5G: And Its Impact on Electronics Gerhard P. Fettweis Vodafone Chair Professor coordinator serial entrepreneur 1
5G: And Its Impact on Electronics
Gerhard P. Fettweis Vodafone Chair Professor coordinator
serial entrepreneur
1
Via Della Conciliazione
Gerhard Fe)weis Slide 2
Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473266.html Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473242.html
2005/4/4 2013/3/12
Wireless >2020 Outlook
100Tb/s
10 Tb/s
1 Tb/s
100Gb/s
10Gb/s
1Gb/s
100Mb/s
10Mb/s
1Mb/s
100Kb/s
10Kb/s
1995 2000 2005 2010 2015 2020 2025 2030
? 802.11ac/ad
802.11n 802.11ag
802.11
802.11b
GSM GPRS
HSPA
HSDPA LTE
3G R99 / EDGE
LTE Advanced
WLAN (10m)
Cellular (100m)
DFG SFB 912 (German Science Foundation Collaborative Research Center) In operations since July-1, 2011
Gerhard P. Fettweis (coordinator) Wolfgang Lehner (vice coordinator) Wolfgang Nagel (vice coordinator)
HIGHLY ADAPTIVE ENERGY-EFFICIENT COMPUTING
Collaborative Research Center 912: HAEC - Highly Adaptive Energy-Efficient Computing
The Communication Bottleneck of Parallel Computing
Parallelism =2 Comm. links =1
P=4 C=6
P=8 C=28
P=16 C=120
P=32 C=496
P=64 C=2016
Collaborative Research Center 912: HAEC - Highly Adaptive Energy-Efficient Computing
Highly Adaptive Energy-Efficient Computing Inter-Chip Communications
Slide 6
Radio Interconnect • on-chip/on-package antenna arrays • analog/digital beamsteering and
interference minimization • 100Gb/s • 220GHz carrier / 25GHz channel • 3D routing & flow management
Optical Interconnect • adaptive analog/digital circuits for e/o
transceiver • embedded polymer waveguide • packaging technologies
(e.g. 3D stacking of Si/III-V hybrids) • 90° coupling of laser
Collaborative Research Center 912: HAEC - Highly Adaptive Energy-Efficient Computing
Some 3D Details of the HAEC Box 7
Collaborative Research Center 912: HAEC - Highly Adaptive Energy-Efficient Computing
The Outlook: The Box in 2030+ Slide 8
Assume 64K processors per chip 2x 4x4 chip-stacks on board
128x chips stacked in 3D 4x boards in a box
in 10x10x10 cm3 (1 liter) 108 processors!
1636 proc.+ 14746 memory chips 104x performance of today!
HAEC Box
Center for Advancing Electronics Dresden
10
Comprehensive Approach
Materials & FuncQons
Devices & Circuits
InformaQon Processing
“More-‐Shots-‐on-‐Goal“
• Reconfigurable circuits
• Nanosensing
CNT transistors as radio frequency amplifiers
Organic electronics for information processing
Using DNA scaffolds to build advanced electronic devices
Enabling the integrated processing of chemical information
Managing heterogeneity in large-scale systems Reliable computing
with unreliable components
Reconfigurable from software to hardware interconnects Learning from nature‘s
information processing
11
A Future for Synchronous Clocks?
