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DTIC IFE CopY 00 LOP. A-OSR.I-. 88-045 7 A Study of the Fatigue Behavior of Small Cracks in Nickel-Base Superalloys Final Report Submitted to Air Force Office of Scientific Research Grant # AFOSR-84-0075 Attention: Dr. A. Rosenstein by Professor Regi• M. Pelloux Dr. Jun Feng Glenn Romanoski Department of Materials Science & Engineering Massachusetts Institute of Technology 77 Massachusetts Avenue Cambridge, MA 02139 February 24, 1988 I i DTIC MAY 0 3 1988 44• Approved for public rvlueam i Ditrbu o UmLm'lh P, 0P ~~~~A, J~k~~lII ~ I L¶-b MIJ K W XflMMý
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Page 1: I i - DTIC

DTIC IFE CopY00

LOP. A-OSR.I-. 88-045 7

A Study of the Fatigue Behavior of Small Cracks in Nickel-BaseSuperalloys

Final Report

Submitted to

Air Force Office of Scientific ResearchGrant # AFOSR-84-0075

Attention: Dr. A. Rosenstein

by

Professor Regi• M. PellouxDr. Jun Feng

Glenn RomanoskiDepartment of Materials Science & Engineering

Massachusetts Institute of Technology77 Massachusetts AvenueCambridge, MA 02139

February 24, 1988 I i

DTICMAY 0 3 1988 44•

Approved for public rvlueam i

Ditrbu o UmLm'lh P, 0P ~~~~A, J~k~~lII ~ I L¶-b MIJ K W XflMMý

Page 2: I i - DTIC

SECURITY CLASSIFICATION OF THIS PAG;E

DOCUENTAION AGEForm ApprovedREPORT DOU ETTONPG0 MS No. 0704-0188

'I la REPOkT SECURITY CLASSIFICATION lb. RESTRICTiVE MARKINGS

UNCLASSIFIED _______________________

Za. SECURITY CLASSIFICATION AUTHORITY 3. DISTRIBUTION /AVAILABILITY OF REPORT

12b. DECLASSIFICATION / DOWNGRADING SCHEDULE UNL IMI TED

4. PERFORMING ORGANIZATION REPORT NUMBER(S) 5. MONITORING ORGANIZATION REPORT NUMBIER(S)

___ __ ___ __ _ _ __ __ AFOSR.Th- 8 8 -045 76a. NAME OF PERFORMING ORGANIZATION 6b. OFFICE SYMBOL 7a. NAME OF MONITORING ORGANIZATION

(if applicable)

Massachusetts Inst of Tech .AFOSR/NE

15c. ADDRESS (City, State, and ZIP Code) 7b. ADDRESS (City. State, and ZIP Code)

77 Massachusetts Avenu., Bldg 410Cambridge, MA 02139 Boiling AFB, DC 20332-6448

-* 8. NAME OF FUNDING/iSPONSORING I8b. OFFICE SYMBOL 9 PROCUREMENT INSTRUMENT IUENTIFICATION NUMBERORGANIZAT:ON (if applicable)

AFOSRINE I AFOSR-84-0075

8?c. ADDRESS (Cil'y State, an.j ZIP Code,' 10. SOURCE Or- FUNDING NUMBERSBldg M( PROGRAM PROJECT TASK WORK UNIT

4Boiling AFB, DC 20332-6448 ELEMENT NO. NO. NO ACCESSION NO.

___________________________________110ll2F 2306 Al

*1. TITLE (Include Security Classificationi)

A STUDY OF THE FATIGUE BEHAVIOR.OF SMALL CRACKS IN NICKEL-BASE SUPERALLOYS

12. PERSONAL AUTHOR(S)Professor Regis M Pelloux ____________________________

13a. TYPE OF REPORT 13b TIME COVERED 14. DATE OF REPORT (Year,MPvonth, Day) 15 AGE COUNT

Final Re ort FROM jjaijLUT~lAL716. SUPPLEMENTARY NOTATION

r17. COSATI CODES 18 SUBJECT TERMS (Continue on reverse if necessary and identify by blo~k number)FIEL1) GROUP SUB-GROUP

19. ABSTRACT (Continue an reverse if necessary and identify b, bioU number)

7'The fat~gur, of behavior of short cracks was investigate ir. five wrought nickel-basesupperalloys currently used for aircpaft turbine disks.- lie alloys and testtemperature were: Inc8neII X-750 (25 C and 427 0GQ) ncnl--, (427 C), powdermetallurgy Rene 95 (25 C) and powder metallurgy IN1OU (649 C).-Cracks -were initiatedat artificial defects and at persistent~. slip bands. 'rest frequencies ranged from201Hz to l0cpm. Fatiguz crack growth ratcs were measured over crack lengths ranging from

AI lOom to lmni. Mos' of the testing was performed in load control. with stress ranges

approaching the ,y'Ii,, yield strengths of alloys. Strain contiolled tests wereperformed on IN100 undI:er elastic-plastic cycling conditions.

20. L'ISTRIf3UTION / AVAILABILITY OF A,35TRACT 121 ABSTRACT SECURITY CLASSIFICATIONLJUNCLASSIFIEDILINLIMAI1ED C3 SAME AS PPT. TI mC USERS IUNCLASSIFIED

22a NAME OF RESPONSIBLE INDIVIDUAL 22.TELEPHONE (include Area CýodI 72. OFFICE SYMBOL*~~~~~~ 6ll 7~rcTT NE.L62 4 3

DD Form 1473, JUN 86 Previous editions are obsolete. SECULIY CLASSIFICATION OF THIS PACE

Page 3: I i - DTIC

ABSTRACT

The fatigue behavior of small cracks was investigated in five wrought nickel-base

: superalloys currently used for aircraft turbine disks. The alloys and tws: temperature were:

Inconel X-750 (250 C), Waspaloy (25' C and 4270 C), Inconel 718 (427' C), powder

metallurgy Ren6 95 (250 C) and powder metallurgy IN100 (649' C). Cracks were initiated

at artificial defects and at persistent slip bands. Test frequencies ranged from 20 Hz to 10

cpm. Fatigue crack growth rates were measured over crack lengths ranging from 10 Aim to

I mm. Most of the tesing was performed in load control with stress ranges approaching the

cyclic yield strengths of the alloys. Strain controlled tests were performed on IN100 under

"elastic-plastic cycling conditions.

In room temperatuie tests of X-750 and Waspaloy, fatigue cracks are strongly

owN. ,crystallographic and their growth rates are grain size dependent. Small cracks grew at

higher rates in large grains than long cracks at the same cJculated nomninal value of AK. In

these two alloys grain boundaries served as obstacles to crack extension resulting in

considerable scatter in AK-nt and near threshold crack growth rates. In fine grained

materials such as Rend 95, the fatigue cr.ck growth rates of small cracks correlate well with

AK. The data is in agreement with long crack results.

In elevated temperature tests under elastic cyclic loading conditions the fatigue crack

growth rates of small cracks (a Ž 100 pmi) correlate very well with AK. The upper bound

of the da/dN -AK data for small cracks coincides with the data for long cracks.

I At elevated temperatures in the elastic-plastic regime where the maximum cyclic

stress reaches the macroscopki yield stress, the fatigue crack growth rates for 100 ira < a S 0

- 300 jim are independent of crack length. This test regime needs further investigation.

2, Aval M1,1t1LY co'n,_-• ,-. . .Avaii uantl/or

"D -st SpOuVal

4 . ,. d t..

Page 4: I i - DTIC

S~ACKNOWJLEDQYEMlvNTS

This investigation was perfomeKd under sponsorship of the Air Force Office of

Scientific Research under Grant # AFOSR-84-0075. Dr. A. Rosenstein was grant

monitor.

The authors would like to thank: M. fflaý;kburn, J. Hill and V. Moreno of Pratt and

Whitney Aircraft; D Backman, R. H. Van Stone,, M. Henry and D. Krueger of General

"Electric; and K. Bain of Allison Gas Tarbine Division of General Motors for material

support and valuable discussions. Special t.Lrnks go to S. Doucette for typing this report.

t.m

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X .ý

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TABLE OF CONTENTS

a: PAGEA B ST R A C T ............................................................................ i

ACKNOWLEDGEMENTS ......................................................... ii

TABLE OF CO NTENTS ............................................................. iii

LIST O F T A B LES .................................................................... iv

LIST O F FIG U R ES .................................................................... v

1. IN TR O D U C T IO N ................................................................. 1

"2. EXPERIMENTAL PROCEDURES ........................................... 3

2.1 M aterials ................................................................. 3

2.1.1 Inconel X -750 ............................................... 32.1.2 W aspaloy .................................................... 42.1:3 Inconel 718 .................................................. 42.1.4 Rend 95 (PM) .......................... ...... .......52.1.5 IN 100 (PM ) .................................................. 6

2.2 Trest Specimen Geometry ............................................. 6

2.2.1 Room Temperature Tests .................................. 612.2.2 Elevated Temperature Tests ................. 7

2.3 Specimen Preparation .............................. 7

2.4 Initiation of Short Cracks ............................................ 8

2.4.1 Crack Initiation from EDM Pits ........................... 92.4.2 Cack bhitiation from Nd-YAG Laser Generated Defects. 92.4.3 Crack Initiation from A12 0 3 particles .................... 102.4.4 Precracking ................................. 10

2.5 Crack Length Measurement by Plastic Replica ..................... 11

2.6 Crack Length Measurement by A. C. Potential Drop ............. 12

2.7 Small Crack Growth Testing at Room Temperature .............. 12

2.ý Small Crack Growth Testing at Elevated Tempera,.ure ........... 13

3. DATA ANALYSIS .............................. 28

3.1 Computation of Crack Growth Rates ............................... 29

I-.. v

F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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3.2 Stress Intensity Factor Calculations ................................. 30

4. RESULTS AND DISCUSSION ................................................. 37

4.1 Fatigue Behavior of Small Cracks at Room Temperature ...... 37

4.1.1 Inconel X -750 ............................................... 374.1.2 W aspaloy .................................................... 414.1.3 Ren6 95 (PM ) ................................................ 424.1.4 Fractography, Room Temperature Tests ................ 43

4.2 Fatigue Behavior of Small Cracks at Elevated Temperature .......... 75

4.2.1 W aspaloy, 427°C ............................................ 75* 4.2.2 Inconel 718, 427°C ......................................... 78

4.2.3 IN100 (PM ), 6490 C ........................................ 804.2.4 Fractography, Elevated Temperature Tests ............. 81

5. CONCLUSIONS...................................................... 120

REFERENCES .................................................................. 122

APPENDIX A: A Multi-Frequency A. C. Potential Drop System for theMeasurement of Fatigue Micro-Cracks ..................... 125

LIST OF TABLES ...................................... iv

Table2.1 Alloy and Test Temperature ................................... 3

Table 2.2 -Chemical Compositions ....................................... 15

Table 2.3 Heat Treatment Conditions .................... 16

Table 2.4 M echanical Properties ......................................... 17•-Tayl 9) • qn~rl ot-r1 Fatmige Tvt) nt Rn-rn Temnperture!.1

Table 2.6 Small Crack Fatigue Tests at Elevated Temperature ........ 19

|

iv

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Page 7: I i - DTIC

I ,

List of Figures

Figure 2.1 Typical microstructures for- a) Inconel X-750 and b) Waspaloy used inthis investigation.

Figure 2.2 Typical microstnictare for Inconel 718 used in this investigation.

IN, Figure 2.3 Typical microstructures for a) powder metallurgy Rend 95 and%- • b) powder rmetallurgy INIO.

Figure 2.4 Specimen geomeiry used fox room temperature tests.

SFigure 2.5 Speciamen geometry used fox elevated temnperature .es:s.

Figure 2.6 Modification to -peciwen gauge section, shown in Figure 2.5, used forV.• cl-\,ated temperature tests.

I Figure 2.7 a) A typicai EDM defect and fatigue crack shown here in the surface ofhxconel X-759.

b) A typical laser defect and fatigue crack shown here in the surface ofWaspaloy.

1"*igul.c•2.8 a) Fatigue cr.ck initiation at an A12 0,3 parle. in pwder metallurg, Rend

95.h' Fatigue crack initiation at PSB's in Waspaloy tested at room

vemperature.

Figui-e 3.1 C!zck front profiles as evidenced by the. presence of oxidation on thefracture surfaces of Waspaloy specimens tested at 4270 C.

iigdire 3.2 The aspect ratio, c/a versus c for aurrnerous cracks in Waspaloy tested at427' C under several stress ranges.

a iE..lelri'm ,-ra-k tmh-M- ed in an infinite solid subjected to a unifromstress.

b) Surface crack in a finite plate subjected to a uniform stress (from Ref."• ~10).

Figure 4.1 Normalized relation between threshold stress and crack length for Inconel"X-750 tested at 25C, R = 0.05.

Figure 4.2 1 •umalized relation between threshold stresF intensity factor range andcrack length for Inconel X-750 tested at 25C, R = 0.05.

Figure 4.3 Normalized relation between threshold stres& hitensity factor range and loadratio, R, for Incovel X-750 tested at 250 C.

Figure 4.4 Normialzed relation between threshold stress intensity factor and load ratio,, VNIR, for Inconel X-750 tested at 25' C.

Lv %I k'0 A LLIA ,F A. ... .. 3 A %A P W '4 A &

Page 8: I i - DTIC

It

Figure 4.5 Fatigue crack growth rates versus stress intensity factor range for InconelF eX-750 tested at 250 C, R = -1.

Figure 4.6 Fatigue crack growth rates versus stress intensity factor range for InconelX-750 tested at 250 C, R = 0.05.

Figure 4.7 Fatigue crack growth rates versus stress intensity factor range for InconelX-750 tested at 25' C, R = 0.5.

Figure 4.8 Summary of the fatigae crack growth rates versis stress intensity factor

range for Inconel X-750 tested at 250 C. R ratio varied.

Figure 4.9 Crack length versus cycle number for Waspaloy tested at 25' C, Max.Stress varied, R = -1.

Figure 4.10 Crack length versus cycle number for Waspaloy tested at 25' C, Max.Stress = 758 MPa, R ratio varied.

Figure 4.11 Sunmmary of fatigue crack growth rates versus stress intensity factor range- *-for Waspaloy, tested at 250 C, R = -1.

"Figure 4.12 Summary of fatigue crack growth rates versus stress intensity factor rangefor Waspaloy, tested at 250 C, R = 0.

Figure 4.13 Fatigue --rack growth rates versus stress intensity factor range forWaspaloy, tested at 25v C, Max. Stress = 7) MPa, R = 0..

Figure 4.14 Summary of fatigue crack growth rates versus stress intensity factor rangefor Waspaloy, tested at 25' C, R varied.

Figure 4.15 Crack length versus cycle nt mber for Rent 95 (PM) tested at 25' C, Max.Stress = 758 MPa, R varied.

Figure 4.16 Crack length versus cycle number for Rent 95 (PM) tested at 250 C, Max.Stress was varied, R = -1.

Figure '4. 1 7 ruguc vi-cji giowdl ia vib suL-sa n UaLIy zactcA 1iclp it. PI.tAL 7.)

(PM), tested at 250 C, Max. Stress = 758 MPa, R = -1.

Figure 4.18 Fatigue crack growth rates versus stress intensity factor range for Rený 95(PM), tested at 25' C, Max. Stress = 483 MPa, R = -1.

SI.Figure 4.19 Summary of fatigue crack growth rates versus stress intensity factor rangefor Ren6 95 (PM), tested at 250 C, R = -1.

, Figure 4.20 Fatigue crack growth rates versus stress intensity factor range for Rcn6 95(PM). tested at 250 C, Max. Stress = 758 MPa, R = 0.

K • Figure 4.21 Fatigue crack growth rates versus stress intensity factor range for Rent 95" (PM), tested at 250 C, Max. Stress = 758 MPa, R = 0.5.

Figure 4.22 Summary of fatigue crack growth rates versus stress intensity factor rangefor Ren6 95 (PM), tested at 250 C, Max. Stress a&d R ratio were varied.

vi

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ri•

Figure 4.23 Scanning Electron Micrographs of small cracks initiated from an EDM pit in14 Inconel X-750, tests at 25' C.

"Figure 4.24 Scanning Electron Micrographs of the fracture surface of the small crack in:, ~Figure 4.23.

"Figure 4.25 Scanning Electron Micrographs of the fracture surface in Inconel X-750P tested at 250 C.

Figure 4.26 Angle diztribution spectrum of a small crack with length 900 pim in InconelX-750, tested at 25' C.

Figure 4.27 Scanning Electron Micrographs of a small crack in Rent 95 (PM) tested atL 7 250 C: a) crack root, b) crack dp.

• Figure 4.28 Scanning Electron Micrographs of the fracture surface of a Nmafl crack inFiue,.8 Rend 95 (PM) tested at 250 C.

Figure 4.29 Micrograph of small cracks initiated from an EDM pit in Waspaloy tested at"250 C.

k Figure 4.30 Micrographs of fatigue cracks in persistent slip bands in Waspaloy tested at250 C.

