Headquarters- Central Taiwan Science ParkNo. 15 Keyuan 1st Rd., Central Taiwan Science Park, Taichung City, 40763, Taiwan, R.O.C.Tel : +886-4-2460-8889Fax : +886-4-2460-8896E-mail : [email protected]
Northern Area BranchRm. B502J, 5F.-2, No. 185, Kewang Rd., Longtan Township,Taoyuan County 32556, Taiwan, R.O.C.E-mail :[email protected]
Chungkang BranchNo.2, Jian 8th Rd., Wuqi Dist., Taichung City 435,Taiwan,R.O.C.E-mail :[email protected]
China -Shenzhen OfficeRm. 1501, Shangmei Technology Building, No. 2009, Shahe West Road, Nanshan District, Shenzhen City, China.Tel : +86-755-2585-7795Fax : +86-755-2583-2003E-mail :[email protected]
China -Suzhou OfficeNo.13, Chun Hui Road, Suzhou Industrial Park, 215121,China.Tel : +86-512-8098-8800Fax : +86-512-6274-9000E-mail :[email protected]
Daxin Materials Corporation
0201
About DAXIN Research & Development
Best Solution Provider for Customized Products
Core Technologies and Product Development
Consistent Innovation & Intellectual Property Protection
Founded in 2006, DAXIN Materials Corporation started with the aim of being the Material Design House. Since we have always strived to deliver best solutions that meet our customers' needs, our corporation has constantly developed customized products from wet chemicals and functionalized materials to polymer solutions. With our expertise and capabilities related to material design, we have consistently offered innovative and value-added solutions for our customers. DAXIN Materials Corporation is now listed on the Taiwan Stock Exchange under ticker number 5234.
Culture
Vision
Mission
Annual Revenue ( Million NTD )
Daxin 5iintegrityinnovationintelligent integrationintercommunicationindividuals
To Be a Leading Company for Material Innovations
Best Solution Provider for Customized Products
To contribute to our customers’ success, we always keep close relationships with clients to design products as desired. Combining our strength in materials expertise and strong manufacturing ability, we aim to be the best solution provider worldwide.
All the innovations are the extension of fundamental science. From the basic photochemistry to color simulation, molecular simulation, dispersion science, surface chemistry, organic and inorganic hybrid materials design, monomer and polymer synthesis, Daxin links all these technologies to provide superior and customer-oriented products in different fields; including Liquid Crystal Display (LCD), OLED, Touch Panel (TP), and Semiconductor.
To defend our innovation and ensure the right for production, we are working to improve intellectual property protection and enforcement for our company in markets around the globe. Our patents include all ranges: from specific chemical formula, better solution to current technology, to the improvements of products. Until 2019, the approved patent license number was more than 235, the application number was more than 370. With intellectual property protection, it gives us exclusive right granted for invention and protects our corporate value in the market.
Research & Development 0403 About DAXIN
Foundation
Paid-in capital 1.03 billion NTD
Chairman Dr. Cheng-Yih Lin
President Jeremy, Tsung-Hsing Kuo
Mission To Be a Leading Company for Material Innovations
PhotochemistryElectrochemistry
Molecule Design &
Simulation
Instrument Analysis
Statistics&
Methodology Precision Manufacturing
Advanced Purification
Technologies
Nanodispersion Surface
Modification
Organic / Inorganic Hybrid Materials
Monomer & Polymer Synthesis
/ Formulation
Headquarters Central Taiwan Science Park
Employees
Major products
Polyimide wins “Gold Panel Awards 2010”
‧Specialty Chemicals for Display, Semiconductor, and Key Material ‧ Instrument Analysis Services
July 12th, 2006
360 (RD >50%)
One Stop Shopping
Customerized Products
Quick Responses and Services
Engineering Supports in Production Ramp-up
Cutting Edge Performance and Cost Effectiveness
Customers
2006
2007
2008
2009
2010
201 1
2012
2013
2014
2015
2016
2017
133
984
1,367
2,054
2,637
2,902
3,256
3,331
3,378
3,620
3,917
3,612
2018 4,413
2019 4,531
Semiconductor Materials
Laser Release Layer
Features
Specifications
Temporary bonding of ultra thin-glass or wafer to glass carrier has emerged as a viable method for various electronic device processing. Laser debonding enables the use of laser release layer (RL) that can withstand high temperatures above . The processed devices are finally debonded and separated from the carriers easily.
