HIGH DENSITY DESIGN COMPONENT SOLUTIONS. Technology Challenges Market Drivers: Make it smaller Make it operate faster Make it more efficient Make.

HIGH DENSITY DESIGNCOMPONENT SOLUTIONS

Technology Challenges

Market Drivers: Make it smaller

Make it operate faster

Make it more efficient

Make it cheaper

Smaller Circuits Design:

1. Higher levels of circuit integration on silicon

2. Use of smaller foot print components

+ Components can be placed closer together

- Closer the components get to each other, the more unwanted signal noise coupling occurs SMT 0603 – 0402

CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS

Technology Challenge

Faster Speed of Operation:

1. More done in shorter amount of time

2. Higher complexity of functions & display

+ Smaller SMT Components Can Function at Higher Speeds.

- Distances between components and traces become significant factors in limiting performance and creates need for control of signal integrity.

MHz1200800600400

Technology Challenge

SMT 0603 – 0402 CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS

Less Power Consumed:

1. More features using less power

2. Thinner barrier silicon IC chips = lower voltage operation = less energy needed.

+ SMT Passive Components can function at lower voltages

- Lower voltage IC have reduced tolerance to spikes – transients. Higher level of transient and noise control is required = more passive components needed (capacitors and TVS devices)

- Lower ESR (lower loss) components needed CERAMIC CHIP CAPACITORS MLV – VARISTORS LOW ESR ALUMINUM & TANTALUM CAPACITORS

Technology Challenge

Reduced Cost of Products:1. Reduce size of PCB = less cost2. Use SMT = faster production and reduced cost

to build3. Reduce component count by component

integration4. Use smaller size components (less raw material =

less $$$)

+ Many SMT Passive Components cost less than leaded equivalents

+ Integrated (multiple element passives) reduce board space and place costs

CERAMIC CHIP CAPACITORS & ARRAYS CHIP RESISTORS & ARRAYS FERRITE CHIP BEADS / INDUCTORS PASSIVE ARRAYS (IPC)

Technology Challenge

SMT Component

Size

080506030402

0201

12mm3mm

NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS

NRC SERIES CHIP RESISTORS

NMC SERIESCERAMIC

CHIP CAPACITORS

0201 •

02

01

•

NIN/NIS SERIES CHIP INDUCTORS

Component Solution: Component Size Reduction

Get More ComponentsIn Less Space

High Density Design Solutions: Component Size Reduction and Integration

10 PIN 8 ELEMENTS

4 PIN2 ELEMENTS

NRSN SERIES RESISTOR ARAYSREPLACE WITH

2 OR 4 OR 8 ELEMENTSCHIP RESISTORS

Integrated Component Solution: Resistor Arrays

0.5mm (0.20”) ”) ~ 1.27mm (0.39”) pitch

103 103 103 103 Four ‘0603’ resistors (1.6mm X 0.6mm each)Typically 0.2~0.5mm space between parts (3.0mm X1.6mm total)Component size, spacing, land patterns and connection layout takes up valuable board space! Placing four components = $$$$

0.5mm (0.20”) ~ 1.27mm (0.39”) pitch

Quad flat pack or PLCC package IC

103

0.5mm (0.20”) pitch (Same or less pitch as IC!)

‘0804’ resistor arrays (2.0mm X 1.0mm total) NIC P/N: NRSNA4I4Far less board space used and short connection layout frees up valuable board space! Placing one component = ¼ the placement cost = $$$ saved!

Quad flat pack or PLCC package IC

NRSNA4I2

NRSNA4I4

SUPERIOR PERFORMANCE IN HIGH SPEED

CIRCUITS!

High Density Design Solutions: Component Size Reduction and Integration

Thick Film Resistor Arrays

Get More ComponentsIn Less Space

NCA SERIES CAPACITOR ARRAY

1 PART: 4 ELEMENTS1206 SIZE

4 ELEMENTSCERAMIC

CAPACITORS

REPLACE WITH

High Density Design Solutions: Component Size Reduction and Integration

Integrated Component Solution: Capacitor Arrays

1.6mm

4.7mm

C1

C2 C3

C4

C1 C2

C3 C4

3.2mm

1.6mm

4 Element capacitor array = ~$40/1000 = 4.0¢ each… 1 part = 4.0¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 2¢ for 1

part.Total cost of 4 ceramic chip capacitor elements = 6.0¢ (42% savings)

Total board area = 1.6mm X 3.2mm = 5.12mm² (32% smaller) Capacitor Array Benefits = Lower total cost and less board space used!

0603 Ceramic chip capacitor = ~$6/1000 = 0.6¢ each… 4 parts = 2.4¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates)

lets say it's 2¢ per part = 8¢ for 4 parts.

Total cost of 4 ceramic chip capacitor elements = 10.4¢

Total board area = 1.6mm X 4.7mm = 7.52mm²

High Density Design Solutions: Component Size Reduction and Integration

Integrated Component Solution: Capacitor Arrays

Get More ComponentsIn Less Space

NPA SERIES PASSIVE ARRAY

1 PART: 8 ELEMENTS1608 SIZE

8 ELEMENTS4 CAPACITORS 4 RESISTORS

REPLACE WITH

SUPERIOR PERFORMANCE IN HIGH SPEED

CIRCUITS!

High Density Design Solutions: Component Size Reduction and Integration

Integrated Component Solution: Passive Component Arrays

NPA SERIES - Four element R•C network array in EIA 1608 size package

Capacitance values from 10 ~ 180pF Resistive element values from 10 ohm ~ 1K-ohm.

R R R R

C C C C

CR

1608 size :0.16” long X 0.08” wide

4.0mm long X 2.1mm wide

High Density Design Solutions: Component Size Reduction and Integration

Integrated Component Solution: Passive Component Arrays