www.creativeelectron.com LED, BGA, and QFN Assembly and Inspection Defect Inspection Examples Copyright © 2014 Creative Electron NOT FOR DISTRIBUTION
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LED, BGA, and QFN Assembly and Inspection
Defect Inspection Examples
Copyright © 2014 Creative ElectronNOT FOR DISTRIBUTION
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Where Are Defects Introduced?
Counterfeit*Components
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Defects associated with paste applicationExcess solderSolder bridgesInsufficient solder
Solder Paste Application Defects
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Component Placement Defects
Defects associated with component placementMisalignmentPolarityMissing component
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Reflow Oven Defects
Defects associated with the reflow profileVoidingBridgingSolder ballsExcess solderInsufficient solder
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Statistical Process Control
Manufacturing process quality assurance.Solder joint measurement data, collected during x-ray test, can be statistically analyzed to identify manufacturing drifts, trends and other relevant process quality issues.
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BGA Head In Pillow Visual Inspection
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