HiSOLProbe System Productshisol.jp/en/wp-content/uploads/2014/09/prober-english.pdf* Items with asterisk vary depending on system configuration. Manual Prober 4 8inch 12inch Model

HiSOL Probe System Products

●Wafer size 2” to 12”

●Manual and Semi‐automatic

●Ultra low current measurement in fA level

● Low capacitance measurement in fF level

●High frequencymeasurement up to 67GHz

● Thermal test from ‐65゜C to +400゜C (Atmospheric)

● Thermal test from 4k to +500゜C (Vacuum)

● 1/f noise, RTN measurement

● Pulse I‐V test, Ultra high speed I‐V test

●High current measurement (～200A pulse)

●High voltage measurement (～10kV)

● Electro static discharge (ESD) evaluation

● Failure analysis

●Magnetic stimulationmeasurement

●Optoelectronics (VCSEL,PD etc.) measurement

●Wafer level reliability test (EM/TDDB/HCI/NBTI/BT)

From From Ultra LowUltra Low Signal to High PowerSignal to High Power testtest,,From DCFrom DC，，II‐‐VV，，CC‐‐V V mmeasurementeasurement

to RF to RF mmeasurementeasurement

Our Probing Solutions

We offer you analysis probe systems for semiconductor and FPD (Flat‐panel display ).We can provide various probe systems from affordable compact manual probers for R&D to high‐end 300mm semi‐automatic probe system for ‐65゜C to +300゜C thermal test. We can customize the most suitable probing solution that matches to your measurement application.

Our probe systems correspond to wide variety of application from ultra low signal test to high power device test, from DC parametric measurement to RF measurement, wafer level reliability test, magnetic field impression measurement, and optical device measurement.We support your development of R&D and technical improvement.

HiSOL,Inc. is a certified solution partner company of KEYSIGHT Technologies

Manual P

roberSem

i‐Autom

atic Prober

Probe System

for FPD

Vacuum

probe systemSpecialty

Probe system

Accessories

Applications

2

3

4inch 6inch

Model HMP-400 / HMP-600

・ Model HMP-400 is for 4" wafers. ・ Model HMP-600 is for 6" wafers.

Bestselling Compact Manual Prober

This is a compact manual prober for R&D that supports wafer measurements ranging from small chip up to 4” or 6” wafers.Prober is capable of measuring ultra low currents on the fA level or low capacitance on the pF level by selecting appropriate options.High temperature tests can be also made by incorporating a hot chuck that supports a temperature range from room temperature to +300°C.

‐Ultra low signal I‐V measurements (fA level)

‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV)

‐ 4‐terminal resistance measurements

‐ Temperature characteristics tests in range from room temperature to+200°C or +300°C‐Mounts in glove box‐ Probe card support‐ RF measurements (up to 67 GHz)‐Ultra high‐speed I‐V measurements‐ High‐power device measurements(100A pulse, ±3kV triaxial, ±10kV coaxial)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)

Extended applications

Applications

■ MANUAL PROBER

Wafer Size

X‐Y coarse travel

X‐Y fine travel

θ travel

Platen Z axis action

Unit dimension（W×D×H）*

Weight*

Platen Z axis adjustment

HMP‐400 HMP‐600

up toφ100 mm up toφ150 mm

X：105mm，Y：150mm X：155mm，Y：200mm

350×390×450mm 390×450×450mm

28kg 36kg

XY：13mm / Micro meter head

coarse ±30°, fine ±2.5°

0 ‐ 20mm free

0～15mm

* Items with asterisk vary depending on system configuration.

Manual P

rober

4

8inch 12inch

Model HMP-800 / HMP-1200

This is a standard manual prober that supports 8” or 12” wafers.

・ Model HMP-800 is for 8" wafers.・ Model HMP-1200 is for 12" wafers.

This prober supports reliable on‐wafer measurements with a simple yet high‐accuracy mechanism that is easy to operate.This standard manual prober model is scalable to support a wide range of applications such as hot chuck systems(from room temperature to +200°C or +300°C), submicron resolution stages, and laser cutters.

Applications

‐ Temperature characteristics tests in range from +20°C to +300°C


‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV)

‐ RF measurements (up to 67 GHz)

‐Ultra high‐speed I‐V measurements


‐ Probe card support (can support Multisite WLR)‐ Built‐in laser cutter (Point marking, Exfoliation of protection layer,Metal layer cutting)‐ Probing with submicron accuracy achieved by a built‐in metallograph, active vibration isolator, and ultra high‐accuracy stage‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)

■ MANUAL PROBER

Wafer Size

X‐Y coarse travel

X‐Y fine travel

θ travel



Weight*


HMP‐800 HMP‐1200

～φ200 mm ～φ300 mm

X：205mm，Y：300mm X：305mm，Y：400mm

550×650×450mm 690×780×450mm

60kg 80kg

XY：13mm/Micro meter head

coarse ±30°, fine ±2.5°

0 / 0.3 / 10mm

0～13mm


Manual P

rober

8inch 12inch■ MANUAL PROBER

Model HMP-810SC / HMP-1210SC

・ Model HMP-800SC is for 8" wafers. ・ Model HMP-1200SC is for 12" wafers.

Manual Prober for High / Low Temperature Tests

This is a manual probe system for next‐generation semiconductor devices designed for low noise and low leakage.In this system, a shielded chamber structure contains the probe and chuck in a totally EMI shielded environment. The system supports measurements such as ultra low signal measurement in the threshold regions, 1/f noise measurement, S parameter acquisition, and high‐speed I‐V measurement in a temperature control range from ‐60°C to +300°C(or +400°C when using the special option).This probe system can optionally support high‐current and high‐voltage power device applications.* The HMP‐610SC for 6” wafers is also available.

