G2100 Maintenance Manual Basic Version V1

G2100 Maintenance Manual Basic Version

V1.0 (Maintenance of the basic version)

Prepared by Maintenance Documentation Support Team Date 2010-07-21

Reviewed by Date

Approved by Date

Huawei Technologies Co., Ltd.

All rights reserved

G2100 Maintenance Manual Basic Version V1.0 Internal

2010-7-26 Huawei confidential. No spreading without permission. Page 2 of 47

Revision Record

Date Revision Version

Revision Reason

Section Number

Change Description Author

2010-07-21 V1.0 Maintenance Documentation Support Team



Contents

1 PRODUCT INTRODUCTION................................................................................................................................. 5

1.1 PRODUCT VIEW................................................................................................................................................... 5

1.2 PRODUCT FEATURES........................................................................................................................................... 6

2 MAINTENANCE INSTRUCTIONS........................................................................................................................ 7

2.1 DOCUMENT APPLICATION .................................................................................................................................. 7

2.2 MAINTENANCE PRECAUTIONS............................................................................................................................ 7

2.3 OBTAINING MAINTENANCE INFORMATION........................................................................................................ 7

3 EXPLODED VIEW OF THE WHOLE UNIT ........................................................................................................ 8

4 LOCATION OF COMPONENTS ON THE MAIN BOARD............................................................................... 10

5 SOFTWARE UPGRADE ........................................................................................................................................ 11

5.1 PREPARATIONS BEFORE UPGRADE ................................................................................................................... 11

5.2 HARDWARE CONNECTION................................................................................................................................. 11

5.3 UPGRADE PROCEDURE ..................................................................................................................................... 11

5.4 EXCEPTION HANDLING..................................................................................................................................... 23

6 MAINTENANCE TOOLS ...................................................................................................................................... 24

7 DISASSEMBLY PROCEDURE ............................................................................................................................. 25

8 ASSEMBLY PROCEDURE.................................................................................................................................... 28

9 TROUBLESHOOTING FOR COMMON FAULTS............................................................................................. 31

9.1 PRINCIPLE SUMMARY ....................................................................................................................................... 31

9.2 PHONE CAN NOT BE POWERED ON .................................................................................................................... 32

9.2.1 Phone can not be powered on-High Current ........................................................................................ 32



9.2.2 Phone can not be powered on-Small Current ...................................................................................... 33

9.3 CHARGE FAILURE ............................................................................................................................................. 35

9.4 KEYPAD FAILURE.............................................................................................................................................. 36

9.5 DISPLAY FAILURE.............................................................................................................................................. 37

9.6 SPEAKER AND RECEIVER FAILURE................................................................................................................... 38

9.7 VOICE TRANSMITTING FAILURE ....................................................................................................................... 40

9.8 VIBRATION FAILURE ......................................................................................................................................... 40

9.9 THE SIM CARD CAN’T BE IDENTIFIED ............................................................................................................ 41

9.10 FM FAILURE...................................................................................................................................................... 41

9.11 SIGNAL FAILURE ............................................................................................................................................... 43

9.12 RF TRANSMITTING FAILURE ............................................................................................................................ 45

10 FUNCTIONAL TEST.............................................................................................................................................. 46

10.1 INTRODUCTION TO THE KEY AND ICONS .......................................................................................................... 46

10.2 MMI TEST......................................................................................................................................................... 46

10.3 VOICE CALL TEST............................................................................................................................................. 47



1 Product Introduction

1.1 Product View



1.2 Product Features

Item Specifications

Technical standard GSM

Operating frequency

GSM 900/1800/1900M

GSM 900M: 880～915 MHz UL / 925～960 MHz DL

GSM 1900M: 1850～1910MHz UL / 1930～1990MHz DL

GSM 1800M: 1710～1785MHz UL / 1805～1880MHz DL

External interfaces USB interface: Micro USB/Headset interface SIM card interface: standard 6 PIN SIM card interface

Battery

Type: Li

Capacity : 3.7V，700mAh

Typical talk time: 240 minutes Typical standby time: 200hours

LCD Type: 1.47＂TFT

Typical: 128×160 65K

Function Feature Support : MP3/FM

Temperature Operating: -10℃~+55℃ Storage: -40℃~+70℃

Humidity 5%~ 95%



2 Maintenance Instructions

2.1 Document Application This document provides instructions for the maintenance of Huawei products for the maintenance personnel in

senior authorized service sites. This manual is Huawei proprietary and is only permitted to be used by authorized

service sites or companies. Mistakes may be found in the document. If you have found any mistake or have any

suggestion, please contact our customer service personnel.

