knowledge people and social and territorial cohesion

COMMUNICATION FROM THE COMMISSION COM(2010) 2020 http://ec.europa.eu/eu2020/pdf/COMPLET%20EN%20BARROSO%20%20%20007%20-%20Europe%202020%20-%20EN%20version.pdf

EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth

5 EU Targets – translated into national ones

7 Flagship initiatives – EU & national action

From 10 years Lisbon Strategy to EUROPE 2020

• UPDATE VISION TO POST-CRISIS WORLD • IMPROVE DELIVERY

http://ec.europa.eu/avservices/download/photo_download_en.cfm?id=206048




Europe 2020: Five EU Headline Targets

By 2020: • 75 % (now 69) employment rate (% of population aged 20-64 years)

• 3% (now 1,8%) Investment in R&D (% of EU’s GDP)

• “20/20/20” climate/energy targets met (incl. 30% emissions reduction if conditions are right)

• < 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree

• 20 million less people (now 80) should be at risk of poverty


And the Private Sector?

Private expenditure on all R&D as % of GDP – average annual growth 2000-2007(source: EC, DG Entr)


Europe 2020: 7 Flagship Initiatives underpin the Targets

Smart GrowthSmart Growth Sustainable GrowthSustainable Growth Inclusive GrowthInclusive Growth

Innovation« Innovation Union »

Climate, energy and mobility

« Resource efficient Europe »

Employment and skills« An agenda for new skills

and jobs »

Education« Youth on the move »

Competitiveness« An industrial policy for the globalisation

era »

Fighting poverty« European platform against poverty »

Digital society« A digital agenda for

Europe »

http://ec.europa.eu/commission_2010-2014/kroes/index_en.htm

http://ec.europa.eu/commission_2010-2014/tajani/index_en.htm

http://ec.europa.eu/commission_2010-2014/geoghegan-quinn/index_en.htm


Europe 2020: Role of Cohesion Policy

• Cohesion Policy is largest source of multi-sector EU funding - much larger than R&D budget: Use it also for R&D&I objectives

• Need to demonstrate that EU instruments work together, not against each other

• Europe cannot achieve ‘2020’ goals unless regions achieve them


Digital Agenda for Europe

• Fast Internet • Digital Single Market • Digital Citizenship • ICT Research and Innovation

need greater priority • Trust & Security • Interoperability


Key Enabling Technologies (KETs)

• Driving force of the development of future goods and services

• Being at the forefront of competitiveness, innovation, knowledge-based economy

• Modernisation of the industrial base and in the further strengthening of the research base

• Creating related eco-systems of SMEs.

• Knowledge intensive (high R&D and capital expenditure)

• Associated with highly-skilled employment

• Multi-disciplinary, cutting across many technology areas, converging

• Create multiplier effects• Enabling process, good and service

innovation and are of systemic relevance.

Importance of KETs Defining KETs

Source: European Commission


The Way Forward-Support of Key Enabling Technologies-

Short Term

Better application of existing state aid rules

Trade: Ensure level playing field

Improve access to finance

Reinforce existing initiatives on KETs & link KETs with EU2020

Long Term

Establish a high level expert group (HLG)

- Assess competitiveness situation

of KETs focusing on deployment

- Analyse R&D capacity

- Policy recommendations

Need to create a shared long term vision and partnership between Commission and Member states and industry and Key stakeholders.

Invite Member States to agree on importance of KETs and support the orientation included in the Communication.

Shared long term vision


R&D is the basic element for the Innovation process

R&D is an integral part of high end manufacturing

Investor’s decision for a production site is influenced by comparison of incentives on a global scale

Risk of losing the production lines AND also the R&D

Conclusions:

1. Where Europe Invested in R&D, State Aid Should be Allowed for Subsequent Investments

2. European Clusters show:

Win-Win Possible for Industry and Society

State Aid for Large Investments –An Element for the Post-Lisbon Process?


The Supply Chain Today

Systems2008

~1430B$2009

~1380B$

Devices2008

~275B$2009

~250B$

Equipment2008

~31B$2009

~17B$

Material

~20B$

2010~1440B$

2010~280B$

2010~26B$

Global electronic market supply chain revenue

Source: Gartner, Ic Insights (2008-2009)Automotive

Industrial and Medical

Military, Civil Aerospace, Security

Consumer

Communications

Data Processing


Military, Civil Aerospace,

Security

Industry and Medical

AutomotiveCommunicati

onsConsumers electronics

Data processing

Devices (IDM, Fabless, Foundry) * *** *** ** * *

Equipment suppliers **

Material suppliers **

• ***: various European players well positioned• **: 1 or 2 major European players and several small• *: very few European playersSource: Datamonitor, Global SC Equipment, March ‘09

Few specialized players

Rest of the world9%

Americas18%

Asia/Pacific65%

Europe8%

Semiconductor equipment sales by region

Equipment suppliers

First European player ASML (NL) ranked 3rd w/w

Other significant European players

ASMI (NL) (2nd European)

