High Performance Thermal Interface Solutions Thermal Interface Pads for Power Electronics HITHERM™ HT-C3200 Thermal Interface Material HITHERM™ HT-C3200 Thermal Interface Material (TIM) is the first of its kind, compressible graphite sheet with thermal performance that matches traditional thermal grease without pump-out and dry-out failure modes. This breakthrough material was developed to address the reliability challenges of mission critical applications in extreme temperature environments and harsh duty cycles. Avoid Expensive Dispensing Equipment and Messy Rollers Eliminate Dry-Out and Pump-Out Failures ● Pad form factor ● Easily integrates into any size production line ● Eliminate re-torque process to prevent torque loss ● Unaffected by extreme temperatures ● Unlimited performance lifetime ● Eliminates grease clean-up and application processes required to replace failed modules Dispense-Free Manufacturing Reliable, Consistent Thermal Performance Residue-Free Repairs LIBERATE YOURSELF FROM GREASE HITHERM TM HT-C3200 Thermal Interface Materials
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High Performance Thermal Interface Solutions · High Performance Thermal Interface Solutions Thermal Interface Pads for Power Electronics HITHERM™ HT-C3200 Thermal Interface Material
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High Performance Thermal Interface SolutionsThermal Interface Pads for Power Electronics
HITHERM™ HT-C3200 Thermal Interface Material
HITHERM™ HT-C3200 Thermal Interface Material (TIM) is the first of its kind, compressible graphite sheet with thermal performance that matches traditional thermal grease without pump-out and dry-out failure modes.
This breakthrough material was developed to address the reliability challenges of mission critical applications in extreme temperature environments and harsh duty cycles.
Avoid Expensive Dispensing Equipment and Messy Rollers
Eliminate Dry-Outand Pump-Out Failures
● Pad form factor● Easily integrates into any size production line● Eliminate re-torque process to prevent torque loss
● Unaffected by extreme temperatures● Unlimited performance lifetime
● Eliminates grease clean-up and application processes required to replace failed modules