i DesignExpress, Cedar, PLACATE, Signaly, FCRAM and CoolAdjust are registered trademarks of Fujitsu Semiconductor Co.,Ltd. FAITH is the registered trademark of Fujitsu Kyushu Network Technologies Co., Ltd. AMBA, ARM, ARM1176JZF-S, ARM7TDMI-S, ARM926EJ-S, ARM946E-S, ETM11, Cortex-M3, Cortex-R4F and Cortex-A9 are trademarks or registered trademarks of ARM Limited. CompactFlash is registerd trademark of SanDisk Corporation. Memory Stick is registered trademark of Sony Co., Ltd. HDMI,HDMI Logo and High-Definition Multimedia Interface are trademarks or registerd trademarks of HDMI Licensing LLC. Other company names and product names are trademarks or registered trademarks of their respective owners. Shanghai Fujitsu Semiconductor (Shanghai) Co., Ltd 30F, Kerry Parkside, 1155 Fang Dian Road, Pudong District, Shanghai 201204 Tel: (86 21) 6146 3688 Fax: (86 21) 6146 3660, 6146 3680 http://www.fujitsu.com/cn/fss Chengdu Fujitsu Semiconductor Design (Chengdu) Co., Ltd B-5 No. 3 GaopengDaDao, Hi-Tech Zone Chengdu, Sichuan (Postcode: 610041) Tel: (86 28) 8515 0023 Fax: (86 28) 8515 0523 Hong Kong Fujitsu Semiconductor Pacific Asia Ltd. 10/F, Wolrd Commerce Centre 11 Canton Road Tsim Sha Tsui, Kowloon, Hong Kong Tel: (852) 2736 3232 Fax: (852) 2314 4207 Singapore & Oceania Fujitsu Semiconductor Asia Pte Ltd 151 Lorong Chuan New Tech Park #05-08 Singapore 556741 Tel: 65-6281-0770 Fax: 65-6281-0220 India Fujitsu Semiconductor Asia Pte Ltd Unit No.3, Level 8, Innovator, International Tech Park, Whitefield Road Bangalore, India 560066 Tel: (91): 80-28419990 Fax: (91) 80-28416660 Xi’ an Fujitsu Semiconductor (Shanghai) Co., Ltd Xi’ an Branch Room B0903, Pioneering Square, No. 48 Ke Ji Road, High-Tech Zone, Xi’ an, Shanxi Province, 710075 Tel: (86 29) 8799 8600 Fax: (86 29) 8799 8465 Taiwan Fujitsu Semiconductor (Shanghai) Co., Ltd Taiwan Branch 10FI., No.451, Chang-Chun Rd., Taipei 105, Taiwan Tel: (886 2) 2719 2011 Fax: (886 2) 2545 3690 Beijing Fujitsu Semiconductor (Shanghai) Co., Ltd. Beijing Branch Room 1501B, 15th Floor, Tower A, Ocean International Center, No. 5 Dong Si Huan Zhong Rd., Chaoyang District Beijing 100025, China Tel: (86 10) 5969 1600 Fax: (86 10) 5969 1611 Shenzhen Fujitsu Semiconductor (Shanghai) Co., Ltd Shenzhen Branch Rm 4509, Di Wang Commercial Centre, 5002 Shen Nan Dong Rd, Shenzhen (Postcode: 519008) Tel: (86 755) 2583 0028 Fax: (86 755) 8246 1510 FSS-ASIC-201111EN The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented soley for the purpose of reference to show examples of operations and uses of Fujitsu Semiconductor device; When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu Semiconductor assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property rught, such as patent right or copyright, or ay other right of Fujitsu Semiconductor assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use and household use, but are not designed, developed and manufactured as contemplated for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e. nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon syste,), or for use requiring extremely high reliability (i.e. submersible repeater and artiificial satellite). Please note that Fujitsu Semiconductor will not liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current level and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedure in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. i Leading Advanced SoC Fujitsu Semiconductor 2011.10 2011.10
19
Embed
Fujitsu Semiconductor...s 40 nm S i-g a te CMO S + 1.1V± 0.1V C S 201 erie 65 nm S a te CMO S pport s a wide r a nge from + 0.9V ~+ 1. 3 V C 101 erie 90 nm S a te CMO S Over
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i
DesignExpress, Cedar, PLACATE, Signaly, FCRAM and CoolAdjust are registered trademarks of Fujitsu Semiconductor Co.,Ltd.
FAITH is the registered trademark of Fujitsu Kyushu Network Technologies Co., Ltd.
AMBA, ARM, ARM1176JZF-S, ARM7TDMI-S, ARM926EJ-S, ARM946E-S, ETM11, Cortex-M3, Cortex-R4F and Cortex-A9 are
trademarks or registered trademarks of ARM Limited.
CompactFlash is registerd trademark of SanDisk Corporation.
Memory Stick is registered trademark of Sony Co., Ltd.
HDMI,HDMI Logo and High-Definition Multimedia Interface are trademarks or registerd trademarks of HDMI Licensing LLC.
Other company names and product names are trademarks or registered trademarks of their respective owners.
