Improved Efficiency & Reliability for Data Center Servers of … · 2017-10-08 · Improved Efficiency & Reliability for Data Center Servers Using Immersion Cooling Technology November
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o Cheryl has over 20 years of experience in electronics manufacturing focusing on failure analysis and reliability. She is passionate about applying her unique background to enable her clients to maximize and accelerate product design and development while saving time, managing resources, and improving customer satisfaction.
o Throughout her career, Cheryl has had extensive training experience and is a published author and a senior member of both ASQ and IEEE. She views teaching as a two-way process that enables her to impart her knowledge on to others as well as reinforce her own understanding and ability to explain complex concepts through student interaction. A passionate advocate of continued learning, Cheryl has taught electronics workshops that introduced her to numerous fascinating companies, people, and cultures.
o Cheryl has served as chairman of the IEEE Central Texas Women in Engineering and IEEE Accelerated Stress Testing and Reliability sections and is an ASQ Certified Reliability Engineer, an SMTA Speaker of Distinction and serves on ASQ, IPC and iNEMI committees.
o Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech and is currently a student in the UT Austin Masters of Science in Technology Commercialization (MSTC) program. She was drawn to the MSTC program as an avenue that will allow her to acquire relevant and current business skills which, combined with her technical background, will serve as a springboard enabling her clients to succeed in introducing reliable, blockbuster products tailored to the best market segment.
o In her free time, Cheryl loves to run! She’s had the good fortune to run everything from 5k’s to 100 milers including the Boston Marathon, the Tahoe Triple (three marathons in 3 days) and the nonstop Rocky Raccoon 100 miler. She also enjoys travel and has visited 46 US states and over 20 countries around the world. Cheryl combines these two passions in what she calls “running tourism” which lets her quickly get her bearings and see the sights in new places.
o 1. Danielson, R.D., Tousignant, L., and Bar-Cohen, A.,Saturated Pool Boiling Characteristics of Commercially Available Perfluorinated Liquids, Proc. of ASME/JSME Thermal Engineering Joint Conference, 1987.
o 2. Bergles, A.E., and Bar-Cohen, A., Immersion Cooling of Digital Computers, Cooling of Electronic Systems , Kakac, S., Yuncu, H., and Hijikata,K., eds, Kluwer Academic Publishers, Boston, MA, pp. 539-621, 1994.
o 3. Mudawar, I., and Maddox, D.E., Critical Heat Flux in Subcooled Flow Boiling of Fluorocarbon Liquid on a Simulated Chip in a Vertical Rectangular Channel, Intl. J Heat and Mass Transfer, 32, 1989.
o 4. Chrysler, G.M., Chu, R.C., and Simons, R.E., Jet Impingement Boiling of a Dielectric Coolant in Narrow Gaps, IEEE Trans. CHMT-Part A, Vol. 18 (3), pp.527-533, 1995.
o 5. Danielson, R.D., Krajewski, N., and Brost, J., Cooling a Superfast Computer, Electronic Packaging and Production, pp. 44-45, July 1986.
o 1. Danielson, R.D., Tousignant, L., and Bar-Cohen, A.,Saturated Pool Boiling Characteristics of Commercially Available Perfluorinated Liquids, Proc. of ASME/JSME Thermal Engineering Joint Conference, 1987.
o 2. Bergles, A.E., and Bar-Cohen, A., Immersion Cooling of Digital Computers, Cooling of Electronic Systems , Kakac, S., Yuncu, H., and Hijikata,K., eds, Kluwer Academic Publishers, Boston, MA, pp. 539-621, 1994.
o 3. Mudawar, I., and Maddox, D.E., Critical Heat Flux in Subcooled Flow Boiling of Fluorocarbon Liquid on a Simulated Chip in a Vertical Rectangular Channel, Intl. J Heat and Mass Transfer, 32, 1989.
o 4. Chrysler, G.M., Chu, R.C., and Simons, R.E., Jet Impingement Boiling of a Dielectric Coolant in Narrow Gaps, IEEE Trans. CHMT-Part A, Vol. 18 (3), pp.527-533, 1995.