Applications

‐ Temperature characteristics tests in range from +25°C to +300°C or from ‐60°C to +300°C‐Ultra low signal I‐V measurements (fA level)‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV) [sub pF level]‐ 1/f noise evaluation‐ RTN (random telegraph noise) evaluation‐High‐frequency noise evaluation (up to 800 MHz)‐ RF measurements (up to 67 GHz) / S parameter acquisition‐Ultra high‐speed I‐V measurements


‐ Probe card support (can support Multisite WLR)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)* 8” model‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)

Wafer Size

X‐Y coarse travel

X‐Y fine travel

θ travel



Weight*


HMP‐810SC HMP‐1210SC

～φ200 mm ～φ300 mm

X：205mm，Y：205mm X：310mm，Y：310mm

1020×1000×1550mm 1150×1100×1550mm

750kg 1000kg

±7.5°

0 / 0.3mm

0～13mm

X：205mm，Y：205mm X：310mm，Y：310mm


5

Manual P

rober

4inch 6inch■ SEMI-AUTOMATIC PROBER

・ Model HSP-100 is for 4" wafers. ・ Model HSP-150 is for 6" wafers.

Semi‐Automatic Probe System for Small‐Diameter Wafers

This is a semi‐automatic probe system that supports 4” or 6” small diameter wafers.Equipped with a high‐accuracy X‐Y‐Z‐θ quadraxial closed loop stage having excellent positioning accuracy and repeatability, this probe system ensures reliable probe contact.This probe system can incorporate a hot chuck that supports a temperature range from +20°C to +300°C.This probe system can optionally support high‐current and high‐voltage power device applications.

Applications







‐ Probe card support (can support Multisite WLR)‐ Built‐in laser cutter (Point marking, Exfoliation of protection layer, Metal layer cutting)‐ Active vibration isolator and ultra high‐accuracy probing through image processing pattern recognition (accuracy: ± 1 um or finer)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)

6

Wafer Size

X‐Y travel

X‐Y repeatability

X‐Y accuracy

Z travel


Weight*

Z repeatability

HSP‐100 HSP‐150

～φ100 mm ～φ150 mm

X：105mm，Y：200mm X：160mm，Y：250mm

1200×900×1550mm 1250×900×1550mm

650kg 700kg

＜±2μm

＜±5μm

20mm

＜±1μm

θ travel

θ repeatability

±7.5°

0.002°


Model HSP-100 / HSP-150

Semi‐A

utomatic P

rober

■ SEMI-AUTOMATIC PROBER

・ Model HSP-200 is for 8" wafers. ・ Model HSP-300 is for 12" wafers.

8inch 12inch

Standard Semi‐Automatic Prober Model

This is a standard semi‐automatic probe system that supports 8” or 12” wafers.Equipped with a high‐accuracy X‐Y‐Z‐θ quadraxial closed loop stage having excellent positioning accuracy and repeatability, this probe system ensures reliable probe contact.This probe system can incorporate a hot chuck that supports a temperature range from +20°C to +300°C.This probe system can optionally support high‐current and high‐voltage power device applications.

Applications







‐ Probe card support (can support Multisite WLR)‐ Built‐in laser cutter ( Point marking, Exfoliation of protection layer, Metal layer cutting )‐ Active vibration isolator and ultra high‐accuracy probing through image processing pattern recognition (accuracy: ± 1 um or finer)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)

Wafer Size

X‐Y travel

X‐Y repeatability

X‐Y accuracy

Z travel


Weight*

Z repeatability

HSP‐200 HSP‐300

～φ200 mm ～φ300 mm

X：205mm，Y：300mm X：310mm，Y：450mm

1300×1000×1550mm 1400×1050×1600mm

750kg 950kg

＜±2μm

＜±5μm

20mm

＜±1μm

θ travel

θ repeatability

±7.5°

0.002°


Model HSP-200 / HSP-300

7

Semi‐A

utomatic P

rober

・ Model HSP-200SC is for 8" wafers. ・ Model HSP-300SC is for 12" wafers.

8inch 12inch■ SEMI-AUTOMATIC PROBER

Semi‐Automatic Prober for High / Low Temperature Tests

Applications

‐ Temperature characteristics tests in range from +25°C to +300°C or from ‐60°C to +300°C‐Ultra low signal I‐V measurements (fA level)‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV) [sub pF level]‐ 1/f noise evaluation‐ RTN (random telegraph noise) evaluation‐High‐frequency noise evaluation (up to 800 MHz)‐ RF measurements (up to 67 GHz) / S parameter acquisition‐Ultra high‐speed I‐V measurements

This is a semi‐automatic probe system for next‐generation semiconductor devices designed for low noise and low leakage.In this system, a shielded chamber structure contains the probe and chuck in a totally EMI shielded environment. The system supports in‐plane automatic measurements such as ultra low signal I‐V / C‐V measurement in threshold regions, 1/f noise measurement, S parameter acquisition, RTN (random telegraph noise) measurement, and high‐speed I‐V measurement in a temperature control range from ‐65°C to +300°C (or +400°C when using the special option).This probe system can optionally support high‐current and high‐voltage power device applications.* The HSP‐150SC for 6” wafers is also available.


‐ Probe card support (can support Multisite WLR)‐ Active vibration isolator and ultra high‐accuracy probing through image processing pattern recognition (accuracy: ±1 um or finer)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements(400A pulse, ±3kV triaxial, ±10kV coaxial) * 8” model‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)

Wafer Size

X‐Y travel

X‐Y repeatability

X‐Y accuracy

Z travel


Weight*

Z repeatability

HSP‐200SC HSP‐300SC

～φ200 mm ～φ300 mm

X：205mm，Y：205mm X：310mm，Y：310mm

1350×1000×1450mm 1450×1150×1450mm

1050kg 1250kg

＜±3μm

＜±5μm

20mm

＜±1μm

θ travel

θ repeatability

±7.5°

0.002°


Model HSP-200SC / HSP-300SC

Semi‐A

utomatic P

rober

8

HiSOL Semi‐Automatic Prober Control Software

Manual operation

BIN mappingWafer Map setting

Seals feature

Supported automatic measurement software

KEYSIGHT technologies‐EasyEXPERT‐Desktop EasyEXPERT‐WaferPro Express

TFF / KEITHLEY instruments ‐4200‐SCS KITE (Keithley Interactive Test Environment)‐ACS

Proplus design solution ‐Noisepro

Other GP‐IB communication‐enabled software

‐User‐friendly multifunctional semi‐automatic probing software.‐ Supports Windows 8 as its operating system. (Windows 7 is also supported.)‐ Also available as a manual prober with a software GUI or joystick controller.‐ Receiving BIN information from a higher‐level measuring instrument, it is possible to display BIN mapping.‐ Supports wafer thermal expansion compensation function for Thermal test.‐ Possible to control the semi‐automatic prober using the GP‐IB command sent from a higher‐level measuring instrument or PC.

