High Reliability T543 COTS Polymer Electrolytic, 2.5 – 63 VDC · electrolytic capacitor with a conductive polymer cathode ... Class Series Case Size Capacitance Code (pF) ... 12R
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• Extremely low ESR• High frequency capacitance retention• 100% accelerated steady state aging• 100% surge current tested• Taped and reeled per EIA 481• Volumetricallyefficienct• Surgeoptionsat25°Cand−55°C/+85°C• EIA standard case sizes• Halogen-free Epoxy/RoHS compliant
Overview
The KEMET Organic Capacitor (KO-CAP) is a solid electrolytic capacitor with a conductive polymer cathode capable of delivering very low ESR and improved capacitance retention at high frequencies. KO-CAP combines the low ESR of multilayer ceramic, the high capacitance of aluminum electrolytic, and the volumetric efficiencyoftantalumintoasinglesurfacemountpackage.Unlike liquid electrolyte-based capacitors, KO-CAP has a very long operational life and high ripple current capabilities.
The T543 COTS Polymer Electrolytic capacitor is an upscreened version of the industrial T520 KO-CAP. The T543's upscreeed option includes surge current testing of 10 cycles at+25°Cand10cyclesat−55°C/+85°C.Inadditionto100%Tin (Sn) terminations a tin-lead (SnPb) option is also available. The recommended application derating for these capacitors is 10 – 20%, rendering them suitable for application voltages from 2.25 to 50 VDC.
KEMET Organic Capacitor (KO-CAP®) – High Reliability
T543 COTS Polymer Electrolytic, 2.5 – 63 VDC
Applications
Typical applications include DC/DC converters, switch mode and point of load power supply, radar pulse capacitor and telecommunications(mobilephoneandbasestation).Othergeneralapplicationsincludedecouplingandfilteringinapplications requiring low ESR or a benign failure mode.
When extreme temperatures and humidity are taken into account, polymer tantalum capacitors offer a number of advantages over other types of capacitors, when used in extreme environments. KEMET continues to investigate the behavior of polymer tantalum capacitors in extreme conditions. If you have questions about using these capacitors in aspecificenvironmentorapplication,wesuggestyoucontactyourlocalrepresentativeorfieldapplicationengineertodiscussthespecificdetailsofyourapplication(see“ConsiderationsforPolymerCapacitorsinExtremeEnvironments”located at www.kemet.com/ExtremePolymerPaper).
RoHS compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder.
K-SIM
Foradetailedanalysisofspecificpartnumbers,pleasevisitksim.kemet.comtoaccessKEMET’sK-SIMsoftware.KEMETK-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels.
Ordering Information
T 543 D 156 K 035 A H E 100Capacitor
Class Series Case Size
Capacitance Code(pF)
Capacitance Tolerance
Rated Voltage (VDC)
Failure Rate/ Design
TerminationFinish Surge ESR Packaging
(C-Spec)
T = Tantalum
Polymer Tantalum
COTS
A,B, C, D, H, L, M, O, T, U, V, W, X, Y
First two digits representsignificantfigures.Thirddigitspecifiesnumberof
KO-CAP capacitors have an average failure rate of 0.5 %/1,000 hours at category voltage, UC, and category temperature, TC.ThesecapacitorsarequalifiedusingindustryteststandardsatUC and TC. The minimum test time (1,000 hours or 2,000 hours) is dependent on the product series.
The actual life expectancy of KO-CAP capacitors increases when application voltage, UA, and application temperature, TA, are lower than UC and TC. As a general guideline, when UA < 0.9 * UC and TA < 85°C, the life expectancy will typically exceed the useful lifetime of most hardware (> 10 years).
ThelifetimeofaKO-CAPcapacitorataspecificapplicationvoltageandtemperaturecanbemodeledusingtheequationsbelow.Afailureisdefinedaspassingenoughcurrenttoblowa1-ampfuse.Thecalculationisanestimationbasedonempirical results and is not a guarantee.