Aixtron (DE) (3rd European)

Substrate Material suppliers

First European player Siltronic (DE) ranked 3rd w/w

Other significant European players

SOITEC 1st SOI wafer supplier

Okmetic

80% of the Equipment Suppliers are SMEs

Equipment and Material suppliers




3. What Can and Will Policy Do?After Lisbon: EU2020 and Digital Agenda


6. Last Words


Outline


• New semiconductor manufacturing approaches, processes and tools

• Joint assessments of novel process/metrology equipment and materials

• Supporting 200/300mm wafer integration platforms

• Preparatory work for 450mm wafer processing

Funding schemes:STREPs

IP

FP7 Nanoelectronics E&M and Manufacturing Targets 2007-10


Thematic Coverage FP7 R&D Nanoelectronics 2007-10

ProcessesFunding: 35 M€

24 %

DesignFunding: 34 M€

23 %

E&M and Mfg(incl. Europractice)

Funding: 35 M€ 21 %

DevicesFunding: 35M€

24 %


Project SEAL: SEA-Leveraging Innovation

35% of suppliers are SMEs

Users: • Global Foundries, Infineon, Intel, LFoundry, MEMC,

Numonyx, Siltronic, Soitec, STMicroelectronics Crolles

Equipment Suppliers: • Hamatech, Alcatel Vacuum, Jenoptik

Automatisierungs-technik, SUSS MicroOptics, Reinhardt Microtech, SUSS Microtech Lithography, MAPPER, Toppan Photomasks, HQ-Dielectrics, SUSS Microtec, Ion Beam Services,

• Lam Research, Nanda, Semilab, Fries R&T, Applied Materials, Integrated Circuit Testing, Oxford Instruments, Metryx, PVA TePla, KLA-Tencor, ProTec

Research Institutes: • CEA/LETI, Fraunhofer IISB, imec, UALB, ICN, FHWN

Budget/Funding:• 14,3 Mio EUR / 9,1 Mio EUR

Duration: June 2010 – May 2013


SP8-PLASMA-TRANS -Plasma Immersion II Tool for Defect Engineering & CMOS imager application

Partners: Ion Beam Services, CEA/LETI, STMicroelectronics CrollesCoordinator: Frank TORREGROSA/ IBSDuration: 24 Months

Short description:Extension of application field by tool modification (process control, pressure, temperature)Assessment of modified tool

Advances proposed Plasma Immersion Ion ImplantAdaptation and evaluation of the IBS PULSION platform for defect engineering/getteringApplication to:

CMOS imagers trench doping shallow trench isolation (STI) deep trench doping for power applications shallow junctions with low thermal budget activation for

backside doping.Modifications for improved throughput

PULSION-nano® tool installed in LETI


SP15 - M4More Mass Metrology for Monitoring

Partners: Metryx, Intel, imecCoordinator: Mark Berry / MetryxDuration: 30 Months

Short description:Assessment of fab ready 300mm tool for mass metrologyEvaluation of new applications like Ion Implantation, Gate Stack, barrier seed layers for BEoL and 3D integration

Advances proposed in M4Assessment of the next generation of mass metrology tools incorporating a high-resolution mass metrology measurement moduleResolution improvement of a factor of 100 to 0.1 micrograms, and a repeatability improvement of a factor of 10 to 8 micrograms. Allow the introduction of mass metrology into new applications, structures and materials being introduced at the 22nm dimension. The advanced modular construction of the tool will also provide the capability of adding multiple mass modules with mixed measurement capability, an extendable platform to cope with ever increasing volumes, and the capability of mixed technologies for custom metrology solutions


MAGIC: The European Initiative on Multibeam Lithography

• Push the insertion of ML2 technology for semiconductor manufacturing– Demonstrate technology interest and capability

• Resolution• Throughput

– Develop first 300mm multi beam platforms• Build infrastructure for a fast and secure start-up

– Fields of development : process, data preparation, proximity effect controls…

– Highlight CMOS process integration compatibility

Tool devlpt DP (1) PI (3) & Technologyassessment

EBPC (2) &simulation

Tool devlpt

Project leader

FUJIFHV


High energy multibeam demonstration capability

• Project driver : IMS Nanofabrication (Vienna)

• Throughput potential– Multi axis : 76 columns

• Each beam covering 1 die area• 256k beam per axis – 1µA per axis

– 5-6wph per exposure module

50 keV

5 keV

programmable

Aperture Plate System

(APS)

32nm hp

25nm hp SRAM test case


Low energy multibeam demonstration capability

• Project driver : MAPPER Lithography (Netherlands)

• Throughput potential– 10wph per module

• 1 module : 1m²• 13000 beams per module

Positive CAR

CD=37nm -D=42µC/cm²Positive CAR

CD=40nm-D=200µC/cm²

HSQ

CD=26nm-D=673µC/cm²

32nm hp resolution 40nm hp Contact hole


110 nm150 nm200 nm

InP

InGaAs channel will be grownhere

STI

Si

Aixtron as equipment partner!