Shanghai
Fujitsu Semiconductor (Shanghai) Co., Ltd
30F, Kerry Parkside, 1155 Fang Dian Road,
Pudong District, Shanghai 201204
Tel: (86 21) 6146 3688
Fax: (86 21) 6146 3660, 6146 3680
http://www.fujitsu.com/cn/fss
Chengdu
Fujitsu Semiconductor Design (Chengdu) Co., Ltd
B-5 No. 3 GaopengDaDao, Hi-Tech Zone
Chengdu, Sichuan (Postcode: 610041)
Tel: (86 28) 8515 0023
Fax: (86 28) 8515 0523
Hong Kong
Fujitsu Semiconductor Pacific Asia Ltd.
10/F, Wolrd Commerce Centre 11 Canton Road
Tsim Sha Tsui, Kowloon, Hong Kong
Tel: (852) 2736 3232
Fax: (852) 2314 4207
Singapore & Oceania
Fujitsu Semiconductor Asia Pte Ltd
151 Lorong Chuan
New Tech Park #05-08
Singapore 556741
Tel: 65-6281-0770
Fax: 65-6281-0220
India
Fujitsu Semiconductor Asia Pte Ltd
Unit No.3, Level 8, Innovator,
International Tech Park, Whitefield Road
Bangalore, India 560066
Tel: (91): 80-28419990
Fax: (91) 80-28416660
Xi’ an
Fujitsu Semiconductor (Shanghai) Co., Ltd
Xi’ an Branch
Room B0903, Pioneering Square,
No. 48 Ke Ji Road, High-Tech Zone,
Xi’ an, Shanxi Province, 710075
Tel: (86 29) 8799 8600
Fax: (86 29) 8799 8465
Taiwan
Fujitsu Semiconductor (Shanghai) Co., Ltd
Taiwan Branch
10FI., No.451, Chang-Chun Rd.,
Taipei 105, Taiwan
Tel: (886 2) 2719 2011
Fax: (886 2) 2545 3690
Beijing
Fujitsu Semiconductor (Shanghai) Co., Ltd.
Beijing Branch
Room 1501B, 15th Floor, Tower A,
Ocean International Center,
No. 5 Dong Si Huan Zhong Rd.,
Chaoyang District Beijing 100025, China
Tel: (86 10) 5969 1600
Fax: (86 10) 5969 1611
Shenzhen
Fujitsu Semiconductor (Shanghai) Co., Ltd
Shenzhen Branch
Rm 4509, Di Wang Commercial Centre,
5002 Shen Nan Dong Rd,
Shenzhen (Postcode: 519008)
Tel: (86 755) 2583 0028
Fax: (86 755) 8246 1510
FS
S-A
SIC
-201
111E
N The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented soley for the purpose of reference to show examples
of operations and uses of Fujitsu Semiconductor device; When you develop equipment incorporating the device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu Semiconductor assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual
property rught, such as patent right or copyright, or ay other right of Fujitsu Semiconductor assumes no liability for any infringement of the intellectual property rights or
other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial
use, general office use, personal use and household use, but are not designed, developed and manufactured as contemplated for use accompanying fatal risks or
dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage
or other loss (i.e. nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch
control in weapon syste,), or for use requiring extremely high reliability (i.e. submersible repeater and artiificial satellite). Please note that Fujitsu Semiconductor will not
liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current level and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedure in accordance with the regulations of the Foreign Exchange and
Foreign Trade Control Law.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
i
Leading Advanced SoCFujitsu Semiconductor
2011.102011.10
2
Architecture Design・Verification
Automotive Electrical Devices
MobileCommunicationDevices
NEq
DigitalAV devices
ReliabilityTechnology
DesignTechnology
Technology
IP MacroDesignServices
P
Products・Technology that supports ASIC/SoC
System SolutionsCodesign L
Achieving “One Pass Success”From LSI to System
3
Due to rapid market change and diversification of
user needs, it is necessary to develop market products
in shorter development period.
As product development becomes increasingly
complex and lengthy, not only LSI, reducing iterations of
whole system becomes an extremely important issue
during development.
Fujitsu Semiconductor provides the “One Pass
Success” technology cultivated around 30 years of
ASIC development. Furthermore, we provide system
solutions integrated with upstream design, verifica-
tion, co-design and low power consumpiton design,
which would contribute to product development. In
addition, we organize business activities such as
restricting Co2 emissions, and pay continual efforts
towards global environment protection. By coping
with various customer needs, we aim to create a pros-
perious future together with you.
IndustryAmusementEquipment
OANetworkEquipment
Package
cro
ARMPlatform
Low Power Design
C O N T E N T S
5
6
10
20
24
34
38
48
Technology Roadmap
ASIC Lineup
IP Macro
Package
Design Methodology
Reliability
Design Center
Tech
nolo
gy R
oad
map
1
Technology Roadmap
Technology Roadmap■ Technology Roadmap
Fujitsu Semiconductor offers a wide range of technologies and products from 0.18μm to 40nm and beyond to meet customer needs.