Wireless >2020 Outlook
100Tb/s
10 Tb/s
1 Tb/s
100Gb/s
10Gb/s
1Gb/s
100Mb/s
10Mb/s
1Mb/s
100Kb/s
10Kb/s
1995 2000 2005 2010 2015 2020 2025 2030
? 802.11ac/ad
802.11n 802.11ag
802.11
802.11b
GSM GPRS
HSPA
HSDPA LTE
3G R99 / EDGE
LTE Advanced
WLAN (10m)
Cellular (100m)
Via Della Conciliazione
Gerhard Fe)weis Slide 13
Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473266.html Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473242.html
4.4.2005 12.3.2013
Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-protesters-set-deadline-for-demands/
Via Della Conciliazione
Gerhard Fe)weis Slide 14
Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473266.html Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473242.html
4.4.2005 12.3.2013
Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-protesters-set-deadline-for-demands/
Via Della Conciliazione
Gerhard Fe)weis Slide 15
Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473266.html Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473242.html
4.4.2005 12.3.2013
Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-protesters-set-deadline-for-demands/
7 Billion Devices
2014
Via Della Conciliazione
Gerhard Fe)weis Slide 16
Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473266.html Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473242.html
4.4.2005 12.3.2013
Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-protesters-set-deadline-for-demands/
500 Billion Devices
2022
7 Billion Devices
2014
Via Della Conciliazione
Gerhard Fe)weis Slide 17
Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473266.html Source: h+p://www.spiegel.de/panorama/bild-‐889031-‐473242.html
4.4.2005 12.3.2013
Quelle: japantimes.co.jp/news/2014/09/30/asia-pacific/hong-kong-democracy-protesters-set-deadline-for-demands/
500 Billion Devices
2022
7 Billion Devices
2014
Throughput
but there is more ....
The Tactile Internet And Its Millisecond
The Tactile Internet
Gerhard Fe)weis Slide 19 12/16/14 h+p://ostsee-‐spezial.de/?p=148
Moving from 25ms RTT 1ms tomorrow
Gaming…
http://popular-pics.com/Cool_World_Record_LAN_Event_Computer_Pictures__5
http://gametaffy.com/imho-the-lan-party/
Gerhard Fe)weis Slide 20
Pedelec: Tactile Control
21
Free-Viewpoint Video
22
Ad-‐Hoc Mobile “Free-‐Viewpoint Video”
Tactile Internet Killer App: Free Viewpoint Video
12/16/14 Gerhard Fettweis Slide 23 h+p://baumgartnerfl.lima-‐city.de/stadion.html
10 cameras @ 100Hz frame rate 100Gb/s Latency @ <10ms
24
Reinventing “Latin Classes”
© MPI Saarbrücken
The Tactile Internet: Remote Controlled Humanoid Robots
Gerhard Fettweis h+p://images.gizmag.com/hero/8456_51207105642.jpg
h+p://www.dvice.com/archives/2011/05/kinect_controll_1.php
Human Touch
Gerhard Fe)weis Slide 26
The Tactile Internet The Manufacturing Revolution Ahead
Gerhard Fe)weis Slide 27
h+p://jerryrushing.net/wp-‐content/uploads/2012/04/roboQc_assembly_line1.jpg h+p://www.witchdoctor.co.nz/wp-‐content/uploads/2013/01/
robot-‐fabricaQon-‐staQon.jpg
Design Service: A Job Machine
28
Revolution Ahead: The Tactile Internet
Gerhard Fettweis
≤ 4G: Content Communications
Health & Care Traffic & Mobility Sports & Gym Edutainment Manufacturing Smart Grid …
5G: Steering & Control Communications
5G CHALLENGES
Gerhard Fettweis
5G – “Massive” Requirements
33
Sta
te o
f the
art
Massive throughput
Massive reduction in latency
Massive sensing
Massive resilience
Massive safety and security
Massive fractal heterogeneity
> 10Gbit/s per user < 1ms RTT > 10k sensors per cell 10x10 heterogenity
5G – “Massive” Requirements
34
Sta
te o
f the
art
Massive safety and security
5G
The Tactile
Internet
> 10Gbit/s per user < 1ms RTT > 10k sensors per cell
Massive low latency
Massive throughput
Massive sensing
Massive resilience
Massive fractal heterogenity
10x10 heterogeneity
35
5G L A B GERMANY
5G Research on four Tracks
Mobile edge cloud Silicon systems
Tactile Internet applications
Wireless
Members on Tracks
36
Wireless track
Silicon systems track
Mobile edge cloud track
Tactile Internet application track
Gerhard Fettweis
Eduard Jorswieck
Frank Ellinger
Christel Baier
Rene Schüffny
Frank Fitzek
Leon Urbas
Christof Fetzer Uwe Aßmann
Wolfgang Lehner
Ercan Altinsoy Thorsten Strufe
Klaus Janschek
Dirk Plettemeier
Wolfgang Nagel
Hermann Härtig Michael Schröter Silvia Santini
Team of 500+ Researchers !!!
