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Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email: [email protected] (Other participants are listed inside)
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Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Dec 19, 2015

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Page 1: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Giga-Scale System-On-A-ChipInternational Center on System-on-a-Chip (ICSOC)

Jason CongUniversity of California, Los Angeles

Tel: 310-206-2775, Email: [email protected]

(Other participants are listed inside)

Page 2: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 2

Background: “Double Exponential” Growth of Design Complexity

• C1: complexity due to exponential increase of chip capacity – More devices– More power– Heterogeneous integration, ……

• C2: complexity due to exponential decrease of feature size – Interconnect delay– Coupling noise– EMI, ……

• Design Complexity C1 x C2

Page 3: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 3

Motivation: Productivity Gap

xxx

xxx

x 21%/Yr. Productivity growth rate

x

58%/Yr. Complexity growth rate

1

10

100

1,000

10,000

100,000

1,000,000

10,000,000

199810

100

1,000

10,000

100,000

1,000,000

10,000,000

100,000,000

Lo

gic

Tra

nsi

sto

rs/C

hip

(K

)

Tra

nsi

sto

r/S

taff

-Mo

nth

Chip Capacity and Designer Productivity

2003

Source: NTRS’97

Page 4: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 4

Project Summary

• Develop new design methodology to enable efficient giga-scale integration for system-on-a-chip (SOC) designs

• Project includes three major components

– SOC synthesis tools and methodologies

– SOC verification, test, and diagnosis

– SOC design driver – network processor

Page 5: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 5

Research Team by Institutions

US UCLA: Jason Cong UC Santa Barbara: Tim Cheng

Taiwan NTHU: Shi-Yu Huang, Tingting Hwang, J. K. Lee,

Youn-Long Lin, C. L. Liu, Cheng-Wen Wu, Allen Wu NCTU: Jing-Yang Jou

China Tsinghua Univ.: Jinian Bian, Xianlong Hong, Zeyi Wang,

Hongxi Xue Peking Univ.: Xu Cheng Zhejiang Univ.: Xiaolang Yan

Page 6: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 6

Current Research Team US

UCLA: Jason Cong UC Santa Barbara: Tim Cheng

Taiwan NTHU: Shi-Yu Huang, Tingting Hwang, J. K. Lee,

Youn-Long Lin, C. L. Liu, Cheng-Wen Wu, Allen Wu NCTU: Jing-Yang Jou

China Tsinghua Univ.: Jinian Bian, Xianlong Hong, Zeyi Wang,

Hongxi Xue Peking Univ.: Xu Cheng Zhejiang Univ.: Xiaolang Yan

Several new faculty members in the 7 institutions Guest members from National University of Singapore, Purdue

Univ., and UCLA (EE Dept)

Page 7: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 7

Thrust 1 -- SOC Synthesis Environment/Methodology(Led by Jason Cong)

Code Generation for Retargetable Compiler

and Assembler Generator

Design SpecVHDL/C

VHDL/CCo-Simulation

Design Partitioning

DSP Synthesis and

Optimization

FPGA Synthesis and Technology

Mapping

ASIC Synthesis

Interconnect-Driven High-level Synthesis

Synthesis for IP Reuse

Physical Synthesis for Full-Chip Assembly

Embedded Processors

DSPs Embedded FPGAs

Customized Logic

Page 8: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 8

ITRS’01 0.07um Tech 5.63 G Hz across-chip clock 800 mm2 (28.3mm x 28.3mm) IPEM BIWS estimations

Buffer size: 100x Driver/receiver size: 100x

On semi-global layer (tier 3) : Can travel up to 11.4 mm in

one cycle Need 5 clock cycles from

corner to corner

Interconnect Bottleneck in Nanometer Designs Challenge: Single-cycle full chip communication is no longer possibleChallenge: Single-cycle full chip communication is no longer possible

Not supported by the current CAD toolsetNot supported by the current CAD toolset

11.4 22.8 28.30

1 cycle

2 cycles

3 cycles

4 cycles

5 cycles

Page 9: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 9

Regular Distributed Register Architecture

Global Interconnect

LCC

Reg. file

LCC

Reg. file

LCC

Reg. file

LCC

Reg. file

LCC

Reg. file

LCC

Reg. file

FSMFSM

FSMFSM

FSMFSM

LocalComputationalCluster (LCC)

….