For 40nm and 28nm, the wafer manufacture was committed to TSMC’s fabs, which will bring together Fujitsu’s IC desgin technolo-
gies, leading edge imaging and communication intellectual property (IP), and high-quality technical support to customers with
TSMC’s foundry-leading process technology and capability.
Year of Production
Gat
e L
eng
th (
nm
)
10
100
1000
1998 2000 2002 2004 2006 2008 2012 20142010
0.18 m 0.13 m 90nm 65nm 40nm 28nm 20nm
500
200
20
50
AS
IC L
ineup
2
ASIC lineup
ASIC Product Lineup■ Overview of ASIC Products
●Standard Cell
●Embedded Array
●Gate Array
■ CS302 SeriesThe CS302 series is a line of 40nm standard cells that satisfy demands for lower power-consumption, higher speed and higher inte-
gration.
These cells are able to implement a mixture of core transistors with three different threshold voltages according to different applica-
tions. Their “High Integration・ Low Power Consumption・High Speed” features achieve optimum conditions for LSI development.
The integration level in this series is twice the CS201 series.
*:Available package and memory vary with the circuit configuration, please contact our representative.
Series Name Technology Gate Supply voltage(Standard)CS302 Series 40 nm Si-gate CMOS ──── + 1.1V± 0.1V CS201 Series 65 nm Si-gate CMOS ──── Supports a wide range from
+ 0.9V ~+ 1.3VCS101 Series 90 nm Si-gate CMOS Over 91 million gates Supports a wide range from
+ 0.9V ~+ 1.3VCS91 Series 0.13 µm Si-gate CMOS Over 48 million gates + 1.2V± 0.1VCS86 Series 0.18 µm Si-gate CMOS Over 40 million gates + 1.8V± 0.15V
Series Name Technology Gate Supply voltage (Standard)
CE88 Series 0.18 µm Si-gate CMOS 13 million gates + 1.8V± 0.15V
Series Name Technology Gate Supply voltage (Standard)
CG88 Series 0.18 µm Si-gate CMOS 13 million gates + 1.8V± 0.15V
Technology 40 nm Si-gate CMOS
Supply voltage Internal:+1.1V±0.1V External:1.8V, 2.5V, 3.3VRandom logiccells librarylineup
For high integration For high speedCS302SL(Low Leakage Transistor) CS302ML(Low Leakage Transistor)CS302SN(Standard Transistor) CS302MN(Standard Transistor)CS302SZ(High Speed Transistor) CS302MZ(High Speed Transistor)
■ CS201 SeriesThe CS201 series is a line of 65nm standard cells achieving low power consumption, high speed and high integration.
These cells are able to implement a mixture of core transistors with three different threshold voltages according to different applications.Their “High Integration・ Low Power Consumption・High Speed” features achieve optimum conditions for LSI development. The integration level in this series is twice the CS101 series.
* 1:Available package and memory vary with the circuit configuration, please contact our representative.* 2:Please contact our representative for the memory capacity range.* 3:Technology from MoSys Corporation is used.
■ CS101 SeriesThe CS101 series is a line of 90nm standard cells achieving lower consumption power and higher speed. These cells can consoli-date core transistors with three different threshold voltages according to different applications. Random logic cell library of transistor withmultiple cell height and threshold voltages can be used in either block unit or cell unit. The integration level in this series is twice the CS91 series and it provides a maximum of 91 million gates. 。
*:Available package and memory vary with the circuit configuration, please contact our representative.
Technology 65 nm Si-gate CMOS
Supply voltage Internal:Supports a wide range from +0.9V ~ +1.3V External:1.8V, 2.5V, 3.3VRandom logiccells librarylineup
For high integration For high speedCS202SNC(Low Leakage Transistor) CS202MNC(Low Leakage Transistor)CS202SN(Standard Transistor) CS202MN(Standard Transistor)CS202SZ(High Speed Transistor) CS202MZ(High Speed Transistor)
Supply voltage Internal:Supports a wide range from +0.9V ~ +1.3V External:1.8V, 2.5V, 3.3VRandom logiccells librarylineup
For high integration For high integration For super high integrationCS104SL(Low Leakage Transistor) CS101SL(Low Leakage Transistor) CS104DL(Low Leakage Transistor)CS104SN(Standard Transistor) CS101SN(Standard Transistor) CS104DN(Standard Transistor)CS104SZ(High Speed Transistor) CS101SZ(High Speed Transistor) CS104DZ(High Speed Transistor)For high speed For high speedCS104ML(Low Leakage Transistor) CS101ML(Low Leakage Transistor)CS104MN(Standard Transistor) CS101MN(Standard Transistor)CS104MZ(High Speed Transistor) CS101MZ(High Speed Transistor)
High integrationSuper high integrationSuper high integration and large capacityHigh speedHigh integrationSuper high integrationHigh integration-High integrationHigh integration
■ CS91 SeriesThe CS91 series is a line of 0.13µm standard cells for low power-consumption, high speed and high integration.
These cells can implement a mixture of core transistors with three different threshold voltages according to different applications. Random
logic cell library of transistor with multiple cell height and threshold voltages can be used in either block unit or cell unit. Their features
achieve optimum conditions for LSI development. This series has a high integration level of up to 48 million gates.