-Figure 4. 11 Crack depth versus cycle number for Waspaloy tested at 427- C, Max.Stress = 504 MPa, R = -1, Freq. = 0.33 Hz.

SFigure 4.32 Crack growth rate versus stress intensity factor range for Waspaloy tested at4270 C, Max. Stress = 504 MPa, R = -1, Freq. = 0.33 Hz.

Figure 4.33 Crack depth versus cycle number for Waspaloy tested at 4270 C, Max.Stress = 621 M, Pa, R = -1, Freq. = 0.33 Hz.

Figure 4.34 Crack growth rate versus stress intensity factor range for Waspaloy tested4ata270 C, Max. Stress = 621 MPaR= 1, Freq. = 0.33 Hz.

Figure 4.35 Crack depth versus cycle number for Waspaloy tested at 4270 C, Max.* Stress = 754 MPa, R = -1, Freq. = 0.33 Hz.

Figure 4.36 Crack growth rate versus stress intensity factor range for Waspaloy tested at427' C, Max. Stress = 754 MPa, R = -.1, Freq. = 0.33 Hz.

Figure 4.37 Summary of crack growth rate versus stress intensity factor range forSWaspaloy tested at 427' C, Max. Stress was varied with R : 1,Sfi'iFreq. = 0.33 Hz.

"f' igur-e 4.38 Crack depth versus cycle number for Waspaloy tested at 427* C, Max.'.- ~Stress = 766 MPa, R = 0, Freq. = 0.33 Hz. •

!Figure 4.39 Crack growth rate versus stress intensity factor range for Waspaloy tested at

r? 427' C, Max. Stress -- 766 MPa, R = 0, Freq. = 0.33 Hz. =_

I. •' vii

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Figure 4.40 Crack depth versus cycle number for Waspaloy tested at 4270 C, Max.Stress = 765 MPa, R = 0.3, Freq. = 0.33 Hz.

Figure 4.41 Crack growth rate versus stress intensity factor range for Waspaloy testcd at427' C, Max. Stress = 765 MPa, R = 0.3, Freq..-- 0.33 Hz.

Figure 4.42 Crack depth versus cycle number for Waspaloy tested at 427' C, Max.Stress = 903 MPa, R = 0.5, Freq. = 0.33 Hz.

Figure 4.43 Crack growth rate versus stress intensity factor range for Waspaloy tested at

4270 C, Max. Stress:- 903 MPa, R = 0.5, Freq. = 0.33 Hz.

Figure 4.44 Summary of crack growth rate versus stress intensity factor range forWaspaloy tested at 427' C, Max. Stress 758 MPa & 903 MPa, R ratio wasvaried Freq. = 0.33 Hz.

Figure 4.45 Comparison of crack growth rates versus stress intensity factor range forWaspaloy tested at 25 C and 427' C, R =-1.

Figure 4.46 Comparison of crack growth rates versus stress intensity factor range forZq Waspaloy tested at 250 C and 427' C, R = 0.Lw Figure 4.47 Crack depth versus cycle number for Inconel 718 tested at 4270 C, Max.

Stress = 621 MPa, R = -1, Freq. = 0.33 Hz.

SI Figure 4.48 Crack growth rate versus stress intensity factor range for Inconel 718 testedat 427' C, Max. Stress = 621 MPa, R = -1, Freq. = 0.33 Hz.

I.,.. Figure 4.49 Crack depth versus cycle number for Inconel 718 tested at 4270 C, Max.Stress = 758 MPa, R = -1, Freq. = 0.33 Hz.

Figure 4.50 Crack growth rate versus stress intensity factor range for Inconel 718 testedat427* C, Max. Stress = 758 MPa, R= -1. Freq. = 0.33 Hz.

Figure 4.51 Summary of crack growth rate versus stress intensity factor range forInconel 718 tested at 4270 C, Max. Stress was varied, R = -1, Freq. = 0.33Hz.

Figure 4.52 Crack depth versus cycle number Tor Inconel 718 tested at 4270 C, Max.Stress = 758 MPa, R = 0.05, Freq. = 0.33 Hz.

Figure 4.53 Crack growth rate versus stress intensity factor range for Inconel 718 testedat 427' C, Max. Stress = 758 MPa, R = 0.05, Freq. = 0.33 Hz.

Figure 4.54 Summary of crack growth rate versus stress intensity factor range for"Inconel 718 tested at 4270 C, Max. Stress = 758 MPa, R ratio was varied,Freq. = 0.33 Hz.

Figure 4.55 Crack depth versus cycle number for IN 100 (PM) tested at 6490 C, Max.Stress = 758 MPa, R = 0.1, Freq. = 10 cpm.

k rFigure 4.56 Crack growth rate versus stress intensity factor range for IN100 (PM) testedat 6490 C, Max. Stress =758 MPa, R =0.1, Freq. =10 cprm

viii

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Page 11: I i - DTIC

Figure 4.57 First hysteresis loop for IN 100 (PM) tested under strain control at 649W C,Average Max. Stress = 1100 Ma, Total Strain Range = 0 to 0.80%.

Figure 4.58 Crack depth versus cycle number for IN 100 (PM) tested undev, strainS ~control at 649* C, Average Max. Stress = 1100 M.Pa, Total Strain Range=

S•0 to 0.80%1r.

Figure 4.59 Crack growth rate versus stress intensity factor rangc for INI ,0 (PM) testedunder strain control at 6490 C, Average Max. Stress = 1100 MPa, TotalStrain Range = 0 to 0.80%.

Figure 4.60 Typical hysteresis loop for IN100 (PM) tested under strain control at 6490L!' k~ C, Average Max. Stress = 1026 MPa, Total Str'in Range = ± 0.55%.

Figure 4.61 Crack depth versus cycle numbez fot LN100 (PM) tested under straincontrol at 6490 C, Average Max. Stress = 1026 MPa, Total Strain Range± 0.55%.

,• Figwre 4.62 Crack gtwth rate versus stress intensity factor range for IN100 (PM) testedunder strain control at 649'C, Average Max. Stre~s = 1026 M.Pa, TotalSzrain Range = ± 0.55%.

. Figure 4.63 Sumary of crack growth rate ,sus ress intensity factor range forI--' IN 100 (PM) tested under load ck ii? o, -.nd strain contani at 6490 C.

i • Figure 4.64 Fractographs of Waspaloy tested at 427' C.

Figure 4.65 (a) Optical micrograph of fatigue crack trace on gauge section surface andL.-J (b) SEM fractograph for Inconel 718 tested at 4270 C.

Figure 4,66 (a) SEM micrograph of a typical fracture surface and(b) SEM micrograph of pore an-d fatigue crack in gauge section surface

after 150 cycles of strain controlled cycling at a total strain range of 0%to 0.80%

1I.

K i

xix

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`"_.

.'):L

Turbine dasks are regarded as the most critical flight safety components of high

performance jet engines. Presently, turbine disks are designed on he basis ofa tow-cycle

- • fatigue (LCF) life limitation crite.ion which is in accordance with guidelines established by

the Air Force Engine Structural Integrity Program (ENSIP) [1]. This LCF (cycles-to-

crack-initiation) ciiterion tends to be conservative since it "builds Lin" a further life margin

- • associated with crack propagation. Hence, there is considerable econoinic incentive to

, i extend engine service lives by combining crack initiation and crack pnopagation criteria in

.1 %.life predictioii methodologies of turbine disks.

..-. Sc me materials are subject to pirinature fatigue crack initiation due to handling or

S.. machining damage, firtting, and intrinsic defects sach as porosity and inclusions usualiy

"found il powder metallurgy (PM) alloys. Civen initial premature cracking, it is necessary

to employ a defect-tolerant design approach to assure adtý,uate cra-ck propagation lives from

Ssniali initial defects and/or cracks.

To achieve either of the two goals described above, extending lives of LCF

damaged disks or assuring safe lives for defect-containirg disks, requires tie application of

a fracture mechamucs type approach to very short cracks. This entails the determination of

threshold and fatigue crack growth rates for short cracks at elevated temperatures.

It has recently been demonstrated that short crack fatigue behavior cannot be

"S . described accurately by conventional linear elastic fracture mechanics (LEFM).

•,. Consequently, developing a methodology for dealing with short crack behavior remains a

critical but missing link in life management and design of gas turbine disks.

The objective of this research was to determine the fatigue crack growth behavior of

small cracks in nickel-base superalloys at room temperature arid at elevated temperatures.

More specifically, the cbjective includes:

Page 13: I i - DTIC

1. The measurement of crack growth rates in the low growdh rate. regime.

;. 2. The deterimnation of the threshold stress range, A&Fri, and/ot the thlishold

K stress intensity factor range., AKTH, for the ntn.opagationt of small fatigue

cra-ks.

3. An evaluation of the effecZ of temperature ai6 enviromncu t on near

,. •? threshold fatigue growth rates of small cracks.

.- 4. A determination of the conditions t.inder which a saall fat gue crack will be

V -. ",different from a long fatigue crack.

I• In this investigation, subject cracks will be referrmd to as "smadl cracks" to

K characterize them as beMig physically small. Crack depths considered were generally in the

- " ,-- rane of 550 1im to 1mmn The terrmn "short t-ack" ix "shor crack effect" will be use4 to

characterizf the fatiiue behavior of small cracks for which LEFM does not coirelate crack

gr-,w g h rates with long crack results. Crack depth and semicrack lenrgxh are synonymzies.

S-. 2~

- -.-

N..

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SSSSSSSSSSSSSSSSSSSS= saN=A hs h -rA r 4 SAarA.aJirAIdS%%, J ~ Jfia

Page 14: I i - DTIC

2. EXPERIMENTAL PROCEDURES

2.1lMatgia

The alloys selected for this investigation are five nickel-base superalloys. Four* of

these alloys are currently behig used extensively for aircraft turbine disks. They include

% conventional cast and wrought alloys and powder metallurgy processed alloys. The alloys

are listed in Table 2.1 with the test temperatures.

.74 Table 2.1

SA12Tesz Tem~ra__ur

Inconel X-750 250 C

*Waspaloy 25 0 C and 4270 C

S, T___-1... i 1 Q a77° r

* Rent 95 (PM) 250 C

*IN100 (PM) 649 0 C

The chemical composition of these alloys are given in Table 2.2. The heat treatment

conditions and grain sizes are given in Table 2.3. The relevant mechanical properties are

S - ,',A,,vea n T.."able ?A,

•.\,.. 2.1.1 bgonel X-750

•" Inconel X-750 is a precipitation-hardened nickel-chromium alloy used for its

corrosion and oxidation resistance and high smength up to 7000 C. Tne heat treated alloy

"has useful strength up to 9800 C. Typical applications include land-based gas turbine

components, nuclear reactor springs, bellows and forming tools.Sr

The Inconel X-750 used in this investigation was suppl'ed by the International

"Nickel Company in the form of a 12.7 mm thick plate in the annealed conditon. It was

Igat

'.-,

.0.:.•X•.x,.X• •••;Xj• .xTc••...xo X•.h\, .•'~',.ftG'•P•¢••,• '

Page 15: I i - DTIC

given a two-stage heat treatment as described in Table 2.3. The typical microstructure of

the heat-treated alloy is given in Figure Ia. TIe average grain size is about 1.30 gim and

uniform in all directions. The two-stage ageing treatment produces a bimodal distribution

of -j precipitates, the ordered intermetallic phase Ni 3(A!, Ti) which is coherent with the

austenite matrix y. A coarse ý phase (~ 0.15 gm) and a fine y phase (- 0.01 gm) are

present. The total volume fraction of - phase is approximately 20% [2, 3].

K2.1.2 Waspal..

Waspaloy is a conventionally processed nickel-base superalloy which is used for

aircraft turbine disks. The general structure of Waspaloy consists of a nickel rich austenite

matrix (y) and is strengthened by ' precipitates. Solid solution strengthening is provided

by Co, Cr, and Mo. The high melting points of Ni and Co provide the basis for good

mechanical properties at elevated temperatures [4].

This alloy was received as a hot rolled plate and given the heat reatment described in

Table 2.3. The typical microstructure of the heat treated alloy is given in Figure lb. The

microstructr'e is comprised of a duplex grain structure with two different grain sizes. The

large grains have a 200 g.m average diameter and the small grVis a 7 gm average diameter.L

The large grains give good creep properties to the detriment of low temperature tensile

strength. The same lot of Waspaloy was used for short crack growth testing at room

temperature and at 4270 C as well as testing of conventional long crack specimens.

2.1.3 Iaqnel1I4

.,r -jAlloy 718 is a precipitation hardened nickel--base superalloy. It is currently being

used as an aircraft gas turbine disk material. The elements which primarily partition to the

austeniti, pha.-e, -y. are Cr and Mo. The Cr provides oxidation resistance while both Cr and

Mo contribute to solid solution strengthening. The Nb, Ti and Al govern the phase

1.Tecipitatioti characteristics whAle small aditions of C and B are intended to enhance grain

41,,

Page 16: I i - DTIC

.1

4

boundary strength and ductility. Alloy 718 contains "j and j precipitates phases. " is a

nmetastable, ordered, coherent precipitate phase having an 1L1 2 structure. y is a metastable,

ordered, coherent precipitate phase having a body-centered tetragonal (BCID crystal

structure with a Ni3(Nb, Al, Ti) stoichiometry. The total amount of ^1 and f precipate in

"Alloy 718 is approximately 19 volume percent [4].

The material used in this investigation was received in the form of hot rolled bars of

~ K 22.2 mm diameter from Huntington Alloys. The material was given ,he conventional

solution plus 2-step ageing heat treatment as described in Table 2.3. The typical

Smicrostructure of the heat treated Inconel 718 is shown in Figure 2.2. The microstructure

is nonuniform with grain sizes ranging from 5 p.m to 500 gim. This is an unfortunate,!•I! [4consequence of prior processing which cannot be rectified by heat treatment alone. Note

that the solution temprature used irn heat uiamici, 9,.n IL., ii beIVw tMe V-phas: ZVIYvuO

near 982' C. It is the 8-phase that inhibits grain boundary migration and controls grain

size. Further grain refinement would require additiorial fltermal-rrehanical processing.

We opted to proceed with the material as shown in Figure 2.2.

= 2.1.4 Rend 95 (PM)

Renr 95 is a high strength nickel-based superalloy which is processed by powderO1

rmetallurgy and is currently used for advanced aircraft turbine disks. Powders are produced

by an argon gas atomization process. Rend 95 is reported to contain the following phases:

y, MC, MC', M23C 6 and M3B2. The microstructure of as HIP materials are generally

Squite homogeneous with large j paiticles (-5 pjm) frequently observed at grain t)undaries.

The mat-ix contains both small (-{0.2 jim) mid intermediate (-2 lim) sized j particles [5].

In this investigation, Rend 95 powders of 140 mesh were used to make the

(f •compact. Before consolidation, the alloy powder was intentionally seeded with A120 3

particles withi an aveyage diameter of 114 gnm. The heat treatment employed is described in,• rtr

Page 17: I i - DTIC

Table 2.3. The typical microstructure of Ren6 95 is shown in Figure 2.3a- The average

gr.in diameter is about 5 gm.

2.1.5 INJ10 TPM)b IN 100 is high strength nickel based superalloy which is processed by pcwder

metallurgy and is currently used for advanced aircraft turbine disks. Strengthening is based

on a high volume fraction of Y precipitates which ae coherent with the matrix. Solid

solution strengthening elements and carbides play the same role in this alloy as in those

described above [4]. This material was supplied by Pratt & Whitney Aircraft. Specimens

were cut from a gatorized disk. The heat treatment employed is described in Table 2.3.

The typical microstructure of INI0O (PM) is shown in Figure 2.3b. TIhe Average grain

diameter is about 3-5 p.m.

S~2.2 Test Sgecimen Gernetrdj

•,2.2.1 RooP.m TempmueL1

[The spechrien geometry ernploy in the investigation of fatigue behavior of short

cracks in tubine disk alloys at room temperature is shown in Figure 2.4. This geometry

was selected because it has the following advantages:

1) Flat surfaces can be easily ground and polished to a nmiror finish,

V" 2) Flat surfaces can be replicated over a larger area.

3) Large flat areas allow the monitoring of a greater number of propagating short

cracks in each specimen.

4) Calculation of the stress intensity factor range is simplified for a flat surface.

"4~

Page 18: I i - DTIC

IMM

rVW

In experiments where the maximum .tress was high, the width of the specimen was

reduced from 11.4 mm to 6.4 mm to prevent premature failure in the threads.

<;22.2 2 •

The two specimen geometries employed in the investigation of the fatigue behavior

of short cracks in turbine disk alloys at elevated temperature are shown in Figure 2.5 and

Figure 2.6. The specimen is essentially an axisymmetric button head low-cycle fatigue

specimen of 6.35 mm diameter gauge section. It was chosen to be suitable for both elastic

and elastic-plastic loading conditions. These specimens are induction heated and have asufficiently long gauge length (lo = 19 trmm), of uniform cross section, for total longitudinal

strain control testing. A modified low-cycle fatigue specimen with flats on opposite. faces,

"Figure 2.6, was adopted when it was fou.ind that the curvature of the cylindrical specimen

surface may have conributed tu a ud'ctL on of un, , ,ack w.hen the surfa.e crack lenoth

exceeded about 600 g.m. This problem will be discussed later.