‐ Possible to provide software for making a database of and extracting parameters of raw data obtained from eachmeasuring instrument in order to analyze the data. (Optional)‐ The self‐developed software allows users to incorporate customized requirements.

■ SEMI-AUTOMATIC PROBER

Semi‐A

utomatic P

rober

9

■ PROBE SYSTEM FOR FPDFPD

Manual Prober for Flat‐Panel Display

We custom‐make manual probers that support FPDs (flat‐panel display) ranging from small to large glass substrates.A microscope and probing area with a wide range of motion allow stable probing across the panel surface.A heating type (up to +200°C) or thermal type (‐40°C to +200°C) can be selected for the rectangle panel chuck andultra low current measurements on the fA level and C‐V measurements on the sub pF level are supported for all temperature zones.This prober also supports light irradiation on the panel surface by the solar simulator or other device and light irradiation onthe bottom side of panel (backlight) by super‐high luminance white LED.

Light irradiation on the bottom side of panel by ultra high luminosity LED (up to 40, 000 cd/cm2) * Sub‐stage

Light irradiation on the panel surface by the solar simulator or other device

Built‐in laser cutter (laser wavelength: 1064, 532, 355, 266 nm)

Ultra high‐accuracy model for stable probing of submicron patterns

Function examples of systems for small to medium-sized panels

Model HMP-FPD series

Wide range probing area that enables layoutof FPD devices.

Probe System

for FPD

10

FPD■ PROBE SYSTEM FOR FPD

Model HSP-FPD series

Semi‐Automatic Prober for Flat‐Panel Display

Function examples of systems for small to medium-sized panels

Common gate pad probing (on sub‐platen)

‐Wide range microscope X‐Y travel‐Wide range probing area‐ Programmable X‐Y‐Z positioner (manipulator)

We custom‐make Semi‐automatic probers that support FPDs (flat‐panel display) ranging from small to large glass substrates.A microscope and probing area with a wide range of motion allow stable probing across the panel surface.A heating type (up to +200°C) or thermal type (‐40°C to +200°C) can be selected for the rectangle panel chuck andultra low current measurements on the fA level and C‐V measurements on the sub pF level are supported for all temperature zones.

Probe System

for FPD

11

High / Low temperature model （‐60゜C ～ +200゜C）

25mm sq.

Model HMP-V80 series

Compact Vacuum Prober for R&D (at Ultra Low to Ultra High Temperatures)

This is a compact vacuum prober for R&D that supports I‐V / C‐V / RF measurements on 5‐mm to 25‐mm samples.There are a variety of models available such as one that supports temperature tests at ultra low temperatures on the 4k level and one that supports the temperature tests at up to +500°C.

Substrate Size

General

Ultimate vacuum*

Number of measurement channels

Measurement feed‐through connector*

Probe X‐Y‐Z travel

Magnification*

Illuminating apparatus for microscopes*

Probe Adjustment sensitivity

5mm ～ 20 mm square

1 x 10E ‐4 Pa

40x ～ 240x (on monitor)

LED ring lighting

2 ～ 7 ( 6 ‐ probe maximum，1‐ chuck)

Hermetically triaxial (Jack) standard

X 30mm, Y 50mm, Z 15mm

＜0.01mm

Microscope movement*

Microscope type

3 joint horizontal swing arm

CCD mono‐scope with LCD monitor


Movements

Microscope

Room temperature or ultra low temperature modelModel Temperature range Heating method Cooling method

HMP‐V80 Ambient None None

HMP‐V80‐LH 4.2 k to 298 k (+25°C) Heater Liquid helium transfer

HMP‐V80‐LHM 8k level to 473 k (+200°C) Heater Liquid helium transfer

HMP‐V80‐LHH 10k level to 573 k (+300°C) Heater Liquid helium transfer

HMP‐V80‐LN 80 k to 298 k (+25°C) Heater Liquid nitrogen cryostat

HMP‐V80‐LNM 80 k to 473 k (+200°C) Heater Liquid nitrogen cryostat

HMP‐V80‐LNH 80 k to 573 k (+300°C) Heater Liquid nitrogen cryostat

HMP‐V80‐PS 80 k to 298 k (+25°C) Heater Free Piston Stirling cooler

Ultra high temperature modelModel Temperature range Heating method Cooling method

HMP‐V80 R.T. to +300 °C Heater Compressed air

HMP‐V80‐LH R.T. to +400 °C Heater Compressed air

HMP‐V80‐LHM R.T. to +500 °C Heater Compressed air

Common specification

■ VACUUM PROBE SYSTEM

Vacuum

probe system

12

6inch 8inch

Model HSP-V150 / HSP-V200

On‐wafer Characteristics Evaluation of MEMS Devices at High / Low Temperatures in an Ultra High Vacuum Environment

■ VACUUM PROBE SYSTEM

・ Model HSP-V150 is for 6" wafers. ・ Model HSP-V200 is for 8" wafers.

This prober supports on‐wafer measurements at high / low temperatures (‐60°C to +300°C) on MEMS devices that must operate in a vacuum environment such as RF MEMS devices or crystal oscillator MEMS devices.The cost of packaging which is a very expensive process can be reduced by implementing this system.MEMS device characteristics such as the equivalence constant, transmission characteristics simulation, or S parameter can be automatically acquired on the wafer by combining the prober with the impedance analyzer, RF network analyzer or other tester.