Relevant Startups Generated by Team
37
Wireless track Silicon systems track Mobile edge cloud
track Tactile Internet
application track
Currently Connected Partners
38
Connected industry partners
39
5G Research Laboratory Sponsored by
Vodafone Chair Slide 40
Inhalt f ast a ctuators s ensors & t ransceivers
fast value chain
sales & service
systems, networks, software circuits
components semi-
conductors
fast network of
states Berlin
Brandenburg Mecklenburg Vorpommern
Saxony-Anhalt Saxony
Thuringia Baden-Württ. Lower Saxony
Bavaria
Coordinators: Frank Ellinger, (Gerhard Fettweis), TU Dresden Starting 2014, appox. €75M project size, 60+ partners
THE MILLISECOND
Gerhard Fettweis
1ms Impact
Hosted Computing (decider)
Network Config.
Manager (SON)
Terminal
Air Interface
Base StaZon & Compute Σ = 0.3 ms
Σ = 0.2 ms
Σ = 0.5 ms Latency Goals:
Software Ecosystem
1ms
Sensor Embedded Computing Receiver
100 µs
Actuator Embedded Computing Receiver Trans
mitter 100 µs
Trans mitter
Tomahawk2
Tommahawk2 (ISSCC 2014)
Gerhard Fe)weis Slide 44 „Atlas“ serial on-chip link (72GBit/s) local ADPLL clock generator
TSMC 65nm LP CMOS 6mm x 6mm Pads: 465 Gates: 10,2 Millionen SRAM: 750 kByte Cores: 20 processor elements Power 150mW typical
Tapeout: 04/2013 Dresden: 06/2013
Successor of Tomahawk1 (2007):
Winner of 2009 DAC/ISSCC Student Design Contest
Block Diagram
Tomahawk Architecture Framework
Control Flow
Data Flow
Dynamic out-of-order task dispatching
SW Application
task specification chronology
Power Management Architecture
Duo PE HPM 0 N0
ADPLL
AVS contr.
DVFS PLEVEL
HPM 1 N1
HPM 2 N2
VDD,0 VDD,1 VDD,2
Ref CLK
PMC
„slow“ AVS adaption
„fast“ DVFS switching f0 f1 f2
LUT 0 1 2
DVFS domain
External
DC/DC VDD,0 VDD,1 VDD,2
VDD,core
VDD,core
AO domain
VDD
VDD t
t
Fast DVFS Measurement Result
• Ultra fast DVFS level change of Duo-PE in <20ns
100MHz 200MHz 0.7V
1.0V
SDR Architectures for MIMO 3GPP-LTE/WiMAX Tomahawk2 Magali [6] Tomahawk [3]
Clocking and Power Management
GALS, local DVFS and AVS, power-gating GALS, local DFS Global clock
Scheduling Dynamic (flexible, energy adaptable) Static Dynamic (fixed
algorithm) Peak Performance 105 GOPS (3.6 GFLOPS) 37 GOPS 40 GOPS
Application for power measurements
4x4 MIMO 3GPP-LTE Rx baseband, 60 Mbit/s
4x2 MIMO, 2x2 MIMO Tx, MAC, 10.8 Mbit/s LTE/WiMAX
Power consumption 480 mW @ 1.15V 477 mW @ 1.2V 1.2W @ 1.3V NoC Throughput (per link) 80 Gbit/s 17 Gbit/s 5.47 Gbit/s Die size 36mm² 29.6 mm² 100 mm² Technology 65nm 65nm 130nm
[6] Clermidy, et al., A 477mW NoC-‐based digital baseband for MIMO 4G SDR, ISSCC Dig. Tech. Papers, pp. 278-‐279, 2010
150mW typical
RESILIENCE
Gerhard Fettweis
Carrier Grade Wireless: Use cases
Planning & OpZmizaZon Overview Slide 51
Traffic safety & efficiency
Availability (Qme)
Coverage/ Availability (space)
Latency Speed
> 99.999% < 1ms ≈100% < 500kmh
Industrial automaQon (MoQon control)
Telesurgery
> 99.999999% < 1ms ≈100% n/a
> 99.999% < 1ms n/a n/a
> 99.999% n/a ≈100% n/a Emergency
CommunicaQon
Others: Power Networks / Smart Grid, Real-‐Time Remote CompuQng, Platooning, ESP, Exoskeleton [1] [1] Fe+weis, G., "The TacQle Internet: ApplicaQons and Challenges," Vehicular Technology Magazine, IEEE , vol.9, no.1, pp.64,70, March 2014.