2.3 B.C.Pi d1

All specimens uskd in this investigation were machined by low stress grinding or

by ele:tro-chemical machining. After low stress grinding, there exists a disturbed layer of

about 50 to 100 pin in depth which contains residual stresses [6]. This rcsidual stress layer

was removed to avoid interference with the propagation behavior of small cracks.

Removal of the residual stress layer was accomplished by the following

procedures. Flat segments and round segmnents of specimen gauge sections were hand

ground with successively finier grades of SiC paper; 240, 320, 400 and 600 grit sizes.

Gauge section surfaces were ground in the longitudinal and tiansverse (circumferential)

directions. Shaip corners were rowided to prevent crack initiation. In the final steps of

hand grinding, 6 Vin diamond paste was used. Finally, the reduced section of each

specimen was clcctropolished with a solution of 45% butyl-celluwlve, 45% acetic acid and

7

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10% perchloric acid, at 40-50 volts for 30 seconds at a temperature of - 0 to 5" C.

Apprximately 100 pim of surface layer was removed by the procedure described above.

When artificially introduced surface defects were used as crack initiation sites, they were

processed at this time.

Thermocouples were spot welded to precise locations below the gauge section to

k• control the temperature using the "set point" technique in elevated temperatur tests.

2.4 lnjij-Pon of Short Cracks

Two important and practical considerations dictate the use of artificial means to

initiate fatigue micro-cracks. The first consideration is that, due to the statistical nature of

471 ýrsmall cracks, the probability of having a characteristically maximum size defect intersecting

the surface of the gauge section of a laboratory test specimen is small, The second

consideration is that measuring small crack lengths is experimentally difficult. However,

this task can be greatly facilitated by knowing the exact location of the cracks.I L

The desired defect geometry is that which is conducive to crack initiation at the

smalhest possible defect size. Such a pseudo-crack should have a sharp defect tip radius

and be oriented normal to the principal applied stress. The process employed to produce

defects must not induce significant residual stressses or other large scale microstructural

damage. In this investigation, small cracks were initiated using three types of artificially

made defects:

1) electro-discharge machined (EDM) surface defects, he-rfispherical "pits" 4

2) elliptical surface defects created by a pulsed Nd-YAG laser

3) alumina particles intentionally introduced into powder metallurgy Ren4 95

before powder consolidation.

Mr./MIMAIVU

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!• Fatigue crack initiation sites at persistent slip bands (PSB's) in conventionally

•; processed alloys and at micro-porosity ha powder metallurgy alloys were also used in this

• • study of small crack behavior.

!,• 2.4.1l Crack Initiation from EDM Pits

S~For many of the crack propagation experiments carried out at room temperature

short cracks were initiated at electro-discharge machined pits. These surface defects were

S~made with a conventional EDM using a monel electrode with a conically shaped, tip. The

IC resulting defect is a hemispherical pit. A typical EDM pit can be seen in Figure 2.7a.

•i There is a shallow cast layer ofabout 10 i.tm thickness surrounding the pit. This technique

S!leaves the surrounding matrix free of residual stress. The advantages of this technique are

that it i:: experimentally expedient and reproducible. There are, however, limitations on

•'€, minimum defect size and defect tip radius.

•i 2.4.2 Crack Initiation from Nd-YAG Laser Generated Defects

The EDM technique, using equipment presently available at MIT, was found to be

limited to a minimum diameter of -200 pan. In the course of testing it was soon realized

,• that anomalous ca-ack growth behavior in turbine disk alloys could likely occur at crack

sizes less than 100 p.m. in fact, c'acks were found tu initiate at sites of ,,i.,,.-p,,.,.,it of.-

S10 pmdiameter in powder metallurgy IN100. It was also felt that fatigue cycles reurdto

propagate a crack from 10 pim to 100 p.m would constitute a significant contuibution to the

•.,. fatigue life of a component. Consequently, it became desirable to initiate cracks from

•.smaler artificially introduced defects. Teo hstcnqei m

4-•;" A pulsed larer was employed to introduce .,urface defects in fatigue test specimecns

the Q-switched mode with a wavelength of 532 trm. T/he incident beamu diameter is ~ 3 tmn

S ... _ . . . - , , •, - - • • • . .+ , V _

Page 21: I i - DTIC

with an output energy of around 10-3 Joules/pulse and a pulse duration of 0.2 g.t sec. The

incident beam is focused by a series of two cylindrical lenses which generates an elliptical

defect in the specimen surface as shown in Figure 2.7b from 100 to 500 pulses are used for

each defect. The depth of each defect is determined by the number of pulses and theII intensity of radiation in the incident beam. Similar defects have also been made using a

spherical lens and t-anslating the specimen with respect to the focal point to achieve the

desired surface length. The disadvantage of this technique is the difficulty encountered in

controlling the depth of the defect. This was due to the nonuniform spatial distribution of

intensity in the incident beam and changes in the beam characteristics between each use of

the laser.4

2,4.3 Crack Initiation frtm Al20 3.__. l'"a

-CTh-e _eni 95 u6 in this investigation was intentionally seeded with AIO, particles

with an average diameter of 114 gin. The oxide particles were mixed at a ratio of 20,000

particles of A120 3 per pound of alloy. Fatigue crack initiation generally occurs where an

p A120 3 particle intersects the surface of the specimen gauge section as shown in

Figure 2.8a.

F;,.

-, 4 4 Perci•

In nearly all experiments where artificial defects were used, cracks were initiated by

precracking at R = -1 and a stress range of approximately ± 520 MPa. Precracking

required from 20 K to 50 K cycles. Precracking was found to be necessary because:

1) Negative R-ratios promote crack initiation.

r 2) It was necessary to initiate and propagate cracks at least 10-20 gim to grow out

of the local influence of the defect.

10

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3) It was intended that cracks should assume a stable crack front geomeuty before

surface crack length neasurements would correlate with crack depth.

2.5 Crack Lenah Measurement by Plastic Repl•ca

The plastic replica technique was used to measure crack lengths in ruoom

temperature and elevated temperature tests. This technique has a resolution of about 1 irm

in crack length. in addition, it serves a-s a valuable record which can later be used to

correlate crack growth rates with crack tip-microstructural interactions. Acetyl cellulose

tape of 125 gim thickness was used as the replicating material and acetone or methyl acetate

as the solvent.

The replicating procedure was as follows:

1) Cyclic loading was stopped at zero load after a preset number of cycles.

2) Induction heating was automatically turned off in elevated tempmerure tests.

3) The specimen was loaded in tension to 50-80% of the peak cyclic load. This

static load was decreased as the cracks became longer.

4) The softened side (with a few drops of solvent) of a piece of replicating film

was applied to the specimen surfaceý under a light pressure for about 15

seconds.

5) The film was allowed to dry for 10 minutes.

6) The film was peeled off and taped to a glass microscope slide with the replica

facing up.

7) The replica was then viewed under a reflected light microscope at magnifications

ranging from 50x to 500x.

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8) Crack lengths were measured using a calibrated eyepiece micrometer.

2.6 Crack Length Measurement by A. C. Potcntial Drop

Due to the cor.-iderable labor involved in monitoring crack length by replication,

especially at elevated temperature, a program was undertaken to develop an A. C. PotentialDrop system for the continuous and automated measurement of crack length. A resolution

of - 2 gim in crack length was achieved. Unfortunately, a significant problem was

encountered in the long term stability of the system. Consequently, work proceeded using

the plastic replication technique for measuring crack length.

The A. C. Potential Drop system is described and discussed in Appendix A.

2.7 Small Crack Growth Testing at Room Temperatume

The fatigue tests for small cracks were carried out for Inconel X-750, PM Rend 95

and Waspaloy on a servo-hydraulic machine under load control at mtom temperature, in lab

air and at a frequency of 20 Hz. The test conditions for small crack growth in Inconel

X-750, Rend 95 (PM) and Waspaloy is shown in Table 2.5. The load ratios selected were

-1, 0.05, and 0.5. The maximum stresses for different tests varied from 331 MPa (48 Ksi)1~~. ~- -f -- 11 *, T.. -L -- 1 1 .- 1- .4C... - *... i n s T rr^ .~

to ID ivu-a k1 IV u 1% ). Llillil I .LallL 1--fItUl lclJ r,.A• IiJL U .Jv V &JA t A.J 1ýJ9S ..

crack lengths the tests were interrupted at regular intervals and replicas were taken of both

faces of the specimen at 80% of maximum load.

.4 The investigations of the threshold behavior of small cracks were conducted only

for Inconel X-750. The threshold stress ranges for small cracks at a given R ratio and a

given crack length wtre determined by increasing stress range by about 3% every 500,000

cycles if the growth rate was ! 10-11 m/cycle.

The polished specimen surfaces were etched by Kalling's solution (100 ml HCI +

100 ml ethanol + 5 gm CuC12) or modified Kall ,g's solution (100 ml H20 + 200 m.

S• 12

Page 24: I i - DTIC

methanol + 100 ml HCI + 7 gm FeCI 3 + 2 gm CuC12). Etched specimen surfaces were

observed under optical microscopy to reveal the microstructure, the morphology of defects,

small crack path and associated slip bands, and the relationship between the microstructures

and the cracks.

The fracture surfaces of small cracks were opened up by breaking the specimens

after making a saw slot along the small crack plane. They were then examined by scanning

electron microscopy (SEM) to reveal fracture surface features.

2.8 Small Crack Growth Testing at Elevated Temperature

Test specimens were prepared in the manmer described in previous sections. Three

defects were introduced at orthogonal positions in the midplane of round gauge section

specimens. Two defects were introduced on opposite faces of round-with-flats gauge

Rl section specimens. Testing was performed on a closed-loop, servo-hydraulic testing

machine. Water cooled grips were alligned on axis to within ± 15 gmn before every test.

This tolerance is less than the lateral play in the actuator.

Specimens were heated by a 2.5 kilowatt - 400 kilohertz induction heating unit

using an eight-turn, axi-symmetric induction coil. The temperature in the plane of the crack

was maintained at the desired test temperature within ± 10 C. The temperature gradient

along the gauge length was less than ±:5 1 C as determined by a system calibration.

The test conditions for small crack growth in Waspaloy, Inconel 718 and IN 100

(PM) are shown in Table 2.6.

Load Controlle Testing

Load controlled tests were performed at 20 cpm or 10 cpm using a sinusoidal

"waveform. Cycling was stopped at zero load and induction heating turned off

Page 25: I i - DTIC

automatically at preset cycle intervals. After the specimen cooled to room temperature,

crack lengths were measured by replication. Tests were terminated when the largest

surface crack length was in the 2-3 mm range. Specimens were separated along the crack

plane by continuing to cycle at room temperaiure and a positive stress ratio.

The principal test variables were maximurnm stress and R-ratio, (minimum

stress/maximum stress). The stress was calculated as the engineering stress, P/A0 ,

Strain Contlrlled Testing

Strain (displacement) controlled tests were performed at 10 cpm using a sawtooth

waveform. Longitudinal displacement was measured on specimen gauge sections to

achieve total strain control. The effective gauge length between extensometer probes was

14.4 umm. Total strain, eT, was measured and controlled to a precision of± 0.01%.

At the end of each cycle interval; cycling was autotmatically stopped at zero strain,

hydraulic pressure turned off returning to zero load along an elastic path and the induction

heating turned off. After the specimen cooled to room temperature, the extensometer was

removed and crack lengths were measured by replication. When elastic-plastic cycling

occurred, care was taken to return the extensometer and the strain-load value to the

appropriate position on the hysteresis loop. Tests were terminated in the same manner!]•'•employed in load controlled tests.

Total strain ranges were chosen to be relevant to notch locations in turbine disks.

14

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Q~00

0 000 0

0 00

C). 0

.0~ OR6 ,

03 en~

xn 00 W

LC 0 - t

m 00o- +6 6 '

0 lo0r ~ ~QA -r- WI.

Page 27: I i - DTIC

00 0

0 .

0 'C 0 0

r-i r+ r OC^

"211

00 + 0 -

CD

0+ -r0u-

* 16

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Table 2.4Mechanical Properties

Im

Material Temp E 00.2% GUTS Elog.(0C) (GPa) (Ma) (MK'a) (%)

Incoocl 23 214 610 1000 30X--, 50

Waspaloy 25 206 903 1324 24538 949 1.51 31

Inconel 25 204 1131 1340 22719, 427 183 1100 1250 47

Rend 95 (PM) 25 214 1240 1650 16.6

1N N100 (?M) 649 1"19 1100, 1380 22-

17

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Table 2.5

Small CrMck Fatigue Tests at Room Temperatre

Test Number Material R-ratio Gmx: (MPa) Number of Cracks

JF! X-750 -1 424 4JF2 X-750 -1 350 2IF3 X-750 -1 331 6WF4 X-750 0.05 15 1Jr5 X- 750 0.0. 456 6JF6 X-750 varied 483 3

JF7 Waspaloy -1 483 10JF8 Waspaloy -1 758 10JF9 Waspaloy 0 758 10JFIO Waspaloy -1 621 7J 1 t Waspaloy -1 345 6JF12 Waspaoy -1 758 3JFI 3 Waspaloy 0 483 4

JF14 Rent 95 (PM) - ,83,Jr.15 RaeO6 95 (PM) 41 758 13

* JF16 Rent 95 (PM.) 0 758 4J JF17 Rend 95 (PM) 0.5 758 3

3.8

Page 30: I i - DTIC

Table 2.6

Small Crack Fatigue Tests at Elevated Thnperature

Test Number Material Temp (°C) R-ratio carak (MPa) Number of CracksGR1 Waspaloy 427 -1 483 2

GR2 Waspaloy 427 -1 758 3GR3 Wa~spaloy 427 0 758 1GR4 Waspaloy 427 -1 621 3GF5, Waspaloy 427 0.3 758 2GR6 Waspaloy 427 0.5 896 3GR0 Waspaloy 427 0.05 621 2?2GR7 Inconel 718 427 -1 758 2GRR 7lc o 427 A ,...,GR9 Inconel718 427 -1 621 2

GR16 IN 100 (PM) 649 0.1 785 2

C - control roin. EUM.

GRI4 IN 100 (PM) 649 -0.55% 0.55% 2CYGR17 IN 100 (PM) 649 0 0.80% 2

" I-.

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N N

(ý,- A.

-ý k U .

vi -

¼

202

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)ILA

-4r

F .¼mt 1l

~)I

r-gi 2 .2 y ia irsrcuefrIcnl7 8ue nti rvsiain

':,t521

Page 33: I i - DTIC

II

Ij

.0 Im

INh ue23 Tpca irsrcmsfo:t odrmtlSr~ e69 nb) po/c ntlug N10

p22

4S

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CL -C

_~t LA~_ n v

I- in , -

Cod

I CL

CT) -- (J (L N- -z I <__ _ _ _ ..

-3 _ _ _ th (

0 fl LA, Uf(NJ < a

NN

23

Page 35: I i - DTIC

Ei 17 EEE E

a):E L

Cf) V

Cv)j

24

Page 36: I i - DTIC

E EE

I -

-< I

1 2 li

25 C

Page 37: I i - DTIC

#S, . , - ,

4 0 , .a

b - a , . ""

40'0

* -

., .• . -

(a)

J.

I- 4 . ° I

I N V- E_

. ' . -..pv . ., ,, ..

--- C----,..--.------ - - - - - -

':'"~. \.j •.t- " "" 3'"-. ', -r&•,• •'k r•;.'

•.•., Waspaloy

Page 38: I i - DTIC

Q(U)

V44.- " - - ,

-v -. -

~fr.k

S_ .. , ,, .. _ _

l::i •;" ½. W'"" " ZA " " S" -.... ... "" "

I a Figure 2.8 a) Fatigue crack initiation at an A120 3 particle in powder metallurgy Ren695.

b) Fatigue crack initiatioa at PSB's in Waspaloy tested at roomtemperature.

U~27

Page 39: I i - DTIC

3. D2ATA AMU=ALYS

The raw data taken frou each fatigue experiment was surface crack lcngth, 2c, and

cycle number, N. The desired presentation of the data is crack depth, a, versus N and

crack growth rate, da/dN, versus stress intenisity factor range, AK. This requircs A

determination of crack size and shape.

Elevated temperature faugue experiments were terminated when one or more cracks

- nad achieved a surface crack length of approximately 2 mm. At room temperature, fatigue

loading was continued at a positive stress ratio, but reduced stress amplitude, until

specimen separation occurred The shape of the subject cracks at the termination of high

temperature testing was then evident on the fracture surface as a result of heat tinting.

Figure 3.1 shows several fracture surfaces with crack front profiles readily distinguished

Iby the presence of oxidation.