o 5. Danielson, R.D., Krajewski, N., and Brost, J., Cooling a Superfast Computer, Electronic Packaging and Production, pp. 44-45, July 1986.
o “Are Zinc Whiskers Growing in Your Computer Room?” R. Hill, Data Clean Corp.; http://www.dataclean.com/pdf/ zincwhiskers3.pdf.
o “Testing Your Mettle: Zinc Whiskers in the Data Center,”B. Brown, Network World, Nov. 2004, http://www.nwfusion.com/news/2004/110104widernetwhiskers.html
o Pesky ‘Whiskers’ Zap PCs in Secretary of State’s Office,” Aldo Svaldi, The Denver Post, 1 July 2004, pp. C-01.
o • “Precautions Against Zinc Whiskers,” Compaq Corp., Power Requirements for Non-Stop Himalaya Servers—429905-001, http://h71033.www7.hp.com/TechPubs/PDF/Power_Requirements/TPSEC05.pdf.
o “What Nasty Little Things Are Lurking Inside Your Data Center?” S. Tucker, Unisys World Monthly, Nov. 2002; http://www.unisysworld.com/monthly/2002/11/whiskers.shtml.
o “Zinc Whisker Abatement,” Worldwide Environmental Services; http://www.wes.net/field_engineering_services-zinc_
o whisker_detail.htm.
o “Zinc Whiskers: Could Zinc Whiskers Be Impacting Your Electronics?” J. Brusse, Apr. 2003; http:// nepp.nasa.gov/whisker/reference/tech_papers/Brusse2003-Zinc-Whisker-Awareness.pdf.
o “Zinc Whisker Contamination: A Paper on the Effect and Abatement of Zinc Whiskers in Data Processing Centers,” D. Loman, HP Services; http://www.dataclean.com/pdf/ZincWhiskerWhitePaper.pdf.
o “Zinc Whiskers Growing on Raised Floor Tiles are Causing Conductive Contamination Failures and Equipment
o Shutdowns,” The Uptime Institute; http://www.upsite.com/TUIpages/tuiflashzinc.html.
o “Zinc Whiskers on Floor Tiles,” Infinite Access Floors; http://www.accessfloors.com.au/zincwhiskers.htm.
o “Zinc Whisker Induced Failures in Electronic Systems,” ERA Technology, Winter 2003, http://www.era.co.uk/news/rfa_feature_06.asp.
o “Whisker Alert,” Japan Electronics & Information Technology Industries Association (JEITA), Jan. 2002; http://it.jeita.or.jp/infosys/info/whisker/ (in Japanese).
o http://www.layerzero.com/Innovations/stainless_steel_hardware.html (Data Center & Zinc whisker mitigation)
o Step 1. – Power down and REMOVE from the environment any and all equipment that you can. If the whole room can be shut down, do it!
o Step 2. – Power down as many air conditioning units as you can for the remaining load.
o Step 3. – Protect remaining equipment with plastic barrier tents. Create safe envelopes for equipment by sealing plastic sheeting between the ceiling and the floor. If you still have airflow under the floor, you will need to create underfloor barriers as well. This step is critical since these barriers will protect your equipment from zinc-laden airflow during the replacement process. Note: This step is often difficult to perform because of the physical layout of the room. If this step cannot be performed, compensating changes to the work plan must be implemented.
o Step 4. – Remove affected panels by carefully lifting (without sliding or jostling them) and placing them in a plastic bag. Place only one panel in a bag and fold and seal the bag. Remove the panel from the room. Don’t reuse the bags!
o Step 5 – Clean the underfloor plenum, flooring understructure, and underfloor infrastructure using HEPA vacuums and wet wiping.
o Step 6 – Clean the underside of unmovable panels (under equipment that cannot be moved) using wet wiping.
o Step 7 – Install replacement panel
o Step 8 – Repeat Steps 4 – 7 throughout remainder of affected area.
o Step 9 – Clean the entire room and its contents. Zinc Whisker contamination does not remain in the underfloor plenum. The whiskers can and do end up on the walls, ceiling, and all items within the room.
o Step 10 – Carefully remove barriers, reinstall equipment. Remember to map or mark panels that were not removed, if any. These panels should be monitored for continued whisker growth and replaced coincident with future equipment moves.