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Solution: a: Find chip surface temp - Since a line of symmetry exists only half of the heat spreader need to be investigated. b: Find temp distribution using FDM with a grid spacing of 1mm. Find K to achieve 85 C at chip surface. Using a thermal conductivity of 18.4 W/m.k gives a temperature under the center of the chip of 85 C. The resulting temperature distribution within the heat spreader is shown below: C: Provide discretization equations HW#3 Solutions Monday, September 30, 2013 9:27 PM New Section 1 Page 1
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Page 1: HW3 Solutions

Solution:a: Find chip surface temp

- Since a line of symmetry exists only half of the heat spreader need to be investigated.

b: Find temp distribution using FDM with a grid spacing of 1mm. Find K to achieve 85 C at chip surface.

Using a thermal conductivity of 18.4 W/m.k gives a temperature under the center of the chip of 85 C. The resulting temperature distribution within the heat spreader is shown below:

C: Provide discretization equations

HW#3 SolutionsMonday, September 30, 20139:27 PM

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C: Provide discretization equations

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