HEB Mixers for Band 6 – CDR H. Merkel, S. Cherednichenko, P. Khosropanah, T. Ottosson, J. Baubert, E. Kollberg The Millimeter Wave Lab Dept. of Microelectronics.

HEB Mixers for Band 6 – CDR

H. Merkel, S. Cherednichenko,

P. Khosropanah, T. Ottosson, J. Baubert, E. Kollberg

The Millimeter Wave Lab

Dept. of Microelectronics

Introduction

• Deliverables:– 2 CQM , 04-03

– 4 FM, 04-03

– 4 FS, 04-04

• Comments:– 6 Low and 6 High built and integrated simultaneously

– Massive Collaboration between JPL and Chalmers

– 6 High mixer qualified by similarity

– All 6H documentation is (for the time being) generic

Collaboration

• JPL and Chalmers form a joint group to deliver mixers for 6L and 6H

• The mixer block will be a refined Chalmers design• The HEB is a NbN HEB made at Chalmers• Mixer blocks will be built at JPL• All integration except the lens integration will be

done at JPL• Most qualification testing is done by JPL• Acceptance testing is done by Chalmers

Collaboration 2Mech. production (mount) JPL

IF board production JPLboardcomponentsintegrationtesting

DC board production JPLboardcomponentsintegrationtesting

HEB devices CTH/MSPU

HEB qual.program CTH/MSPU

Lenses CTH

Lens AR coating CTH

Connectors to boards JPLwires / semirigidsconnectorsmounting

Assemblymech / electrical JPLdevice / lens CTH bonding needed at CTH

Qualification testingPerformance tests CTH characterizationHealth test CTH room tempFull performance test (incl. Beam pattern)CTHCooling cycles JPLVibration JPLBake-out JPLConfidence test CTHFunctional test one noise temperature at a single frequency

Procurement

Mech. production (mount) JPL

IF board production JPLboardcomponentsintegrationtesting

CD board production JPLboardcomponentsintegrationtesting

HEB devices Chalmers/MSPU

HEB qual.program Chalmers/MSPU

Lenses procured by Chalmers

Lens AR coating organized by Chalmers

Conncectors to boards JPLwires / semirigidsconnectorsmounting

Assemblymech / electrical JPLdevice / lens Chalmers

Acceptance testing ChalmersPerformance testsHealth testFull performance test (incl. Beam pattern)Cooling cyclesVibrationBake-out

Procurement

QM FM

Collaboration 3

• Metric interface drawings + Documentation generated by JPL– Internal (nonmetric) drawings generated within JPL

and will stay within JPL

• Hardware to be made by JPL– Process details stay within JPL, in case of reworking,

process details may become interfaces and be transferred to Chalmers.

• Assembly at Chalmers• Up to now: works extremely well

Requirements

Output power data on solid state LO – Solved for 6L, – News for 6H?– Expect measured data in 12-2002

1: Requirements and Interfaces

• Specifications:– Ready to be signed

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1: Requirements+Interfaces

• Interfaces are frozen• Environment definitions frozen• Design currently updated to meet all critical points

– Lens fixture solved– Board clamping solved– No alumina, more elastic TMM10A substrates

1: Requirements+Interfaces

• Experience with DM testing at SRON shows:– Common understanding of which parameters

are important for HEB characterization is required

– Rules how to handle HEB mixers (by SRON or ESA) must be elaborated T

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Documentation Status for Band 6

The Millimeter Wave Lab

Dept. of Microelectronics

Documentation Status

• BA ready for sign-off

• Spec 6L ready for sign-off

• BA with JPL requires SRON BA to be signed!

• Spec 6H generic issue,

• PID– completed, drawings by JPL ready

Documentation Status

• DVM ok

• Compliance matrix ok

• Failure modes/ single point failures:– More input needed if necessary and in which

form to be documented (more details in a few minutes)

7: Documentation

• 1.Is all of the above (requirements, interfaces, design and performance, qualification, verification, AIT, business commitments, planning) adequately documented conform the HIFI CDR data-package definition document – Yes.

• and placed under Configuration Control– Yes

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More preemptive answers...