Cracks of different sizes are present in the same specimen due to the variability in

the number of cycles required for initiation from the artificial defects. In some cases, one

or more cracks may have arrested. Careful measurements of surface crack length and crack

depth were made from these and other photographs. These values are shown graphically inV~. Fig.-e "3.2• ',' .... plo i•c yPi, aganst c for n numer of t it• ,rder diffeA nt -onditions.

A c/a ratio of-I is the predominant value over the full range of crack sizes considered and

for the variety of testing conditions employed. Any variation from c/a I cannot be

systematically related to testing conditions. Hence, all subsequent data reduction will be

performed by first taking the crack depth, a, to be equal to half the surface length c. The

c/a ratio was taken to be equal to one for room temperature experiments as well.

Each fatigue experiment yielded from 7 to - 30 data points. These Ni, ai, pairs

were tabulated and first plotted as ai vs. Ni. The data was edited for potential measurement

28

~ U~LF~ ~it N ~ J~LWU~ J~ Uirw.~ ~ ~K6YUX.~t AU U~~~ Mr, VU L" L" IAtv LtW in ýA IV% 16Lft~ IW\

Page 40: I i - DTIC

errors. If a data point appeared to fall erroneously out of place, the replica was measured

again.

Values of a were compared to artificial defect size and shape on the fracture surface.

Data pairs were considered to be valid only after the crack assumed a semicircular shape

encompassing the defect. For this reason some. of the first Ni, ai pairs may have been

Lrejected.

3.1 Computation of Crack Growth Rates

The determination of daldN from a versus N was accomplished using two well

established data processing techniques; the secant method and the incremental polynomial

technique.

,ti ~ll • ,7 r 4U VU 3 • t .- UdL v..L V t,, f~l. v' k StJLJV nfla JI. ,.e bJIIor.t'. a 3.'l% IL, %L - A.•lLl-Jkf.LJ t' .LLS . I5

crack growth rate. This was usually attributed to the interaction of short cracks with

variable resistance in the microstructure. The secant or point-to-point technique was

frequently employed when depicting this variabilty. The secant method is simply a

calculation of the slope of a straight line which connects two adjacent data points on the a

versus N curve. The crack growth rate may be calculate as:

da ai+1 - ai(3.1)

dNi Ni÷ 1 - NiIN.N

The stress intensity factor range associated with this crack growth rate was calculated using

the average crack length where am -( ai+ 1 + ai)/2. The principal disadvantage of the secant

method is that the variability calculated for da/dN often includes a significant component

which can be attributed to error in the measurement of crack length.

29

`t• '•i• •'••• . ` ••• ;•'t••-•-••.• •. - • .r•%* ••• •• • r••'`•• r•• .3.•• `• • . '-' ••'•• • - 7- a • A ••• •. J4J __ .• •

Page 41: I i - DTIC

"Tlhe bulk of the crack growth rate data was processed using the 7 point-incremental

polynomial technique. This technique "smooths out" the crack growth rate curve andSminimizes the influence of meaurement error on 6,a/dN by fitting the a versus N curve

locally in inciements. This technique involves fitting a parabola to successive 7-point

0 subsets of the data using a "least squares" proceduoe. To determine daidN at point i, the

equation of a parabola was determined for data points Ni-3, ai-3 through Ni+3, ai+3, The

slope at point i is simply the first derivative of the equation of the parabola. In view of the

limited number of data points for each experiment, the slope at the first and last three points

was determined using the first and last fitted parabolas [7].

3.2 Stress lntensity Factor Calculations

fi. The essence of the short crack problem in fatigue is the inability of the stress

intensity factor, K, based on linear elastic fracture mechanics, to consolidate crack growth

rate data at very small crack sizes in some materials. The anomalous behavior of short

cracks is generally characterized in terms of da/dN versus AK. The breakdown of LEFM

for short cracks is attributed to a lack of similitude between short and long cracks. In some

cases, the apparent deviation from long crack behavior may be attributed to an inappropriate

determination of the effective stress intensity factor range, AKff. This may be due to an

L ,'' '.,,e cha.a s. :, - io Of ,"tkt bpo l , u .L .J WM a ,JU accou A for '. %. JCt ,, . ', i.. al

incorrect assessment of the stress intensity factor.

The stress intensity factor solution employed in this investigation was that for a

-' semi-elliptical surface. crack.

Irwin [8] developed an expression for the mode I stress intensity factor around an

elliptical crack embedded in an infinite elastic solid subjected to uniform tension. The most

general formulation is given by

30L"'

Page 42: I i - DTIC

[4 K, a [sin24~ + (a2/c2 ) cos2~]i/4

(3,2)

where 4 is an elliptical integraJ of the second kind and is given by

x/t2

f I-(c 2 -a 2 ) sin2 4 11t2 do)

The symbols a, c and 0 are defined in Figure 3.3a. As discussed in a previous section, the

c/a ratio was found to be approximately one and constant over the full range of crack sizes

considered. By substituting c --- a, the above expression for stress intensity simplifies to

K= 2 o'aWa=0.637 -r•ia- (3-4)

This expression was first developed by Sneddon [9] and is valid for all values of 0 when

p c = a, that is (or a circular internal crack of radius a (penny-shaped crack) embedded in an

infinite solid.

The stress intensity factor for surface cracks in finite elastic bodies (laboratory

specimens) may be expressed in terms of a boundary correction factor modification to the

stress intensity factor for cracks in infinite bodies. The most general formulation is giver,

by

K = 4 c [sin 2 4 + (a2/c2) cos 2 011/4 F (a/t, a/c, c/W, 4)(3.5)

The boundary correction terms are defined in Figure 3.3b.

31

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Newman 10] has reviewed a significant number of boundar correction factors for

surface cracks. For the caie of the semicircular surface crack (a/c = 1) and a/t < 0.2, the

maximum value of F occurs at or near the intersection of the crack with the specimen

surface (• = 0) where F - 1.15. Hence, the maximum value of the mode I stress intensity

factor for small semicircular surface cracks may be approximated by

K (1.415) 2a In 0.73 o ,ii(3.6)

.•--, This expression was used for all data analysis in this investigation.

The specimen geometry employed in room temperature tests, shown in Figure 2.4,was of rectangular cross section similar to Figure 3.3b. A boundary correction factor of

1.15 is the appropriate estimate for this geometry and the range of a/t covered in all tests.

Usually a/t was less than 0.2.

SThe specimen geometry employed in many elevated temperature tests, shovwn in

Figure 2.5, has a cy'lindrical gauge section. Nisitani arid Chen [11] have calculated stress

solution for elliptical surface cracks in finite. plates, Eq. 3.6. They have calculated this

correction factor to be equal one when c/a = 1 and air is less than 0.2 which was the case in

the elevated temperature test specimens.

Raju and Newman [121 calculated stress intensity factors for semi-elliptical flaws in

cylindrical rods using a three dimensional finite element method. The results were

presented in terms of K/a ,4",taQ versus ). When c/a =1, Q = (it2)/ and a/D) •0.2,

therefore, K/a 'JTQ = 1.15 which is the boundary correction factor for the cylindrical

3specimen.

•"• 32

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The stress intensity factor rmage was calculated using only the positive portion of

the loading cycle. These tests were not instrumented for the measurement of crack

f•. opening/closur-e stresses, therefore, the stress range, Au, was taken as o ma. when

Crain • 0 and as (•max - Omin) when imin > 0. Cracks grew nominally perpendicular to

the applied stress. Crack lengths were taken as their prqjected lengths. Hence, for the

specimen and crack geometries considered in thtis hivestigation, the nominal stress intensity

factor range was calculated according to

AK = 0.73 AMT- (3.7)

It is important not to understimate AK for small cracks because it could yield crack growth

rates that are apparently higher than the true values when compared at a given AK.

r

!

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tx K

I AN -,~ I V

Mag =30XF~igure 3.1 Crack front profiles as evidenced by the presence of oxidation on the

fracture surlaces of Waspaloy specimens tested at 4270 C.

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|I

1.2-

mu UU

0.6

f•. 0.2'IL 0.0

200 400 600 800 10oo 1200 1400 1600

C (urn)

Figure 3.2 The aspect ratio, c/a versus c for numerous cracks in Waspaloy tested at427C under several stress rauges

35

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S

m •(a)I -4

A

SeCtion A-A

(b)

A A FrOnt foce -- 2c -

r----------Section A-A

Figure 3.3 a) Elliptical crack embedded in an infinite solid. subjectod, to a unifromnstress.

b) Surface crack in a finite plate subjectcd to a uniform stress (from Ref.10).

' I ? 36

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4. RESULTS AND DISCUION

4.1. Eoaduc BebA,;r of Stnall Cracks at

4.1.1 ID1Q";j X-70

The variation of threshold stress range with semicrack length for Inconel X- 750 at

R=0.05 is shown in Figure 4.1, in which ao is the intrinsic crack length and ar is the

fatigue limit. The corresponding plot of threshold K vs. semicrack length is shown in

Figure 4.2. It is found that when the crack is long the data points approach the line

K representing the long crack threshold values. At small crack lengths these data points

deviate from the long crack line at somre, critical point, with the threshold stress approaching

the fatigue Limit of the alloy and with the threshold stress intensity factor appoaching zero.

This threshold behavior of small cracks has been observed by other investigators [13, 14].

The breakdown of LEFM for small surface cracks gives one explanation for the

unusual small crack threshold behavior. The lower plastic constraint for a small crack near

the free surface provides a condition of extensive plastic flow. This factor combined with

a high applied stress (near yield stress) for small cracks results in a high ratio of rp / a.

The stress and strain fields at the crack tip thus can best be described by EPFM due to theerather large plastic zone at the crack tip. As an alternative approach, an effective crack

length which contains part of the plastic zone was proposed to substitute for the actual

crack length in the calculation of K in order to get a better description of the stress field at a

small crack tip. The effective crack length contains an extra term in addition to the actual

crack length, The extra tenn is called "intrinsic crack length (a,)", which is directly related

to the plastic zone size. When the crack is very long, the effective crack length is almost

the same as the actual crack length, then the crack behavior follows LEFM. But when the

crack length approaches zero, the effective crack length approaches the in tinsic length ao,

then the small crack behavior appears as shown in Figures 4.1 and 4.2.

i[•, 37

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Grain boundaries play a critical role in the threshold behavior of small cracks since

grain boundaries give large constra-it to the plastic flow at the tip of a small crack. The

grain size provides a limit to the plastic zone size at the crack tip and thus a limit to the

intrinsic crack length a.. It then can be inferred that the smaller the grain size, the smaller

the intrinsic crack length and the less is the extent of small crack behavior. This inference

has been comfirned by experimental observations [15, 16].

Another important factor which affects the threshold behavior of small cracks is the

! crack closure effect. As described in [17-23] small cracks have less closure than long

; cracks. This fact results in the much higher effective AK for small cracks than for long

4 "cracks, which decreases the nominal threshold AK of small cracks (Figure 4.2).

Figure 4.3 shows the variation of maximum and minimum values of threshold

stress innsity f....r f small crck with t.he la-nd Atio R in cnendl X-75f0, with cracks

having almost the .sare length (-110 gim). The data can also be plotted as AKth vs R,

shown in Figure 4.4 where A.Kt is only the positive part when R < 0.

I It is found that the maximum value of the threshold stress intensity factor K1(,.

increases with increasing R (Figure 4.3). AKth is the highest at R = 0 and the lowest at

U R , 054(Figure4.). Therelation shown in Figure 4.4 was expressed by Kiesnil and

Lukas' equation if AKb is now taken as the whole SWF range [241.

AKh (MPa -dm) = 7.236 (1-R•Y (4.1)I."

or in other forms:

* AKt1J.236 = (I - R)y (4.2)

K1j'•/7.236 = (1 - R)-Y- 1 (4.3)

wherey= 0.956 R 0

r y=0.514 R<0r

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Equation (4.1) can also be transformed into Walker's equation 125]:

&Kf= (-R)P (4.4)

where p =0.044 R Z 0

p0.486 R<O

Crack.closue plays a critical role in the effect of R on the threshold value of smali

cracks. Elber [22] proposed the following equation to show the variation of closure

parameter U with R in aluminmn alloy:

U = 0.5 + 0.4 R (4.5)

where U = AIeff / AK

Similu- udar it -" We -- ".... by - . t..... ewe M'A-

Equation 4.5 implies that closure decreases with increasing R. Although Equation

4.5 is for plastic-induced closure, there is the same tendency for variation of U with R foi

oughness-L-iduced closure [281. If a constant effective AK, is assumed through all R

P ratios, it is not surprising that when R increases, the nominal AK.th will decrease due to the

d.'re~e of cck closure, ass ohwn in Figure 4.4. A further examination of the R effect

reveals some discrepancies between the R effect and its closure explanation. For instance,

when R is high enough (say R = 0.5) the closure effect almost disappears, AKth is

supposed to be constant (equal to efective AKth) as R continues to increase according to the

closure model, but the threshold values of AK have been found still to decrease with

increasing R ratio [291. The other possible reason for R ratio efect may be the mode 1I

component and compression. For a small fatigue crack with a zig-zag path, as a tension

load is applied to the specimen, both mode I and mode H mechanisms operate. As a

compressive load is applied to the specimen only mode HI contributes to the driving force

39

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for the crack growth. The compression and mode H effect were not taken into account in

closure explanations [211.

The crack growth rates computed from "a vs N" curves by polynomial regression

were plotted as a function of the stress intensity factor range AK for R = -1, 0.05, 0.5

respectively in Figures 4.5 - 4.7, where AK was calculated by Eq. 3.7. The effect of

EDM pits on initial K values was accounted for with Bowie's correction [30, 31]. All the

crack growth data for different R ratio (-1, 0.05, 0.5 ) are then plotted together as a

"f-unction of AK in Figure 4.8 in order to compare the effect of different load ratios on crack

growth rates. The long crT'ck data of R = 0.5 and R = -1 are calculated by Walker's

equation (4.4) based on long crack data for R = 0.05 after reference [32].

It is found that the growth rates of small cracks are much higher than those

predicted for long cracks at the same AK for all three different R ratios (Figures 4.5 - 4.7).

The transition points from typical small crack region to long crack behavior are around a

length of 400grm to 6OO.im in Inconel X-750. This length is about 3-5 times the grain

size. It is also very interesting to note that some very small cracks with a length less than

the grain size had higher growth rates than longer small cracks (Figure 4.5).

The higher growth rates come from the EPFM nature of small cracks due to the

high ratio of r[/a. From the point of view of modified LEFM, a high ratio of rp/a provides

a larger effective driving force AKe = Y Ao-%rt -(a~rpt2). Alternatively, according to

EPFM, the high ratio rp/a results in a larger crack tip opening displacement (ClOD) (see

Dugdale model). For a growing small crack, when its plastic zone size is smaller than the

grain size, it behaves like in a single crystal with less plastic contraint and thus a high ratio

.ra- After its plastic zone size exceeds the grain size, more plastic constraint leads to a

lower ratio rpia. The transition plastic zone size (rp- d) corresponds to a semicrack length

of 4-5 times the grain size [33, 34, 35, 36].

40

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From the above discussion it is clear that the AK values based cn LEFM can not be

taken as a general parameter to rationalize all small crack data. A new parameter based on

EPFM should be proposed to better characterize the crack driving force for small cracks.

Figure 4.8 shows the inability of AK to rationalize the R ratio effect for both small

cracks and long cracks. To solve this problem, the effective stress intensity factor range,

AK lt = Kma -KOp, has been used instead of AK in the plots of da/dN vs SIF The use

of AKff works in general, but it fails to correlate the data at negative R ratios. This

suggests that other factors such as the mode U component or other criteria must be looked

N, at.

7• •:4.1.2 WasRoqlo

A comparison of fatigue behavior for different stresses at R - i and for different R

ratios at amax = 758 MPa are shown in Figures 4.9 and 4.10. This data is similar to the

data of Rene' 95.

Figures 4.11 - 4.13 show the crack growth rates versus the stress intensity factor

range for different R ratios and different stress levels. It is found that the test data of smallcracks initiated in fine grains fali within the scatter IuJs of h0 -ic Long ...... g..La..

However, it is also observed that some very small cracks, initiated naturally from PS-9s

inside large grains, had much higher growth rates than the other small cracks (Figure

4.13). The different behavior of small cracks in large and small grains of Waspaloy

provides more evidence of the critical role of grain size in the fatigue behavior of small

c'acks.

High applied tensile stress levels and a compressive stress are two important factorsvwhich promote the formation of PSBs and the initiation of microcracks in PSBs. The

interaction between these PSB cracks and the main crack results in the fluctuation of crack

41

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growth rates and sometimes leads to the higher growth rates of small cracks, see the scatter

in data of small cracks at R = -1 and IMax = 758 MPa in Figure 4.11.

Figure 4.14 summarizes the test data for different R ratios and stress levels.