Semiconductor 0605 Semiconductor
Excellent thermal resistance and stability over 300° C
Easily stripped by laser
Applicable under various laser wavelength (308/355/532/1064nm) with high absorption
Optical alignment (Tunable IR absorption or transmittance)
Applications
300 °C
Display
Bonding
RL
0.1 mm glass
Ultra thin glasslaminated oncarrier glass
0.5 mm glass
0.1/0.1 mm ultra thin LCD
LCD process LaserDebond
Semiconductor
*Indirect /Direct Materials for FO,2.5D,3D IC
FOWLP / FOPLP 2.5D IC 3D IC
For exampleFor exampleRL RL
RL
Laser Debond& Cleaning
EMCEMC
RDL( PI / PBO)RDL( PI / PBO)
RDL( PI / PBO)
Face Up Laser Debond& Cleaning
EMCEMC
RDL( PI / PBO)
RDL( PI / PBO)RDL( PI / PBO)
RL
RL RL
For Fine-Pitch
Bonding Laser Debond& Cleaning
RDL( PI / PBO)RDL( PI / PBO)
Temporary Bonding Adhesive Photosensitive Dielectric / Passivation
Varnish-type photosensitive dielectrics for the advanced chip packaging (WLP/PLP) are designed, which could be spin or slit-coated into thin film on the substrate and is photosensitive, able to be patterned into multi-layer redistribution layer (RDL). It can also be applied as a stress buffer coating. Low curing temperature, excellent Cu adhesion and electric properties are achieved for the varying chip applications.
Temporary bonding adhesive (TBA) is used for die attach or wafer to wafer/glass/molding compound bonding process.TBA offers stable adhesion through subsequent physical or chemical processes. There's no thermal reflow issue during high temperature over-baking. After device processing the adhesives can be easily cleaned from the wafer/carrier.
Specifications
Features
Specifications
FeaturesDebonding capability with various laser
wavelength (308/345/355/532/1064nm)
Easy to be cleaned by thinner Low temperature curing
Excellent Cu adhesion
Low CTE
Good thermal resistance
Good mechanical properties High resolution
Good electrical properties (Dk/Df)
Excellent chemical resistance
Semiconductor 0807 Semiconductor
ApplicationsApplications
Multi-chip Fan-Out Package Fan-Out PoP
Varnish Tape
Varnish Tape
RDL first - Glass and EMC bonding
Chip first- Die/Package attach
Laser Debond& Cleaning
Laser Debond& Cleaning
EMC EMC
EMC
EMC EMC
EMCEMC
RL
RLRLRDL( PI / PBO) RDL( PI / PBO)
RDL( PI / PBO) RDL( PI / PBO)
RDL( PI / PBO)RDL( PI / PBO)
RDL( PI / PBO)
PIM-1
1086420
PIM-2
Toughness
Transparency
HeatResistance
ChemicalResistance
ThermalExpansion
PI varnish for TP, OLED, EPD Substrates
PI (Polyimide) varnish can be used as the flexible substrates, for various devices that need to endure the high-temperature post-processing. Firstly PI varnish is coated on the carrier and cured, then PI substrate can be laser lifted off or mechanical released from the carrier after the device processing.
Applications
Features
Specifications
High thermal resistance
Excellent mechanical properties
Good dimension stability
High chemical resistance
OLED Materials
CarrierCarrier
Making DeviceFlexible Device
Carrier
PI VarnishCoating andFollowed byBaking
Specifications
Si waferTPL
DieRDL
TPLDie
Spin Coating Wafer Dicing Fan-out Package
Temporary Protection Layer
Temporary Protection Layer is applicable in die singulation process, to protect device surface by spin-coating on the wafer, capable of avoiding die chipping or defects during wafer dicing and grinding. Complete removal of Temporary Protection Layer is achieved by wet cleaning after process.
Applications
09 Semiconductor OLED 10
Photosensitive Dielectric/Passivation
PBO dielectric layers can be used as the pixel defining layer (PDL) over the pixel electrode or the planarization layer (PLN) covering the TFTs in an organic light emitting diode display (OLED).Besides, due to its good adhesion ability to copper surface, it can also be used as a dielectric insulating layer or a flat layer above the copper circuit, qnd be applicable in the fields of micro-LED and semiconductors.