Register File

Wi

H i

Island

FSMADD

MUXMUL

Cluster with area constraint

Use register banks: Registers in each island are partitioned to k banks for 1 cycle, 2 cycle, … k

cycle interconnect communication in each island Highly regular

1 cycle

2 cycle

k cycle

Page 10: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 10

MCAS: Architectural Synthesis for Multi-Cycle Communication Using RDR Architecture

ICG

C program

Locations

Placement-driven rescheduling & rebinding

Placement-driven rescheduling & rebinding

Scheduling-driven placementScheduling-driven placement

CDFG generationCDFG generation

Register and port bindingRegister and port binding

Datapath & FSM generationDatapath & FSM generation

Floorplan constraints

Resource allocation& Functional unit binding

Resource allocation& Functional unit binding

RTL VHDL

Multi-cycle path constraints

CDFG

MC

AS

(Mu

lti-Cycle A

rchitectu

ral S

ynth

esis)

Page 11: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 11

MCAS flow vs. Synopsys Behavioral Compiler (on Virtex-II)

Synopsys Behavioral Compiler setting: default (optimizing latency) Average latency ratio of MCAS vs. BC: 69%

Latency Resource

Design Flow Cylces Reg ALU MULT fmax (MHz) LUTs Latency (ns) MCAS vs. BCSynopsys BC 25 28 5 8 95.87 877 260.78

MCAS 27 34 6 2 86.07 1477 313.69 120.29%Synopsys BC 29 36 7 8 63.02 1143 460.17

MCAS 14 35 5 8 140.31 1523 99.78 21.68%Synopsys BC 43 142 23 7 51.09 3256 841.60

MCAS 34 35 6 3 53.59 2561 634.44 75.39%Synopsys BC 29 44 8 14 52.13 2112 556.31

MCAS 23 42 6 8 71.95 2606 319.65 57.46%

pr

wang

mcm

honda

0

500

1000

1500

2000

2500

3000

3500

pr wang mcm honda

Synopsys BCMCAS

0. 00

100. 00

200. 00

300. 00

400. 00

500. 00

600. 00

700. 00

800. 00

900. 00

pr wang mcm honda

Synopsys BCMCAS

Page 12: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 12

Optimality Study of Large-Scale Circuit Placement

• Construction of Placement Example with Known Optimal (PEKO) [C. Chang et al, 2003]

? Construct instances with known

optimal using the characteristic of the original problem

First quantitative evaluation of the optimality of circuit placement problem

Existing placement algorithms can be 70% to 150% away from the optimal

Page 13: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 13

High Interest in the Community

• Three EE Times articles coverage– Placement tools criticized for hampering

IC designs [Feb’03]

– IC placement benchmarks needed, researchers say [April’03]

– FPGA placement performance [Nov03]

• More than 150 downloads from our website– Cadence, IBM, Intel, Magma, Mentor

Graphics, Synopsys, etc

– CMU, SUNY, UCB, UCSB, UCSD,

UIC, UMichgan, UWaterloo, etc • Used in every placement since its

publication http://ballade.cs.ucla.edu/~pubbench

Page 14: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 14

Floorplanning & Interconnect Planning

• Based on proposed Corner Block List (CBL) representation propose several Extended Corner Block List, ECBL, CCBL and SUB-CBL to speed up floorplanning and handle more complicate L/T shaped and rectilinear shaped blocks.

• Propose floorplanning algorithms with some geometric constraints, such as boundary, abutment, L/T shaped blocks.

• Propose integrated floorplanning and buffer planning algorithms with consideration of congestion .

• Using research results from UCLA on interconnect planning

• About 30 papers published in DAC, ICCAD, ISPD, ASPDAC, ISCAS and Transactions.

Page 15: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 15

P/G Network Analysis & Optimization

• Propose an Area Minimization of Power Distribution Network Using Efficient Nonlinear Programming Techniques (ICCAD2001, accepted by IEEE Trans. On CAD)

• Propose a decoupling capacitance optimization algorithm for Robust On-Chip Power Delivery (ASPDAC2004, ASICON2003)

Page 16: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 16

Parasitic R/L/C Etraction

• 3-D R/C Extraction using Boundary Element Method (BEM)• Quasi-Multiple Medium (QMM) BEM algorithms• Hierarchical Block BEM (HBBEM) technique

• Fast 3-D Inductance Extraction (FIE)

• Papers were published in ASPDAC, ASICON and IEEE Transaction on MTT

Page 17: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 17

Thrust 2 -- SOC Verification, Test, and Diagnosis(Led by Tim Cheng)

Verification and Testing

Enabling techniques for semi-formal functional verification

Integrated framework for simulation, vector generation

and model checking

Testing and diagnosisfor heterogeneous SOC

Self-testing using on-chip

programmable components

Self-testing for on-chip analog/mixed-signal components

New test techniques for deep-submicron embedded memories

Scalable constraint-solving techniques

Automatic/semi-automatic functional

vector generation from HDL code

Page 18: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Tim Cheng 18

Key Results - Verification

• Developed and released ATPG-based SAT solvers for circuits (Univ. of California, Santa Barbara)– Integrating structural ATPG and SAT techniques with new conflict learning– CSAT: Fast combinational solver (released on March 2003)

• Demonstrated 10-100X speedup over state-of-the-art SAT solvers on industrial test cases (reported by Intel and Calypto)

• Has been integrated into Intel’s FV verification system and a startup’s verification engine

• Publications: DATE2003 and DAC2003– Satori2: Fast sequential solver (released on Dec. 2003)

• Demonstrated 10X-200X speedup over a commercial, sequential ATPG engine on public benchmark circuits

• Publications: ICCAD2003, HLDVT2003 and ASPDAC2004

Page 19: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Tim Cheng 19

Key Results - Testing

A new Statistical Delay Testing and Diagnosis framework consisting of five major components (UCSB):