Wafer Size

X‐Y travel

X‐Y repeatability

X‐Y accuracy

Z travel


Weight*

Z repeatability*

HSP‐V150 HSP‐V200

～φ150 mm ～φ200 mm

X：160mm，Y：160mm X：310mm，Y：310mm

2500×1800×1900mm 2700×2000×1900mm

1300kg 1600kg

＜±2μm

＜±5μm

20mm

＜±1μm

θ travel

θ repeatability

±7.5°

0.002°


Ultimate vacuum 1 x 10E ‐3Pa （1 ｘ 10E‐5 Pa optional）

At the stage of research and development of organic semiconductor device such as OFET，OTFT，OEL，and OLED, it is necessary to perform evaluation under high‐purity inert gas to avoid characteristic degradation caused by moisture or oxygen in the atmosphere. Once this system is implemented, organic semiconductor devices can be measured at a high or low temperature (‐60°C to +300°C) in the highly‐pure inert gas (N2 or Ar) environment achieved by vacuuming and gas displacement.This system supports ultra low signal measurements and meets demand for high‐accuracy I‐V / C‐V measurements in various organic semiconductor devices.

MEMS

Organic semiconductor

13

Vacuum

probe system

Magnetic Stimulation Probe System

■ SPECIALTY PROBE SYSTEM

Semi‐automatic Vertical magnetic field prober( ± 1500 Oe , ‐60゜C to +200゜C )

We offer design and manufacturing of probe systems to apply magnetic fields for evaluating all types of spintronics devices (MR sensor, MRAM, Fram, FeRam) and Hall devices.

‐Highly advanced nonmagnetic structure‐ Excellent magnetic field hysteresis characteristics‐ Supports super low residual field electromagnets.‐ Supports in‐plane magnetic fields and vertical magnetic fields.‐ Provision of magnetic field application and measurement application software‐ Provision of traceable magnetic field calibration tool and correction software‐ Temperature characteristic evaluation in range from ‐65°C to +200°C‐ Low resistance measurements, RF measurements (up to 67 GHz)‐ Supports manual prober and Semi‐automatic prober

Elemental technologies

Patent technology of Toei Scientific Industrial Co.,Ltd. is used for our probe system mounted with vertical magnetic field electromagnets ( Japan Patent Application Laid‐Open Disclosure Number 2010‐212453 )

Manual In‐planemagnetic field prober( ‐3000 Oe to +3000 Oe)

14

SpecialtyProbe system

Probe systems for Optoelectronics

We offer design and manufacturing of systems that measure optical and electrical characteristics of the various optoelectronics( light‐emitting and light‐receiving ) devices on wafers.

Semi‐Automatic Probe System with Built‐in Microscopic Photometric Tube For VCSEL, PD/ APD evaluation (for diameter of 2 inches)

Manual Optical Fiber Direct Connection Type ProberFor VCSEL evaluation (for diameter of 3 inches)

Applications

‐Optical and electrical characteristics evaluation of VCSEL, LED or other light‐emitting devices on wafer level‐Optical and electrical characteristics evaluation of photodiode, avalanche photodiode or other light‐receiving devices on wafer level

■ SPECIALTY PROBE SYSTEM

‐ I‐L‐V

‐ C‐V

‐ Pulsed I‐V

‐Wavelength

‐NFP

‐ FFP

‐Modulation frequency

‐ RIN

‐Dark current

‐ I‐V

‐ C‐V

‐ Conversion efficiency

‐Wavelength‐conversion efficiency

‐ Cut‐off frequency

‐Modulation frequency

‐ Transient response

VCSEL・LD・LED characteristic PD・APD characteristic

Manual 4 point resistivity prober

This manual measuring system is to measure Si wafers, solar cell, sheet resistance such as LCD, and resistivity by usingfour‐point probe method. We provide manual four‐point prober and Keithley’s source meter model 2401 as a standard measuring system. By using accessory measuring software for Keithley 2401, automatic calculation of sheet resistance and resistivity become possible.

4‐point probe

15

SpecialtyProbe system

Various light source Single MonochromatorIntegrating sphere PMT

■ APPLICATIONS

Ultra Low Signal I‐V / C‐V Measurement

High‐frequency / RF measurement

The following plot is a result of measuring the current value while impressing the sweep voltage to the probe and the chuck that are in the open state. The result shows the noise and leak current of the probe is less than ±10fA. With 300 mm‐thermal chuck, it shows the noise and leak current is less than ±20fA in all the temperature ranges ：‐60゜C to +300゜C. It proves that our probe system corresponds to ultra low signal measurement application that requires measurement precision of 1pA or less.

The plot on the right is measured data of reverse voltage and capacitance measurement of diode device. By correcting OPEN / SHORT / LOAD, it enables to do stable C‐V measurement of “fF” level.

C300‐60UL High/Low temperature chuck ( ‐60゜C～+300゜C )Voltage sweep range：‐10V ～ +10V

Model A74CJ 1tip‐Kelvin Coaxial ProbeVoltage sweep range： ‐200V ～ +200V

Note) The above measurement value is actual measurement value in our measurement environment and not guaranteed value

＜±3fA

Our probe station can cover measuring frequency band of DC to 67GHz due to its high rigidity and stable mechanism.System integration with Vector network analyzer (VNA), RF probe, RF cable, calibration substrate etc., will support high frequency /RF measurement which is high resolution and excels in repeatability. It supports from 2‐port to multi‐port measurement, temperature range from 10 k to + 250 ゜C, and characterization under ultra‐high vacuum (10e‐6Pa) environment.

Ultra low current I‐V measurement

Ultra low capacitance C‐V measurement

16

Applications

‐65゜C ～+200゜C ：＜±10fA+300゜C：＜±20fA

■ APPLICATIONS

Wafer‐Level Reliability Test

Noise Characterization

Organic Semiconductor Device EvaluationAt the stage of research and development of organic semiconductor device such as OFET，OTFT，OEL，and OLED, it is necessary to perform evaluation under high‐purity inert gas to avoid characteristic degradation caused by moisture or oxygen in the atmosphere. We offer small‐footprint manual prober and semi‐auto prober that are specially designed for the usage inside of a glove box. They are suitable for operation by gloved hand.

