Hamburg, 07.05.2003 LAB S iliziu m L ab o r B onn SI Marcel Trimpl, Bonn University A DEPFET pixel-based Vertexdetector for TESLA 55. PRC -Meeting Hamburg, Mai 2003 M. Trimpl niversity of Bonn .Karagounis, R.Kohrs, H.Krüger, I.Peric, M.Schumacher, M.Trimpl, J.Ulrici, N.Wermes niversity of Mannheim . Fischer, M.Harter PI Munich, HLL .Andricek, G.Lutz, R.H.Richter, M.Schnecke-Radau PE Garching, HLL .Herrmann, G.Schaller, F.Schopper, L.Strüder, J.Treis NSensor GmbH, HLL .Heinzinger, P.Lechner, H.Soltau
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Hamburg, 07.05.2003 Marcel Trimpl, Bonn University A DEPFET pixel-based Vertexdetector for TESLA 55. PRC -MeetingHamburg, Mai 2003 M. Trimpl University.
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Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
A DEPFET pixel-based Vertexdetector for TESLA
55. PRC -Meeting Hamburg, Mai 2003
M. Trimpl
University of BonnM.Karagounis, R.Kohrs, H.Krüger, I.Peric, M.Schumacher, M.Trimpl, J.Ulrici, N.Wermes
• pixel size: 20-30 µm • close to IP, r = 15 mm (efficient c-tagging)• high spatial resolution: few µm• 5 barrels – stand alone tracking• thinned sensor: d = 50µm, ~0.1% X0
• overall: ~ 1GPixel
50µs readout time for module / detector
Required clock rate: up to 50MHz for TESLA @ Layer I
time structure
950 µs 199 ms 950 µs
2820 bunches
high e+e--background: 80 hits / (mm2 train)
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
CONTENT
Vertex Detection at TESLA
The DEPFET Principle
DEPFET pixels for TESLA
Present Status
- detector
- thinning
- Switcher (steering)
- CURO (readout) Summary
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
p+
p+ n+
rear contact
drain bulksource
p
sym
met
ry a
xis
n+
ninternal gate
top gate clear
n -
n+p+
DEPFET-Principle of Operation
FET-Transistor integrated in every pixel (first amplification) Electrons are collected in „internal gate“ and modulate the transistor-current Signal charge removed via clear contact
-
-
+
+
++
-
MIP
internal Gate
Potential distribution:
Drain
Source
Backcontact
[TeSCA-Simulation]
~1µm
50
µm
- -- ---
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
p+
p+ n+
rear contact
drain bulksource
p
sym
met
ry a
xis
n+
ninternal gate
top gate clear
n -
n+p+
DEPFET-Principle of Operation
FET-Transistor integrated in every pixel (first amplification) Electrons are collected in „internal gate“ and modulate the transistor-current Signal charge removed via clear contact
internal Gate
Potential distribution:
Drain
Source
Backcontact
[TeSCA-Simulation]
~1µm
50
µm
- -- ---
0V
+15V
0V
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
n x mpixel
IDRAIN
DEPFET- matrix
VGATE, OFF
off
off
on
off
VGATE, ON
gate
drain VCLEAR, OFF
off
off
reset
off
VCLEAR, ON
reset
output
0 suppression
VCLEAR-Control
• read pedestal current • reset pixel / clear internal gate (row wise)• read pixel-current at drain
Matrix Operation
Matrix-scheme:
64 x 64 matrix with 50 x 50 µm2 pixel designed for Biomedical Applications clock rate : 50 kHz achieved noise in matrix: ~100e-
(due to operation mode)
DEPFET-Hybrid:
Control-Chip:Switcher I
64x64 pixel DEPFET-Matrix(50x50µm2 pixel)
low noise Readout-Chip: CARLOS
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
achieved performance
2 4 6
0
1000
2000
3000
4000
5000
6000
Escape - Peak
K
K
# Z
ähle
r
Energie [keV]
Single-pixel spectra:
ENC = 4.8 +/- 0.1 e-
55Fe-spectra @ 45C
[J.Ulrici, Bonn]
Autoradiogram with 3H:
~ 10 mm
detection of Tritium 3H(5,6 keV mean energy)
spatial resolution (50x50 µm2 pixel):
~ 4.5µm (22 keV, 109Cd) ~ 6.5µm (6 keV, 55Fe)
~ 3.2 mm
Matrix-picture with 55Fe:
measured atroom temperature
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
CONTENT
Vertex Detection at TESLA
The DEPFET Principle
DEPFET pixels for TESLA
Present Status
- detector
- thinning
- Switcher (steering)
- CURO (readout) Summary
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
DEPFET-Pixels for TESLA
steering chips
readout chips
520 x 4000 pixelDEPFET-Matrix
(25 x 25 µm pixel)
readout chips
Layer I - Module:
attractive features for TESLA:
• small pixel size (20-30µm)
• low noise thin (50µm) S/N > 70 @ RT
- thin sensor (50µm) + frame 0.11% X0 / layer
• low power consumption little cooling !
