Integration of pre-fabricated ultra-high density (1000 nF/mm 2 ) capacitor films (50-75 microns) onto wafers and panels Himani Sharma, P. M. Raj* (Presenting author), Parthasarathi Chakraborti, Teng Sun, Nathan Neuhart, Kamil-Paul Rataj^, Saumya Gandhi+, Udo Merker&, Frank Stepniak+, Matt Romig+, Mitch Weaver, Naomi Lollis#, and Rao R. Tummala 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA ^ - H.C.Starck GmbH, Im Schleeke 78-91, 38642 Goslar/Germany + - Texas Instruments, 13020 TI Blvd, Dallas, TX 75243 # A.V.X. Corporation, One AVX Blvd, Fountain Inn, SC 29644 & Heraeus Inc., Leverkusen, Germany.
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Integration of pre-fabricated ultra-high density (1000 nF/mm2) capacitor films (50-75 microns) onto wafers and panels
Himani Sharma, P. M. Raj* (Presenting author), Parthasarathi Chakraborti, Teng Sun, Nathan Neuhart, Kamil-Paul Rataj^, Saumya Gandhi+, Udo Merker&, Frank
Stepniak+, Matt Romig+, Mitch Weaver, Naomi Lollis#, and Rao R. Tummala
3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA
^ - H.C.Starck GmbH, Im Schleeke 78-91, 38642 Goslar/Germany
+ - Texas Instruments, 13020 TI Blvd, Dallas, TX 75243
# A.V.X. Corporation, One AVX Blvd, Fountain Inn, SC 29644
& Heraeus Inc., Leverkusen, Germany.
Slide 2
CONFIDENTIAL
Outline
Introduction to GT Packaging Research Center
Capacitor needs for consumer, telecom and automotive industry
Capacitor integration strategies
Tantalum film capacitors on silicon– Capacitor Integration
– Capacitor performance
– Reliability studies
Integrated voltage regulator (IVR) with capacitors and inductors
CP/Carbon/Silver paste/lead frame Minimal interfaces;Direct metallization of CP with Cu/Au
100 milliohms x microfarad 20-50 milliohms x microfarad
1-5 MHz >10 MHz
Bulky Ta Vs Silicon-Integrated Ta Film Capacitors
Slide 11
CONFIDENTIAL
100 nm/ 200 nm II. Lamination on Si
Vacuum laminator
III. Planarization
I. Passivation
IV. Via drill
a. Desmearing
b. Electroless Cu seed layer
c. Photolithography
d. Electroplating
Capacitor foil
Capacitor Integration scheme
V. Metallization
Slide 12
CONFIDENTIALDemo. of Capacitor Integration
• Anodization voltage- 20 V at 85oC
ABFPorous Ta
Ta foil
ABF
64 µm
10 µm
• Sintered tantalum electrodes on tantalum films
• Laminated onto Silicon
• Via connections with laser drilling, metallization
Slide 13
CONFIDENTIAL
Supply Chain Involvement
Ta foil
Anode Cathode
AnodeCathode
Component Manufacturer (Ex. AVX)
Wafer or substrate
Power modules with passive-active integration
Slide 14
CONFIDENTIAL
Capacitor Performance
~1µF/mm2 obtained wiuth:
• 80 KA grade with thin dielectric thickness (8V/10V)
• 150 KA with thick dielectric thickness (12V)
200k 400k 600k 800k 1M0.0
2.0µ
4.0µ
6.0µ
8.0µ
10.0µ
12.0µ
14.0µ
16.0µ
18.0µ
20.0µ
Ca
pa
cit
an
ce
(F
)
Frequency (Hz)
Slide 15
CONFIDENTIAL
Reliability of passivated capacitors
1.14 µF/mm2
1.40 µF/mm2
Parlyene thickness- 200 nm
65°C/95% RH, 500 hrsTCT conditions
1.15 µF/mm2
1.34 µF/mm2
• Increase in capacitance observed post 500 hr of thermal cycling
Slide 16
CONFIDENTIAL
0
0.5
1
1.5
2
2.5
0 2 4 6 8 10 12 14
Cap
acit
an
ce D
en
sit
y a
t 1
MH
z
(μF/
mm
2)
Anodization Voltage (V)
Before… After…
Reliability of Passivated Capacitors
150 kA-8V
80 kA-8V
60 kA-8V
80 kA-10V 150 kA-12V
65°C/95%RH 500 hours
• All foils passed 65/95 for 500 hours
• Capacitance comparable or higher after thermal and moisture test
Slide 17
CONFIDENTIAL
• Discretes • Embedded ICs
• on-chip • 3D Packages
Inductors • Ferrites; • Embedded or SMDs
• Thinfilminductors
• Thinfilminductors
Capacitors • MLCCs • MLCCs • Trench capacitors
• Thinfilmcapacitors
EFFICIENCY
POWER HANDLING
SIZE
COST
MANUFREADINESS
Competitiveness of GT Approach with Embedding Si Integrated Ta Capacitors
IC
CAPACITOR
INDUCTOR
Slide 18
CONFIDENTIAL
Summary
Pioneered a breakthrough capacitor integration technology on wafers and packages:• Unlimited capacitance density on Silicon• Low cost – cheaper than traditional discrete passives• Extensible to high voltages• Extensible to high frequencies
Created an ecosystem of supply chain involving:• Material suppliers,• Component manufacturers• End-users
Extending this baseline technology to: • High-voltage power modules: Ex. Automotive• Automotive battery chargers• Integrated voltage regulators