Manual prober for glove box Semi‐automatic prober for glove box

+300゜C High temperature multi‐site probe cardAn oxygen meter inside of a chamber and a mass flow controller (MFC) enable probing with a low residual oxygen concentration of less than 100ppm

We offer probe systems that support wafer‐level reliability test such as EM, TDDB, HCI, NBTI, BT, etc.,.Our probe system support various tasks required in wafer‐level reliability test such as high temperature up to +300゜C, long‐term testing over weeks, stable contact under high temperature environment, mounting multi‐site probe card, anti‐oxidation environment by nitrogen gas purge, etc.,.

Our probe system with shield chamber ( HMP‐810SC/1210SC，HSP‐200SC/300SC ) has option setting of ultra low floor noise (‐UL). By choosing this “–UL” option, it can support on‐wafer noise characterization such as 1/f noise, random telegraph noise, (RTN), and RF noise in the wide temperature range from ‐65゜C to +200゜C.

17

Applications

■ APPLICATIONS

High‐Power Device Measurement

Safety

High Voltage Measurement ( ～ 10kV)，High Current Measurement (～ 200A pulse )

In high‐power device evaluation where dangerous high voltage and high current are required, safety measures against human have to be taken in anticipation of various cases. Our probe system for high‐power device measurement is equipped with interlock system that is standard. Each interlock system will prevent from electric shock, a burn, and oxygen shortage

Interlock that interrupts applied high voltage with safety light curtain. Interlock that prevents oxygen shortage with open air oxygen monitor.( Applied to a system with gas purge function. )

High Voltage Probing High Current Probing

We offer probe accessories that support maximum 10kV 200A pulse as well as chucks that support maximum 5kV 40A pulse.It supports device characterization in the temperature range from ‐60゜C to +300゜C in order to support operation test in wide temperaturerange for devices such as in‐vehicle devices.

Chucks for Power Devices

High voltage probe unit( ±3kV，‐60゜C to +300゜C )

Insulation liquid immersion trayto prevent electric discharge

High current probe unit( Maximum 200A pulse，‐60゜C to +300゜C )

+300゜C High Temperature Test, Antioxidant Environment

When evaluating GaN or SiC high power device, high temperature test at +300゜C is required. Our product with shield chamber makes it possible to do non‐oxidation probing with a low residual oxygen concentration of less than 100ppm by purging nitrogen gas into the chamber.

We offer chuck units specially designed for high power devices.

・ Room temperature chuck and high temperature chuck ( RT ~ +200゜C / +300゜C ),high/low temperature chuck ( ‐40゜C / ‐60゜C ~ +200゜C / +300゜C )

・ 5kV 40A pulse・ Thin wafer handling

Feed‐through Connectors and Measurement Cables

We offer measurement cables and feed‐through connectors that connect various high power device testers with our probe system.

・ Kelvin connection・ TAIKO process wafer

Keysight technologiesB1505A HV‐TRIAX

TFF / Keithley Instruments2600‐PCT / 4200‐PCTHV‐TRIAX

SHV connector & cable( ~ 10kV )

IWATSUCS‐3000 / 5000

It supports closed loop control by using oxygen meter inside of a chamber and mass flow controller ( MFC ).

18

Applications

Failure Analysis, Fail Die Marking

Mounting a laser cutter

Fragile In‐Circuit probing

Emission analysis・OBIRCH / TIVA

All of our probe systems can be mounted with laser micro cutter. Our probe system with laser micro cutter support applications such as point marking of FIB or SEM before observation, exfoliation of protection layer, cut metal circuit pattern etc., .Laser wavelength can be chosen from 1064 / 532 / 355 / 266 nm ( Multiple wavelength is possible )

Point marking Exfoliation of protection layer

Pattern cutting TFT panel cut

We offer options and accessories to support probing to fine pattern of submicron order that is required for failure analysis andtesting flat panel display. By combining with metallurgical microscope, positioner with submicron positioning precision, whisker probe for circuit probing, and active vibration isolating table, it can perform stable probing to a submicron hole whose protective film is exfoliated with a laser cutter without a damage to the circuit.

Active vibration isolating UnitActive vibration isolating Controller

metallurgical microscope Submicron precision positioner

Whisker probe (left) for In‐circuit probing*Standard probe on the right

Active vibration isolating table

Fail die marking ( Inker )

We offer probe stations that can be mounted on emission microscope and OBIRCH system.

It can mark defective die with the minimum dot size ranging fromminimum 125μmφ to maximum 2150μmφ.It can be mounted on our semi‐auto probers HSP‐100/150/200/300.

■ APPLICATIONS

19

Applications

Inker head Ink Cartridge

ModelHP50/R ( right hand model)HP50/L ( left hand model)

Travel range ( X,Y,Z ) 5 / 5 / 5 mm

Screw resolution ( X,Y,Z ) 0.5mm / rev.

Feature resolution 10μm

Mounting On/Off switching magnet base (standard)

Dimensions W36×D85×H56 mm

Weight approx. 200 grams

Positioners (Manipulators)

HP50 Compact positioner

Compact lead screw feed positioner.The special guide mechanism allows for stable contact on 50μm or larger PAD.

CorrespondenceProbe station

‐HMP‐400/600‐HMP‐800/1200‐HMP‐FPD series

HP65 Compact high‐accuracy positioner

Compact micrometer feed type high‐accuracy positioner.Easily accesses 10μm or larger circuit pattern or PAD without backlash.

Model HP65

Travel range ( X,Y,Z ) 6.5 / 6.5 / 6.5 mm








◆ Physical dimensions ( unit : mm)


Accessories

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Accessories

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Accessories


HP80 Compact positioner

General‐purpose positioner designed for low cost. ( HP80/L・R‐M )Stable contact on 70μm or larger PAD with minimal backlash.