TAF = e[ ( )]Ea
k
1
273+TA
1
273+TC
TAF - acceleration factor due to temperature, unitlesswhere:
Ea - activation energy, 1.4 eVk - Boltzmann’s constant, 8.617E-5 eV/KTA - application temperature, °CTC - category temperature, °C
VAF = ( )UC
UA
n
VAF - acceleration factor due to voltage, unitlesswhere:
UC - category voltage, volt
UA - application voltage, volt
n - exponent, 16
AF = VAF * TAF
AF - acceleration factor, unitlesswhere:
TAF - accerlation factor due to temperature, unitless
VAF - acceleration factor due to voltage, unitless
* AFLifeUA ,TA= LifeUC ,TC
LifeUA, TA - guaranteed life application voltage and temperature, years
where:
AF - acceleration factor, unitless
LifeUC, TC - guaranteed life category voltage and temperature, years
Terms:Category voltage, UC : maximum recommended peak DC operating voltage for continuous operation at the category temperature, TC
Rated voltage, UR : maximum recommended peak DC operating voltage for continuous operation up to the rated temperature, TR
Category temperature, TC : maximum recommended operating temperature. Voltage derating may be required at TC
Rated temperature, TR : maximum recommended operating temperature without voltage derating. TR is equal to or lower than TC
Reliability Table 1 – Common temperature range classifications85°C (TR) / 85°C (TC)
SIDE VIEW ANODE (+) END VIEW BOTTOM VIEWCATHODE (-) END VIEW
W
S STermination cutout at KEMET's option,
either end
Glue pad shape/design at KEMET's option
Case Size Component Dimensions TypicalWeight
KEMET EIA L W H F ±0.1 ±(0.004)
S ±0.3 ±(0.012)
B ±0.15 (Ref)
±0.006
X (Ref)
P (Ref)
R (Ref)
T (Ref)
A (Min)
G (Ref)
E (Ref) (mg)
A 3216–18 3.2±0.2(0.126±0.008)
1.6±0.2(0.063
±0.008)1.6±0.2
(0.063±0.008)1.2
(0.047)0.8
(0.031)0.4
(0.016)0.10±0.10
(0.004±0.004)0.4
(0.016)0.4
(0.016)0.13
(0.005)1.2
(0.047)1.1
(0.043)1.3
(0.051) 53.17
B 3528–21 3.5±0.2(0.138±0.008)
2.8±0.2(0.110±0.008)
1.9±0.2 (0.075±0.008)
2.2 (0.087)
0.8 (0.031)
0.4 (0.016)
0.10±0.10 (0.004±0.004)
0.5 (0.020)
1.0 (0.039)
0.13 (0.005)
1.9 (0.075)
1.8 (0.071)
2.2 (0.087) 98.30
C 6032–28 6.0±0.3(0.236±0.012)
3.2±0.3(0.126±0.012)
2.5±0.3 (0.098±0.012)
2.2 (0.087)
1.3 (0.051)
0.5 (0.020)
0.10±0.10 (0.004±0.004)
0.9 (0.035)
1.0 (0.039)
0.13 (0.005)
3.1 (0.122)
2.8 (0.110)
2.4 (0.094) 193.46
D 7343–31 7.3±0.3(0.287±0.012)
