GD 500 Adhesive Volume Sensor Technical Data Sheet e GD 500 sensor monitors the volume of liquid adhesive being applied in corrugated applications such as side-seam wheel-pot or extrusion gluing. e system consists of a digital controller, one or two dielectric sensors, a photocell, bracketing and cables, and is used in conjunction with the LogiComm® system as part of a total application and quality monitoring system. Key Features n Easy-to-use LCD display and keypad-user interface, available in multiple languages, simplifies setup and changeovers. n Dynamic calibration process automatically learns the desired adhesive profile over a user-specified number of products. n Adjustable thresholds for too much glue (squeeze-out) or too little glue (weak bond). n e LogiComm system displays, tracks and ejects or marks defective products. Specifications Sensor Technology Dielectric Triggering Thru LogiComm Encoder Signal Encoder repeater output LogiComm Maximum Sensing Width 40 mm (1.57 in.) Maximum Sensing Depth 64 mm (2.52 in.) Maximum Distance Between Sensors 350mm; distance must be exact * (tolerance ±1mm) Maximum Distance Between Trigger And Sensor 250mm Maximum Production Speed 300 m/min 75,000 pieces/hour Operating Temperature 0 to 40° C (32 to 104° F) Operating Voltage 24VDC via LogiComm control system Diagnostic LED Three LEDs 1) Turns green to indicate that the system is in run mode, and turns yellow during dynamic calibration 2) Turns green to indicate trigger signal 3) Turns yellow to indicate that the system is ready for setup Glue Image Graphical image of glue bead can be displayed on external PC (semi-live); update rate depending on production speed and product length. * software program available to set optimum distance (via external PC)