4.1.3 Rene'95 (?M)

A comparison of the fatigue behavior for different R ratios at OmY. =758 MPa, as

well as for different stress levels at R = -I is shown in Figures 4.15 and 4.16,

respectively. At the same maximum applied stress, the fatigue life was found to be the

longest at R = 0.5 and the shortest at R = -1. This fact is due to the small AK at R = 0.5,

a mode II effect and less closure effect at R = -1. The higher anjax results in a higher

driving force for crack growth and thus a shorter fatigue life can be seen in Figure 4.16.

The crack growth rates, da/dN, versus AK are shown in Figures 4.17 to 4.21 for

three different R ratios and two different amax, respectively. The test data for two

different stress levels at R = -1 are found to fall in same region in the plot of da/dN vs AK

((Figure 4.19). The small crack data points fall around the long crack trend at R = 0

(Figume 4.20). In the case of R = -1 and R = 0.5, the small crack data are distributed

• Atl- ,-,.,aA ,%tIh a vria% clnj-^ f" ,ul,-h ;c nlc- r dt r -n ia r% nn, I rn k lina'

(Figures 4.17,4.18 and 4.21). It appears that the small cracks in Rend 95 obey the

LEFM law of the long cracks. Only a few data points fall above the scatter bands (Figures

4.17 and 4.21), this is probably due to an underestimation of the stress concentration

around inclusions and the role of the debonded interfaces [37].

By comparing the results of Rend 95 to those of Inconel X-750, the grain size is

found to be a critical factor in the snmll crack behavior. The small cracks in Inconel X-750

with large grains have obvious small crack behavior (higher growth rates than long cracks

at the same nominal driving force), but small cracks in fine grain PM Ren6 95 behave like

long cracks. This fact can be understood from the discussion given in the last section.

42

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When the grain size is very small such as in PM Rend 95, the free surface effect (ess

plastic constraint) ahrlostly disappears since the plastic zone size and crack length are all far

greater than the grain size, no difference exists beween small cracks and long cracks. On

the other hand, the closure effect (mostly the roughness induced closure effect) happens

very early for small cracks in fine grains because the dimension of surface roughness is

directly related to the grain size. So the closure effect and thus the effective driving force

between small cracks and long ciacks in very fine grains are almost same.

Figure 4.22 shows a summary of all test data points for R = -1, 0, 0.5. It seems

that the R effect for PM Rend 95 is not as strong as for Inconel X-750. It is probab'y due

to the small grain size leading to less closure arnd less mode H.

4.1.4 Fractography. Room Temperature Tests

Inne mX-_750

Metallographic examination revealed that at low applied stress ranges, small cracks

initiated from or around EDM pits and then propagated approximately perpendicular to the

applied stress following a zig-zag path. Initiation sites at inclusions and propagation along

twin boundaries were also observed. At high stress ranges, initiation of small cracks also

occured along persistant slip bands which developed around the F.DM pits. These

rmicrocracks then linked together to form a main crack.

The preferred initiation of small cracks at EDM pits or inclusions at low stress

ranges is obviously due to the strong stress concentration. At stresses approacbing the

surface flow stress of the alloy, extensive plastic deformation occurs at the specimen free

surface, especially around EDM pits, resulting in PSBs in the grains of favorable

orientation. These PSBs promote the initiation of small cracks.

43

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The specimen with a small crack initiated from an EDM pit (Figure 4.23) was

broken open to show the corresponding fracture surface (Figure 4.24). The examination of

SKthe fracture surface shows crystallographic growth features in the small crack region

(Figure 4.25).

The crystallographic growth is one of the important factors which affects the

growth rate of small cracks. As pointed by Schijve [15], the elastic restraint surrounding a

small crack in a free surface is very different from that experienced at the tip of a long crack

Sinside the material. For a small surface crack with size of the order of the grain size, the

r. ~low plastic constra'int on the free surface results in only a few active slip systems. The

Scyclic plastic slip along the slip system of the highest critical resolved shear stress produces

"a mode 1 + mode I slip band crack, which has strong crystallographic growth features.

single direction in each grain is difficult "ftis results in an increased restraint on cyclic

"plasticity which activates more slip systems leading to crack advance by alternating or

simultaneous shear on many different slip systems.

apidWh.en the crack is long the crack mouth was found to remain open even at zero

•appli, s-tress, due to a "crack clos'ure effect." which is induced by fracture surface

roughness. When the crack is small this closure effect decreases and even disappears when

the crack length is less than some critical length.

A lower closure stress for small cracks than for long cracks is one of the most

- important factors which leads to the faster growth rate of smali cracks than for long cracks

at the same nominal AK.

The zigzag propagation paths of the smali cracks were quantified by measuring the

angle distribution $pectrum. The frequency of occurence for angle E), F(E)), was computed

,.~ ~.using

44

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F(e) =I1aL... [11 = o Lj (6)] (4.6)

where I. (6) is the length of a segment of crack which is at E degree with respect

to the plane perpendicular to the applied stress.

Ltot is the total crack length and given by

Ltot = 7906 o 0 i = o Li (8) (4.7)

Figure 4.26 shov, s the angle distribution of a typical zig-zag small fatigue crack at

low applied stress whithin a total length of about 900 gim. It was found that the maximum

distribution, i.e. the most probable deviation angle, takes place for 400 < E < 550.

Near the threshold for small cracks and even for some long cracks, if the extent of

local plasticity is small enough to be contained within a single grain, the cracks will

propagate by a single shear mechanism with the orientation of the slip band crack changing

at each grain boundary, thus leading to a faceted or zig-zag crack path. The occurrence of

this shear mode of'crack extension, together with the development of a faceted fracture

surface,will result in the roughness induced closure effect.

Ren6 95 (PM)

The fatigue cracks were initiated from debonded inclusions (Figure 2.8a). No slip

band cracks were observed. The preferred initiation at inclusior•s can be understood by the

dislocation, model proposed by Tanaka and Muta [38]. This model described localized

decohesion around inclusions. These localized decohesions clustered to cause complete

debondiag. The debonded particles and tie corresponding surface intrusions/extrusions

constitute strong stress concentration centers which favor microcracks initiation.

Figures 4.27a ani 4,27b show that the zigzag small crack initiated from a debonded

inclusion still remained opern at the crack tip and at the crack root under zero applied stress.

45

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"lThe shear mechanism of mode 11 deformation can be clearly observed. This mode HI

deformation combined with the fracture surface roughness results in the "roughness

induced crack closure effect".

Figure 4.28 shows that fracture surface of a small crack after intentionally breaking

the specimen open. The fracture path is predominately transgranular.

Figure 4.29 shows a small crack initiated from an EDM pit. Figure 2.8b shows

clearly that small cracks also initiate from persistant slip bands. Most small cracks initiated

from slip bands stop growing before or at grain boundaries. The grain boundaries offer an

obstacle to the growth of small cracks.

Extensive plastic deformation associated with crack propagation was found at the

crack tip as well as around the crack wake (Figure 4.30). The crack propagation along slip

bands can also be observed.

I.4• 46

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Figure 4.23 Scanning Electron Micrographs of small cracks initiated from an EDM pit inInconel X-750, tested at 25C

-~ AiN,

Figure 4.24 Scanning Electron Mfic-rographs of the fracture surface of the small crack inFigure 4.23.

69

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p .q

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Figure 4.25 Scanning Electron Micrographs of the fracture surface in Inconel X-750tested at 25' C.

7

70

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rýrr

F~iguire 4.28 Scanning Flcfcwn MIN crographs of' til fracture, surfaýe of a small ciac:k illRenC 95 (PM) tcstemd -.it 250 (C.

I Q.0

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I,

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42 at Elevated Teweat

"Fatigue crack growth rates of small cracks were measured at elevated tfemperature in

Waspaloy, Inconel 71 S, and IN 100 (PM). A summary of testing conditions is given in

Table 2.6. Data reductions bcgan with a surface crack length (2c) of approximately

200 p.m. Basee. on the determinaticer that c/a = 1 was a valid approximation, data was

reported and evaluated in emý,s of crack depth, a. Dam is presented hem as crack depth

versus cycle number and crack growth rane versus stress intens' .y factor range. Crack

growth rates were detendined using th'e seven point incremental po3lynomial method unless

otherwise specified.

II

Trends- in long crack data were. taken trom tie literature. Ca-e was taken to"1 F- considkr equivalent materials and testing conditions. Dif•erertces in th- fatigue behavior of

Ssr-nal1 acks (a > 100 Ltm) and long crack trends did no: iustiy gencrating long crack data.

r 4.2.1 AM72Ar

The fatigue behavior of small crack-, in Waspaloy was investigated at 427' C

p (800" k} A!0 tests were performed under load control on specimens with round gauge

section. (Figare 2.5). The principal test variables were maximum stress and R-ratio.

ThV evýt of tht maximum stre.s on small crack growdt raics is shown in

Fiure 4.31 ihrwugh Figure 4.36. Values of the maximum stress employed were 504 MPa

(73 Ksi), 621 MPa (!90 Ksi) and 754 MPa (109) Ksi). Crack depth versus cycle number is

presented firt for each tes?, then d&ViN versus •iK. The. stress ratio was eunstant at

R P=.1. Crack eowth rates vursus AK curves arc consolidated in [igure 4.37 for these

;. thl cc tel, :s,

T'lc vaIduc of maximum :iu-css urndcr fully revercd, R 1, clastic cychig v-a

Sbhwn *o have 11o cffec: oh the upper Ixiurid ciack gauwth rates uo fuall cracks as shown ui

75)

Page 87: I i - DTIC

Figure 4.37. This upper bound trend is precisely coincident with long crack results taken

from the work of Larsen et al [391. Maximum stresses employed in testing are

approximately AM, 60% and 75% of the 0.2% yield strength. This is a particularly

interesting outcome when one considers that the stress intensity factor defines the near-

crack-tip elastic stress field. In these experiments, the far field stress is greater than 50% of

the magnitude of stresscs in the crack tip field.

The only apparent anomalous behavior observed in da/dN versus AK curves is

crack growth rates which fall notably below the long crack trend. Consider, for exrnple,

crack-B in Figure 4.32 for wMch da/dN first decreases and the.n increases below the long

crack trend. By examining the. a versus N curve for crack B in Figu-e 4.31, this b2havior

represents only a slight perwurbation in crack extension and is attributable to the non-

uiiifr rm natue of the Waspaloy rnicrostructlre.

The effect of R..rtio on stnall crack gowth rates is shown in Figure 4.35 through

Figure 4.43. Values of stress ratio erntoyed were: R -1, = 0, R = 0 3 and K = 0.5.

The irnaximum stress was 758 MPa (110 Ksi) ,i ,all tests except the R = 0.5 test where the

Smaximum stress was necvssarily increased to 903 NMa (130 KsO). Crack -tow h rates

versus AK curves were coisolidated in Figure 4.44 for these four tests with the expected

i esults.

For positive R-ratios, the ordering of crack growth, rates from high to low

corresponded to R values of 0.5, 0.3, and 0, respectively. This R-ratio effoct is g8nerally

cxplained in tenas of ciack closure. The true crack driving force is then

AKft - Kmrax - Kop, w lhC l, i- o ;s tIle str-css intensity f•,ctor at which the cra;A flanrks are

fully oucn. In tLis program, the noaifnt! value of AK - Krna - Ki,: (for KIIin ;-> 0) was

useAl in prebcntiii dsta .i was noit measured dtmctly. For high 1.-ratios, the

.nomiinal vedhic of AK is al-p.rxinm.tely equal to AKU, sincm crack flanks would be opci at

7o

Page 88: I i - DTIC

all values of load in tie cycle. At low R-ratios, the nominal value of AK is greater than

AK.,f, therefore, crack growth rates for k = 0 are shifted to the right.

The R = -1 results fall closer to the R =0.5 results than they do to the R = 0 results

which have the equivalent nominal vaule of AK for any crack length. Thfe maximum stress

was 758 MWa in both tests. The higher crack growth rates in the R = -1 tests can be

K ~attributed to a greater amount of crack tip strai reversal which promotes crack extension.

The same ordering of crack growth raies as a function of R-ratio was found in the Inconel

X-750 results.

The effect of temperature (427 C vs. 25C) on the crack growth rates of smallI cracks

can be seen in Figures 4.45 and 4.46 for R = -A and R = 0, respectively. In both cases,

-rack growth rates were higher in the elevated temperature tests. This could be a result of a

-1. .:eeeu eniomna nte-r%.tni'w n ip errenw~ in thp. cfnv.-rle ktr exnerineeda

427C. The 427C tests exhibited less crystallographic faceting on firacture swifaces as

determined by stereoscopic observations. This. would result in less roughness induced

closure and, therefore, higher crack growth rates.

Crack growth at lower values of AK at R = 0 in more temperature tests is a result of

a "short crack effect" in the room temperatur tests. Crack lengthr were < 100 gim in many

* room temperature tests.

In surrdnary, the fati,,ue behavior foY. sia~ll cracks (a > 100 pim) in Waspaloy at

427C exhibited a generdl abseiv...e of a "short crack effect" over a range of test conditions.

More spcA.ifically, the crack driving foivc could be charactefiz~cd in teiras of AK with upper

bound c-rack growth r-ates coincident ivith long clack rresU is.

II ri

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4.2.2. Inconel 718.427°C

The fatigue behavior of small cracks in Inconel 718 was investigated at 4271 C

"(800' F). All tests were performed under load control on specinmens with two flats as

shown in Figurm 2.6. Unfortunately, this drawing was not strictly followed in dhe

machining of six Inconel 718 specimens. The radii-to-flats were made smalkr at 6.35 mm

rather than The designated 12.7 ram. Consequently, three tests failed prematnely at this

location. An attempt was m.ile to salvage whatever information could be saved from these

S- tests. The principal test variables wer• maximum struss and R-ratio.

iThe effect of niaxirnum siress on small crack growt.: . aes can he seen in Figures

4.47 through Figure 4.50. Values of maximum stress were 621 MAPa (90 Ksi) and 758

MPa (110 Ksi). 'I he stress ratio was consta•nt at R = -I. Crack growth rates versus AK

curves awu consolidated hi FiMtre 4.51 for t-ese two tests. There is good coarelation of% da/dN with AK at high values of &K (longer crack lengths). However, a tendency towards

" nearly constant crack growth races occurs at low values of AK. This behavior is more

clearly evident in the a versus N curves for these tests shown in Figure 4.47 and Figure

4.49. These a versus N curves could be fiued with a straight line (da/dN : constrnt) for

all values of a < 300 gm.

[ The R = 0.05 test resuls for small cracks (Figures 4.52 and 4.53) were found to be.

nearly coincident with the long crack trend as seen in Figure 4.53. The long crack results

were taken from the work of Krueger [401. The deviation from long crack behavior may

be attributeJ to the c-,%rse heterogeneous inicrostructur': which offcr, a variblte rcsstncc

K to crack extension oy to a Jack of mcchanical simrilitude at small crack sizcs.

The effe•,t of R-rnitio on small (.-rack g-owth rates is shown in liguze 4.49 Chrough

Figure 4.43. Valus c,f the strc•ss rato emp!cycd wkzv~ R = -1 and R = Q.05. The

naaximuw swrvss was 7!u, ,MPa (1110 Ksi). Crack grovh tes veius AK curves ,ere

78

Page 90: I i - DTIC

consolidated in Fig=i 4.54 for th e two tests. Similar to the Inconel X-75% and

Waspaloy iesulhs, the general trend for higher crack growth rates at R = -I versus R = 0.05

was also seen in Inconel 718.

In summary, the fatigue behavior of small cra-ks in Inconel 718 exhibited an

absence of a "short crack" effect when fth maximum stress was low. The crack driving

force could be claacterized in terms of AK. When the maximum stress was high, constant

crack growth rates were observed over the initial regime (100 gIm to 300 gim) of crack

extension.

5

I. *,

fA

79

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S 4.2.3 IN 100 (PM). 649° C2

The fatigue behavior of small cracks in powder metallurgy IN100 was investigated

at 6490 C (12000 F). All tests were performed on the modified specimen shown in Figure

2.6. Test results on Waspaloy and Inconel 718 established the basic conclusion that; for

small cracks ( a > 100 g.tm) the upper bound of crack growth rates could generally be

characterized in terms of AK and consolidated with long crack data- Thc orly suf, .stodon

of anomolous behavior occurred when crack depth was small (100 .tm < a < 3 nni m) an.3

the maximum stress approached the cyclic yield strengih of the nate ii?,.

Terefore, it was decided that the IN1O( itivcEaimi wotud focus on the •iiaigue

behavior of small cracks under elastic-plastic cycb~iq c,-¢,itions wlhich ar.c elva,•tt to

cracking in notch locations of tubine disks such w. boia holcs ar. L,:,.de at.tachnitnts. The

aim of the IN100 study is to develop baseiine data undiier fuliy re'¢ir4d, cotiinuous uScycin.j

conditions (emin/enx = -1) as well as consider disk releran€ strainrliges w•il. hold. times.

A few results from this chagoing Fwdy are. reported h.c. Tests were peiforra.. in load

control and sutain contrAl.