- in active area : sensor + R/O chip or steering chip
- whole vtx-d (5 layers / pulsed mode ) :
sensor : 0.3W
steering: ~ 3-4 W
R/O chip: 1-2 W frame: ~300µm
sensor: ~50µm
whole vtx-d: ~5W
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
DEPFET-Pixels for TESLA
attractive features for TESLA:
• small pixel size (20-30µm)
• low noise thin (50µm) S/N > 70 @ RT
- thin sensor (50µm) + frame 0.11% X0 / layer
• low power consumption little cooling !
- in active area : sensor + R/O chip or steering chip
- whole vtx-d (5 layers / pulsed mode ) :
sensor : 0.3W
steering: ~ 3-4 W
R/O chip: 1-2 W
whole vtx-d: ~5W
perforated frame for reduced material
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
steps towards TESLA :
new DEPFET-sensor fabrication - smaller pixels (25µm) improved performance for TESLA
develop thinning of sensors -
fast (50 MHz) steering chip -
fast readout chip with 0 suppression -
(full size) prototype system
finished
first results
fabricated
prototype
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
CONTENT
Vertex Detection at TESLA
The DEPFET Principle
DEPFET pixels for TESLA
Present Status- detector
- thinning
- Switcher (steering)
- CURO (readout) Summary
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
new sensors for TESLA
from JFETs to MOSFETs less device variation (large sensors), linear transistors (small pixels) double metal process (large sensors) higher amplification (1nA/e-) fast and complete clear
b) wafer bonding and grinding/polishing of top wafer
a) oxidation and back side implant of top wafer
Handle <100> Wafer
Top Wafer
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
new steering chip
• AMS 0.8µm HV• versatile sequencing chip (internal sequencer flexible pattern)• high speed + high voltage range (20V)• drives 64 DEPFET-rows (can be daisy chained)• produced 12/2002
Switcher II:
[I.Peric (Bonn) / P.Fischer (Mannheim)]
4.6 mm
4.8
mm
Results:• power consumption: ~1W /channel• tested ok to 30MHz
1 0 1 1
U = 20V = 30 MHz
20ns
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
IBias
input output
sample
I In
CGate
Current based Readout
Storage phase: input and sample-switch closed : gate-capacitance of nmos charged ISTORE
Transfer phase: output switch closed : (done immediately after sampling) ISTORE is flowing out
Sampling phase: input and sample-switch opened : voltage at capacitance „unchanged“ current unchanged
I = I In + IBiasI = I In + IBias
How to store a current ??
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
CURO - Architecture
front end: automatic pedestal subtraction (double correlated sampling) - easy with currents -
analog currents buffered in FIFO
Hit-Logic performs 0 suppression and multiplexes hits to ADC (ADC only digitizes hits !)
CURO : CUrrent Read Out
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
Results - CURO I
TSMC 0.25µm, 5metal contains all blocks for a fast DEPFET R/O radiation tolerant layout rules with annular nmos produced 05/2002
CURO I:
analog part (current memory cell):• tested up to: 25MHz• differential non-linearity: 0.1 %• noise contribution to readout: < 39e-
digital part: works with desired speed (50MHz)
0 10 20 30 40 50 60 70
0
10
20
30
40
50
60
70
IBias
= 70µA
Measured linearityof memory cell
Iou
tpu
t [µ
A]
Iinput [µA]
crucial elements of readout concept work
4 mm
1.5
mm
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
Prototype System
Hybrid-PCB:
• steering chips for Gate and Reset (Switcher II) • 64x128 pixel DEPFET-Matrix• 128 channel R/O – Chip (CURO II) - submission scheduled: july 2003 - improved sampling speed : 50MHz - analog noise contribution : < 30 e-
- linearity well below 1%
PC
DEPFET -Matrix(25x25 µm)
Re
set
-Sw
i tc
he
r
CURO II
Gat
e-S
wi t
ch
er
Hybrid
Readout-PCB
ADC
DATA-RAM Controller
Sequencer Readout-PCB:
• ADC and RAM• communication between
Hybrid and PC
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
Summary
main DEPFET features
high S / N ~ 70, high spatial resolution (~2 µm, analog readout) thin (50 µm) low power (< 5W total, pixel inactive during charge collection) current based fast readout (50 MHz)
Hamburg, 07.05.2003
L ABSiliz ium Labor Bonn
S I
Marcel Trimpl, Bonn University
Outlook
2nd version of readout chip (CURO II): july 2003 study new DEPFET structures: summer 2003 system assembly: 2nd half of 2003 radiation hardness issues