ModelHP80/R ( right hand model)HP80/L ( left hand model)




Mounting[ ‐M ] Rubber magnet base[ ‐E ] On/Off switching magnet base

Dimensions[ ‐M ] W46×D74×H55 mm[ ‐E ] W41×D83×H69 mm

Weight[ ‐M ] approx. 160 grams [ ‐E ] approx. 240 grams



HP80/L‐MRubber magnet base model

HP80/R‐EOn/Off switching magnet base model

HP80/L・R‐M Rubber magnet base model

HP80/L・R‐E On/Off switching magnet base model


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HP120 High‐accuracy positioner

Model HP120








‐HMP‐400/600‐HMP‐800/1200‐HMP‐FPD series‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series

Precision lead screw feed high‐accuracy positioner.Stable contact on 10μm or larger circuit pattern or PAD without backlash.


HP130A High‐accuracy positioner

Fine‐pitch micrometer feed high‐accuracy positioner.Stable contact on internal devices of several micrometers and small PAD.

ModelHP130A / R ( right hand model)HP130A / L ( left hand model)





‐HMP‐800/1200‐HMP‐FPD series‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series

Mounting[ ‐M ] On/Off switching magnet base[ ‐V ] Vacuum base

Dimensions[ ‐M ] W71×D159×H124 mm[ ‐V ] W66×D159×H124 mm

Weight[ ‐M ] approx. 1230 grams [ ‐V ] approx. 1190 grams


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Accessories

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HP130S Sub‐micron accuracy positioner

ModelHP130S / R ( right hand model)HP130S / L ( left hand model)

Travel range ( X,Y,Z )13 / 13 / 13 mm ( Standard )6.5 / 6.5 / 6.5 mm ( HR option )

Screw resolution ( X,Y,Z ) 0.25mm / rev. ( Standard )0.1 mm / rev. ( HR option )

Feature resolution ＜0.5μm


‐HMP‐800/1200‐HMP‐FPD series‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series


Dimensions[ ‐M ] W71×D159×H124 mm[ ‐V ] W66×D159×H124 mm

Weight[ ‐M ] approx. 3200 grams [ ‐V ] approx. 3160 grams

Steel ultra high‐accuracy positioner.Contact on submicron internal devices is possible with excellent rigidity and feed accuracy.

HP130S/L・R‐M On/Off switching magnet base model

HP130S/L・R‐V Vacuum base model


HP130S/R‐MOn/Off switching magnet base model

HP130S/L‐VVacuum base model

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Accessories

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HP130-SC Positioner for shield chamber

Positioner specially designed for systems with shield chamber.

ModelHP130‐SC/R ( right hand model)HP130‐SC/L ( left hand model)






‐HMP‐810SC/1210SC‐HSP‐200SC/300SC

HAP300 Programmable positioner

ModelHAP300/R ( right hand model)HAP300/L ( left hand model)



Programmable resolution 0.1μm

X‐Y‐Z repeatability ±1.5μm

X‐Y‐Z accuracy±10μm ( uncompensated over 10 mm )±5μm ( with compensation)

X‐Y‐Z maximum speed 5mm / sec

Typical cycle time 0.5 sec ( X‐Y 500 μm , Z 30μm )

Mounting[ ‐M ] On/Off switching magnet base[ ‐V ] Vacuum base[ ‐B ] Mechanic bolt down




‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series

Stepping motor drive‐type positioner. With HiSOL's semi‐automaticprober control software, it enables fully programmable hands‐off probeplacement. It supports I‐V/C‐V and RF applications.

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Accessories


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Accessories

Accessories

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Probe & probe arm

DC Probe

Kelvin probe

Specialty probe

HP40Standard probe

HP40SSuspension probe

HCP40High‐performance probe

HCP40LPLow profileHigh‐performance probe

A74CJ1tip/Kelvin probe

A74‐KS1tip/Kelvin probe

A73‐TKTrue Kelvin probe

Coaxial ・ Triaxial probe

RF probe ・ Active probe Probe for High‐power devices

HCP40‐HVHigh‐voltage probe

HCP‐SHCHigh‐current probe

GGB Picoprobe( Active probe )

Various RF probe

HCP40UFree angle probe( Universal probe )

HCP40NMNon‐magnetic probe

A73‐ULHigh‐performance probefor Noise measurement

We offer optimal probe for your required measurement application from our abundant lineup.We also offer customized probes according to your required specification.

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Accessories

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Probes and Probe Arms

Model Maximum voltage（DC ±）*1

Frequency band（3dB）*1

Temperature range

Note

HP40 500VDC ～ 30 kHz ‐65℃～+300℃ noncoaxial

Support disposable probe

●

HP40S 500VDC ～ 30 kHz ‐65℃～+250℃ noncoaxial，soft contact●

HCP40 Coax 500V，Triax 1.2kVDC ～ 10 MHz 4k～+300℃ Ultra low current measurement(fA level)●

HCP40LP Coax 500V，Triax 1.2kVDC ～ 10 MHz 4k～+300℃ Ultra low current measurement(fA level)，low profile●

A74CJ 500VDC ～ 100 MHz 10k～+200℃ Ultra low signal I‐V・C‐Vmeasurement，1tip/kelvin△*2

A74KS 500VDC ～ 10 MHz 4k～+300℃ 1tip/Kelvin，I‐V・C‐Vmeasurement，support disposable probes●

A73TK 500VDC ～ 100 MHz 10k～+200℃ True kelvin，ultra low signal I‐V・C‐V，LCR－

HCP40‐HV Coax 10kV，Triax 3kVDC ～ 10 MHz 4k～+300℃ High voltage，support disposable probes●

HCP‐SHC 200VDC ～ 30 kHz 50k～+300℃ Supports maximum current of DC20A，200A pulse－

HCP40‐NM 500VDC ～ 10 MHz 4k～+300℃ Non‐magnetic，prober for applying magnetic fields●

A73‐UL 500VDC ～ 300 MHz 10k～+200℃ 1/f noise, RTN, TLP－

Typical specifications

Note *1 Frequency band and maximum voltage varies depending on a type of cable connected to a probe.*2 Only special coaxial semirigid probe at the tip is replaceable.