*:Available package and memory vary with the circuit configuration, please contact our representative.
■ CS86 SeriesThe CS86 series is a line of 0.18µm standard cells based on higher integration implemented by introducing wiring pitch reduction
technology and on I/O pad placement technology to the conventional CS81 series.
These cells can implement a mixture of core transistors with three different threshold voltages according to different applications. Randomlogic cell library of transistor with multiple cell height and threshold voltages can be used in either block unit or cell unit. Their “HighIntegration・ Low Power Consumption・High Speed” features achieve optimum conditions for LSI development.
*:Available package and memory vary with the circuit configuration, please contact our representative.
Technology 0.13 µm Si-gate CMOS
Supply voltage Internal:+1.2V±0.1V External:2.5V, 3.3V
Random logiccells librarylineup
For high integrationCS92SL(Low Leakage Transistor)CS92SN(Standard Transistor)CS92SZ(High Speed Transistor)CS91SL(Low Leakage Transistor)CS91SN(Standard Transistor)CS91SZ(High Speed Transistor)
For high speedCS91HN(Standard Transistor)CS91HZ(High Speed Transistor)
Package lineup * FC-BGA、FBGA、QFP
Memory capacity(bit)*
Name Type Capacity Range
Clock-synchronized single-port RAM(1RW)
Clock-synchronized dual port RAM(2RW)
Clock-synchronized dual port RAM(1RW/1R)Clock-synchronized ROMClock-synchronized register file(1R/1W)Clock-synchronized register file(2R/2W)
High integrationSuper high integrationHigh speedSuper high integration and large capacityHigh speedSuper high integrationHigh integration-High integrationHigh integration
Clock-synchronized dual port RAM(1RW/1R)Clock-synchronized ROMClock-synchronized register file(2R/1W)Clock-synchronized register file(2R/2W)Delay-line memory
High integration/Partial light typeLarge capacityHigh speedSuper high integration/ Partial light typeSuper high integration and large capacityHigh integration-High integrationHigh integration-
・Reference designs are optimized for each ARM core.・Outstanding extensibility and customizability・Test bench, simulation environment, sample boot-code・Supports various process technologies
○Prototyping environment for ASIC
・Our prototyping environment combined with original ARMevaluation chip and FPGA
・Enables verification of hardware system operation, perfor-mance evaluation and software development in shorterperiod.
・Provides ARM11 based (embedded with ARM926 andARM946 too) ASIC prototyping boards
・Prototyping kit (FPGA reference design, simulation model forevaluation chip, etc) for each prototyping board allows shorterlaunch of prototyping environment.
ARM Core FASP RoadmapARM Core FASP Roadmap
2010 2011 2012 2013 2014
Application
ARM Core Lineup
FASP Roadmap
Real Time
Microcontroller
ARM1176ARM1176
ARM926ARM926
ARM946ARM946
ARM7ARM7M3M3
A9A9
ARM1176JZF-S Cortex-A9
Cortex-R4F
Cortex-M3
Cortex-A5
Cortex-A15
Cortex-R5
Cortex-M4
Cortex-M0
ARM926EJ-S
ARM946E-S
ARM7TDMI-S
A5A5 A15A15Under operationUnder operation
Under developmentUnder development
Under planningUnder planning
R5R5
M4M4M0M0
R4FR4F
NEW!NEW!
FASP Reference Design Block DiagramFASP Reference Design Block DiagramWhen When CPU is ARM1176JZF-SCPU is ARM1176JZF-S
ARM, ARM7TDMI-S, ARM926EJ-S, ARM946E-S, ARM1176JZF-S, Cortex-M3, Cortex-R4F, Cortex-A9 and AMBA are the trademarks of ARM Limited in the EU and other countries.
IP M
acro
8
■ Interface・Macro
Fujitsu supports customers’ advanced SoC development with various interface macros.
●USB3.0 InterfaceFujitsu Semiconductor provides device macros and PHY
macros of standard USB 3.0 specification in November 2008.
This innovative product achieves low power consumption with
enhanced efficiency and power management.
○USB3.0 Device Link macro
・Super Speed Link Layer and Protocol Layer embedded・Super Speed protocol process on hardware・FIFO for EndPoint embedded・DMA interface for data transfer is separated from CPU BUS
○USB3.0 PHY macro
・Supports Super Speed (5Gbps)・SSC (Spread Spectrum Clocking) generator embedded・CDR (Clock Data Recovery) function compliant to SSC mod-
ulation embedded・Receiver detection equipped・LFPS transmitter and receiver function embedded・8810B encoder/decoder embedded
・Supports Loopback BERT function for compliance test・LINK macro interface is compliant with PIPE specification
●HDMI® InterfaceHDMI (High-Definition Multimedia Interface) connects with AV
equipment such as camcorder/digital camera/HDD recorder,
etc. It also inputs/outputs digital video/ audio signals.
The latest HDMI-V1.4 supports 3D images and 4K2K panels.
We provide controller macros and PHY macros which comply
with this HDMI specification.
