HV-AC HIGH POWER LED - files.elv.com · hv-ac high power led issue no : date of issue : ... 0.4641 0.4112 0.4750 0.4304 ... wh wj wm wn wp wq wk wl.

HV-AC LED 1 / 24Http://www.samsungled.com

Rev : 00

SPECIF ICAT IONMODEL : SPHWHTHAD605S0W0U4

HV-AC HIGH POWER LED

ISSUE NO :

DATE OF ISSUE : 03/14/2011

SAMSUNG LED CO,.LTD.

314. MAETAN3-DONG, YEONGTONG-KU,

SUWON-SI,GYUNGKI-DO,KOREA,442-743

SAMSUNG LED

DRAWN CHECKED APPROVED

CUSTOMER :

DRAWN CHECKED APPROVED


Contents

1. Product Outline ------------------------- 3

2. Absolute Maximum Rating ------------------------- 3

3. Characteristics ------------------------- 3

4. Typical Characteristic Graphs --------------- 7

5. Outline Drawing & Dimension ------------------ 10

6. Package Structure --------------------------------- 11

7. Solder Conditions ------------------------------ 11

8. Reliability Test Items & Conditions ---------- 12

9. Circuit Design - Package and PCB --------- 13

10. Taping Dimension ----------------------------------- 14

11. Label Structure ------------------------- 15

12. Lot Number ---------------------------------------- 15

13. Reel Packing Structure --------------------------- 16

14. Aluminum Packing Bag ---------------------- 18

15. Precaution For Use ---------------------------------- 19

16. Hazard Substance Analysis ------------------------- 21

17. Revision history ------------------------------------ 24


1. Product Outline

1) Features

ㆍ Plastic Molded Lead Frame Type : 12.4(L), 11.4(W), 4.38(T)

ㆍ SMD Type : 1 Heat Pad and 4 Electrical Pad

ㆍ Beam View Angle(θ)＊ :136˚

ㆍ High Power / Brightness Chip & Long Time Reliability

2) Applications

ㆍ Indoor & Outdoor lighting

ㆍ Direct AC power source plug-in (110Vac, 220Vac)

※ View Angle describes the spatial intensity distribution and is the difference between the angles

corresponding to 50% of the maximum intensity. (Full Width Half Maximum)

2. Absolute Maximum Rating

Parameter Value Unit

Operating Voltage 250 V[RMS]

Power Dissipation 6.5 W

LED Junction Temperature (TJ) 125

Operating Temperature Range (TOPR) -40 ∼ 85

Storage Temperature (TSTG) -40 ∼ 120

ESD Sensitivity ± 3,000V HBM -

3. Characteristics

1) Electro-Optical properties (Ta = 25 )

Parameter Symbol Condition Min. Typ. Max. Unit

Luminous Flux ΦV

IF=22mA(rms)/220Vac

IF=44mA(rms)/110Vac

220 250 - lm

CCT CT - 2700 - K

CRI Ra 80 - - -

Power Dissipation P 3.3 W

Operating Frequency fo 50/60 Hz

※ Tolerance : ±10%


2) Chromaticity Coordinates (Ta = 25 )


ㆍ 2700K

TABLE Rank CIE X CIE Y Rank CIE X CIE Y

2700K

(W0)

WH

0.4373 0.3893

WM

0.4465 0.4071

0.4465 0.4071 0.4562 0.4260

0.4523 0.4085 0.4624 0.4274

0.4428 0.3906 0.4523 0.4085

WJ

0.4428 0.3906

WN

0.4523 0.4085

0.4523 0.4085 0.4624 0.4274

0.4582 0.4099 0.4687 0.4289

0.4483 0.3919 0.4582 0.4099

WK

0.4483 0.3919

WP

0.4582 0.4099

0.4582 0.4099 0.4687 0.4289

0.4641 0.4112 0.4750 0.4304

0.4538 0.3931 0.4641 0.4112

WL

0.4538 0.3931

WQ

0.4641 0.4112

0.4641 0.4112 0.4750 0.4304

0.4700 0.4126 0.4813 0.4319

0.4593 0.3944 0.4700 0.4126

WHWJ

WM WN WP WQ

WK WL


3) Luminous Flux (Ta = 25 ) (Unit, lm)

Parameter Symbol Condition * Rank Min. Typ. Max. CCT

LuminousFlux

ΦV

IF=22mA(rms)*/220Vac

IF=44mA(rms)/110Vac

U4

U1 220 - 240

2700KV1 240 - 260

W1 260 - 280

X1 280 -

※ Tolerance : ±10%

* Sorting is done @ IF=22mA(rms)

4) VF Bin (Ta = 25 )

Symbol Condition Rank Min. Typ. Max. Unit

Vf IF = 22mA(rms) S0

F1 190 - 195

Vac(rms)

F3 195 - 200

F5 200 - 205

※ Tolerance : ±5V

5) Resistor Table

VfParallel Connection Series Connection

Unit100Vac 110Vac 120Vac 220Vac 230Vac 240Vac

ResistorValue

F1 330 560 800 2,200 2,620 3,100

ΩF3 300 510 750 2,100 2,560 3,000

F5 270 460 700 2,000 2,500 2,900

※ LED Power dissipation Tolerance : ±7%


4. Typical Characteristic Graphs

1) AC voltage operating characteristic

Total Power Consumption = Power_LED + Power_Resistor

Power_LED = Total Power - I2R

< Power consumption vs. Operating current >

0

1

2

3

4

5

6

7

0 10 20 30 40

Operating Current [mA rms]

Consum

ption P

ow

er [W

] .