2.2 Maintenance Precautions Maintenance and adjustment can only be conducted by qualified technical personnel.

Always wear an antistatic wrist strap during the operation and conduct the maintenance in an antistatic room.

Ensure that all the components, screws, and insulators are properly installed after maintenance or adjustment.

Ensure that all the cables are properly connected.

Ensure that the welder job shall comply with the environmental requirements and is lead-free.

Electrostatic discharges are the major cause for the damage of sensitive electronic components. Each

service site should attach great importance to the electrostatic discharges and strictly observe the antistatic

measures described in this manual.

2.3 Obtaining Maintenance Information To obtain related product knowledge and maintenance information, please visit Huawei website at

http://www.huaweidevice.com/worldwide/technicaIndex.do



3 Exploded View of the Whole Unit BOM list match the exploded view below:

No. Name Description Quantity

1 Lens Protection Film 1

2 Lens 1

3 Speaker Net 1

12

3

4

56

7

8

9

10 11

12

13 14



No. Name Description Quantity

4 Top Cover Sponge 1

5 Top Cover 1

6 LCD Sponge 1

7 Keypad 1

8 LCD 1

9 PCBA 1

10 Speaker 1

11 Motor 1

12 Bottom Cover Sponge 1

13 Bottom Cover 1

14 Battery Cover 1



4 Location of Components on the Main Board

Z300 SAW Filter It damaged result: No signal; Weak signal; Can’t register network

U501 FLASH It damaged result: No signal; No powered on; Other failures etc

J700 Headset Connector It damaged result: No powered on; No charged

J300 RF Connector It damaged result: No signal; Weak signal; Can’t register network

音不搜网

U401 CPU It damaged result: No signal; No powered on; Other failures etc

X400 Crystal-32.768KHz It damaged result: No signal; No powered on

U302 RF Multi, Functional Component It damaged result: No signal; Weak signal; Can’t register network

X300 TCXO-26MHz It damaged result: No powered on; No signal

J500 IO Connector It damaged result: No powered on; No charged

Q500 Transistor-PNP It damaged result: No powered on; No charged

J600 SIM Socket It damaged result: Can’t identify SIM card

J501 Power Receptacle It damaged result: No powered on No charged

Q501 Dual Transistor-NPN It damaged result: No powered on; No charged



5 Software Upgrade

5.1 Preparations before Upgrade

Item Contents Remark

PC Windows 2000 /Windows XP system

Battery Upgrade environment

G2100 USB Data Cable BOM: 02450712

Upgrade File HUAWEI G2100

V100R001ENGC01B117SEC.fls

Mobile Studio-R Upgrade Software Tool

GH0G2200ML01ULC2MLVer1004

The version is only for your reference.

Download or use the latest version.

USB drive PL2303_Prolific_DriverInstaller_10311.exe Install automatically

Upgrade mode Upgrade by USB date cable Normal

5.2 Hardware connection

5.3 Upgrade Procedure 5.3.1 Install USB Driver

The G2100 will automatically install USB driver as it is connected to PC. As following figure:

PC

G2100 USB Cable



NOTE: If it can’t install automatically, please install USB driver by manually.

303_Prolific_DriverInstaller_10311.exe.

5.3.2 Install Upgrade Software Tools

（1） Double click to install Mobile Studio-R

MobileStudio-R.lnk



（2） Select “I accept…”, show as below figure:

（3） Input the information, click “Next ”,show as below figure:



（4） Click “Install”, show as below figure:

（5） Start installation, show as below figure:



5.3.3 Install Upgrade Project File

（1） Double click icon

GHULC2MLVer1004.exe.lnk

（2） Click “Install”



（3） Installation finish

5.3.4 Upgrade

（1） Double click Mobile Studio-R, select project.



（2） Select product type “ULC3”

（3） Select “Others OWM”, click “Init”.

（4） Click “Download Type and Files Settings”, select download type “Batch Upgrade”.