One load contru! te~t: waý plrforrnrzJ ui.der nominall. eli.,tic condijuins. "'tbc.

maximum stress was 758 MPW (110 Ksi) and R - 0.1. Rc.siuls arc r IC:rAl in l'ifUgE( 4.55

and Figure 4.56. The fari,&.•c crack grov•lh rare. ;)f snalD c/acks (, > 100 p.) tM) IN J00

were coincident with the !ong "r.'.k irir -. :.ti.:,,, i•, U:irc 4 !56. Lori,, crack r:.ý.ults'" " t~ tJ.•- wo<rk of L•ys.si ci. al [ ? 9J.

01:r*~- ('3 in :.,; trj;Jna! ycI). af~;C),~t ) " ~Ii.T'4i sa%.-5 was t&JS.Ii flJOjU MtT-,wcr taý¢r 1.u vrh 1C7m-uliUC.O : 0.he "irt hy:,hvt •,i:; 'ie is .Ih 'i in " 'th a, 0'"1: 1

, ~ ~~~y~Ail~flMt, dih= t.y, 'iiig w;: rk'.'uiaiV C1,.j!R :•z.. T?.' a,,tc4Cg< 'no a.iirnam• ,:•.i wias 11 Ql O• M

,•,3~~~,8 t••, ' ,.59. f7,..k• • •}v t :w•h.¢ •s At:otll.l w;'h ;' ,K inl V:•,.: 4,.5 . 5, (iji',¶ ,,' otlit:i

lx,|

Page 92: I i - DTIC

tests where the maximum stress was high, the crack growth rate was nearly constant up to

a crack depth of 300 g.tm beyond which results merge with the long crack trend.

A fully reversed strain controlled test with Eminin/en =- 1 was performed. The total

114 strain range was ± 0.55%. A typical hysteresis loop is shown in Figure 4.60. A plastic

s t ,arge of 0.08% was measured at zero load. The average value of the maximum

,• ,rcss was 1026 MPa. The results are presented in Figure 4.61 and Figure 4.62. Although

lina,u" e)asti.- fr'•-d,-ii r, mechanics is invalid under these conditions, crack growth rates are

plottt!. in• ,ri.m of •FX. in Figure 4.62 for the sake of comparison. AK was calculated

hiv., thr. avc'ag,j, valac of Ihe maximum stress. Representing the crack driing force in

teirnm ,-f AM ic wv..o '.ý xitlc.'i atp,,'riate for this test. However, at this time, we have an

"-;L',~ ~ iris Uffev.iezn cha:,:uAw; ,o. :I the A cy.clic stress-strain response to make an accurate estimte

of /AJ.

The rcsuhil ut rotA atoxt Uut teitrt are plotted together in Fig=e 4.63. Crack

"gjxrw'.n rates unde: elastic-plastic cyc ait ax• approximately three times greater than the longcrack, ticri-•l. 1'. is interus.;ung to note a o.)r.'vajecnce of die two strahi control test results at

•i the lowt:t ra.ige of AK where h -_ I(- ) 1 j0 n in tIwh tests. 'lnis result suggests that near-.

surface elexments in die 0- 0.80% tcsi 5ctix.•ern, rway have experiencxd elastic-plastic

cycbiiig due to a lack of ori,)trant w Oe fi.' :iuf;,ce. TIus uiay alo have lccn Lrue in

woine of the Inconel 7i8 tc,.ts whcre the r.Du-:vanw stress wws high.

4.2.4 L , nwI ) j. .LI.x•. Jur

A5 pmvioubly di,.usY'U), hjlX;iIinIJI sop,,i..tio wa. achived by high fwyiiCncy

I A."; c;ycling at n.>in tmy, artuure ahiw su; mt e c.ria c . ¶14.i ko ci• ied 2 nu-. -iacturt surf aces,

S*WUIC IiISt cCIAkiti" a).' : ; togra h ',.id '.*J lh t •vi•tiical .•C .Owt.p)ic tl~is c p'i. - to

(hO actcriz i;rack frtxt piuvilcd anJ gcIeI ;Ijuao4ouq)ic fcatuzc. I:rIctuCc burl- acC W;Ic

, I." ' I i i'' • ' ' d f " ' ' ' z ' " ( ' • , ! f ', ~ " " " ' * : . . • • . - • •k

Page 93: I i - DTIC

further examined by scanning electron microscopy. Sides of specimen gauge sections were

also examined by SEM and optical microscopy.

_Waspalo. 427' 1C

* An optical fractograph of a typical Waspaloy specimen is shown in Figure 4.64a.

The fracture path is nominally perpendicular to the specimen axis with the exception of near

surface regions beyond a surface crack length of - 600 jrm where the crack deflects out of

plane. This was suspected to be related to the curvature of the specimen surface.

Consequently, the specimen geometry was modified (Figure 2.6) to include two flats from

ENa, which cracks were initiated, This solved the crack deflection problem. This crack

Q' •deflection is believed to have caused some deviation from c/a = i. Although accountinjg for

this slight change in geometry may be tractable, it did not manifest it-elf in the crack growth

behavior. Therefore, data reOucdon was carried out in the manin describev" m a previous

section.

Typical fracture surface features for Waspaloy can be seen in Figure 4.64b. TheN fracture path is transgranular and similar to that observed for room temperature tests.

However, fatigue fracture paths in r-om temperature tests exhibited greater deviation frun,

ka *%"c.nel 71lI 4270 C

,The fatigue fracture path for sitxni cracks in Inconcl 713 are shown in Figure 4.65.

SrFigture 4.65a is an optical micrvgiaph of a lahse defcct a rd crack t•acc at the gauge scuaio

N. .swf•axc. Figure 4.65b. is an SEM muicrograph of fvic fautcwe surface. built exhibit a

taijij5Li•f•lufijactiw j)tlI. Fatigue hulativous art evident (xi the fiacture su f ec.

-U,

>.hr

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A SEM micrograph of a typical fracture surface for IN100 is shown in Figure

4.66a. The fracture path is transgranular with crystallographic facets often terminating at

grain boundaries.

Figure 4.66b. is an SEM micrograph of the surface of a specimen gauge section

after 150 cycles of strain controlled cycling at a total strain range of 0% to 0.80%. A

rmicrocrack is emanating from a 10 M diameter pore, typical of many found in gauge

section sn-faces in this alloy. Crack propagadon from these sites is responsible for the•ifatigue faihuir of smooth specimens. Future efforts will be directed at measuring crack

•. growth rates from these pores.

Ion

K".

'aI _2"

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~~in

L al

3 0j

a) E

(3

0* ~LfLJ

tyl

~U-1

u u U IN. ED t Y N

ii 04

Page 96: I i - DTIC

1-5

WNAS PFALO0Y 427C(800F)

-Max Stra3m 5a4MPa(73Ksl) R--l Fraq-0.33Hz

LEGEND*Crack A

0 Crack B

100

F-7

0 0-6

CL'

IL)LLTFIf K<, (Mfa 4ri-)

Hw~ire .3 ("%,k tiwtli raitc vc;sult siles intllsciNty tiKutn iiir ~c hn Vv'iplly IC41cd al

4.2 427'CL, MuA. Sucsb 5W4 MI'a, R --1, Ficq. .0.331 liL

Page 97: I i - DTIC

tnISn

U-)

%X

A N

N6 0

rux 0(5

x a

x

ASS

M xS oo m () M m(S)~~ IS () m G M M-

(j3 Go r" .-0 ul V* wn "RCsJ3 D H

r*xL Z xri X86

Page 98: I i - DTIC

S10-6I.. -

LEGEND* Crack R

- - 0 Crack BZ X( Crack C

S10-0

•- bJ 1'

K, .'

(5X

PJ.J

S0ý

05 10 10

1 1 L I ,.'U

:- -DELTA K, (MPa -F•)

Figure 4.34 CTack growth rate versus stress intensity factor ;ange for Waspaloy tL stedat 4271 C. Max. Stress 621 MPa, R -1, F:eq. = 0.33 Hz.

87

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In

N. -

U

P4-

lnrn

CC)n i

.I1P 01% a *

aj u a

*ox X C

rn (S) m 9QG()C 0 G a

(wnf) ''HicdG i: >IJ d:D

Page 100: I i - DTIC

0-

NRSPRLOY 427C(B8OOF)03

Max Stress 7S4MPi(I39KsI) R--1 Freq-0.33Hz

OR -6

\10E

LEGEND* Crtack R0 Crack B X

z X Crack C X-D X

\ - 7 0 o-X0

I. W -* IXU.0I X

T 10-eI- z

ly-

UU-

I~ e I I I I I I_ I _I _._ I I I I I_ 00

5 i0 1 00

DELTR K, (MPPa -f-)

Figure 4.36 Crack growth rate versus stress intensity factor range for Waspaloy tested at427' C, Max. Stress = 754 MPa, R = -1. Freq. = 0.33 Hz.

89

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10 i i I -

NASPALOY 427C(8OOF)

- PMax Streas - VRRI.&n R--I Freq-8.331Hz

U0 - "

\10E

LEGENDMax Stresa* se4MPa(?3KsI)

Z 0 62LflPaCSOKst)O- X ?54MP•CIJSKat) 0

i o - long crack [39]

S-z

X/0 '-

K 0• 0 0I'Yo

10-9* to-S= =0

U:

U

: 1~ 1• e 1 .I I I_ I .I I I I I I 1 0

, -5 1 0 1 0[ 0

N. DELTA K, (MPa 4m)

Figure 4.37 Summary of crack growth rate versus stress intensity factor range forWaspaloy tested at 427' C, Max. Stress was varied with R = -1,Freq. 0.33 Hz.

'- 90

k,-,- kSu% lWnd~ ý mum. -~ -t -S - - -J -SSL ,eaMtl~aTJ , % . LL~.tnl Ial na j r naanan tna.ata r --~

Page 102: I i - DTIC

"-'4

0,

U'

00

L.L~i

00fl

a--

0 ~Li

(D M~ mf (D m (S) U (S) -

(Wfl) '2-'HidJ3L[ AID Ha:

tj 91

Ar~zS~V ~ .~hA~ L~d~dU~iN ~r~ Nr b~~MAA~RJ.8A4fl~f mr ~LLI 4. bLb A~U~fLbA a4 xLA mmg~

Page 103: I i - DTIC

10~ r-1TT7-

NASPALOY 427C(800F)

Max Strasx . ?65l1PCLIIKat) R-0 Frs..-.33Hz

\ 106E

Z

00rd 10 00

00 0

CE 00

"(- -0

0

y 100-~.1 U

U

5 1010

Soo

DJELTA K, (t1Pa-fm)

yFigure 4.39 Crack growth rate versus s.ess intensity factor range fr Waspaloy tested at427' C, Max. Stress o766 Ma, R =0, Freq. = 0.33 Hz.

92

SI -

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0 x

aU'n

LL- v

wq WN M.

0 x J~

:z Nvi in

0 cg >- -ox u

mm

M. x t

~(S mi co r LO Lii m c u -

(Wfl) 'R 'HldBQ >EUJOd

F-3

Page 105: I i - DTIC

101

NASPALOY 427C(SO0F)

K.- "-Max Stres. s 765MPa(IllKst) R-0.3 Freq,,.33Hz

>,,

10E "

LEGEND0 Crack B

S- X Crack C

za1 0-7 0 0

F- 0~ 0

• F - _ o

0.x"-.o H×

F-: (5:::•10U_

1010 100

DELTA K, (MPa4m)

Figure 4.41 Crack g'owth rate versus stress intensity factor range for Waspaloy tested at4270 C, Max. Stress = 765 MPa, R = 0.3, Freq. = 0.33 Hz.

94

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L-)

I! 0

00

0 01

LxOD1 00 w

C~;

5,n

-48

.44

w nL- Ic-K AjN

Lx avcn-

Page 107: I i - DTIC

A

& '--

-NSPHLOY 427C(800F)Q)

SMax Strmas 9S3MPaI(13IKaIl) R-0,5 Freq-0.33Hz

\ 10-•

E -

IE:.

0 100

00

CE o

p i Z 0 7

01• 0--0

U

' 510 100

]JELTR K, (MPa4-m)

Figure 4.43 Crack gpowth rate versus stress intensity factor range for Waspaloy tcsted at4270 C, Max. Stress = 903 MPa, R 0.5, FReq. = 0.33 Hz.

L• 96

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UU

LEEN

* UA

+&3R-8.5I se 0

10 10dmp 11100rl

0IV DELTA K CN, aihiFigure~~~~~~ ~~~~ 4.4 Sum0 fcakg't aevru esi'niyfco ag oK.~~~~~ vaid rq.03 z

Wapaoytstd t420 ,Ma. tes 78 ~ &90 I~, ato a

W 07

V jsg &r~t~

Page 109: I i - DTIC

iI

b101' I I I I I I I l i i1 1 1

NFISPFALOY

Max Str-aa-VRRICD R--,

"LEGEND0 25C -

- - 42?C

Z

7

\ -0 /-% -10-8 0'

UI 0,.: -"0 or

Y 10 &"UoL 0

U

5 10 100

DELTA K, (MPa -f)

I, '• Figure 4.45 Comparison of crack growth rates versus stress intensity factor range for

Waspaloy tested at 250 C and 427' C, R = -1.

12 98

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10, I I ,IIi

NASPALOYQ)

"- Mux Stress-VRRIID R-8

VX\10

ELEGEND

I'4." 0 ZlSC

* 427C

z*S10.7

0U[ *0

I-- * 0_

0 00vu~0

k0 01Z: - ,E T K0088W 0 0

0oCbO

6 10 1llt in 1 i0 1 1 1 1 1 .1 t1 _1 1 1 I ,i5 10B 100

•! ~DELTR K, (MPa 4-m) l

Ii: Figure 4.46 Comparison of crack growth rates versus stress intensity factor range for •

Waispaloy tested at 25' C and 427° C, R = 0. '

9.99

p|

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G,

U,

Um C-4

0

LU w

U U

000

LJ0 U

0 to Z g 0*0 LL cp U-

LIJWg 0*

mn co N LOW n V m n -

Lwn k.'Hd3

Page 112: I i - DTIC

I)i%

-T1-

"INCONEL 718 427C(800F)Q3

"Max Straus - C21MP%(9'Kaf) R--I Fraq-a.33H%

LEGEND* Crack R

0 Crack C 1 q*QPzS

I0

00

S *I08-? o

71:))i

0

L I -11111titIt

k - 0

~~ 5 0 0

ICIo

5•0 100s

~~ DELTA K, (MPa-Jmh

Figure 4.48 Crack growth rate versus stress intensity factor range for rinconel 718 testedat 427" C, Max. Stress =621 M.Pa., R =-,Frwq. 0.33 lIft

wi w4 A • I f A PL b Irh IW A. W A I R Imd ih iL _.!t n. .A I! Iý I~j I, K-: !8101

II0

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ICU

U-)

(S)

Li' u C;

1020

~~ kN ~k~M~JM~ ~R~1I~(M~k~i..MAIWIN ~M ini (L(A~~~nWI~fh/UA~~

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. •~ 0Bs 'i,,, i ,,

INCONEL 718 42?C(800F)

-,%• • Max Strusa. 759rMPP(Ii0KIz) R•,-! Frlq-0.33Hz

\ 106

E"LEGENDS Crack A0 Crick C

z-

O0100

0 000

EK M'0

cc:

y 100

U-

5 10100

DIELTFA K, (MPa-fmi)

Figure 4.50 Crack growth rate versus stress intecnsity factor range for Inconel 718 testedat 4270 C, Max. Strcss=758 MPa.R:L-1Freq. =O.33HL.

103

"_.

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•, - INCONEL 7 18 427C('800F) -

-lux Stress-VARIED R-•-

\ 106E

LEGEND0 629MPue• O 810 ) 1

-7 ~00

'+t, " 0 00(•

ci:P 00i•F 0u oiole.+I--

102

U4

451 10- IYiur DELTA K,(Ma4;)C

Figur 4.51Swnmmy of crack growth rate versus stress intensity factor range forIncxnel 718 tested at 4270 C, MAx. Stress was varied., R -1. Feq. = 0.33Hz.

104

L

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(S)

F,.' c)

de-%

00

-XJ

00

~lo~~~~I~~L d~Wf. U ) '

0 105

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INCONEL 718 42?C(80OF)

NU- Max Streas " ?S6fPa(LtOKIa) R-8.0S Fraq-,.33Hz

\ 10-

ECr-c - LEGEND

•,.• * Crack A- - 0 Crack C

-7 lon crack [40] S1-7_

1.0000

I..II -

t'•o

0

U

Y 10-5

Ufrw-LL.

U ol1a I I I I II 15 10 100

r" rDELTA K, (MPa-at -)

Figure 4.53 Crack growth rate versus stress intensity factor range for Inconel 718 testedat 427C, Max. stress = 758 MPa, R = 0.05, Freq.= 0.33 Hz

- 106 1

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10i INCONEL 718 427C(800F) :

-Max Stress 7SOMP%(tIOKsl) R-VRRIEID Freqi0.33H%

10

ELEGEND0 R---t

o -

000_- - oooo°%

0

10 0

I- 0X

Ž•10

U

5 10 to0

DJELTA K, (MP a -fii)

Figure 4.54 Summary of crack growth rate versus stress intensity factor range forInconel 718 te~sted at 4270 C, Max. Stress =758 MPa, R ratio was varied,Fq. =0.33 Hz.

