Head Movement Based Wireless Swtcng

PRESENTED BY:

M.RADHA06681A0431

CHRISTINE D’CRUZE06681A0410

T.BHASKER 06681A0406

M.KIRANKUMAR 06681A0436

 In the world there are many people who are physically challenged who cannot move and operate devices like switching of lights, fans, etc.

Even there are many people who are paralyzed or a dumb who cannot speak and ask for his needs like food, medicine, water etc.

So they are facing many difficulties in fulfilling of their basic needs

So in our project we have designed a “Head movement controlled device switching system for physically challenged”.

Now the person who is physically challenged can wear this device to head and with the simple head movement’s he can request the basic needs like water, food or medicine.

Using our project he can also control the electrical devices like light, fan etc with the help of head movements.

In this project in order to control the devices with head movements we are using MEMS sensor

We also used a voice circuit which speaks out the needs of the user.

So the difficulty of the physically challenged person will be decreased.

By using this, reduces even those difficulties which are being faced by the care taker of the person

1.Power supply regulator-7805

Hardware & software specifications

2.Resistors -10k,330ohms,100k,330k

3.Transistor- BC547 4. Electromagnetic Relay -12v,7 amp

5.PIC microcontroller-16F72 6. Interfacing voice chip with microcontroller-APR9600

7.MEMS Accelerometer based sensor

8.RF Transmitter & Receiver modules -433Mhz

9.Encoder-HT12E 10.Decoder-HT12D

11.Rectifier-DB107 12.Capacitors-10uf Capacitor-1000uf

Block diagram:

ADCMicro

controllerRelay

Regulated power supply

LED indicators

MEMS

Micro controller

Regulated power supply

RF receiver

Decoder Encoder

RF transmitter

Apr9600

voicecircuit

RF TRANSMITTER

RF RECEIVER

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through micro fabrication technology.

MEMS are also referred to as micro machines or Micro Systems Technology – MST. And also called as accelerometer.

Micro electro mechanical sensors form a class of sensors which we here loosely define as sensors which are sensitive in one way or another to mechanical properties and which are made by micromachining technology.

MEMS INNER PART

Play back and record options are managed by on chip circuitry

The APR9600 samples the incoming voice signals and stores the instantaneous voltage samples in non-volatile flash memory cells.

Total sound recording time can be varied from 32 seconds to 60 seconds by changing the value of a single resistor.

Each memory cell can support voltage ranges from 0 to 256 levels.

Microprocessor: Requires ‘external’ support hardwareE.g., External RAM, ROM, Peripherals.

Microcontroller:Very little external support hardware.Most RAM, ROM and peripherals on chip.“Computer on a chip”, or “System on chip” (SOC)

E.g., PIC = Peripheral Interface Controller

•

Harvard Architecture

CPU

8

Memory (Program &

Data)

CPU

121416

Memory(Data)

8

Memory (Program)

CCS ‘C’ COMPILER

EMBEDED ‘C’

PIC TOOL KIT

Features OF RF TRANSMITTER & RECEIVER:•Range in open space(Standard Conditions) : 100 Meters •RX Receiver Frequency : 433 MHz •RX Supply Current : 3.5 mA •RX IF Frequency : 1MHz •Low Power Consumption •Easy For Application •RX Operating Voltage : 5V •TX Frequency Range : 433.92 MHz•TX Supply Voltage : 3V ~ 6V•TX Out Put Power : 4 ~ 12 Dbw

PICs have two different types of program storage:

1.EPROM (Erasable Programmable Read Only Memory)

2. FLASH

The PIC Family- Speed: Instruction speed = 1/4 clock speed (4 MHz to 20 MHz)

Core: 14bit cores with 35 instructions: 12C67x,16Cxxx

Program memory:16F73 7192 (7k) 14bit instructions

Data memory: Ex: 16F877-368 Bytes (plus 256 Bytes of nonvolatile EEPROM)

Micro electro mechanical sensors form a class of sensors which we here loosely define as sensors which are sensitive in one way or another to mechanical properties and which are made by micromachining technology (disregarding the actual size of the sensors).

Same parallel wafer-fabrication process as semiconductor memories.

Keeps the prices low

Same mechanical positioning of R/W heads as disk drives

Data can be stored using higher density thin-film technology

MEMS ADVANTAGES

Entry costAccess time VolumeMassPower dissipationFailure rate Shock sensitivityIntegrate storage with computationComplete systems-on-a-chip integratingProcessing unit RAMNon-volatile storage