（5） Select upgrade files of safety project version, click “Apply”



（6） Connect the phone to the PC by USB cable, click “Start Download”. Insert the battery

according to prompt





（7） Start to download file



（8） Upgrade finish



Remark: The upgrade software supports multi-upgrade.

5.4 Exception Handling

Failure Type Solution

Start download failure Ensure Inserting battery time less than 2 minutes, and suggest inserting the

SIM card to try.

The phone cannot be

connected

Ensure that the phone is power on and the power of battery enough.

Ensure that the USB cable is normal and connect is stably.

Open the upgrade file failure Ensure that select the upgrade file is correctly.

Download is intermitted

abnormity

Ensure that the power of battery is enough.

An error is prompted during

the download Ensure that whether the pull out the USB cable when downloading.



6 Maintenance Tools

Tool Figure Description

Name: constant-temperature gun Application: It is used to heat the components.

Name: Solder the iron Application: It is used for Solder the during maintenance.

Name: DC power Application: It is used to supply power.

Name: Solder the fixture Application: It is used to fix the main board.

Name: lead-free Solder the wire Application: It is used for Solder.

Name: digital multimeter Application: It is used for measuring during maintenance.

Name: Tool kit Application: It is used to assembly and disassembly the PHONE.



7 Disassembly Procedure

4．Remove the battery.

2．Make sure the ESD antistatic wrist strap connect to the ground is normal.

3．Remove the battery cover by the arrow direction.

1．The G2100 disassemble procedure.



8. Screw off two screws. 7. Remove the front cover.

10. Remove the LCD. 9. Turn up and remove the mainboard.

6. Disassemble the front cover from the back cover. 5．Screw off three screws.



15. The disassembly procedure is completed.

12. Remove the motor. 11. Remove the speaker.

14. Remove the antenna. 13. Remove the function keys.



8 Assembly Procedure

4．Install the motor.

3．Install the keypad.

2．Install the antenna. 1．Make sure the ESD antistatic wrist strap connect to the ground is normal.



10. Assemble the front cover. 9. Install the front cover.

8. Install the two screws. 7. Install the mainboard to the back cover.

6. Plug the LCD. 5．Install the speaker.



14. Assembly procedure is completed.

12. Install the battery.

13. Install the battery cover.

11. Install the six screws.



9 Troubleshooting for Common Faults Before performing the following troubleshooting operations on the hardware, ensure that the software on the PHONE is in good condition and is restored to default settings.

9.1 Principle Summary

The G2100 phone develops basing on INFINEON ULC3, integrates Baseband、RF module、Power Management(PM) system. It mostly consists of baseband、RF and PM. The part of baseband is divided into RF signal disposal and intelligent interface, the part of RF achieves among phone and base station communications, the power management supports whole power supply for phone.

The baseband includes power management 、clock、MCU processor、FLASH、electroacoustic components、vibration、SIM card 、LCD、keypad、FM etc. The PM module controls power input and output. The RF module is divided into receiving channel and transmitting channel, it includes LO、receiver、transmitter、antenna components etc.

Principle Diagram



9.2 Phone can not be powered on

9.2.1 Phone can not be powered on-High Current

Analysis：The current is above 1A as power supply by DC-power. Short circuit of the VBAT line

causes high current usually. (Reference Figure 1)



9.2.2 Phone can not be powered on-Small Current

Analysis：The current is among 10mA-400mA scope as power supply by DC-power. The software or

FLASH damaged cause the failure usually. (Reference Figure 1)

J501 Pin3 (VBAT)

Q500

U302 U501 FLASH

U401 CPU

VDDTDC/VDDXO Test Point C303

VDD1V8/VRF1 Test Point L401

VBAT≈3.05V-5.5V VDDTRX=1.4V VRF1=1.8V VRF2=2.5V VDD1V8=1.8V VDDTDC=1.3V VDDXO=1.3V VRCORE=1.2V

VRCORE Test Point C409

VRF2 Test Point C302

Figure 1

J500Pin1 (VCHG)

U302-VBAT Test Point C324

VDDTRX Test Point C301





9.3 Charge Failure

Analysis: The IO Connector damaged causes the failure usually. (Reference Figure 2)

Charge Fault

Measure J500 Pin1 whether voltage is

5V?

Insert charger

Replace J500

Measure R500 whether resistance is

0?Replace R500

Measure Q500 Pin1 and Pin4 whether

voltage is different?