One of the Challenges: Integration on Silicon and the heteroepitaxy problem

DUALLOGIC approach: Use standard Si STICompatibility with standard CMOS cost effectiveness IP re-use

Problem : Narrow trenches !

IMEC results in DUALLOGIC : G.Wang et al., ECS Trans. 27, p. 959 (2009)

Ge in Si STI IMEC results in DUALLOGIC: G. Wang et al., APL 96, 111903 (2010)

InP buffer in Si STI


Fab of the Future (FoF)Smart Factories - 2009

“Smart Factories” expected impact:– Higher level of intelligence & environmental

consciousness on the shop floor

– Introduction of advanced automation into mainstream manufacturing

– Higher productivity of customised manufacturing paired with reduced emissions & waste

Smart Factories

ICTDigital

FactoriesVirtual

Factories

More to come in 2011, 2012, 2013


Thematic Coverage FoF - Smart Factories 2009 -

Integrated Process Automation

Energy & MatMonitoring

Robotics EnabledMfg.

Laser Applications in

Mfg

Result: 8 proposals with 35 M€ funding


Topics and Targets:

- Very advanced Si and non-Si switches, memories and interconnects (perf/ee)

- Co-integration of non-Si, charge, spin, photon based devices on Si

- Combined modelling, technology+ design work at circuit, device, material level for monolith and 3D integr of BeyondC+very adv. MtM on Si backbone

- Mfg solutions for integration/interfacing of

Beyond CMOS+MtM with NanoCMOS - E&M solutions to manufacture and measure

1D + 3D Si, including E&M assessment

- CSAs to support 450 mm cordination, develop strategies, attract young ones and link up globally to support IP creation and manufacture in Europe

Very Advanced NanoE Components 2011-12

2011 60M€ STREPs, IPs, CSAs


Transport and Mobility Energy and Environment

Design Methods and Tools

E&M and Manufacturing

E3Car SE2A SmartPM

IMPROVE

MODERN

ENIAC Themes covered - 1st call - 2008

Electric car Car safety & efficiency

Power managemen

t

Reliability

LENSJEMSIP_3D

NEPTUNE

Productivity

LithographyHeterogeneity

Heterogeneity

Proposals selected for funding (EC + MS) per sub-programme

33 M€ 10 M€

43 M€12 M€


Health and Wellness Energy & eSociety

Design Methods and Tools

E&M and Manufacturing

CSI

MAS

Last Power EEMI 450 END

ENIAC Themes covered - 2nd call - 2009

3D imaging

Remote monitoring &

therapy

Wide bandgap materials

Energy-aware design

ESiP

450mm preparation

Multi-chip integration

Proposals selected for funding (EC + MS) per sub-programme

33 M€ 11.6 M€

31 M€ 6.3 M€

Security and Safety

Communications

CSSL

Solid state lighting

MERCURE

Wide bandgap & RF MEMS

CAJAL4EU

Biosensors for

diagnostics

MIRANDELA

mm-wave & RF integration

SMART

Secure storage

16 M€ 8.5 M€


Target R&D Activities E&M + Manufg:

- EUV sub-22 + complementary 1x nm patterning - 450 mm supply chain - Metrology Innovation - Green & flexible Manufacturing - Photomask innovation - 3D IC Manufacturing - Disruptive BEOL Technology + WL-Packaging - Large Area Organic Substrates

Call 3: Projects being selected at present !

Eniac - Annual WP 2010

2010 25-30 M€ 3 year projects


First half of FP7 (2007-10): - More than 50 different European SC E&M suppliers

participating in R&D and assessment projects, more than 40% of them being SMEs

- More than 150 M€ invested in SC E&M and Mfg

Second half of FP7 (2011-13):

- R&D funding will increase by 30%.

NanoE E&M and Mfg in FP and Eniac2007-10


Last Words

New European Commission with Emphasis on R&D&I – basis for sustainable growth in Knowledge Society

The European R&D&I Programmes are investing in key technologies as nanoE - a basis for innovation and growth

In the long run no SC ecosystem w/o SC E&M & Mfg

Opportunity if:

The Europeans keep IP and silicon together Industry sees recent paradigm shifts as a chance not a threatPolicy and industry adapt a holistic approach to face global challenges

It Seems There is a Common Will to Act Jointly!


THANK YOU

[email protected]

Intel Supplier Forum, IMEC Sept 2010 1 Semiconductor E&M & Manufacturing in Europe – Quo Vadis? Georg Kelm European Commission, DG INFSO, Nanoelectronics.

Documents

intel supplier forum

nanoelectronics slide

semiconductor em manufacturing

sc industry

digital agenda dialogue

sc em manufacturing

developed em industry

rd actors commission