107

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ILL

OF 0

L~Ln

m rum

.V2

EL)

I A

(S S S S 9 mw C) CC9- U 0( co 0 D 0

IS) . o i v ~ ( -S un -'iJ:U ADUZ

4 108

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0-510 • -• - ,- ,- , 1 ., , .1 , , i ,, , _

IN 100 (PM) 649C( 1 0Q)"0 Max Stresa m 758MPa(.IKsI) R,,. Frs q cpm

q U 0-6\10

E

0

"long crack [391 *

S10-

Li1--

10-5

T-

S10'U(E1U

,•}1• lie I I I Ii .. _ I I I ! I

5 10 100

DELTA K, (MPa-f4 )

Figure 4.56 Crack growth rate versus stress intensity factor range for INIOO (PIM) testedat 649' C, Max. Stress = 758 MPa, R = 0.1, Freq. = 10 cpm.

109

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.0

0 40

0

0.

~~~ ,/ ,I t - I ! -*•0.5 1.0

STRAIN (%)

-2-

•. -4 T

Figure 4.57 First hysteresis loop for IN100 (PM) tested under strain control at 6490 C,Average Max. Stress = 1100 MPa, Total Strain Range = 0 to 0.80%.

110

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K cn

0i0

4 WLLI

to 9

Log

-- CD

CU) _s, * o

G o 0 C m (Sn (5) w n m G a(S) (Wfl() m 2Hdc G>19US) (S m (S

(n c ' t - m r

w n H cj-3GA111

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!O-s• I I '1"' it iI i1 I n :

INIO0 (PM) 649C(1200F)Q)-- Strain Range -. 080 to +0.880%

>1

L)k 1 -6 eJ

.\1-- - LEGEND -

S0 Crack R 0

z

S10 -

caU

rV10

.P.II

0

M 10-s

U

U

i••L n i I I I I I I5 10 100

DELTR K, (1P a T )

Figure 4.59 Crack growth rate versus stress intensity factor range for IN100 (PM) testedunder strain control at 6490 C, Average Max. Stress = 1100 MPa, TotalStrain Range = 0 to 0.80%.

112

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0

51 -4

I'

-2

1.1"Jil

Page 125: I i - DTIC

CI

ILu

i -IL4L

U)U

pp 0 0* 0*S) Iin (T)

o inc4C

Z aa uu +4

411

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21o.j

1-5 E I_ I i I 7 T Im_

IN100(PM) 643C(1200F)So°"

LEGEND

0 Cra0 *R

U 1 0-;

-- "

d 10

rF

0

y 10~

U

13 i 1e I I m I I I I I I I I J.

"5 10 100

EDELTA K, (rMPa-iTh)

Figure 4.62 Crack growth rate versus stress itensity factor range for IN100 (PM) testedunder strain control at 649TC, Average Max. Stress = 1026 MPa, TotalStrain Range ± 0.55%.

115

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1 0-

INl00fPM) 64÷C(1200F)+

U) +

X ++S1-6 +• 10 LEGEND 4o

LORD CONTROL it? 4S0 tIx - ?SeMpt0

ZSiTRRIN CONTROL. 0•"-0 * a.60 oe• 0. 0 0~e

7 ": o.8to 0 000

I"'-

0- 0

0-a

0

U

1&fl ' I t.I I 100Ii i I

5 10 100

DELTA K, (MPa4-fii)

Figure 4.63 Summary of crack growth rate versus stress intensity factor range forIN 100 (PM) tested under load control and strain control at 6490 C.

116

Page 128: I i - DTIC

(b)

Figure 4.64 F-ractographs of Waspaloy tested at 427C

I 117

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.. . °I .

Pd t4 *- . r . ' "- ,

. - -" ,

* -t

"° "I il" "K'" .++••" / + .

K- ,i i •11

+• • -,; .- ,+ ., . +•" 0 "

k, P l •+'+ -

Fiur 465 (a Otca mcrgrpho fatigu .crac-trac ongagesetonsufaern(b E fatgap o ncnl71 etd t47

.. ÷118+

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(a)

I''

Figure 4.66 (a) SEM4 micrOgraph of a typical fracture surface and (b) SEM micrographof pore and fatigue crack in• gauge section surface after 150 cycles of stratncontrolled cycling at a total strain range of 0% to 0.80%

119

"M -

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5. CONLUSIONS

S~RoomU Temperaur Tests-

1. The fatigue behavior of small crystallographic cracks is strongly grain size

dependent. In large grains, small cracks grew at higher rates than long cracks at the

,ame nominal AK. In fine grained materials such as Ren6 95, the fatigue behavior

of small cracks and long cracks was the same. The transition from small crack to

long crack behavior occurs around 3 to 5 times the grain size.

2. The fatigue threshold behavior of small cracks was found to differ from

long crack results in large grained alloys.

3. Grain boundaries serve as a constraint to the spreading of plastic slip bands

and the prcpagation of small surface cracks. This leads to considerable scatter in

threshold stress intensity factor ranges and near-threshold crack growth rates.

r El~Ieated Temperature Tests:

4. The mechanical driving force for fatigue crack growth of small cracks

(a > 100 Mrn) in turbine disk alloys can be characterized in terms of AK when the

,,,•,L.La i ,.tA,,,, , I ,- y,..% Wtui. Te upIel bnM d of" Urack

growth rates for small cracks is coincident with the long crack trend.

5. When cycling at high values of maximum stress, approaching the cyclic

yield strength, crack growth rates were constant over an initial regime of crack

extension (100 gam < a < 300 jIm).

6. LEFM could not consolidate crack growth rates under elastic-plastic

cycling.

!.. 120

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7. The compressive component of the cyclic stress range promotes crack

initiation in PSB's and at defects. Crack growth rates are higher at the same

nominal value of AK when R < 0.

S8. Fracture paths of small cracks exhibited transgranular crystallographic

feartues which leads to roughness induced crack closure and a mixed mode of crack

extension, Mode I and Mode II.

I1. 21

ri

1.Z•• •2

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References

1. W. D. Cowie, "Turbine Engine Structural Integrity Program (ENSIP)," Journal of

Aircraft, Vol. 12, No. 4, pp. 366-369.

2. Huntington Alloy Handbook International Nickel Company, 3 rd edition, 1977.

3. R. G. Ballinger, J. W. Prybylowsld and C. K. Elliott, "Microstrucrural Analysis ofDouble Aged and Annealed Plus Double Aged Inconel Alloy X-750," unpublishedresearch report, MIT, 1984.

4. e Ed. C. T. Sims and W. C. Hagel, John Wiley and Sons, 1972.

5. J. A. Dominge, W. J. Boesch and J. F. Radavich, "Phase Relationships in Ren66- 95," in Superallovs 1980. Proceedings of the 4th International Syrn. on

Sucaly pp. 335-344, 1980.

6. G. Bellows, "Low Stress Grinding," Machinability Data Center, Pub. No. MDC10 78-103, 1978.

7. S. J. Hudok, Jr, A. Saxena, R. J. Bucci and R. C. Malcolm, "Development ofStandard Methods of Testing and Analyzing Fatigue Crack Growth Rate Data,"Technical Report AFML-TR-78-40, 1978.

8. G. R. Irwin, Journal of Applied Mechanics, American Society of MechanicalEngineers, V. 29, No. 4, 1962, pp. 651-654.

9. I. N. Sneddon, "The Distribution of Stress in the Neighborhood of a Crack in anElastic Solid," in 1P1m Roy. Soc. London AI87, 1946, pp. 229-260.

10. J. C. Newman, Jr., "A Review and Assessment of the Stress-Intensity Factors forSurface Cracks" A Part-Through Crack Fatigu= Lift Prediction. ASTM STP 687,J. B. Chang, Ed. American Society for Testing and Materials, 1979, pp. 16-42.

1I. ^- A -l 14 -1 hn "4.ec Tntenc:ity F'tr fna r fn r emri-Filintical Surface&A 1.,L3.&A ..awn-.... __.,------ - - -Crack in a Shaft Under Tension," Trans. Japan Soc. Mech. Enrs. V. 50, No.

t 453 (1984) pp. 1077-1082.

12. I. S. Raju and J. C. Newman, Jr., "Stress-Intensity Factors for CircumferentialSurface Cracks in Pipes and Rods Under Tension and Bending Loads," NASA

~ Technical Memorandum 87594, 1985.

13. S. Suresh and R. 0. Ritchie,"Propag:-tion of Short Fatigue Cracks," it, Mel,r, IRQy,, Vol.29, No.6, 1984, pp. 445-476.

14. B. N. Leis, M. F. Kanninen, A. T. Hopper, J. Ahmad, and D. Brock,"A CriticalReview of the Short Crack Problem in Fatigue," AFWAL-TR-83-4019, AFWALMaterials Lab, 1983.

15. J. Schijve,"Diffexence Between the Growth of Small and Large Fatigue Cracks inRelation toThreshold K Values," in Figure eshold, a. by J. Backlund et al.,Vol.2, 1982, pp.881-908.

S~122

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16. S. Taira, K. Tanaka and M. Hoshina,"Grain Size. Effect on Crack Nucleationand Growth in Long-Life Fatigue of Low-Carbon Steel," ASTM j]3 U5, 1979,pp.135-163.

17. P. K. Liaw and W. A. Logsdon,"Crack Closure: An Explanaticn for Small FatigueCrack Growth Behavior," Eng. Frac. Mech, Vol. 22, No. 1, 1985, pp. 115-121.

18. K. Tanaka and Y. Nakai,"Propagation and Non-Propagation of Short FatigueCracks at a Sharp Notch," Fat. Eng. Mat. Struct., Vol.6, 1983, pp. 315-327.

19. J. F. McCarver and R. 0. Ritchie,"Fatigue Crack Propagation Thresholds forLong and Short Cracks in Rene'95 Nickel-Base Superalloy," MatSLiEM,55, 1982, pp. 63-67.

20. J. C. Newman Jr.,"A Nonlhiear Fracture Mechanics Approach to the Growthof Short Cracks," AGAIRD Specialists Meeting in behayica of ShoC Toronto, Canada, Sept. 1982.

21. S. Banerjee,"A Review of Crack Closure," AFWAL-TR-84-4031,AFWAL/MLLN, 1984.

22. W. Elber,"Significance of Fatigue Crack Closure, Damage Tolerance inAircracft Structure," ASIM ST[I486 1971, pp. 230-242.

1 UA IW.l....-r "Paat;mnp Cr"rr I'1ric,,rp ITrr 4Cuv1ir T&ndinn "Fa PnrPt, Mo,.,h Vol

2, 1970, pp.37-45.

24. M. Klesnil and P. Lukas,"Effect of Stress Cycle Asymmetry on Fatigue CrackGrowth,".,Mat. Sj.Enig., Vol. 9, 1972, pp. 231-241.

25. K. Walker,•'The Effect of Stress Ratio During Crack Propagation and Fatigue for2024-T3 and 7075-T6 Aluminum," ASTM STP AU2. 1970, pp. 1-14.

26. M. Jollcs,"Constraint Effect on the Prediction of Fatigue Life of Surface Flaws,"LJLng. Mat. Tcch., Vol. 105, 1983, pp. 215-218.

"27. M. Katchner and M .Kaplan,"Effect of R-Factor and Crack Closure on FztigueCrack Growth Rate for Aluminum and Titanium Alloy," AMiSTh.559,1974,

5'.. pp. 264-282.

28. J. Lankford, T. S. Cook and G. P. Sheldon,"Fatigue Microcrack Growth in aNickel-Base Superalloy," l, Vol.17, No.2, 1981, pp. 143-155.

Y" 29. R. T. Davenport and R. Brook,"The Threshold Stress Intensity Range in Fatigue,"Fat. Eng. Mat. Struct., Vol.1, 1979, pp. 151-158.

"30. P. C. Paris and G. C. Sih,"Stress Analysis of Cracks," AI.S:T?381, 1965,pp. 30-83.

31. D. L. Bowie, "Analysis of an Infinite Plate Containing Radial Cracks Originating atthe Boundary of an Internal Circular Hole," LMath. PhyL. Vol. 35, 1956, pp.60-71.

123

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32. F. Gabrielli and R. M. Pelloux, "Effect of Environment on Fatigue and CreepCrack Growth in Inconcl X-750 at Elevated T"mpratuMetr. Tn.A,VoI.13A, 1982, pp. 1083-1090.

33. J. Lankford and S. J. Hudak Jr, "Relevance of the Small Crack Problem toLifetime Prediction in Gas Turbines", Proc. of Conf. on Life Prediction forgli.-Temperatr Gas Turbine Mateials ed. by V. Weiss and W .T. Bakker, 1986,pp. 11-1-11-2.

34. D. Broek, Elementry EngneringFractureMchanics, Mar. Nij. pub., 1982.

35. L. Wagner, J. K. Gregory, A. Gysler, and G. Lutjering,"Propagation Behavior ofShort Cracks in a Ti-8.6AI Alloy," Proc. of Conf. on Small Fatigue Cracks, ed. byR. 0. Ri :hie and J. Lankford, 1986, pp. 117-128.

36. M. R. James and W. L. Morris,"The Effect of Microplastic Surface Deformationon te Growth of Small Cracks," Proc. of Conf. on Small Fatigue Cracks ed. byR. 0. Ritchie and J. Lankford, 1986, pp. 145-156.

37. G. G. Trantina and M. Barishpolsky,"Elastic-Piastic Analysis of Small Defects-Voids and Inclusions," Eng. Frac. Mech., Vol. 20, No. 1, 1984, pp. 1- 10.

38. K. Tanaka and T. Mura, "A Dislocation Model for Fatigue Crack Initiation,"LApnL 1c•c, Vol. 48, 1981, pp. 97-107.

.32n 1zW. L.. 3%SI. n. T. C U.b3 Y&ýS, O~t~ ar fUA J *fl., T k h 1 t ** tt

MecLanics Under Engine Spectra," Technical Report AFML-TR-79-4159.

40. D. Knreger, "Effects of Grain Size and Precipitate Size of the Fatigue CrackGrowth Behavior of Alloy 718 at 427* C," General Electric AEG Report No.R85AEB 133, 1985.

41. K. Bain, private communication, Allison GM, 1984.

42. T. Nicholas, J. H. Laflen, and R. H. Van Stone, "A Damage Tolerant DesignApproach to Turbine Engine Life Prediction, "in Proc. of Conf. on Liffredifiinfhr HRih-Temnetratre Glas Turbine Materials. ed. by V. Weiss and W T Bakker.1986, pp. 4-1 - 4-45

124

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APPENDIX A

A Multi-Frequency A. C. Potential Drop System for the Measure.ent cf

The occurrence of fatigue cracks in safety critical structures and components,

particularly in the aircraft industry, has led to the demand for a system capable of detecting

and measuring very small surface cracks (<1 mm). Presently, these components are

designed employing a defect-tolerant design approach. This requires the determination of

threshold stresses and stress intensitites and near-threshold crack growth rates. Recent

studies have demonstrated that the fatigue behavior of "short cracks" cannot be predicted

from data obtained in long crack experiments. Consequently, there is considerable interest

in the direct measurement of growth rates of very short fatigue cracks. The resolution

required for crack length measurement in such studies far exceeds the capabilites of

conventional techniques employed in "long crack" studies.

Participation in this mainstream of current fatigue research requires a system

capable of accurate and continuous monitoring of very short crack lengths. In an attempt to

meet this objective, a multi-frequency A. C. potential drop (A. C. PD) system for crack

length measurement was built. Such a system is essential for the foliwing reasons:

1. Resolution (- 1 prm)

2. Alternative means, such as replication, necessitates interrupting tests possibly

resulting in "test transients" which obscure true behavior.

"3. Measurements can be made in an environmental chamber.

4. Oxidation of surfaces during high temperature testing may prevent accurate

measurement by any other means.

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I-

5. The A. C. PD technique is experinnntally expedient, permitting investigations

of broader scope, encompassing test variables of intrest

The unique ability of A. C. PD systems for resolving shoxt cracks is a result of

the "skin effect" associated with A. C. conduction. The skin depth is inversely

proportional to the square root of the frequency of the power source. The

system described below is notable for having a variable frequency capability

allowing different skin depths to be scanned. This allows for the measurement

of very short crack lengths as well as a determination of their shape (aspect

ratio). -

Electrcal Field Measurements

Early attempts to detect and measure surface cracks have employed D. C. field."..... t. , Y r t�o.hnimuit k illan'tMtl in gin'e Al for a nlate conining an

edge crack. The electric field varies only in the x-y plane, it can be seen that in regions

remote from the crack, the electric field strength is uniform but varies considerably near the

crack tip. Potential probes with a fixed distance between contacts points can be used to

measure the field. If used to measure the field remote from the crack, the measurement

would always give the same value, V-. Using the probe in regions close to the crack

results in measured voltages less than Vo- which decreases as the probe is moved closer toI'

' C-' the crack. The relationship vetween V1 and V2 and the crack depth will be cowplex. Only

u if a full theoretical solution or an experinental calibration is available, can the crack depth

be interpreted from these readings. In the case of a surface crack, the problem becomes

more complex as the electric field distribution varies in three dimensions making both the

theoretical and experimental calibration extremely difficult. In fact, it has been

I- ~~4 demonstrated that changes in crack curvature introduce significant erros in crack lengths if

bowing is not accounted for during calibration.

I12

12t

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A. C. PD systems are theoretically superior to D. C. Systems for measurement of

surface cracks. The improved sensitivity is a result of the "skin effect" associated with A.

SC. conduction. The skin depth varies wiht the frequency of the power source according to

the following equation:

%

Where 8= skin depth

o = conductivity

(t) frequency

g. = permeability of the material

* to= permeability of vacuum

For example, if one used an AC power source of 5 KHz on mild steel, the skin depth

-W would be about 130 pLm.

At low frequencies the skin depth is large and this makes it suitable for through-

S...v,-..... , La.nyrh , i rm n-•nt At hM ah _fireirencie "- 10O K z)U . the skin effect is

pronounced and the current flow is primarily in the outer boundaries of the specimen. With

this skin effect, the measured potential would indicate local crack growth in the near-

surface regions rathei than through-thickness crack growth. Obviously, this phenomenon

is highly desirable for the case of part- through surface cracks (see Figure A2).

One difficulty encountered in using the AC method is that the impedance of theelectrical circuit is sensitive to mechanical stress, chemical cominpcsition; etc. This means

