IC Packages The protective container (housing) for an integrated circuit (die). Can include external leads to provide electrical access to the internal component. Packages provide physical and chemical protection of the circuits. Common package materials include Ceramic and Plastic. IC Plastic packages are also available in OPEN-CAVITY format. This “Open-Cavity” package is used for the Assembly and test of new I.C. (Prototype) designs. It allows for the I.C. design Engineer to test newdesigns ( FIB work, die probing, more ) - in the same plastic package as intended for Production. IC Package Materials IC Package Materials » Open Cavity Plastic Packages » Ceramic Packages » Laminate Substrates » Custom Package Configurations Quik-Pak can provide virtually any package you need for your prototype devices, such as Open Cavity Plastic (OCPP), ceramic, laminate substrates and even custom package configurations. If you don’t have a specific package identified, we can provide technical assistance to select the best package for your application.
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IC PackagesThe protective container (housing) for an integrated circuit (die). Can include external leads to provide electrical access to the internal component. Packages provide physical and chemical protection of the circuits. Common package materials include Ceramic and Plastic. IC Plastic packages are also available in OPEN-CAVITY format. This “Open-Cavity” package is used for the Assembly and test of new I.C.(Prototype) designs. It allows for the I.C. design Engineer to test newdesigns ( FIB work, die probing, more ) - in the same plastic package as intended for Production.
IC Package MaterialsIC Package Materials» Open Cavity Plastic Packages» Ceramic Packages» Laminate Substrates» Custom Package Configurations
Quik-Pak can provide virtually any package you need for your prototype devices, such as Open Cavity Plastic (OCPP), ceramic, laminate substrates and even custom package configurations. If you don’t have a specific package identified, we can provide technical assistance to select the best package for your application.
IC Package ServicesOPEN CAVITY PACKAGESQuik-Pak is your same-day source for open cavity, plastic IC packages.We can configure any style, any size, any lead count, no limitations!
Quik-Pak patented technology can transform any transfer molded plastic device into a ready-to-assemble open cavity plastic package. All body sizes and lead counts are available with no limitations.
This is a through-hole device, similar to a TO-23 package .
Case mount. A type of package which provides a method of readily attaching one surface of the semiconductor device to a heat dissipater to achieve thermal management of the case temperature. The case of this device is connected to the Collector.
Case temperature. Case temperature is that temperature measured at a specified point on the case of a semiconductor device.
Transistor Can Packages TO-5 Case style, Metal Can
TO-5 Metal Can
Transistor Can Packages; TO-18 Case style, Metal Can
TO-18 Metal Can
Transistor Can Packages TO23 Case style
TO-23 Transistor Case
TO-23 is a two lead through-hole device. The third lead is the case.Case mount. A type of package (outline) which provides a method of readily attaching one surface of the semiconductor device to a heat dissipater to achieve thermal management of the case temperature.
Transistor Can Packages TO-39 Case, Through-Hole
TO-39 Package
The TO-39 package is a through-hole device [metal can].The TO-39 metal can has three terminals; Lead 1; Emitter, Lead 2; Base, Lead 3; Collector. Additional types of Transistor cases; IC Package styles.
Transistor Can Packages; TO46 Case style, Metal Can
TO-46 Metal Can
TO-46 is a through-hole device with a metal lid.Terminal identification; Pin 1 Emitter, Pin 2 Base, Pin 3 Collector. Note the location of the tab to the pins.Types of Transistor cases; Transistor Packages.Manufacturers of FETs and BJTs [Transistor Manufacturers]How to Derate Transistors
Transistor Can Packages TO61 Case style, Bolt Mounting
TO-61 Package
The TO-61 package is a through-hole case mount device.
Case mount. A type of package which provides a method of readily attaching one surface of the semiconductor device to a heat dissipater to achieve thermal management of the case temperature. The TO-61 Case is isolated from any of the terminal leads.
Terminal Leads; Lead 1 Emitter, Lead 2 Base, Lead 3 Collector.
Transistor Can Packages TO-78 Case style, Metal Can
TO-78 Metal Can
The TO-78 package is a 6 pin device in a metal can. This is a through-hole device.Example configuration; Dual Transistor package, NPN/PNP transistors.
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This category is for integrated circuit packages. Transistor packages can be found here and passive device packages (e.g. resistors) can be found here.