Applications
Features
Features
Specifications
Low water absorption
Low dielectric constant
Precision planarization capabilities
Excellent mechanical and thermal properties
High chemical resistance
New : UV-resistance
Good mechanical properties Young’s modulus 6.8 GPa
Good lamination applicability (OCA-free)
OLED 12
543210
Daxin's PBO
Ref.PIDielectricConstant
HeatResistance
WaterAbsorption
InsulationReliabilty
PhotoSpeed
ChemicalResistance
T %
Glass
Insulator InsulatorPoly-Si
Anode
Buffer
PLN
PDL
Gate
S D
Colorless Polyimide Varnish/Film
DAXIN’s colorless polyimide (CPI) varnish/film possesses superior transparency, mechanical strength, thermal stability, and recovery after bending. The adjustable CTE and young’s modulus let it adapt to the applications of foldable displays, such as foldable cover film, film for touch sensor, and substrate. Besides, we provide customization according to customers’ requirement.
Applications
Specifications
11 OLED
Specifications
Specifications
Flexible Hard Coating
Flexible hard coating can be applied to flexible displays, automotive dashboards, polarizer and relevant products as a protective layer. This protective layer endows final products with excellent hardness and transparency. In addition, no crack and substrate separation occur after bending.
Applications
FeaturesExcellent hardness performance (9H on glass)Foldability (Outward R=3 mm, Inward R=2 mm >200K times)Good adhesion, RA without delaminationVariable products for different film stacking
3 mm 1.5 mm
Hard CoatingHard CoatingSubstrateSubstrate
Outward Folding Inward Folding
Foldable Cover Film
Foldable cover film is developed as a cover layer for foldable devices. DAXIN’s colorless polyimide (CPI) film shows excellent transparency, high modulus, and low CTE. While combining with our flexible hard coating, the cover film possesses great surface hardness, as well as transparency and flexibility.
Applications
Features
High transmittance (T> 90%)
Bending radius < 3 mm
Surface hardness 4H~5H
Young’s modulus > 6 GPa
Coefficient of thermal expansion < 15 ppm/° C
13 OLED OLED 14
Flexible HC
crack
Normal HC
After bending test
Photo Spacer
Via adjusting electric field between two glass substrates, the arrangement of liquid crystal materials can be controlled to make LCD exhibit expected pictures. Photo Spacer acts as a key component in TFT LCD which is used to maintain the cell gap’s uniformity.
Applications
FeaturesHigh sensitivity
Good coatability
High elastic recovery ratio
Excellent mechanical properties
New:
High resolution photo spacer for fast response panel
Applicable for ultra-high LCD cell thick panel
PSA028(mask size: 20*20)
PSA032(mask size:20*20)
HPS23mask size:10*10)
Liguid Crystal
ITOPhotoSpacer
BlackMatrix
TFTGlass
GlassITO Pixel
High Resolution
Glass
Glass
TFT
G R
PS
Specifications
Black Matrix Resist
Black matrix is arranged in the form of stripes, grids or mosaics between color patterns of RGB in color filter for LCD panel. This product is designed for high light-shielding properties to increase the contrast ratio of LCD panel.
Applications
Features
Specifications
15 LCD
LCD Materials
High optical density High coating uniformity, high sensitivity, excellent adhesion, excellent developing performanceExcellent reliability in heat, light,and chemical resistance with good shelf-lifeNew: Black matrix resist for LCD panel with high resolution
LCD 16
PI Alignment Layer
Polyimide layer is used to controlled the liquid crystal orientation and the pre-tilt angle. Daxin TN and VA mode alignment layers make LCD panels perform well and provide wide process margin for LCD manufactures.
Applications
Features
TN-PI
Free image sticking
Rubbing mura/ particle free
Stable pretitle angle
Excellent reliability after high
temperature/ humidity
VA-PI
Image sticking free
High VHR and excellent reliability
Stable pretilt angle
Drop mura free
Specifications
3.0
0.1 0.3
DAXIMIDEGood PTA Stability
Ref.
0.70.5
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
5
0 12 18
5.5
6
6.5
7
7.5
8
Liquid Crystal
Liquid crystals are fluid phase of matter which possess orientational ordering. Hence, liquid crystals are anisotropic fluid and could be re-oriented along the direction of the applied electric field, thus controlling light to or not to pass through two-crossed polarizers.
Applications
FeaturesHigh stability to UV and heat
Wide operating temperature
Low threshold voltage and
low electrical power consumption
Fast response time, and image
sticking solution
Excellent contrast ratio and
good image quality
High △ n LC : Applicable for flexible
display and smart window
50
001 00 2003 00 4005 00 600
100
2m s
DLC-111DLC-117
T(%)
Time(ms )
Common Electrode
Pixel Electrode
AlignmentLayer
Color Filter
Polarizer
LiquidCrystal
Specifications
17 LCD LCD 18
High transparency
Excellent planarization ability
Good heat and chemical resistivity
Low UV transmittance, which
protect RGB from UV damage
High crosslink ratio
Thermal Overcoat
Thermal overcoat is applied to IPS-like panel and acts a transparent planarization layer on Color resists (RGB) and Black matrix (BM), protecting color filter and providing flat surface to ensure subsequent process uniformity.