Power_total

Power_LED

Power_Resistor

< LED Input Power vs. Generated Heat >

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0 2 4 6

Input Power [W]

Genera

ted H

eat [W

]

.

※ Total Thermal Power = LED + Resistor

Thermal power of the LED is the vertical axis of the above graph.

Thermal power of the resistor is Current2 X Resistance.

Resistor value and type must be selected depending on the operating condition.

Ballast

Resistor


2) IV characteristic (operating in AC voltage, Ta = 25 )

0

10

20

30

40

50

60

70100

120

140

160

180

200

220

240

Voltage [V rms]

Current [m

A rm

s] . Without Resistor

With Resistor' (220Vac)


0

20

40

60

80

100

120

140

160

180

200

40

50

60

70

80

90

100

110

120

130

140

150

Voltage [V rms]

Current

[m

A r

ms]

.

Without Resistor

With Resistor''' (100Vac)

With Resistor'' (110Vac)


3) Optical characteristic (operating in AC voltage, Ta = 25 )

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 10 20 30 40

Operating Current [mA rms]

Rela

tive

Lum

inous F

lux

.

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 10 20 30 40Operating Current [mA rms]

Rela

tive

Lum

inous E

ffic

acy

.

4) Thermal characteristic (operating in AC voltage, Ta = 25 )

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0 20 40 60 80 100 120

Temp []

Norm

aliz

ed L

um

inous

.

※Temperature is measured on Metal PCB bottom surface with resistance ballast.

Metal PCB Bottom

Temperature


5) Typical Spatial Distribution

6) Spectrum Distribution

0.0

0.2

0.4

0.6

0.8

1.0

1.2

350 400 450 500 550 600 650 700 750 800

Wavelength (nm)

Rela

tive

Spartia

l P

ow

er

Dis

trib

ution

.


5. Outline Drawing and Pad Configuration

Pick and Place

1. Do not place pressure on the encapsulating resin

It is recommended to use a pick&place nozzle with inside diameter at 9.2mm

2. The maximum compressing force is 20N on the polymer

Unit :

Tolerance : ±0.1

Pad Function

① Bipolarity

② Bipolarity

③Thermal

(Electrically Isolated)

④ Bipolarity

⑤ Bipolarity


6. Package Structure

7. Solder Conditions

1) Reflow Conditions (Pb-Free)

Reflow Frequency : 2 time max.

2) For Manual Soldering

Not more than 5 seconds @Max. 300 , under soldering iron.

0

50

100

150

200

250

300

0 50 100 150 200 250 300

Time[sec]

Tem

pera

ture

[

] 0

Preheating : 150~180

Peak Temp. : 260±5 , Max. 10 sec

Max. 60 secTime above 220 : Max. 60 sec

Max. Temp. gradient in cooling : -5 /sec

60~120 sec

NUMBER ITEM MATERIAL

① FRAME Copper Frame(Silver Plated)

② Package Heat-Resistant Polymer

③ LED Chip GaN on Sapphire

④ WIRE Gold Wire

⑤ Encapsulation RESIN Silicone + Phosphor

⑥ Lens Silicone


8. Reliability Test Items and Conditions

1) Test Items

2) Criteria for Failure

Item Symbol Test ConditionLimit

Min Max

Forward Voltage VF IF = 22 (rms) - U.S.L.*1.2

Luminous Flux ΦV IF = 22 (rms) L.S.L.*0.7 -

※ U.S.L : Upper Standard Level, L.S.L : Lower Standard Level

Test Items Test ConditionsTest

Hours/Cycles

Room Temperaturelife test

25, IF = Max AC 25mA(rms) 1,000 h

High Temperaturehumidity life test

85, 85% RH, IF = Max AC 25mA(rms) 1,000 h

High Temperature lifetest

85, IF = Max AC 25mA(rms) 1,000 h

Low Temperature lifetest

-40, IF = Max AC25mA(rms) 1,000 h

High TemperatureStorage

120 1,000 h

Low TemperatureStorage

-40 1,000 h

Thermal Shock -40 / 120, each 30 min200

cycles

Temperature humidityCycle On/Off test

-40 / 85, each 20 min, 100 min transferPower On/off each 5 min, AC 20

100cycles

Reflow (Pb-Free) Peak 260±5 for 10 sec 3 times

ESD(HBM) R1 : 10 , R2 : 1.5 , C : 100 5 times(± 2 )

Surge Line to Line 2


9. Circuit Design - Package and PCB

This HV-AC LED can be used for both 110Vac and 220Vac depending on the PCB

circuit design.

