INFORMATION NOTE N° 119/14 2014-12-18 Page 1 of 2 DCB and bond wire optimization for IHV-B 3.3kV Subject of Change: DCB and bond layout of IHV-B 3.3kV modules will be optimized due to continuous improvement Products affected: All IHV-B 3.3kV modules, see attached table Reason of Change: Continuous improvement Description of change: Assessment: Old New Different length of gate wires Gate wires have uniform length Minor change. No change of electrical parameters and no negative impact to quality and reliability. The specifications of the mentioned modules remain unchanged according to JEDEC Standard JESD46-C: fit, form, function and reliability. Time schedule: Planned implementation: from January 2015 onwards. During ramp up time there could be deliveries with both old and new Designs. If you have any questions, please do not hesitate to contact your local Sales office.