○HDMI macro
・Transmission of uncompressed video・Transmission of multi-channel audio signals・Content protection with HDCP・Guarantees connectivity between equipment by compliance
test・Supports Deep Color・Supports 3D images and 4K2K panels・Functionally equivalent to ASSP products by Silicon-Image ・Mutual recognition between connected equipment・Equipment control function by CEC (Consumer Electronic
Control)・Elastic buffer embedded・Compliance test of pattern generator embedded
- test chip- 65nm CMOS- PBGA package, wire bonding
USB3.05Gbps
Generator&
Analyzer SSD
Purposes of HDMIPurposes of HDMI
HDMIHDMI Evaluation Board Evaluation Board
CamcorderCamcorder MonitorMonitor
DigitalFrontend
Image/AudioProcess Unit
SensorImage SensorMicrophone M
emor
y
HDMICable
Imgae/AudioEngine
Panel/Speaker
HD
MI
-Tx
HD
MI
-Rx
IP M
acro
9
●DDR InterfaceFujitsu Semiconductor provides DDR interface macros from
low-mid range transfer bandwidth to higher transfer band-
width, with various technology nodes. We also support cus-
tomers’ SoC development with design support such as initial
timing budgeting and guidelines.
○DDR Interface・Macro
・Supports high speed operation/ various calibration (high-speed macros)
・supports low latency/low power consumption (low-mid speedmacros)
・DFI compliant (all macros)
○DDR Interface Design Support
・Power-supply design in LSI to reduce SSO/SSI Noise・Early detection for critical issues by initial Timing Budget・Hybrid timing analysis for STA (in LSI), Spice (including PCB)
(provides guideline for timing design)
●PCI Express InterfaceDue to the expansion of CPU processing capacity and data
transfer needs, the existing BUS has difficulty to achieve good
system performance. The high-speed PCI Express Interface,
which enables data transfer with few hundred mega bytes,
can solve the problem. PCI Express macros passed the com-
pliance test of PCI Express standard by PCI-SIG, and verified
connectivity and reliability with many PCI Express interfaces.
○PCI Express LINK Macro
・Compliant with PCI Express Base Specification rev.2.0・Selectable Root/Endpoint(Dual Mode)・Supports lane number of x1/ x4・Supports multifunction(8 at maximum)・Supports a maximum of 8 channels of VC on board・AHB BUS Interface・PHY Macro Interface compliant with PIPE Specification
○PCI Express PHY Macro
・Actual transfer bandwidth is over 800MB/s (with x4 lanes)・Guarantees high-speed signal-transmission by De-emphasis
function・Interface of LINK macro complies with standard PIPE
PCI Express system evaluating boardPCI Express system evaluating board
IP M
acro
10
●Serial ATA InterfaceFujitsu Semiconductor provides AHCI macro complied with
Serial ATA R3.0 Specification and AHCI R1.3 Specification,
we also provide PHY macros of 3Gbps/1.5Gbps. AHCI macro
equips with NCQ (Native Command Queuing) to enhance the
performance of DMA transfer.
PHY macros satisfy Interoperability Test Revision 1.1 Specifi-
cation by SATA-IO and confirm high connectivity with different
drives.
○Serial ATA AHCI macro
・Compliant with Serial ATA R3.0 Specification・Compliant with AHCI Revision1.3 Specification・Supports NCQ (Native Command Queuing) hardware・Supports Partial to Slumber・AXI BUS interface
USB2.0 PHY 480Mbps Eye Diagram USB2.0 PHY 480Mbps Eye Diagram PBGA Package Filter Not In UsePBGA Package Filter Not In Use
IP M
acro
11
■ Analog・Macro
We offer various analog macros (ADC/DAC PLL DC-DC LDO)
for customers to develop advanced SoCs of various applica-
tions such as communication system, image processing and
sensor/ control LSI, etc
●Data・ConverterWe provides various data converter macros that achieve low
power consumption, small area and low cost.
●Full lineup●All macros are silicon-proven●Embedded on various ASIC with mass production results
○High Speed SAR Type ACDC
・Achieves the best-in class lowest power consumption (1/10 of others)
・Applicable for mobile communication in place of conven-tional pipeline type ADC
●Various Evaluation Boards○Evaluation board for communication
Recently, various blocks (such as PLL) are used in large-
scale SoC construction. Evaluation boards are available for
communication purposes and to facilitate selection of ADC
and PLL according to system demands.
・Embedded with pinelined ADC for communication・Embedded with 2 types of high precise PLL・Enable prototyping environment of customers
○Audio AFE Evaluation Boards
High precise Audio Codec can be evaluated in real acoustic
environment. Evaluation boards are set in accordance with
system specifications
・Embedded with world’s best quality Audio Codec macro・Various proven guidelines
●Power・ManagementWe provide various power management macros that enable
SoCs single power source.