Creepage distance between edge and Cu pattern should be greater than 5mm.

Schematic Circuit Connection (Example)

PCB Pattern Circuit (Example)

To improve protection against surge, divide resistor value in 3.5) Resistor Table

(Page 6) by 2 and use half and half on both sides as illustrated in the figures

above.


10. Taping Dimension

(1) Quantity : 800 Pcs / 13" Reel.

(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches is less than ±0.2

(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when

the cover tape is turned off from the carrier tape at 10 angle to be the

carrier tape.

(4) Packaging : P/N, Manufacturing data Code No. and quantity to be indicated

on a damp proof Package

More than 100

Unloaded tape

Mounted with

LED

Leading part more than

(200~400)

More than (100~200)

Unloaded tape

EndStart

Polarity

Symbol A B C W1 W2

Dimension() 330 ± 1 80 ± 1 25 ± 0.5 13 ± 0.3 29.5 ± 1


11. Label Structure

Rank Code

/S0/ : VF Rank (refer to page 3)

/W0/ : Chromaticity Coordinate Rank, CIE (refer to page 4)

/U4/ : Luminous Flux (refer to page 4)

12. Lot Number

The Lot number is composed of the following characters

/ I / 800PCS

: Production Site (S:SAMSUNG LED, G:Gosin China)

: L (LED)

: Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)

: Year (S:2008, T:2009, U:2010...)

: Month (1 ~ 9, A, B)

: Day (1 ~ 9, A, B ~ V)

: SAMSUNG LED Product Number (1 ~ 999)

: Reel Number (1 ~ 999)

S0W0U4

SPHWHTHAD605 S0W0U4 XXXX

IIIIIIIIIIIIIIIIIIIIIIIIIIII

/ I / XXXXpcs

IIIIIIIIIIIIIIIIIIIIIIIII


13. Reel Packing Structure

1) Reel

2) Aluminum Bag

3) Inner Box

HP LED

Material : Paper(SW3B(B))

TYPESIZE()

L W H

13inch 335 45 335

↓

↓Silica gelHumidity Indicator Card

H

L

W

S0W0U4SPHWHTHAD605 S0W0U4 XXXX


/ I / XXXXpcs




/ I / XXXXpcs


S0W0U4

SPHWHTHAD605 S0W0U4 XXXX


/ I / XXXXpcs



4) Carton Box

Material : Paper(SW3B(B))

TYPESIZE()

L W H

13inch 350 350 350

HP LED

↓

L

W

H



/ I / XXXXpcs



14. Aluminum Packing Bag

Silica gel & Humidity Indicator Card in Aluminum Packing Bag


15. Precaution for Use

1) For over-current-proof function, customers are recommended to apply

resistors to prevent sudden change of the current caused by slight shift of

the voltage.

2) This device should not be used in any type of fluid such as　water, oil,

organic solvent, etc. When washing is required, IPA is recommended to use.

3) When the LEDs illuminate, operating current should be decided after

considering the ambient maximum temperature.

4) LEDs must be stored in a clean environment. If the LEDs are to be stored

for 3 months or more after being shipped from SAMSUNG LED, they should

be packed by a sealed container with nitrogen gas injected. (Shelf life of

sealed bags : 12 months, temp. 0~40, 20~70%RH)

5) After storage bag is open, device subjected to soldering, solder reflow, or

other high temperature processes must be:

a. Mounted within 168 hours (7days) at an assembly line with a condition

of no more than 30/60%RH,

b. Stored at <10% RH.

6) Repack unused Products with anti-moisture packing, fold to close any

opening and then store in a dry place.

7) Devices require baking before mounting, if humidity card reading is >60% at

23±5.　

8) Devices must be baked for 24hours at 65±5, if baking is required.

9) The LEDs are sensitive to the static electricity and surge. It is

recommended to use a wrist band or anti-electrostatic glove when handling

the LEDs.

If voltage exceeding the absolute maximum rating is applied to LEDs, it may

cause damage or even destruction to LED devices.

Damaged LEDs may show some unusual characteristics such as increase in

leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low

current.


10) When handling LED with tweezers, the LED Should only be held by the

polymer body, not by the encapsulant or LENS.

11) The use of appropriate nozzle for the LED recommended. For the

recommended nozzle size, refer to the figure at the below.

Inner diameter of nozzle ≥ Φ9.2mm

12) Do not stack assembled PCBs together. Since silicone is a soft material,

abrasion between two PCB assembled with silicone encapsulated LED might

cause catastrophic failure of the LEDs due to damage to encapsulant and

wire and LED detachment.


16. Hazard Substance Analysis




Date Revision HistoryAuthor

Drawn Approved

2011.03.05 Initial Edition Y.J. Lee I.H. Choi

2011.03.14

Revision History(Model : SPHWHTHAD605S0W0U4)

HV-AC HIGH POWER LED - files.elv.com · hv-ac high power led issue no : date of issue : ... 0.4641 0.4112 0.4750 0.4304 ... wh wj wm wn wp wq wk wl.

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