4.3±0.3(0.169±0.012)
2.8±0.3(0.110±0.012)
2.4 (0.094)
1.3 (0.051)
0.5 (0.020)
0.10±0.10 (0.004±0.004)
0.9 (0.035)
1.0 (0.039)
0.13 (0.005)
3.8 (0.150)
3.5 (0.138)
3.5 (0.138) 352.36
H 7360–20 7.3±0.3(0.287±0.012)
6.0±0.3(0.236±0.012)
1.9±0.1(0.075±0.004)
4.1 (0.161)
1.3 (0.051) N/A 0.10±0.10
(0.004±0.004) N/A N/A 0.13 (0.005)
3.8 (0.150)
3.5 (0.138)
3.5 (0.138) 366.62
L 6032–19 6.0±0.3 (0.236±0.012)
3.2±0.2(0.110±0.008)
1.8±0.1(0.071±0.004)
2.2 (0.087)
1.3 (0.051) N/A 0.05
(0.002) N/A N/A 0.13 (0.005)
3.1 (0.122)
2.8 (0.110)
2.4 (0.094) No data
M 3528–15 3.5±0.2(0.138±0.008)
2.8±0.2(0.110±0.008)
1.4±0.1(0.055±0.004)
2.2 (0.087)
0.8 (0.031) N/A 0.05
(0.002) N/A N/A 0.13 (0.005)
1.9 (0.075)
1.8 (0.071)
2.2 (0.087) 97.99
O 7360-43 7.3±0.3 (0.287±0.012)
6.0±0.3 (0.236±0.012)
4.0±0.3 (0.157±0.012)
4.1 (0.161)
1.3 (0.051) N/A 0.10 ±0.10
(0.004±0.004) N/A N/A 3.8 (0.150)
3.5 (0.138)
3.5 (0.138) 696.00
T 3528–12 3.5±0.2(0.138±0.008)
2.8±0.2(0.110±0.008)
1.1±0.1(0.043±0.004)
2.2 (0.087)
0.8 (0.031) N/A 0.05
(0.002) N/A N/A 0.13 (0.005)
1.9 (0.075)
1.8 (0.071)
2.2 (0.087) 59.38
U 6032–15 6.0±0.3(0.236±0.012)
3.2±0.2(0.110±0.008)
1.4±0.1(0.055±0.004)
2.2 (0.087)
1.3 (0.051) N/A 0.05
(0.002) N/A N/A 0.13 (0.005)
3.1 (0.122)
2.8 (0.110)
2.4 (0.094) No data
V 7343–20 7.3±0.3(0.287±0.012)
4.3±0.3(0.169±0.012)
1.9±0.1 (0.075±0.004)
2.4 (0.094)
1.3 (0.051) N/A 0.05
(0.002) N/A N/A 0.13 (0.005)
3.8 (0.150)
3.5 (0.138)
3.5 (0.138) 262.90
W 7343–15 7.3±0.3(0.287±0.012)
4.3±0.3(0.169±0.012)
1.4±0.1 (0.055 ±0.004)
2.4 (0.094)
1.3 (0.051) N/A 0.05
(0.002) N/A N/A 0.13 (0.005)
3.8 (0.150)
3.5 (0.138)
3.5 (0.138) 222.94
X 7343–43 7.3±0.3(0.287±0.012)
4.3±0.3(0.169±0.012)
4.0±0.3(0.157±0.012)
2.4 (0.094)
1.3 (0.051)
0.5 (0.020)
0.10±0.10 (0.004±0.004)
1.7 (0.067)
1.0 (0.039)
0.13 (0.005)
3.8 (0.150)
3.5 (0.138)
3.5 (0.138) 588.16
Y 7343–40 7.3±0.3(0.287±0.012)
4.3±0.3(0.169±0.012)
3.8±0.2(0.150±0.008)
2.4 (0.094)
1.3 (0.051)
0.5 (0.020)
0.10±0.10 (0.004±0.004)
1.7 (0.067)
1.0 (0.039)
0.13 (0.005)
3.8 (0.150)
3.5 (0.138)
3.5 (0.138) 481.55
Notes: (Ref) – Dimensions provided for reference only. For low profile cases, no dimensions are provided for B, P or R because these cases do not have a bevel or a notch.These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative.