●DC-DC converter (switching regulator)●LDO (Linear regulator)●All macros are silicon-proven
Various Data ConvertersVarious Data Converters
0.010 2 4 6 8 10 12 14 16 18 20 22 24
10
1
100
0.1
1000
10000
Resolution [bit]C
onve
rsio
n F
requ
ency
[MH
z]
Sound/Audio Codec
Sensor/ ADC
Network Graphics/ Pipeline ADCCurrent D AC
High Speed IF/FlashADCCurrent DAC
Network/High Speed SARADCCurrent DAC
Controller/SAR ADCLow Speed DAC
1.2V 10bit 50MS/s High Speed SAR ADC1.2V 10bit 50MS/s High Speed SAR ADC
Low power consumption Small area pipleine type ADC(For mobile communicatin)
High Speed SAR ADC
Various Evaluation BoardsVarious Evaluation Boards
Evaluation Board for Communication
Evaluation board for Audio AFE
IP M
acro
12
■ IP Macro・LineupFujitsu Semiconductor supports customers’ advanced SoC development with various interface macros.
●Overview of Function/ Interface macrosCategory Function
Process Technology0.13µm 90nm 65nm 40nm
CPU Core
ARM7TDMI-S Now Now Now NowARM946E-S/ARM926EJ-S Now Now Now NowARM1176JZF-S Now Now Now NowCortex-M3 Now Now Now NowCortex-R4F Now Now Now NowCortex-A9 Now Now Now Now
Image CoreJPEG Codec
Standard Version Now Now Now NowHigh Speed Version Now Now Now NowLow Power Version Now Now Now Now
JPEG Encoder High Speed Version Now Now Now NowNTSC/PAL Encoder Now Now Now Now
Security CoreDES/3DES Now Now Now NowAES Now Now Now Now
Interface Controller Core
I2CI2C Master/Target (100k/400kbps) Now Now Now NowI/OCell for I2C Now Now Now Now
PCIPCI V2.2 (32bit,33/66MHz) Contoroller Now Now Now Now
I/OCell for PCI Now Now Now Under planning
IrDA (SIR/MIR/FIR) Now Now Now NowE-IDE Host (66MHz) Now Now Now NowUART Now Now Now NowPCMCIA Host Now Now Now NowCardBus Host Now Now Now NowCompactFlash Host Now Now Now NowMemory Stick PRO V2.0 Host Now Now Now NowSD V1.1/ MMC V3.3 Host Now Now Now Now
SD V3.0/ MMC V4.41 Host - Underdevelopment
Under development
Underdevelopment
IP M
acro
13
●Overview of Special I/O/ High-speed Interface MacroCategory Function
Process Technology0.13µm 90nm 65nm 40nm
USB
USB2.0 (FS) Device Link Now Now Now Now
USB2.0 (FS/LS) I/O Cell Now Now Underdevelopment
Under planning
USB2.0 (HS/FS/LS) Host LINK - Now Now NowUSB2.0 (HS/FS) Device LINK Now Now Now NowUSB2.0 (HS/FS/LS are HOST only)Host/Device LINK Now Now Now Now
USB2.0 (HS/FS) Device PHY Now Now - -USB2.0 (HS/FS/LS) Host/Device PHY - Now Now Now
USB3.0 (SS/HS) Device LINK - Under development Now Now
USB3.0 (SS/HS) Device PHY - - Now Under development
USB3.0 (SS/HS) Host LINK - - Under planning
Under planning
Ethernet Gigabit Ethernet MAC Now Now Now Now
LVDSLVDS Transmitter I/O cell (~666Mbps) Now Now Now Now
LVDS Receiver I/O cell (~666Mbps) Now Now NowUnder
development
FPD Link
FPD Link Transmitter (1-clock/5-data) - Now~945Mbps
6bit 100MS/s 3.3V Half Flash Now Now - -7bit 1GS/s 1.2V Flash - Now - -8bit 3MS/s 2.8V S.A.R* Now - - -8bit 50MS/s 3.3V Half Flash Now Now Now -8bit 110MS/s 1.2V dual channel pipeline - Now Now -10bit 1MS/s 3.3V S.A.R*
(Input numbers of ch)Now
Now(17ch)
Now(12ch)
Now (16ch)
10bit 30MS/s 3.3V Half Flash Now Now - -10bit 40MS/s 1.2V dual channel pipeline Input MUX - Now Now -
10bit 50MS/s 1.2V S.A.R* - - Now Under development
10bit 80MS/s 1.2V dual channel pipeline - Now Now -10bit 165MS/s 3.3V single channel pipeline - Now - -12bit 500kS/s 3.3V S.A.R* - - Now -12bit 2MS/s 3.3V S.A.R* - - - -12bit 50MS/s 1.2V dual channel pipeline - Now Now -
16bit 10kS/s 3.3V Delta-Sigma - Under development - -
DAC
8bit 1MS/s 3.3V with x1 amp Now Now Now -
10bit 1MS/s 3.3V with x1 amp Now Now Now Under planning
10bit 45MS/s 3.3V Differential O/P - Now Now -10bit 54MS/s 3.3V Now Now Now Now
10bit 220MS/s 3.3V Now(110M)
Now Now Now (160M)
12bit 54MS/s 3.3V - Now Now -
16bit 48kS/s 3.3V - Now Under planning -
AFEAudio Codec (High-end) - Now Now -Touch Panel - Now Now -
RegulatorVin=3.3V, Output=1.0V, 1.2V, Iout=200mA LDO - Now Under
development -
Vin=3.3V, Output=1.2V, Iout=400mA DCDC - Now Underdevelopment -
Standard PLL
Fout:100~300MHz, Fin:2.5~200MHz Now Now Now -Fout:300~600MHz, Fin:2.5~200MHz Now Now Now -Fout:400~800MHz, Fin:10~100MHz Now Now Now NowFout:600~1200MHz, Fin:10~200MHz Now Now Now Now
Low Jitter PLLFout:300~400MHz, Fin:4~32MHz - Now Under
developmentUnder
