Underground M3 Final Meeting June 10, Cambridge IMM Bologna IMM Final Report within Underground M3 Project IMM Final Report within Underground M3 Project M h 44 M h 44 th th MEMS iii MEMS iii Month 44 Month 44 th th – MEMS activities MEMS activities M. Ferri, A. Roncaglia, L. Belsito, J. Yan*, A. Seshia*, K. Soga* M. Ferri, A. Roncaglia, L. Belsito, J. Yan*, A. Seshia*, K. Soga* Institute of Microelectronics and Microsystems (IMM), Bologna Institute of Microelectronics and Microsystems (IMM), Bologna *Cambridge University Engineering Dept Cambridge Cambridge University Engineering Dept Cambridge Cambridge University , Engineering Dept., Cambridge Cambridge University , Engineering Dept., Cambridge
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
IMM Final Report within Underground M3 ProjectIMM Final Report within Underground M3 Project
M h 44M h 44thth MEMS i i iMEMS i i iMonth 44Month 44th th –– MEMS activitiesMEMS activities
M. Ferri, A. Roncaglia, L. Belsito, J. Yan*, A. Seshia*, K. Soga*M. Ferri, A. Roncaglia, L. Belsito, J. Yan*, A. Seshia*, K. Soga*
Institute of Microelectronics and Microsystems (IMM), BolognaInstitute of Microelectronics and Microsystems (IMM), Bologna**Cambridge University Engineering Dept CambridgeCambridge University Engineering Dept CambridgeCambridge University, Engineering Dept., CambridgeCambridge University, Engineering Dept., Cambridge
Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Underground M3 Final Meeting June 10, CambridgeIMM Bologna
New fabrication process: power harvesting MEMSNew fabrication process: power harvesting MEMSNew fabrication process: power harvesting MEMSNew fabrication process: power harvesting MEMS
Mask design for process 1, 2 completedMask design for process 1, 2 completed
Mask design for process 3 still under developmentMask design for process 3 still under development
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
New fabrication process: power harvesting MEMSNew fabrication process: power harvesting MEMSNew fabrication process: power harvesting MEMSNew fabrication process: power harvesting MEMS
Process 1, 2: MEMS with front and backside silicon etching for the fabrication of Process 1, 2: MEMS with front and backside silicon etching for the fabrication of po er har esting de ices ith integrated Schottk diodes and MOS capacitorspo er har esting de ices ith integrated Schottk diodes and MOS capacitorspower harvesting devices with integrated Schottky diodes and MOS capacitorspower harvesting devices with integrated Schottky diodes and MOS capacitors
Process 3: MEMS with front and backside silicon etching for the fabrication of power Process 3: MEMS with front and backside silicon etching for the fabrication of power harvesting devices based on PZT materials integrated on siliconharvesting devices based on PZT materials integrated on siliconharvesting devices based on PZT materials integrated on siliconharvesting devices based on PZT materials integrated on silicon
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Power harvesting MEMS: process flowPower harvesting MEMS: process flowPower harvesting MEMS: process flowPower harvesting MEMS: process flow
Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Crackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsOscillator waveform for varying MEMS DC biasesOscillator waveform for varying MEMS DC biases
8 V8 V 9 V9 V 10 V10 V
1511 V11 V 12 V12 V 13 V13 V
Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Crackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test results
Short term frequency stability (DC = 15V) around 0.2 Hz (0.02 με strain resolution)Short term frequency stability (DC = 15V) around 0.2 Hz (0.02 με strain resolution)
4.0270610000E+05
4.0270615000E+05
4.0270620000E+05
4 0270595000E+05
4.0270600000E+05
4.0270605000E+05
4.0270590000E+05
4.0270595000E+05
1 12 23 34 45 56 67 78 89 100 111 122 133 144
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Crackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test results
Vibration isolation: Strain gauge 1. Long term stability: 10mins, 25V. (25Hz 2.5με over Vibration isolation: Strain gauge 1. Long term stability: 10mins, 25V. (25Hz 2.5με over 10 mins) probably due to temperature drift10 mins) probably due to temperature drift10 mins), probably due to temperature drift10 mins), probably due to temperature drift
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Crackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test results
Initial Strain Test (gauge 1)Initial Strain Test (gauge 1)
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Crackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test results
Initial Temperature test 1 (gauge 1):Initial Temperature test 1 (gauge 1):
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Crackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test results
Initial Temperature test 2 (gauge 1):Initial Temperature test 2 (gauge 1):
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Crackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test resultsCrackmeter prototyping: first test results
Knocking test (gauge 2)Knocking test (gauge 2)
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Underground M3 Final Meeting June 10, CambridgeIMM Bologna
Activity plan for crackmeter deploymentActivity plan for crackmeter deploymentActivity plan for crackmeter deploymentActivity plan for crackmeter deployment