Replaceable Probe Tips （Disposable probes）

HiSOL’s probe tip lineup

Tungsten (W)Excels in electrical characteristics, elastic modulus, mechanical strength, and also cost effective. Tungsten is widely used probe material.Different from other probe materials, it can do shape machining at the tip with etching. It can do extra‐fine tip processing that machine cannot do. Also, there are varieties of tip shapes. Especially compatible with aluminum pad.

Tungsten with Au platingGold plated on the surface of tungsten probe. Special method is used for higher adhesive strength with tungsten.Low contact resistance against gold pad and copper pad. Excels in ohmic features. Non‐magnetic since Ni coat is not used in underlayer

25mm ( standard ) ・ 0.5mm

0.6 / 1.2 / 2.4 / 5 / 7 / 12 / 25

Straight or 45°bend


5 / 7 / 10 / 12.5 / 20 / 25


Paliney® 7

Palladium based noble metal alloy developed for probes. ( Pd 35 / Ag 30 / Pt 10 / Au 10 / Cu 14 / Zn1 % )Contact resistance is small and also stable. Very little surface oxidation in atmosphere and high temperature. Suitable for applying high current andcontinuous test application under high temperature. Need to be cautious when handling thinner probes since they get bend easier compare to tungsten probes. ( Tip radius of more than 20μm is recommended. )


5 / 7 / 10 / 12.5 / 20 / 25 / 50 / 100


Beryllium Copper （Be‐Cu）

Probe material is copper alloy that excels in electric character and elastic modulus. ( Cu 98 / Be 2 % )Smaller contact resistance compare to tungsten, and stable. Suitable for contacting to gold pad and copper pad. Damage to pads by scrubbingcan be reduced. Not recommended for continuous test under high temperature.


5 / 7 / 10 / 12.5 / 20 / 25


Paliney® 7 is a trademark of Deringer‐Ney

Overall length・shank diameter ( mm )

Tip radius ( μm )

Shape


Tip radius ( μm )

Shape


Tip radius ( μm )

Shape


Tip radius ( μm )

Shape

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Accessories

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Probes and Probe Arms

Tungsten Carbide ( TC )Highly rigid and abrasion‐resistant probe material. To utilize the characteristic, it can be used for scribe, exfoliation of oxide layer, cutting metal pattern, and touchdown sensor besides electrical measurement. Shank cannot be bent.

Whisker ProbeProbe with minuscule tip radius to contact internal circuit. Ultra thin tungsten wire is spliced at the tip of φ0.5mm nickel shank.Elasticity of tungsten wire has appropriate spring pressure. It reduces damage to circuit during probing.φ0.5mm shank can be bent or cut freely. Wire diameter is available in 127μm, 76μm, and 25μm.


5 / 7 / 10 / 12.5 / 20 / 25

Straight only

Overall length・shank diameter ( mm ) 34mm ・ 0.5mm

Wire diameter・Tip radius ( μm )Diameter 127μm ： 0.35 / 0.75 / 1Diameter 76μm ： 0.1 / 0.35 / 0.5Diameter 25μm ： 0.25 / 0.5 / 0.75

Shape Straight only ( Shank can be bent or cut )

Wire length ( mm ) 5mm

Replaceable Coaxial Probe Tip for A74CJ

Replaceable semirigid coaxial probe specially for A74CJ. Except about 2.5 mm of tips which the needle point is exposed, it has 50Ω coaxial geometry and excels in high frequency property. Material of the tip is tungsten ( W ). Various radius is available.

Probe conductor dia.・shield dia. 0.2mm ・ 0.86mm

Tip radius ( μm ) 0.5 / 1.5 / 5 / 10 / 12.5 / 15 / 20 / 25 / 35 / 50

Shape Low profile double‐bend

Probe Card・Probe Card Adaptor

Standard probe card adaptorfor 4.5” probe card

Probe card adaptor for circular probe card

Probe card adaptor for Shield chamber ( SC )

Adaptor for large diameter WLR probe card

Various Probe Card Adaptor

Probe Card for +300゜C High Temperature

We customize probe card adaptor according to your required specification.

We offer probe cards manufactured by Celadon Systems in USA. They support low noise and low leak measurement in thetemperature range of ‐65゜C ～ +350゜C.


Tip radius ( μm )

Shape

Accessories

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Various Wafer Chucks

Chuck ‐ Ambient

Standard Chucks （Coaxial）Model Wafer sizeHC20 2 inch

HC40 4 inchHC60 6 inch

HC80 8 inchHC120 12 inch

Triaxial ChucksModel Wafer sizeHTC20 2 inch

HTC40 4 inch

HTC60 6 inchHTC80 8 inch

HTC120 12 inch

General Purpose Hot chuck・Calefaction/Endothermic Chuck

High performance hot chuck and thermal chuck system. High performance hot chuck and thermal chuck system with advanced temperature control technique and low noise / low leakage technology.Because of their features of high‐speed temperature rise / fall, superior chuck top planarity and temperature uniformity, they can support high precision temperature characteristics test or wafer level reliability test.

High‐Performance Hot chuck, Thermal chuck

ModelHA40HA60HA80HA40HHA60HHA80H

Wafer size4 inch6 inch8 inch4 inch6 inch8 inch

Temperature Range

R.T. ～ +200゜C

R.T. ～ +300゜C

Heating method

Heater

Cooling method

N / Aor

Compressed air

HA40HA60HA80

4 inch6 inch8 inch

‐10゜C ～ +85゜C Peltier element Peltier element

Hot Chuck

Calefaction/Endothermic Chuck

We offer optimal chuck for your required measurement application from our abundant lineup.We also offer square chucks for glass substrate, chuck for pressure sensor, chuck for high frequency, chuck for power device, chuck for print circuit board etc.,. Please contact us for details.

RT chuck for wafer. Standard ( Coaxial ) model and triaxial model are available.

General purpose hot chuck and Calefaction/Endothermic Chucks. Standard ( Coaxial ) type and triaxial type available. In addition to the following chucks, we customize chuck according to your applications.

