Heraeus Copper Pastes for Hybrid Electronic Circuits Heraeus Electronics offers a series of thick film pastes for production of hybrid microelectronic circuits where copper conductors will be utilized on alumina substrates. The products include copper conductors, through hole conductors, dielectrics, and overglazes which all can be fired in a nitrogen atmosphere furnace. Key Benefits: ■ Low cost base metal composition ■ Solderable ■ Wire bondable ■ ENIG plateable ■ Etchable ■ Compatible dielectric and overglaze materials
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Heraeus Copper Pastes for Hbrid Electronic Circuits€¦ · Heraeus Copper Pastes for Hbrid Electronic Circuits Heraeus Electronics offers a series of thick film pastes for production
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Heraeus Copper Pastes for Hybrid Electronic Circuits
Heraeus Electronics offers a series of thick film pastes for production of hybrid microelectronic circuits where copper conductors will be utilized on alumina substrates. The products include copper conductors, through hole conductors, dielectrics, and overglazes which all can be fired in a nitrogen atmosphere furnace.
Key Benefits: Low cost base metal composition Solderable Wire bondable ENIG plateable Etchable Compatible dielectric and overglaze materials
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.