1 October 21, 2009 Gary K. Maki*, Wusi C. Maki* and Nirankar Mishra CAMBR, University of Idaho, Post Falls, ID Integration of Nano Transistor Food Biosensors BC Food Protection Association Workshop Supported by USDA *Now with Integrated Molecular Sensors
Integration of Nano Transistor Food Biosensors. Gary K. Maki*, Wusi C. Maki* and Nirankar Mishra CAMBR, University of Idaho, Post Falls, ID. October 21, 2009. BC Food Protection Association Workshop Supported by USDA. * Now with Integrated Molecular Sensors. - PowerPoint PPT Presentation
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October 21, 2009
Gary K. Maki*, Wusi C. Maki* and Nirankar Mishra
CAMBR, University of Idaho, Post Falls, ID
Integration of Nano Transistor Food Biosensors
BC Food Protection Association Workshop Supported by USDA
*Now with Integrated Molecular Sensors
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Integration of MicroelectronicsCAMBR/NASA Custom Processors
• Reed Solomon Coder– Programmable error
correction, message length• Lossless Data Compressor
(USES)• Low Density Parity Check
Encoder– Landsat Data Continuity
Mission• High Performance Data
Compression– MMS mission
• New correlator work underway– GeoStar IIP
Delivered November 2008
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GeoStar System• The GeoStar system enables astronomers to advance science
with a space based imager which will correlate data from 588 separate antennas.
• This requires a custom processor board capable of 442,368,000,000,000 correlations per second while using less than 120W for the correlations.
Example 0.01% Modern VLSI chip with 100M Xsters4 contracts per transistor10,000 Xsters non-functional
24University of Idaho - CAMBR 24
Areas of Concern
Silicon Wafer
Insulation Layer
Au PadPNAAu Pad
Thickness
Doped Silicon
Nano FET Surface ThicknessSmall for good E-FieldThick for insulation
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Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
University of Idaho - CAMBR 25
Au Pad Au PadDoped silicon
Digital Electronics
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Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
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Au Pad Au PadDoped silicon
Digital ElectronicsAnalog Signal to DigitalWith multiple sensors, quality control routineData Analysis to map Target IdentifyIntelligent I/O InterfaceInternet Communication
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Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
Au Pad Au PadDoped silicon
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Au Pad Au PadDoped silicon
Digital Electronic ProblemsProcessing Order1. Create Digital Circuits (20 layers)2. Place Gold pads3. Place doped silicon on gold pads
• High Temperature Process• Nano packaging solution ?