Standard chuck sizeφ 155mm ( 6 inch ) ，φ205mm ( 8 inch ) ，φ305mm ( 12inch )

Temperature Range Heating methodR.T. ～ +200℃ Heater

Cooling methodCompressed air

+20℃～ +200℃ HeaterR.T. ～ +300℃ Heater

Compressed air Compressed air

+20℃～ +300℃ Heater Compressed air ‐40℃～ +200℃ Heater Refrigerator & compressed air ‐60℃～ +200℃ Heater‐40℃～ +300℃ Heater

Refrigerator & compressed airRefrigerator & compressed air

‐60℃～ +300℃ Heater Refrigerator & compressed air‐40℃～ +200℃ Heater Fluorinated liquid circulation ‐65℃～ +200℃ Heater‐40℃～ +300℃ Heater

Fluorinated liquid circulation Fluorinated liquid circulation

‐65℃～ +300℃ Heater Fluorinated liquid circulation +30℃～ +400℃ Heater Compressed air

Model‐A‐AC‐AH‐ACH‐C‐CL‐CH‐CLH‐M‐ML‐MH‐MLH‐HH

Specifications

Ultra low noise, low leakage, and short settling model ”‐UL” series is also available.

Model Wafer size Temperature Range Heating method Cooling method

Accessories

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Microscopes, Optics, Cameras & Monitors

Shield Dark Boxes ( for open type manual probers )

We offer best suited observation optical systems such as stereomicroscope, high‐power metallurgical microscope unit, camera, display etc. according to your application.

Shield dark box for open type manual prober that is required for ultra low current measurement below pA* level.Hatchback door‐type and double swing door‐type are available. Inner walls of all the models are painted black and shading Level below 0.01 Lx is guaranteed. They also support opening / shutting of a door and linkage of the interlock function of a tester.

HEB5565

HDBB6070

HDBB8080H

HDBA6070H

HDBA6070H

*During triaxial connection

Bench‐top modelModel

HEB5565

Door type

Hatchback *1Dimensions（W x D x H mm）*3

560×670×670

Correspondence Probe station

HMP‐200 / 400

HEB6070 Hatchback *1 600×720×720 HMP‐400 / 600

HDBA6070 Hatchback *2 610×720×780 HMP‐400 / 600

HEBB6070 Double swing 600×700×1020 HMP‐400 / 600

HDBA8080 Hatchback *2 810×820×850 HMP‐800

HEBB8080 Double swing 810×820×1020 HMP‐800

HDBA9595 Hatchback *2 950×950×850 HMP‐1200

HEBB9595 Double swing 950×960×1020 HMP‐1200

Standalone model ( Without vibration isolation table )

HDBA6070H Hatchback *2 610×720×1510 HMP‐400 / 600

HEBB6070H Double swing 600×700×1750 HMP‐400 / 600

HDBA8080H Hatchback *2 810×820×1580 HMP‐800

HEBB8080H Double swing 810×820×1750 HMP‐800

HDBA9595H Hatchback *2 950×950×1580 HMP‐1200

HEBB9595H Double swing 950×960×1750 HMP‐1200

Model with air suspension typemicro‐vibration isolator

HSA850S Hatchback *2 850×850×1690 HMP‐800

HSB850S Double swing 860×870×1850 HMP‐800

HSA1000S Hatchback *2 1050×1050×1690 HMP‐1200

HSB1000S Double swing 1000×1000×1850 HMP‐1200

Options・ Add‐on cable duct enlargement with shading tube・ Add‐on connector panel・ Tester interlock linked with door switch・ Side desk

*1 Counterbalance, folding hatchback*2 Gas damper support hatchback*3 Dimensions when a door is closed. Protuberances are not included.

・ Shelf board inside of a box・Quakeproof fixing bracket・ Load dispersion board, etc.

Model Door type Dimensions（W x D x H mm）*3 Correspondence Probe station

Model Door type Dimensions（W x D x H mm）*3 Correspondence Probe station

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Measurement Cables, Feedthrough Connectors, Conversion adaptors

Other Accessories and Options

We offer best suited measurement cables, feedthrough connectors, and conversion adaptors according to your application.

Standard ConnectorsTriaxial, BNC, SMA, SMB, SSMC, QLA, Micro coax, N 50Ω,K ( 2.92mm ), V ( 1.85mm ), 1.0mm, HV‐Triaxial, SHV, MHV, Banana, FC for optical fiber

Laser Oscillator Simplified Blackout Curtain

Desktop Micro‐Vibration Isolator

Air Compressor ・ Vacuum pump

Forced‐air cooling system Water cooling system

Rubber vibration‐isolator Automatic level controlvibration‐isolator

Active vibration isolator ( Desktop type )

Silent compact air compressor

Compact vacuum pump

HiSOL,Inc. is a certified solution partner company of KEYSIGHT Technologies

System integration

B1500ASemiconductor Device Analyzer

B1500A WGFMUWaveform Generator /Fast Measurement Unit

B1505APower Device Analyzer / Curve Tracer

B2200A/01ALow Leakage Switch

B2900A seriesPrecision Source / Measure Unit ( SMU )

B2961A / 2962A6.5 digits Low Noise Power Source

E4980APrecision LCR Meter

E4990A20Hz ～ 10/20/30/50/120MHzImpedance Analyzer

E4991B1MHz ～ 500MHz/1GHz/3GHzImpedance Analyzer

ENA SeriesNetwork Analyzers

PNA FamilyMicrowave Network Analyzers

KEYSIGHT Technologies' Products ( Extracts selection )

We provide a complete solution by integrating HiSOL probe stations and KEYSIGHT Technologies' products.We offer optimized systems including a variety of measurement products, software, and cables according to your applications.

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Copyright (C) 2014 HiSOL.incCAT.No.2014-1623871-GPG-EN001

1-17-6 Ueno, Taito-ku Tokyo 110-0005 JAPANPhone：+81-3-3836-2800 FAX：+81-3-3836-2266

URL：http://www.HiSOL.jpThe content of this catalogue might be changed without a previous notice.

HiSOLProbe System Productshisol.jp/en/wp-content/uploads/2014/09/prober-english.pdf* Items with asterisk vary depending on system configuration. Manual Prober 4 8inch 12inch Model

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