HW02

© GNU Su-Jin Kim

Atomic BondingMaterial Science

HW02

Group6

Process of Telephone

© GNU Su-Jin Kim

Atomic BondingMaterial Science

How to make?

*Mass production-small parts of telephone are mostly made by mass production.this way are used in plastic, rubber, steel, semi-conduct.

*Pressing-pressure are belong in mass production. pressure can make many parts early.

*Soldering -soldering is used in electronic conductivity.this way are used in speaker, mic, semi-conduct

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Procedure

Sub company use Mass production. So They make parts of telephone.

They assemble partsof telephone to finishedProduct.

Finally, finished product are sold toPeople.

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Mass production

Almost product using mold die process

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Mass production

*Cut-Off Die

*Forming Die

*Punching Die

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Die ＆ Mold for Mass Production

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Plastic Injection Molding

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Die ＆ Injection Molding process

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Injection Molding forexample in life

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Soldering

*Link up two different metal

*Unmelted base matal

*Good for electrical conductivity

*Use sucking machine beside soldering

© GNU Su-Jin Kim

Atomic BondingMaterial Science

Telephone

© GNU Su-Jin Kim

Atomic BondingMaterial Science

End

THANK YOUFOR ATTENTION