developmentFout:300~600MHz, Fin:11~100MHz - Now Now NowFout:600~1200MHz, Fin:11~100MHz - Now - Now
High-speedPLL
Fout:800~1600MHz, Fin:16~200MHz - - Now -Fout:1000~1600MHz, Fin:16~200MHz - Now - -
Routers, personal computers, graphics, digital TVs, set top boxes,printers
Personal computers, mobile,digital video cameras, digital still cameras, PDAs
Mobile, digital videocameras,digital still cameras,PDAs
7
13
15
17 60
20 40
25 60
2.5
1
1.5
2.5
1.6
1.6
450 2116
256 1156
256 1156
66 906
16 68
42 309
ApplicationI/O frequencyGHz
Heat resistance jaºC /W 0m/s
FC-PBGA(AlSiC-LID)
92.5450 1156FC-PBGA(Cu-LID)
TEBGA
PBGA
FBGA
QFN
WL-CSP
Personal computers, digitalTV, set tip boxes, printers15 1002.548 304
QFPLQFP
TEQFP
Packag
e
17
■ PBGA Low-heat Resistance Package(Ag paste type)As PBGA package, we provide Ag paste type which achieves both low-heat resistance and low cost.
A wider range of packages are available for high performance products.
■ QFP Low-heat Resistance Package(Stage-exposed type)We provide thermal enhanced QFP which achieves both low-heat resistance and low cost.
Heat resistance can be reduced significantly by exposing the die pad and connecting motherboard to ground.
■ SiP(System in Package) - Embedded example of QFPDue to the adoption of bonding/LF bus bar structure, internal pins are collaborated and external pins are reduced. We provide vari-
ous SiP-QFP which achieve high integration and low cost.
3W
4W
5W
PBGAPBGA Ag PasteAg Paste
PBGA
TEBGA
TEBGATEBGA Ag PasteAg Paste
Ag Paste
SubstrateLSI ChipEpoxy Resin
Ball AdhesiveAdhesive Insulator FilmInsulator Film
Wire
0
5
10
15
20
25
30
35
0m/s 1m/s 3m/s
Hea
t res
ista
nce
/W
Wind speed
Upper view Bottom view
LQFP Conventional product TEQFP
Exposed die pad
SolderSolder
Heat transferHeat transfer
Connection with TEQFP package Example
Motherboard
Die Padis exposed
LQFP144 Existing
TEQFP144Not connected with circuit board
TEQFP144Connected with circuit board
Data is reference value
Example of SiP stack &LF bus bar structure QFP208
- GND Chip-Stage- GND Stage-Lead- Power supply Chip-Bus Bar- Signal Chip-Lead / Chip-Chip
tion which considers multiple corner conditions and operating
modes. Repetition and development period can be reduced.
●Power Analysis・Crosstalk Noise AnalysisAs increasing miniaturization and low power voltage of LSI,
delay variations become greater by IR drop (voltage drop)
and crosstalk noise inside LSI.
By high precision IR drop and crosstalk noise analysis, we
have verified that it does not influence system operation.
Early Estimation• Area estimation• IR drop estimation• SSO noise estimation
Floorplan Simple Layout• Demonstration of estimated results• Verification of timing and routing convergence• Pad assignment• Verification of timing constraint
Optimization of Pad-Package Pin AssignmentOptimization of Pad-Package Pin Assignment Timing Analysis Considering NoiseTiming Analysis Considering Noise
SSO Noise
Chip Package PCB DRAM
O
I
Jitter
Jitter caused by SSO Noise
Reliability
30
Reliability
Reliability■ Pursuit of quality and reliabilitySemiconductor devices of Fujitsu adopt most advanced technology and have been regarded as high quality and reliable products
both domestically and overseas. We always have a serious commitment to quality and reliability. Particularly, we believe people,
process and product contribute significantly to this outstanding result.
●High quality by personnel educationDue to our special education program and Qfinity activity, our
workers are not only equipped with proficient skills in processes,
we are dedicated to achieve high quality and reliability.
It is a comprehensive system which enables workers to fully
aware of the importance of assuring high quality products.
●High quality built-in at every stageMaintenance of optimum manufacturing process is the key point
of stably supplying high-yield and high-quality LSIs.
From planning to final delivery, every stage of manufacturing pro-
cess is under thorough checks based on strict quality standards.
●High reliability for all sectors of societyAs a leading company of computers and communication devices,
we manufacture products according to various needs of custom-
ers. We aim to provide high reliable goods which produce from
high reliable semiconductor devices that are suitable for all sec-
tors of society.