that the use of some remote calibration device could lead to unacceptable errors. In

127

LALA AAMAAUIPM A %,A ~ AAgk PuA~k L a~ AJZMXM\~ .~i~~LA~ wau a iw~~ ~u i. ~ _ ~ii~iz '~~ JF !~I,~,

Page 139: I i - DTIC

applying this approach it would be preferable to make all the field measurements directly on

the metal test specimen. This is only possible if all stray voltages are eliminated from the

measuring system so that the local measured voltage s the true voltage at the metal surface.

Recent advances in the understanding of this probler, l.ake it possible to measure the tue

surface voltage. Consequently, a much improved AC field measurement system can be

constructed and used for most metals. These A. C. field measurements can be interpreted

in terms of crack dep&, and shape.

Compaiison of A. C. and D. C. M o

The advantages and disadvantage of the two techniques are listed in Table Al. The

major advantages of the DC method are that it does not rely on advanced electronics and for

NN 7certain specimen sizes and geometries, it is a well-known, established technique. however,

it does have the disadvantage of a complex relationship between PD and crack length and'• [ithe problems inherent in handling lowx-l~evl, Millivolt, DC sigratas including dlifcuities.

•! •'arising from themal EMF effects.

'IThe major advantage of the AC technique are the ease of calibration for different

-specimen geometries and the lack of size dependence of the technique as well as the high

sensitivity to small crack detection.

A schematic of the AC potential system is shown in Figure A3. The system

consists of two basic segments; these are the excitation circuit which supplies a constant

AC current to the specimen, and the measurement circuit which detects the AC potential

RR drop across the specimen. These circuits are interconnected through a lock-in amplifier.

The lock-in amplifier has two basic functions in tius system. First, a 1 volt ACSlreference signal drives the power amplifier at the reference frequency. Second, the lock-in

S~128

Page 140: I i - DTIC

measures the amplitude of the AC potential across the specimen, but unlike an AC

voltmeter, the lock-in accepts for measuremient only that component of the potential at the

reference frequency. The use of asynchronous rectifies, instead of a lock-in amplifier,

would add complications in that the phase characteristics of the filtering becomes important

and careful attention must be given to the oscillator and filter stability and matching.

In principle, all that is required from the power source is a sufficient current

(- 2amps) through the test piece. However, to monitor cracks over a period of time, it is

essential that the current be held at a constant value so that the voltage readings can have

long-term significance. Current stability is largely a matter of economics, but a long term

stability of better than. 1% is definitely required.

In order to produce variable skin depth, a sweep oscillator or frequency systhesizer

will be used to drive the power supply. The oscillator must be capable of low distortion

such that the signal be reasonably sinusoidal to prevent harmonic causing, radio frequency

interference. For practical purposes the oscillator should cover the range of I tiz-200

Kttz.

The input signal consists of the desired potential signal at the reference frequency

combined with broad-band noise picked-up from stray magnetic and electrical fields enid

o:ner souru.s. Si.nce th e potent.ial s1,,a , .,l at "h ;V" cm411 (f< IMA IV) the.'c *inal-tcr.-

noise ratio of the input signal may also be quite small and the resolution of the potential

signal within the noise may be unaccepuole. The frequency discrimination characteristic of

the lock-in is used to selectively amplify the desired potential signal for measuremCnt. The

noise rejection capabilities of available lock-in amplifiers allow them to handle signals with

signal to noise ratio as low as 0.1. The process for finding a submerged signal begins by

preamplifying the entire input signal and then attenuating the frequency omponent above

and below th. eference frequency thiough a bandpass filter. A phase-sensitive-detector

then reverses the polarity of the remaining signal each half period of the rtference

129

fA MUA.K kA k A k- A A"A MAL A bL.U¶M . Q #Q A - &F' AJ¶ KA AJ% AAL A A. ?.

Page 141: I i - DTIC

frequency. This causes the reference frequency component of the signal to reverse polarity

." at every integral half-period, causing that component to becore rectified and produce an

average net DC component. All portions of the signal at the input of othe phase-sensitive-

detector, which do not have the reference frequency, reverse polarity at some non-integral

multiple of their half-period, producing an average zero net DC component. A capacitive

filter then converts the rectified reference frequency signal into a DC signal with a ripple

factor which depends on the filter time constant. This DC signal is proportional to only that

component of the original input signal which entered the lock-in at the reference frequency.

The amplified DC sigriai is then digitized and stored for further data analysis.

Approac

A multi-frequency A. C. PD system was built to study the fatigue behavior of

"short cracks" at elevated temperature, in air and in an environment chamber. Although the

SyWSl.J IN t(dp4uiv Ul LId1AL Liih1 -, I. um ",L of )ipe %..acc cracalas, U.&E1ay car.

be obtained by consideration of singlular surface cracks of known origin. In this short

crack study, cracks were artificially initiated at carefully made EDM pits. Potential

mcasurement probes were welded at precise locations on either side of the initiation site.

The potential probes were metal foils at the location of attachment to prevent unintended

initiation due to local penetration, as would be the case with round wire. A semi-elliptical

surface crack with potential probes is depicted in Figure A4.

A brief surhmary of the data analysis will be presented here.

The crack geoeutry is described in Figure A5 where a denotes the crack depth on

the center line, 2c the length of the crack trace on die surface, x and y are the axes in the

plane of the metal surface. The A. C. power supply provides a constant current I through

diic specimen test section via remote attachment. For a given frequency, a constant current

is maintained by application of an clectic field E0 . The value E. is dependent on the

139

*~ Y K )N~V )A',L¶ ~A~A .7~AA ,.A A A ~AI~A.~A~ U ~VAI~x~ ~ U'.NA NUMUJU. ?%- h6'MdX dl Mm* ~d I. X"' Jl' w U . rx d

Page 142: I i - DTIC

overall impedance of the specimen between the location of attachment of the power supply.

This impedance will increase with increasing ý,rack lengths in the specimen gauge section

resulting in an increase in to required to maintain a constant current.

The value of T is also dependent on the applied frequency. As the frequency is

increased, the skin depth decreases according to Equation I resulting in a higher current

flux 1. according to

Jo(co) = (2)

• ,~ 2 crb(wo)

Consequently, the applied potential of the power supply must vary as

Eo (W) = PO)o(c) (3)

"The equation governing the electric field in the metal intefiox is

-V2 If (x, y) =ta (4)

at

The field on the metal surface is shown in Figure A6 and the discontinuous difference in

potential which occurs across the surface edge of the crack, denoted by Vc, is now evident.

if we slve fnr EI (w. v) for i fixed frequency knowing the boundary conditions and E.

Eo (w), the solution to Equation 4 can be used to determine the potential drop across the

crack. 'The maximum value of this potential difference, which occurs on the crack center-

line is

VC (0) -E (01, y+) - E (0, y-) (5)

4cEo

Vc (0) = - cotan - (6)

o.,

I2.3ZL

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where n is related to the crack aspect ratio by

a= c cotan - (7)4

The distribution of Vc along the surface edge is shown for various aspect ratios in

Figure A7. For a given punctual position of the probe (x/c) and by changing the

frequency, therefore changing E., the value of ri can be obtained nmmerically. With this

value of n and Equations A6 and A7, c and a can be determined uniquely. These

calculations must be confirmed by an experimental calibration.

0The utility of the multi-frequency capability is now evident in that it permits

continuous determination of aspect ratios as well as effecting maximum sensitvity over a

range of cracks lengths.

A Demonstration of System Caaities

The A. C. potential drop measurement system described above was assembled. A

calibration experiment was performed. A short crack was propagated in Inconel 718 at

room temperature under fully reversed loading at near threshold stress intensities. A crack

growth wc ul'appiO, tubatiy S A lu -I ,. ""Vv, w., . .........

1W- frequency of 40 Klz was employed. The test was periodically interrupted to record the

potential at zero load and at 80% of maximum load, The surface crack length was

measured directly using the plastic replica technique. The results are plotted in Figure A8.

"TThere are numerous features of this plot which require explanation. The most

obvious is the sudden increase in potential beyond a surface crack length of 800 p.m. This

is axesult of the geometry of the potential probes. As shown in Figure A4a, the foil width

1W was exactly 800 p.m in this experiment. This illustrates the importance of using punctual

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probes. The foil design shown in Figure A4b was used in future experiments. Punctual

probes, approximated by the foil in this experiment for crack lengths beyond 800 paim,

cffects a greater resolution in crack length increment and results in a steeper slope. A

resoluntn of 1.6 gm demonstrated in this experiment, is quite adequate for studying the

fatigue behavior of short cracks. The system is inherently capable of a resolution of better

than 0.1 pim in crack length increment!

Also notewcothy is the increase in potential at 80% of maximum load. This

indicates that the system is capabie of measuring crack closure stresses. The crack closure

phenomenon is believed to play an important role in the fatigue behavior of short cracks.

To simultaneously measure and record load, in addition to potential, an analog-digital

converter has been added to the system design.

Sy~stem Shortcomins

Although the system caiibration at room temperature (Figure A8) was encoturaging,

attempts to proceed to continuous monitoring of crack growth rates in elevated temperature

fatigue tests were unsuccessful. Potential measurements proved to be unstable over long

periods of time (> 4 hrs.), even at constant crack length. The calibration experiment was

peifoid ULdk JUL HOM. 3 ... tw,•l.l..n &u&' kr VrMrnihiteAd to instability in the A. C.

power supply. This component was custom built by an outside electronics firm.

Consequently, being a one-of-a-kind item, the iteration process required for perfeA ting this

unit was bypassed.

Since the principal objective of this research was to measure the fatigue behavior of

small cracks at elevated temperature, testing proceeded using the plastic replication

technique for measuring crack lengths. This same system, with an improved A. C. power

supply, was later successfully used in a study of stress corrosion crack initiation in a

nickel-base superalloy tested under monotonic loading in a PWR environment.

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Table AI

ADVANTAGES D IS ADVA17Ar,;ES

1. Simple technique does not 1. Complex relationship betwe-rely on advanced electron- en F.D. and crack length.

Ics.d.c. 2. Thetnil efrf effects.

2. Well established techni-que for certAin specilien 3. Technique sensitive to spe-sizes and ;-ccmetries. cimfen Size 4n. georetry.

1. Ease of calibratLon for 1. Reliance on advanced

Sdrfering Specimen geo- electronicx.metrics.

2. Lead Interaction.r 2. Inherently linear res-

pon$S. 3. Requirenvnt for high

i.• 3. Lack of size dependeriC.a! method.

4. tase of aimoliticatxon ofinput signal.

5. multiple P.D. probe

systecs can re used.

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Ys.

Figwue A illustration of the d.c. electrical field distribution for an edge crack specimen

L. AC INPUT LEADS

/DETECTOR PROEIS\

��¢CURRENT PATH

Figure A2 Illustiation of the skin effect associated with a.c. conduction

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sweep oscillator

or power supplyfrequency synthesizer(2 ams a.c.

A-D Converter loadcell

lock-in probe_amplifier

-N C

recording devise signal analysisdigitizer W by microcomputer

printer - plotter

Figure A3 Schematic diagram of the muh~i-frequency a.c. potential drop system forcrack length measunnment

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Initiation pit

crack -foil ipotentialcrackprobes

--- 800smm

Figure A4.a nlustraiion of potential probes used in the calibration experiment

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initiation pit

q foil poten~tiaic r crack probes

Figure A4.b Illustration of potential probes to be used in subsequent experiments. Thisgeometry wMU scryc as an id!aI punctual probe.

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Fig=r A5 General descnption of a *ym~etrirAl surfare crack

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- -.

£•Figure A6 Lines of constant potential on the re-t,- surface around crack

S~2t/0.2 - -

0,6

0 0.5 1

-•. o. - -- _ L

-- -.-.. 20-

"0.4

0 0.5

, •Figure A7 Distribution• of the discontinuous difference in potential across a circular arc•'• crack for various crack aspect rtios

: ±40

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iitA

h short crack

2cI L current I amp (rms)

frequency = 40 kHz

4.50 at 80% max. load* at zaro load

S-4.0am

Slope = 0.003 py

Resolution - 3.3ijm (2c)3.5 & 1.6 (a)

3.0

2.5 0 Slope S.001y

Ji

0 ResoIution IWm (201.*.,,"- V S Im (al

k• • ~ ~~~2.0 IIII_ _tf_,400 500 600 700 800 900 1Q00 1100

SURFACE CRACK LENGTH (20) Ipm)

p Figure A8 Potential drop calibration illustrating:1) the importance of using punctual potentnal probes2) a high resolution in crack length increment3) the ability to detect a ,racL closu-e simss

S141

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APPENDIX A References

1. K. Wallin, T. Saario, P. Auerkari, H. Saprelma, and K. Torronen, "Comparison ofPotential Drep and Unloading Compliance Methods in Detenrnining Ductile Crack

K.*Y< SILBI8.9 E. T. Wessel arid F. J. Loss, Eds., American Soc. for Testing and Mat.,1985, pp. 363-374.

2. T. V. Tenkatasubrai-nanian and B. A. Unvala, "An AC Potential Drop System forMonitoring Crack Length," Jgrglg PjLyA~and Eng. SCi. instnrumeit V. 17,1984.

3. 1. Verpoest, E. Aernoudt, A. Deruyttere and M. Neyrinck, "An Improved A.C.Potential Drop Method for Detecting Surface Microcracks, during FatigeueTests ofUnnotched Specimens," Fafigue of Enging&ringy Materials and Sjcurs V. 3,1981, pp. 203-217.

4. D. H. Michael, R. T. Waechter and R. Collins, "The Measutreent of SurfaceCracks in Metals by Using A. C. Electric Field," Em .Sg m 31 1982,pp. 139-157.

5. D. H. Michael, R. Collins, and W. D. Dover, "Detection and Measurement ofC~racks in Threaded Bolts with an A. C. Potential Difference Method," RM, &SMJ. Lnd, A385, 1983, pp. 145-168.

6. F. D. W. Charlesworth and W. D. Dover, " Some Aspxcts of Crack Detection atidSiring using A. C. Field Measurements," in The Measurment of Crackj.nLengt an

Shape ~ ~ ~ ~ at DtigFatueaj , Edited By. C. J. Beevers, EMAS, WestMidlands, U. K., 1982.

7. 1. Verpoest, E. Aernoudt, A. Deruymtre and M. Neyrinck, "An A. C. PotentialDrop Method for Detection anid measurement of Surface Micrvcracks duringFatigue Testing of Wires," in The Measuremient of Crack Lengt and Shape& DuringFrpM; &ad atggi= Edited by C. J. Beever%, EMAS, West Midlands, U. K.,1982.

8. D. Mirshekar-Svahkal and R. Collns, "Induction Effects during CrackMeasurement by the A. C. Field Technique," in IbeMes mi )f a Q c1kLL&ngtl1and Shalpe during1a Frc~d Fatigue, Edited by C. J1. Beeveirs, EMAS, WestMidlands, U. K., 1982.

9. K. R. Watt; "A Consideration of an A. C. Potential Drop Methed for Cnack Length. .Mpasurement,' in Th = =to :kLrg~x~Wd Fmtr

and Faigimc Edited by C. J. Beeven., EMAS, West Midlands, U. K., 1983.

10. R.. P. Wei and R. L. Brazil] "An A. C. Poterajal System for Crack LengthMeasurement,' in The Measurment of CrackLenrd andA~nLEti~gM~.Edited by C. J. Beevers, EMAS, Westi Midlands, U. K., 1983.

142