Defect Injection &Simulation

Statistical Timing Analysis Framework(Cell-based characterization)

Static Timing Analysis Dynamic Timing Simulator

Path Filtering

Critical Path Selection

DiagnosisATPG/Pattern Selection

• Selection/Generation of high quality tests for target paths Selection/Generation of high quality tests for target paths [ITC’01][DATE 2004][ITC’01][DATE 2004] Identifying tests that activate longer delay along the target pathIdentifying tests that activate longer delay along the target path

• Delay fault diagnosis based on statistical timing model Delay fault diagnosis based on statistical timing model [DATE’03, VTS’03, DAC’03][DATE’03, VTS’03, DAC’03] Ref: Krstic, Wang, Cheng,& Abadir, DATE’03–Best Paper Award in TestRef: Krstic, Wang, Cheng,& Abadir, DATE’03–Best Paper Award in Test

• Statistical timing analysis• Statistical critical path selection [DAC’02,ICCAD’02]

Selecting statistical long & true paths whose tests maximize detection of parametric failures

• Path coverage metric [ASPDAC’03] Estimating the quality of a path set

Page 20: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Tim Cheng 20

Key Results - Testing

• On-Chip Jitter Extraction for Bit-Error-Rate (BER) Testing of Multi-GHz Signal (UCSB)– Using on-chip, single-shot measurement unit to sample signal

periods for spectral analysis– Demonstrated, through simulation, accurate extraction of

multiple sinusoids and random jitter components for a 3GHz signal

– Publications: ASPDAC2004 and DATE2004

Page 21: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 21

Thrust 3 – Design Driver: Network Security Processor (Led by Prof. C. W. Wu & Xu Cheng)

• Applications: IPSec, SSL, VPN, etc.• Functionalities:

– Public key: RSA, ECC– Secret key: AES– Hashing (Message authentication): HMAC (SHA-1/MD5)– Truly random number generator (FIPS 140-1,140-2 compliant)

• Target technology: 0.18m or below• Clock rate: 200MHz or higher (internal)• 32-bit data and instruction word• 10Gbps (OC192)• Power: 1 to 10mW/MHz at 3V (LP to HP)• Die size: 50mm2

• On-chip bus: AMBA (Advanced Microcontroller Bus Architecture)

Page 22: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 22

Encryption Modules (PKEM)

• Public key encryption module– Operations:

• 32-bit word-based modular multiplication• Multiplication over GF(p) and GF(2m)

• An RSA cryptography engine with small area overhead and high speed• Scalable word-width• TSMC 0.35μm• 34K gates (1.7×1.8 mm2 )• 100MHz clock• Scalable key length• Throughput

– 512-bit key: 1.79Kbps/MHz– 1024-bit key: 470bps/MHz

Page 23: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 23

Encryption Modules (SKEM)

• Secret key encryption module– Operations:

• Matrix operations, manipulation

• AES cryptography

• 32-bit external interface

• 58K gates

• Over 200MHz clock

• Throughput: 2Gbps

• Support key length of 128/192/256 bits

Technology TSMC 0.25m CMOS

Package 128CQFP

Core Size 1,279 x 1,271 m2

Gate Count 63.4K

Max. Freq. 250MHz

Throughput

2.977 Gbps (128-bit key)

2.510 Gbps (196-bit key)

2.169 Gbps (256-bit key)

Page 24: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 24

International Collaborations

• Joint NSF/NSC workshop in Aug. 1999 on SOC (Hsin-Chu, Taiwan)

• First team preparation meeting for the proposed center in Jan. 2000 (Yokohama, Japan)

• 2nd planning meeting held in April 2000 (Hawaii, US)

• 3rd planning meeting in Aug. 2000 (Chengde, China)

• Proposal submitted to NSF in Aug. 2000 and funded in Dec. 2000

• Workshops

– March 30-31, 2001 in Taipei, Taiwan.

– June 23-24, 2001 in Los Angeles, USA

– August 31-September 1, 2001 in HangZhou, China

• March 28-29, 2002, National Tsing Hua University, Hsinchu, Taiwan

• August 20-21, 2002, Peking University, Beijing, China

• November 15-16, 2002, University of California, Santa Barbara

• March 27-29, 2003, National Taiwan University, Taipei, Taiwan

• December 19-21, 2003, Yunnan University, Kunming, China

Page 25: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 25

Publications

• 56 research publications up to this point

• 17 in top conferences/journals (DAC, ICCAD, ASPDAC, ITC, etc.) in the field

Page 26: Giga-Scale System-On-A-Chip International Center on System-on-a-Chip (ICSOC) Jason Cong University of California, Los Angeles Tel: 310-206-2775, Email:

Jason Cong 26

People & Education

• Many interactions among participants from different institutes

• Two new IEEE fellows:– Prof. Xiaolang Hong, Tsinghua Univ.

– Prof. Cheng-Wen Wu, National Tsing Hua Univ.

• Involved many young faculty members and researchers

• Trained an army of graduate students