Serious Carrier Grade: 10-x via Diversity # indep. channels
1 2 3 4 5 6
outage 3% 10-3 3×10-5 10-6 2×10-8 7×10-10
Gerhard Fe)weis Slide 52
2007-2013: World’s Largest Operational LTE-Advanced CoMP Algorithm Testbed
Gerhard Fe)weis 53
© Google Earth
Hbf-‐Süd
Karstadt
Lennéplatz
Mi)e
Kongresszentrum
Fritz-‐Förster-‐Pl.
Strassburger Pl.
WTC
Hbf
54
Combining multiple Rayleigh-fading links
David Öhmann & Gerhard Fe)weis Slide 55
HANDOFF REVISITED
Gerhard Fettweis
router
Mobile Edge Cloud / Micro Cloud / Cloud
Gerhard Fe)weis Slide 57
Distributed Compute Within
Distributed Cloud
Data Center Steering & Control Center
Mobile Edge Cloud / Micro Cloud / Cloud
Gerhard Fe)weis Slide 58
Networking The Connnection
59
node
node
Single Path
60
node
node
Revolution Compute & Forward (Disintergration of packet)
61
node
node
Revolution Distributed Everything Storage/Computing/Networking/…
62
node
node
Cloud Evolution
Gerhard Fe)weis Slide 63
Single/Static Distributed/Static Distributed/Agile
CONCLUSIONS
Gerhard Fettweis
Telco Markets: A First Glimpse At Germany
65
care German ambulatory care ~€35B TAM €10B/a
manufacturing German industrial interconnect revenue ~€2B TAM €10B/a
events German event/concert/sport/stadium/congress TAM €10B/a
‘edutainement’ German TechniSat €.5B (home entertainment €11B) TAM €10B/a
mobility German Tollcollect €5B, TAM €10B/a
smart grid EU smart grid ICT market €27B, $47B by 2020 TAM €10B/a
x20 x10
=200x
=$20T
emerging e.g. drones, agriculture, and new gadgets TAM €10B/a
2G – 1992 Voice Messages
3G – 2002 + Data + Positioning
4G – 2012 + Video everything + 3D Graphics
5G – 2022 + Tactile Internet
Cellular Roadmap of USPs
Gerhard Fe)weis 66
$20T GDP boost
$200B Si chance
Related publications
[1] Fettweis, Gerhard, and Siavash Alamouti. “5G: Personal Mobile Internet beyond What Cellular Did to Telephony”
Communications Magazine, IEEE 52.2 (2014): 140-145.
[2] Fettweis, G. "The Tactile Internet: Applications and Challenges."
Vehicular Technology Magazine, IEEE 9.1 (2014): 64-70.
[3] Fettweis et al. „Positionspapier Das Taktile Internet“, VDE ITG
[4] Fettweis et al. „Tactile Internet“, ITU Tech Watch report, 2014,
http://www.itu.int/en/ITU-T/techwatch/Pages/tactile-internet.aspx
[4] HUAWEI. „5G: A Technology Vision“
68