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IAR Americas Summit 2012 Anand Chadrasekher

Feb 11, 2022

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Page 1: IAR Americas Summit 2012 Anand Chadrasekher

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Americas SummitNOVEMBER 28, 2012

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Anand Chandrasekher

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This image cannot currently be displayed.

Fortune 500 Company

25+ years of driving the evolution of wireless

Making wireless more personal, affordable and accessible to people everywhere

World’s largest fabless semiconductor company, #1 in wireless

This image cannot currently be displayed.

This image cannot currently be displayed.

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A Technology Enabler for the Entire Mobile Value Chain

Qualcomm’s Unique Business Model

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Innovation Across Entire Wireless Value Chain

Qualcomm: A Communications Systems Company

InnovativeTechnologies

Standardization Productization Commercialization

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Key Industry Trends

Computing Redefined Unprecedented Data Demand Digital 6th Sense

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Computing Redefined

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Displacing Feature Phones

Continued Smartphone Momentum

Source: Average of Gartner, Oct. ’12; Strategy Analytics, Aug. ’12

2011 2012 2013 2014 2015 2016

Annual Forecasted Smartphone Unit Shipments24% CAGR

2011–2016

Cumulative Smartphone Unit Sales Forecast Between 2012–2016 ~5B

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Immediacy, Portability, Connectedness

Our Most Important Device

Source: Google/Sterling Brands/Ipsos Multi-Screen Research, Aug. ’12

4/5of all searches on a smartphone are spontaneous, compared to

52% on PC

1/3+of daily media interactions

occur on a smartphone

~1/2of smartphone owners use

them while watching TV

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Mobile is Redefining Computing

High Resolution Screens

Responsive Devices

Fast, Always-On Connectivity

Rich Multimedia Experience

High Performance Computing

Sleek, Ultra-light

Longer Battery Life

Thermal Efficiency

Without Compromising Mobility

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Snapdragon Across a Range of Devices

Afterburn

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Unmatched Portfolio

Qualcomm Approach: Own the Key Technology Blocks

DSP

GPU

CPU RF

Connectivity

Location

3G/4G/LTE

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Successful Investments Have Resulted in Leadership

ApplicationProcessor

GraphicsProcessor

Digital SignalProcessor

3G/4G/LTE RF

Sources: Mobile AP Unit Shipment - Strategy Analytics; GPU Shipment - Jon Peddi Research; DSP shipment - Forward Concepts; 3G/4G/LTE - Strategy Analytics; RF iSuppli, Q1’12

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/ /

A History Of Time-To-Market and Product Superiority

Qualcomm Modem Technology Leadership

2008 2010 20122009 20112007200620052004 2013

90

70

50

30

40

60

80

100

20

10

DL 1.8 MbpsUL 384 kbps

DL 7.2 MbpsUL 5.76 Mbps

DL 28 MbpsUL 5.76 Mbps

First Integrated LTE Multimode

DL 100 Mbps

First DC-HSPA+

DL 42 Mbps

Pea

k D

L D

ata

Rat

e (M

bps)

First LTE World ModeDL 100 Mbps

MSM 6275

MSM 7200

MDM 8200

MDM 8220

MDM 9x00

MDM 9x15

MDM 9x25

First LTE Advanced Carrier Aggregation with Cat4DL 150 Mbps

First HSDPA

First HSUPA

First Integrated LTE Smartphone

DL 100 Mbps

MSM 8960

150

FirstHSPA+

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First and Second Generation Gobi LTE Launch Velocity

Qualcomm LTE Leadership and Scale

Nov. ’12 CAs shown are projected, based on documented OEM products in development; all other figures are actual/historical CAs

MDM9x15

MSM8960

MDM9x00

Cum

ulat

ive

Num

ber

of C

arrie

r Acc

epta

nces

(U

niqu

e O

EM

Dev

ices

)

LTE OEM Device Acceptances on

Qualcomm LTE chips

12/2010 11/2012

Time

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16Performance (DMIPS)

Pow

er (

mW

)

0

500

1000

1500

2000

0 1000 2000 3000 4000 5000 6000 7000

Half the Power

Laptop Only

Highest Performance at the Lowest Power

CPU Leadership Now and into Next Generation

Source: Qualcomm lab testing

x86 SOC (32nm HKMG)

Current Gen Competitor (40nm LP)

Newly Released Competitor (32nm HKMG)

Snapdragon “Krait” 200 (28nm LP)

Snapdragon “Krait” 300 (28nm LP)

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Latest GPU Architecture — Higher Performance, Lower Power

Adreno 320 GPU Leads in Power-Efficient Performance

Sources: AnandTech ’12, Qualcomm data

Rel

ativ

e P

erfo

rman

ce p

er m

W

Performance Power Efficiency (Higher Is Better)

0.00

0.50

1.00

1.50

2.00

2.50

3.00

3.50

4.00

Competitor A quad-core Snapdragon dual-core(8960) Adreno 225

Competitor B quad-core Snapdragon quad-core(8064) Adreno 320

5.1

5.9

8.7

8.8

9

12

13

13

13

29

Samsung Galaxy Nexus(OMAP4460/SGX540)

Huawei Ascend P1 (OMAP4460/SGX540)

LG Optimus 4X HD (Tegra 3)

Samsung Galaxy S 2 (Exy/Mali400)

HTC One X (Tegra 3)

HTC One S (S4/Adreno 225)

HTC One X (S4/Adreno 225)

Samsung Galaxy S 3 (Exy4/Mali400)

Samsung Galaxy S 3 (S4/Adreno 225)

LG Optimus G (S4 Pro/Adreno 320)

GLBenchmark 2.5—Egypt HD (Offscreen 1080p)Frames per Second—Higher Is Better

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Investing for Growth

Qualcomm Maturing Turnkey Model

Ecosystem, Channel Support

Complete Reference

Design

Competitive Price

Superior Technology

Brand

OEMs Launches

DaysLaunch Time-to-Market in Design

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Enabling 1000x Capacity

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Demand Driving Extreme Densification

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Low Cost, Small Size and Ease of Deployment

Small Cells Everywhere

3G4G

Wi-Fi

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Digital 6th Sense

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Digital 6th Sense

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Everything Around us Is Becoming Intelligent and Connected

Internet of Everything

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© 2012 QUALCOMM TECHNOLOGIES, INC. All rights reserved. 25

© 2012 Qualcomm Technologies, Inc. All rights reserved. Qualcomm, Snapdragon, Trepn, and Gobi are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Trademarks of Qualcomm Incorporated are used with permission. AllJoyn is a trademark of Qualcomm Innovation Center, Inc., registered in the United States and other countries. Other products and brand names may be trademarks or registered trademarks of their respective owners.

Qualcomm Technologies, Inc5775 Morehouse Drive

San Diego, CA 92121-1714