The Millimeter Wave Lab

Dept. of Microelectronics

2: QM/FM Detail Design and Performance    

• FMECA– Loss of LO power, reduced critical current, reduced

critical temperature of the HEB, changed IF amplifier impedance can partially be cured by different biasing regime

– Failure of the ESD protection caps reduces protection but is not fatal to the device

– All other failure modes are non recoverable• Lens breaking, solder joints separate, cracks in PCB, electrical

component failure, bond wire breaking

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2: QM/FM Detail Design and Performance

• External drawings are metric

• Assembly/Manufacturing drawings will be nonmetric [JPL requirement]

• Some details are currently under investigation together with JPL

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2: QM/FM Detail Design and Performance

• Detail design under completion– IF board redesign for improved filtering still

under test– IF board RF properties ok now– Lens design [extension length] again in

question, this does not affect qualification– Lens holder: positive feedback from JPL– TMMA10e simply screwed to mixer block

3: AIV /QA planning and Implementation

• AI Procedures are redefined to fit into the work package split

• Qual program for the block JPL

• Acc. program for the block Chalmers

• QA program for the mixer Chalmers

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3: AIV /QA planning and Implementation

• 3.Have Test Plans and- (detail) Procedures been completed for all Functional-, Performance and Environmental tests.– yes

• GSE is improving, there are more resources now since two labs are involved– New vacuum chamber at Chalmers under

construction

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4: Product Assurance

• 1.Is the definition and planning of the PA activities technically adequate and consistent.– Yes.

• 2.Has a state of implementation readiness for the post-CDR phase been achieved.– PA is running on the films and on the HEB. – PA for the mixer blocks is done by JPL

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Programmatics for Band 6

The Millimeter Wave Lab

Dept. of Microelectronics

5: ”Programmatics”• 1.Are all deliverables funded,

– Yes

• has a supplier been identified and has the supplier accepted.– Yes [additional procurement loopholes thanks to JPL]

• 2.Does the planning include adequate margins for the following contingencies:

     Delays due to all critical items– There is no space for any delays

      Delays due to AIV contingencies– AIV works on the spot. Success-oriented design

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5: ”Programmatics”

• 3.Planning consistent.– Delivery dates are possible to be met in this

constellation

• 4.Long Lead Items– How to deal with CPPA for the 6H parts?– Maximum possible involvement of CPPA

even for 6H

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5: ”Programmatics”

• 5. Manpower/ Resources Planning– Group fusion yields sufficient manpower– No signed-off BA yet but it is ready for sign-

off.

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5: ”Programmatics”

• 6.Is the Manufacturing Readiness for QM and FM (tooling, facilities) progressing consistent with the project planning– Yes.

• 7. Is the maturing of QM and FM Assembly and Integration preparations, -tooling, -support equipment and -facilities consistent with the project planning.– Yes.T

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Planning

• Due to time pressure CQM/FM/FS programs run parallel

• No feedback between programs possible independently how they are laid out

Schedule

See Jonathan’s nice Schedule OH

Personnel

• Same old stuff... – 100% Sergey– 50% Pourya– 100% Therese– 15% Erik– 15% Gunnar– 40% Harald– 100% Vladimir

Open Issues for Band 6

The Millimeter Wave Lab

Dept. of Microelectronics

Open Issue

•CPPA delivery dates

Open Issues

• KIP/MIP?– According to p-CDR not applicable– According to the 1...5 CDR applicable– What to do with inspection points?

Open Issues

• Definition of IF subbands?– 1 GHz bands (as for bands 1...5)– Or 25% of 2.4GHz 0.6GHz subbands?

How to define the allowed IF ripple?

6: Critical Items, Key Issues, Recovery and Risk

• 1.Has the feasibility of all design-and performance critical items been established.– Yes.

• 2.Has the feasibility of all technology development critical items been established.– Yes

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6: Critical Items, Key Issues, Recovery and Risk

• 3.Have all technical-,planning- and resource risk elements been identified as Key Issues and have credible back-up or recovery scenarios been put forward consistent with the S/S, Unit and subunit planning– On some issues. There is no backup for any

design faults detected during CQM phase. The

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