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
Rated Voltage
Rated Cap
Case Code/Case Size
KEMET Part Number
DC Leakage DF ESR
Maximum Allowable
Ripple Current
Maximum Operating
TempMSL
VDC at 105°C µF KEMET/EIA (See below for part options)
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
Rated Voltage
Rated Cap
Case Code/Case Size
KEMET Part Number
DC Leakage DF ESR
Maximum Allowable
Ripple Current
Maximum Operating
TempMSL
VDC at 105°C µF KEMET/EIA (See below for part options)
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
VDC at 105°C µF KEMET/EIA (See below for part options)
µA at VR, 25°C Maximum/ 5 Minutes
% at 25°C120 Hz
Maximum
mΩ at 25°C 100 kHz
Maximum
mA at 45°C 100 kHz °C Reflow Temp
≤ 260°C
RatedVoltage
RatedCapacitance
Case Code/Case Size KEMET Part Number DC Leakage DF ESR Maximum Allowable
Ripple CurrentMaximum
Operating Temp MSL
Table 1 – Ratings & Part Number Reference cont'd
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates capacitance tolerance.(2) To complete KEMET part number, H = Solder Plated, T = 100% Tin (Sn). Designates termination finish.(3) To complete KEMET part number, insert E = None, S = 10 cycles +25°C, W = 10 cycles −55°C +85°C. Designates surge current option.Refer to Ordering Information for additional detail.Part Numbers marked in blue font are "Under Development." Engineering samples available upon request.
Rated Voltage
Rated Cap
Case Code/Case Size
KEMET Part Number
DC Leakage DF ESR
Maximum Allowable
Ripple Current
Maximum Operating
TempMSL
VDC at 105°C µF KEMET/EIA (See below for part options)
Recommended Application VoltageKOCAP’saresolidstatecapacitorsthatdemonstratenowearoutmechanismwhenoperatedwithintheirrecommendedguidelines. WhiletheKOCAPcanbeoperatedatfullratedvoltage,mostcircuitdesignersseekaminimumlevelofassurance in long term reliability which should be demonstrated with data.A voltage derating can provide the desired level of demonstrated reliability based on industry accepted acceleration models. Since most applications do require long term reliability, KEMET recommends that designers consider a 10% voltage derating, according the graphic above, for the maximum steady state voltage.
Permissible AC ripple voltage and current are related to equivalent series resistance (ESR) and the power dissipation capabilities of the device. Permissible AC ripple voltage which may be applied is limited by two criteria: 1. The positive peak AC voltage plus the DC bias voltage,
if any, must not exceed the DC voltage rating of the capacitor.
2. The negative peak AC voltage in combination with bias voltage, if any, must not exceed the allowable limits specifiedforreversevoltage.SeetheReverseVoltagesection for allowable limits.
The maximum power dissipation by case size can be determined using the table at right. The maximum power dissipation rating stated in the table must be reduced with increasing environmental operating temperatures. Refer to the table below for temperature compensation requirements.
Temperature Compensation Multipliers for Maximum Ripple Current
T≤45°C 45°C<T≤85°C 85°C<T≤125°C1.00 0.70 0.25
T= Environmental Temperature
The maximum power dissipation rating must be reduced with increasing environmental operating temperatures. Refer to the Temperature Compensation Multiplier table for details.
Using the P max of the device, the maximum allowable rms ripple current or voltage may be determined.
I(max) = √P max/RE(max) = Z √P max/R
I = rms ripple current (amperes)E = rms ripple voltage (volts)P max = maximum power dissipation (watts)R = ESR at specified frequency (ohms)Z = Impedance at specified frequency (ohms)
Surge voltage is the maximum voltage (peak value) which may be applied to the capacitor.The surge voltage must not be applied for periodic charging and discharging in the course of normal operation and cannot be part of the application voltage.Surge voltage capability is demonstrated by application of 1,000cycles at relevant voltage at 105°C and 125°C.The parts are charged through a 33 Ohm resistor for 30 seconds and then discharged though a 33 Ohm resistor for each cycle.
Rated Voltage (V) Surge Voltage (V) Derated Voltage (V) Derated Surge Voltage (V)–55°C to 105°C Up to 125°C
Polymer electrolytic capacitors are polar devices and may be permanently damaged or destroyed if connected in the wrong polarity. These devices will withstand a small degree of transient voltage reversal for short periods as shown in the below table.