Applications
Features
PI
ThermalOvercoat
Glass
Glass
TFT
G R
PS
Specifications
Cu/Mo Etchant
Cu Stripper
Cu ion Chelating Agent
Features
Features
Features
Coagulant
Hydrogen peroxide type is environmental friendly
Good stability for very high copper loading (> 10k ppm)
Good etching uniformity
Good taper profile after etching.
Non-Corrosive to Cu, Mo, Al, ITO and IGZO
Water compatible, favorable for post-clean process
Regenerable and environmental friendly
Low toxicity, no reproductive toxicity
High chelating performance
Strong aggregation
Easy operation
Completely removed
Suspension
Flocculation
Flocculation
Flocculation
19 LCD LCD 20
Photo Overcoat
Photo overcoat is applied in touch sensor a dielectric layer and a insulating layer. Photo overcoat
contains good properties of insulation, adhesion, chemical resistance and hardness.
Applications
FeaturesOptical properties: high transparency and
good color hue
Mechanical properties: good adhesion to
bare glass, ITO and metal substrates; good
hardness
Protective layer Dielectric layer Metal bridgeITO-Y ITO-X
Specifications
Electrical properties: excellent insulating properties
Chemical properties: excellent chemical resistance
Process window: easy to coat and high sensitivity
New: Low temperature photo overcoat is for on-cell or G/F
touch sensor ( post-bake at 120~150℃ )
Glass Substrate
OCR / OCA
(Glass / Plastic)Cover Lens
OCR(Optical clear resin) is an optical grade adhesive applied on laminated cover lens, touch
panels and LCD modules. OCR can improve visibility and contrast ratio by reducing the
reflection light between the interfaces in cover lens, touch panels or LCMs.
Applications
Features
High transmittance
Easy to rework
Excellent adhesion on cover lens, touch
panels and LCMs
Non-yellowing , low dosage
Fast cure, low dosage
New: High side cure efficiency for shadow area
Optical Clear Resin (Hybrid)
Black Light R% R%R%
Air gap
Black Light
Optical Clear Resin
OCRP-3 series
150~250 μmUV UV
OCRP-3 series
LCD LCD
Black Frame Un cured OCR Cured OCR
Specifications
Touch Panel Materials
21 Touch Panel Touch Panel 22
Green Materials
Developing lithium-ion batteries with high energy density is of critical importance to address the increasing
energy storage needs for the portable electronics and electric vehicles. Silicon acts as an alternative
anode material for LIB due to its high theoretical capacity. However, Si-based anodes also face significant
challenges of volume expansion upon lithium insertion in Si. Binders, which holds the active material
together, thus, maintains the integrity of the electrode during the battery operation. High energy density
and long cycle life have been achieved by the way of utilizing our special designed binder in combination
with Si-based anode materials.
Applications
High Performance Binder for Silicon based Anode Materials of Lithium ion Battery (LIB)
Features
Electrode integrity - volume expansion inhibition Binder performance - Cycling of coin cell
Better flexibility
Strong covalent bonding between silicon and carbon particles
Exceptional dispersing qualities
Excellent adhesion strength to Cu foil
Reduce the expansion rate
High capacity
Cu
-COOH group Conductive material Binder Active material(Si & Carbon)
Adhesion group Current Collector
HC 2
HC 2
HC 2
HC 2
A B C Dm n x y
Specifications
Black Bank White Bank
Black Bank
R G BSubstrate
Black Bank
White Bank
R G BSubstrate
White Bank
MircoLED Materials
Bank Materials
Black bank / white bank materials are used as the separation of LED chips for Micro LED displays.
Black bank with high optical density can increase the contrast. White bank with high reflectance
can increase the brightness. Bank materials are available based on the product designs.
Applications
Features FeaturesHigh optical density
High electrical resistance
Excellent weather resistance
High reflectance
High electrical resistance
Excellent weather resistance
Green Materials 2423 MircoLED Materials
Cycle 30th 100% Lithiation
64 % Expansion
Cycle 30th 100% Lithiation
64 % Expansion
Features Features
CBDA DNDA
Cyclobutane-1,2-3,4-tetracarboxylic dianhydride (CBDA) is an alicyclic dianhydride.
