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Hybrid Pixel R&D After BTeV As of two years ago: FNAL-designed readout chip had two minor fatal flaws. No system demonstration had yet been done. An “extended closeout” R&D program was approved 1 more readout chip submission. Pixel R&D refocused on ILC. Two system tests approved: • Telescope for the forward direction of PHENIX (at RHIC) • Test beam telescope Both efforts in collaboration with LANL & Columbia U.
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Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

Dec 13, 2015

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Eileen Watkins
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Page 1: Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

Hybrid Pixel R&D After BTeV

• As of two years ago:– FNAL-designed readout chip had two minor fatal

flaws.– No system demonstration had yet been done.

• An “extended closeout” R&D program was approved– 1 more readout chip submission.– Pixel R&D refocused on ILC.– Two system tests approved:

• Telescope for the forward direction of PHENIX (at RHIC)• Test beam telescope

– Both efforts in collaboration with LANL & Columbia U.

Page 2: Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

Sensor & FPIX2.1 wafers

Sensor wafers produced for PHENIX by CiS (LANL has agreed to donate

the x4 sensors for use in MTest)

FPIX2.1 fabricated on wafer with “TripT” for D0; fatal flaws fixed; 11 wafers

purchased by LANL for PHENIX, 11 by FNAL to support R&D - 2 required for

MTest telescope.

Page 3: Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

Sensors & ROCs probed – yield is high

260945-12 sensor 06 11_06 UNM

0

500

1000

1500

2000

2500

3000

0 50 100 150 200 250 300 350 400

V (volts)

I (nA)Series1

Typical FPIX2.1 wafer map

Typical sensor IV curve

Page 4: Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

Hybridization – solder bump bonding done by VTT (Finland)

X-ray made at FCC

VTT bump-deposition process flow

Production orders placed ~10/15/07Delivery of hybrids is the schedule

driver.

Page 5: Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

Half-plane = three 1x4 modules

Station = two half-planesoffset by active area of sensor

read out by 1 FPGA

2 stations upstream of DUT & 2-4 downstream

(precision x & precision y)

Test beam telescope

Page 6: Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

MT6-1A Assets

• Climate controlled hut.• Aluminum table on rails allows entire setup to be

removed from beam.• Dark box with feed throughs for signals, power,

& cooling fluid.• Remotely controlled motors determine (x,y)

position of both ends of box.• Local chiller provides closed loop cooling system• CAEN power system can provide LV & sensor

bias (“HV”).• Plenty of quiet power is available.

Page 7: Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An.

Schedule

• Goal = installation in February 2008 (depends on delivery of bump bonded hybrids).

• First user = LHCb.• Hybrid pixel telescope will measure every

beam particle with good timing and moderate precision (5-10 m).

• Anticipate the addition of one station with very high precision (& probably much less good time resolution), such as MAPS.