High-Speed and Low-Power On-Chip Global Link Using Continuous-Time Linear Equalizer Yulei Zhang 1 , James F. Buckwalter 1 , and Chung-Kuan Cheng 2 1 Dept. of ECE, 2 Dept. of CSE, UC San Diego, La Jolla, CA 19 th Conference on Electrical Performance of Electronic Packaging and Systems Oct 25, 2010 Austin, USA
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High-Speed and Low-Power On-Chip Global Link Using Continuous-Time Linear Equalizer
High-Speed and Low-Power On-Chip Global Link Using Continuous-Time Linear Equalizer. Yulei Zhang 1 , James F. Buckwalter 1 , and Chung- Kuan Cheng 2 1 Dept. of ECE, 2 Dept. of CSE, UC San Diego, La Jolla, CA 19 th Conference on Electrical Performance of Electronic Packaging and Systems - PowerPoint PPT Presentation
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High-Speed and Low-Power On-Chip Global Link Using Continuous-Time Linear Equalizer
Yulei Zhang1, James F. Buckwalter1, and Chung-Kuan Cheng2
1Dept. of ECE, 2Dept. of CSE, UC San Diego, La Jolla, CA
19th Conference on Electrical Performance of Electronic Packaging and SystemsOct 25, 2010 Austin, USA
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Outline Introduction Equalized On-Chip Global Link
Overall structure Basic working principle
Driver Design for On-Chip Transmission-Line Guideline for tapered CML driver Driver design example
Continuous-Time Linear Equalizer (CTLE) Design CTLE modeling CTLE design example
Driver-Receiver Co-Design for Low Energy per Bit Methodology Overall link design example
Conclusion
Research Motivation Global interconnect planning becomes a challenge in ultra-
deep sub-macron (UDSM) process Performance gap between global wire and logic gates Conventional buffer insertion brings in larger extra power overhead
Uninterrupted wire configurations are used to tackle the on-chip global communication issues On-chip T-lines to reduce interconnect power Equalization to improve the bandwidth State-of-the-art[Kim2009]
2Gb/s/um, < 1pJ/b, signaling over 10mm global wire in 90nm
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Our Contributions Contributions
Build up a novel equalized on-chip T-line structure for global communication
Tapered CML driver + CTLE receiver Accurate small-signal modeling on CTLE receiver to improve the
optimization quality A design methodology to achieve driver-wire-receiver co-
optimization to reduce the total energy per bit Results of our design
20Gbps signaling over 10mm, 2.2um-pitch on-chip T-line 11ps/mm latency and 0.2pJ/b energy per bit in 45nm
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Equalized On-Chip Global Link
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Overall structure Tapered current-mode logic (CML) drivers Terminated differential on-chip T-line Continuous-time linear equalizer (CTLE) receiver Sense-amplifier based latch
Basic Working Principle Tapered CML Driver
Provide low-swing differential signals to driver T-line Tapered factor u, number of stages N, fan-out X, final stage current ISS,
Internal SQP (Sequential Quadratic Optimization) routine to generate best solution
Best set of design variables in terms of overall energy-per-bit
Change variables[ISS,RT,RL,RD,CD,Vod]
Cost-FunctionVeye/Power
Simulated Eye Diagrams
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Methodology A: driver/receiver separate design
Methodology B: driver/receiver co-design for low-power
Summary of Performance ComparisonMethodology Adriver/receiver separate design
Methodology Bdriver/receiver co-design for low-power
RS/ohm 47 148
RT/ohm 94 1100
RL/ohm 440 890
RD/ohm 110 1430
CD/fF 680 150
Vod/mV 60 58
Eye-Opening@CTLE/mV 91 113
Power Consumption/mW 8.1 3.8
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Note: driver/receiver co-design methodology uses much larger driver/termination resistance to reduce power, but will close the eye-opening at the driver output and wire-end. Final eye is recovered by fully utilizing CTLE.
Conclusion We propose a novel equalized on-chip global link
using CML driver and CTLE receiver Accurate modeling for CTLE is provided to achieve
<10% correlation error and will improve eye-opening optimization quality
Our design achieves 20Gbps signaling over 10mm, 2.2um-pitch on-chip T-line 11ps/mm latency and 0.2pJ/b energy