Based on our unique photochemical reaction, we can synthesize the core structure of cyclobutane
and the configuration of CBDA can be determined to be cis-trans-cis.
CBDA is widely used as a raw material for polyimide resins or polyamic acid resins because of its
high reactivity during polymerization. In the application of display materials, such as alignment films
for liquid-crystal-display devices, CBDA provides excellent electrical properties such as high VHR
(Voltage Holding Rate) and low RDC (residual DC Voltage Measurement).
Furthermore, polymers made of CBDA offer good transparency and excellence flexibility, and
therefore it is a good candidate for flexible substrate applications. Moreover, photodegradable
polyimide is also widely known as its other applications.
Decahydro-1,4:5,8-dimethanonaphthalene-2,3,6,7-tetracarboxylic dianhydride (DNDA) is an alicyclic
dianhydride. Based on our unique synthetic process, we can synthesize the core structure of
tetracyclododecane and the stereostructure of DNDA can be controlled well to get high purity as
single form.
DNDA can improve thermal stability and electrical properties of polyimide because of its highly rigid
structure. This unique properties make it be noticed in recent years.
Furthermore, non-aromatic structure made of DNDA offer good transparency, and therefore it is a
good candidate for flexible substrate applications.
Applications Application
Key Materials
25 Key Materiais Key Materiais 26
Organic Components/Outgas Analysis
High Mass
Polymers/Oligomers Monomers
AdditivesAdditivesSolvents
Low Mass
Cold trap-GC/MS
Direct to GC/MS
Py-GC/MSCold trap-GC/MS GC/MS;GC-FID
MPLC/HPLC+FC+NMRGC/MSGC-FID
Thermal decomposition
Reverse analysis
Mixed composition
Trace analysis
Rapid screening
Organic residue
SPMEAqueous phase
SPMEGaseous phase
(10mm )BubbleSi Wafer
Water Particle Metal Native oxideOrganic Contaminants
Fraction Collection
TPD-MSFor H O , CO , SO …2 2 2
General composition analysis
TempRamp to 250℃
@10℃ / min
Hold 30min Hold 30min(℃ )50℃ 50℃ 250℃
lon 1 8.00 H Olon 28.00 N or COlon 32.00 Olon 41 .00 Organic fraglon 44.00 CO
2
22
2
Instrument Analysis 2827 Instrument Analysis
Development and Improvement of Analytical Techniques and Testing Equipment
Identification of ChemicalComposition
Cold trap-GC/MS (Ex. Evolved Gas Analysis and Thermal Desorption Analysis)Development of testing method for the thermal expansion coefficient of transparent material filmDevelopment of technology on the rate of development of thin film materialModifications of variable temperature testing
Separation and purification of mixturesComposition identificationProduct failure mode analysisIdentification of impurities and source trackingProduct efficacy difference analysismaterial
Instrument Analysis
AnalyticalLab
‧Drop Shape Analyzer‧Microwave Oven‧Oxygen Bomb
‧TGA‧DSC‧UV-DSC‧TMA‧DMA ‧Thin Film
Thickness Measurement System
‧Universal Tensile Tester‧Rheometer
‧LCR Meter‧Zeta Potential Analyzer‧High Resistance Meter
‧SEM‧OM
‧Chromatography: GC, HPLC, IC, GPC‧Mass Spectrometry: GC-MS,ICP-MS‧Spectrum: FTIR, UV-Visible
Optical
Others
Thermal
ElectricalMechanical
Chemical
Micro-structure
Thermal Analysis
Physical parameter varies with temperature, time, and environment
TGA DSC TMA DMA
Weight change An endothermic or exothermic change
Dimension change The response to obtain phase angle and deformation data as applying a stress or strain the sample
‧Glass transition temperature ‧Melting temperature‧Crystallization temperature‧Endothermic or exothermic reaction
‧Thermal expansion coefficient‧Glass transition temperature ‧Melting temperature
‧Change with temperature while under dynamic stress
TA TGAModel: Q500Applications:1. Weight loss analysis2. Thermal stability analysis3. General composition analysis
TA TMAMode: Q400 EMApplications:1. CTE2. Strain & stress3. Creep analysis
‧Decomposition temperature (T )‧Composition information‧Thermal stability
d
TA DSCModel: Q200 & Q2000Applications:1. Phase transition temperature (T ,T ,T )2. Heat of reaction3. Specfic heat capacity4. Compatible with UV-light
m g c
29 Instrument Analysis