Replace Q500 or Q501

Replace U401

No

Yes

No

Yes

No

Yes



9.4 Keypad Failure

Analysis: The DOME of keypad damaged causes the failure usually.

J501 Pin3 (VBAT)

Q500 Pin4

U401 CPU

VBAT≈3.05V-5.5V VCHG≈5.0V

Figure 2

J500Pin1 (VCHG)

Q501

R500 R=0Ω

Q500Pin1



9.5 Display Failure

Analysis: The LCD module damaged causes the failure usually.



9.6 Speaker and Receiver Failure

Analysis: Above all, should restore all setting. (Reference Figure 3)



C706C707

Figure 3

L705 R≈0Ω

L703 L709 L707 L708

L706 R≈0Ω

LB706 R≈0Ω

LB705 R≈0Ω

R607 R≈4.6KΩ

J600 SIM card socket



9.7 Voice transmitting Failure

(Reference Figure 3)

9.8 Vibration Failure



9.9 The SIM Card can’t Be Identified


9.10 FM Failure




Figure 4

Q700 FM-LNA

J700Headset socket

J700Pin2

J700Pin1



9.11 Signal Failure

Analysis：Above all, check RF parameter whether is correct, the wrong RF parameter can cause

the failure usually. (Reference Figure 5)



U302Multi-function IC

U401 CPU

VDD1V8/VRF1 Test Point L401

VBAT≈3.05V-5.5V VRF1=1.8V VRF2=2.5V

VRF2 Test Point C302

Figure 5

U302-VBATTest Point C324

J300

Z300RX SAW Filter

X300 TCXO



9.12 RF Transmitting Failure

Analysis：Above all, check RF parameter whether is correct. The U302 cause the failure usually.




10 Functional Test

10.1 Introduction to the Key and icons

10.2 MMI Test Insert the SIM card. Enter MMI test command *2846570+Down to access the MMI keypad binding combination test mode.

No. Item Procedure

Contents Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.)

1 SIM Card Test 1

Whether the SIM card is identified

Enter the test command to access the SIM card test. If the SIM card is identified, the "SIM card test succeeded" is displayed. Otherwise, the "SIM card test failed" is displayed.

2 LCD Test 2 White screen Press the Send key and the LCD displays the white screen, and LCD Test display in middle.

Right Soft Key

Right Key

End Key

Down Key

Up Key

Send Key

Left Soft Key

Left Key

OK Key



No. Item Procedure

Contents Method and phenomenon (Take the new device as a standard. Press the Send key to enter the next procedure.)

3 Black screen

Press the Send key and the LCD displays the dark screen.

4 multicolor stripe

Press the Send key and the LCD displays the color panel grids.

5 Dot Press the Send key and the LCD displays the black and white dots.

6 Black and white blocks

Press the Send key and the LCD displays a black block overlapped with a white block. (Note: There is a white block amid the black block.)

7 Black and white blocks

Press the Send key and the LCD displays a white block overlapped with a black block. (Note: There is a black block amid the white block.)

3 LED and motor test 8 LED and

motor Press the Send key. Then all the keypad LEDs are on and the motor vibrates.

4 Key test 10 Keypad

Press the Send key to display the keypad diagram. When you press any key except Send and End the keypad, a blue square grid appears on the key in the diagram.

5 Sound Test

11 Speaker Press the Send key，LCD displays Sound. then the speaker makes sound. When you use the headset,sound can be heard through the headset.

6 Call test 12

MIC and headset

Press the Send key and speak to the microphone, then you can hear your sound from the receiver; When you use the headset, your voice can be heard through the headset.

7 FM test 13 FM

Insert the headset first, Press the Send key to test FM function.

Press the Send key display MMI Test Result, all the test Item and test result displays. If test pass, will display succeed after test Item, otherwise display failed after test Item. Completed MMI test, press End key to exit MMI Test Mode.

10.3 Voice Call Test Insert a normally used SIM card and the battery into the phone to be tested. Press and hold the End key to power on the phone. Check whether the signal strength is changed normally in normal network environment. Dial the number of a fixed-line phone to test the voice quality during a call. If the preceding tests are normal, end the voice call test. Otherwise, perform the test again or send the phone

to advanced maintenance center for repair.

G2100 Maintenance Manual Basic Version V1

Documents

check rf parameter

voice call

white block

black block

sim card

damaged result

usb cable

lcd displays