Temperature Permissible Transient Reverse Voltage25°C 15% of rated voltage55°C 10% of rated voltage85°C 5% of rated voltage
105°C 3% of rated voltage125°C* 1% of rated voltage
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).1 Height of these chips may create problems in wave soldering.2 Land pattern geometry is too small for silkscreen outline.
The KEMET families of surface mount capacitors are compatible with wave (single or dual), convection, IR, orvaporphasereflowtechniques.Preheatingofthesecomponents is recommended to avoid extreme thermal stress.KEMET'srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/J–STD–020D standard for moisture sensitivity testing. Thedevicescansafelywithstandamaximumofthreereflowpasses at these conditions.
Please note that although the X/7343–43 case size can withstandwavesoldering,thetallprofile(4.3mmmaximum)dictates care in wave process development.
Hand soldering should be performed with care due to the difficultyinprocesscontrol.Ifperformed,careshouldbetaken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflowoccurs.Oncereflowoccurs,theironshouldberemovedimmediately.“Wiping”theedgesofachipandheating the top surface is not recommended.
Duringtypicalreflowoperations,aslightdarkeningofthegold-colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change.
Peak Temperature (tP)20 seconds maximum 30 seconds maximum
Ramp-down Rate (TP to TL) 6°C/second maximum 6°C/second maximumTime 25°C to Peak
Temperature 6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Time
Tem
pera
ture
Tsmin
25
Tsmax
TL
TP Maximum Ramp Up Rate = 3°C/secondMaximum Ramp Down Rate = 6°C/second
Calculated shelf life in sealed bag:– 12 months from bag seal date in a storage environment of < 40°C and humidity < 90% RH– 24 months from bag seal date in a storage environment of < 30°C and humidity < 70% RH
If baking is required, refer to IPC/JEDEC J–STD–033 for bake procedure
KEMET’smoldedchipcapacitorfamiliesarepackagedin8and12mmplastictapeon7"and13"reelsinaccordancewithEIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system is compatible with all tape-fed automatic pick-and-place systems.
B1 is for tape feeder reference only, including draft concentric about B0.
T2
ØD1
ØD0
B1
S1
T1
E1
E2
P1
P2
EmbossmentFor cavity size,see Note 1 Table 4
[10 pitches cumulativetolerance on tape ±0.2 mm]
Table 4 – Embossed (Plastic) Carrier Tape DimensionsMetric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0 D1 Minimum
Note 1 E1 P0 P2 R Reference
Note 2S1 Minimum
Note 3 T Maximum T1 Maximum
8 mm 1.5+0.10/−0.0(0.059
+0.004/−0.0)
1.0 (0.039) 1.75 ±0.10
(0.069 ±0.004)4.0 ±0.10
(0.157 ±0.004)2.0 ±0.05
(0.079 ±0.002)
25.0 (0.984) 0.600
(0.024)0.600
(0.024)0.100
(0.004)12 mm 1.5
(0.059)30
(1.181)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch B1 Maximum Note 4 E2 Minimum F P1 T2 Maximum W Maximum A0, B0 & K0
8 mm Single (4 mm) 4.35 (0.171)
6.25 (0.246)
3.5 ±0.05 (0.138 ±0.002)
2.0 ±0.05 or 4.0 ±0.10(0.079 ±0.002 or 0.157 ±0.004)
2.5 (0.098)
8.3 (0.327)
Note 512 mm
Single (4 mm) and Double
(8 mm)
8.2 (0.323)
10.25 (0.404)
5.5 ±0.05 (0.217 ±0.002)
2.0 ±0.05 (0.079 ±0.002) or4.0 ±0.10 (0.157 ±0.004) or
8.0 ±0.10 (0.315 ±0.004)
4.6 (0.181)
12.3 (0.484)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 4).3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).4. B1 dimension is a reference dimension for tape feeder clearance only.5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3). (e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
1. Cover Tape Break Force: 1.0 kg minimum.2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624.
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