■ Manufacture of ASIC products with high reliability
● Quality Assurance ProgramWe evaluate and examine semiconductor devices in every stage
from marketing research to planning, design, development,
experiment and mass production according to quality assurance
program. The building of quality has started in the stage of pro-
duction already. We incorporated customer demands which are
analyzed from marketing research into product planning, and it
can be reflected in the quality. This kind of quality building will be
continued in all stages of production such as design, develop-
ment and mass production.
Our Quality SupportOur Quality Support
CustomerCustomer
Sat is f i cat ionSat is f i cat ion
High QualityHigh Quality
Continual ImprovementContinual Improvement
Mechanisms and techniques Mechanisms and techniques
supporting qualitysupporting quality
Awareness for the realization of high qualityAwareness for the realization of high qualityPersonal development to support qualityPersonal development to support quality
PlanningPlanning DevelopmentDevelopmentMassMass
ProductionProduction MarketMarket
Manufacturing thatfully emcompasses
high quality
All-company All-company
improvement activitiesimprovement activities
SCRUMSCRUM
Remarks: SCRUM (Satisfying Cusomers & Reforming of Us Movement) includes
Qfinity Activity” of whole Fujitsu Group and it is initiated for resolving
assignments with the aim of reaching goals.
Verificationof productplanning
DesignFMEA
Verificationof basicdesign/technology
Evaluation ofelectrical characteristic and reliability Process FMEA
Productionqualificationtest
ScreeningReliabilitymonitoring test
Market researchProduct planningDevelopment plan
ProductDesign
Prototype ofpilot circuit
Developmentprototype
Mass productionprototype
Massproduction
PlanningReview
DR0
TechnologyReview
DR1
Mass ProductionTransitionReview
DR2
Mass ProductionStartedReview
DR3
Mass ProcutionStabilityReview
DR4
Flowchart of Quality Assurance ProgramFlowchart of Quality Assurance Program
Reliability
31
● Basic Assessment TestIn order to ensure reliability in new technology development, assessment is taken place by using TEG*1 for each basic failure
modes. Assessment has been carried out between transistor and wiring relationship. (Refer to table 1)*1: TEG (Test Element Group)
Collection of single element for evaluating specific failure modes.
Table-1 Basic Assessment Test
● Production Qualification TestWe focus on technical items which affect product reliability and would take its novelty and combination into account to perform prod-
cut grouping. Each group is represented by use of TEG, hence production qualification test (evaluation assessment) is conducted.
◆ Reliability Assessment for Representative Product
We would consider the following topics when determining product grouping and representative product:
●Process technology ・Design rule ・Employed material ・Structure ●Assembly technology ・Design rule ・Employed material ・Structure ●Circuit technology ●Combination of process technology and assembly technologyTesting items and sample size are determined in accordance with technology novelty and assessment purposes. (Refer to Table-2)
Table-2 Production Qualification Test
*2 : For surface mount packages, heat stress is added before testing.
Assessment Item Design elements Acceleration factorsElectro migration Wiring material, structure, current density Current density, temperature
● Production StageMaintaining high quality and steady production after development stage is essential. It is necessary to manage and understand the
condition of manufacturing sites to ensure its stability.
●Management of ProcessIf there are problems affecting quality and reliability in manufacturing process, quality assurance department would take the lead,
determine the cause immediately and take measures. Also, quality assurance department would confirm the effectiveness of mea-
sures.
● Failure Analysis and Cause InvestigationWe do not only monitor the manufacturing process, but also results of wafer probing test and final test of finished goods. Failure
analysis of defective goods would be executed. The results would be feedback in the process. In addition, analysis result of defec-
tive products from customers is valuable for preventing defects. The results would be reported to relevant departments for measure
planning.
Analysis results do not only contribute to the improvement of cause, but also to progressive development. In addition, horizontal
expansion is also carried out.
●Failure Analysis of defective productsWe would analyze failures thoroughly and prevent recurrence of problems. Effective information analysis would be carried out. We
devote great effort to this since the feedback would become direct policies for reliability improvement.
Customer complaints are first handled by our sales department. Then, reliability assurance department would analyze the electrical
and physical cause by the use of EMS, SEM and FIB etc,. Technical and manufacture department would take measures based on
the analysis results.
Moreover, we do not only focus on the problematic site, we are required to carry out measures towards all our manufacturing sites.
Please visit http://jp.fujitsu.com/microelectronics/brochures/catalog/ for quality and reliability assurance of Fujitsu semiconductor
devices.
FSSQuality Assurance Department
Reliability Assurance Department
Engineering Department
DesignTesting
AssemblyProcess
Process
Assembly
Testing336h48h
Final reportMid-term report
Objective Arrangement
Custom
ers
Technical Departm
ent
Factory
Quality A
ssurance D
epartment
Production Management Department
ProductionPlanning
Circulation
Supporting Flow of ClaimSupporting Flow of Claim
Number of days since the reception of reliability assurance department.
* 1: TS16949 Akiruno Technology Center is included in their scope of certification as a supporting department.* 2: TS16949 FIM head office and Aizu Factory are included in the scope of certification of Miyagi Factory as a supporting department.