From Interconnect to Innovation in the DoD Keynote - From... · From Interconnect to Innovation- 2 ... •The history of electronic packaging, and the unique needs and role of Defense
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UNCLASSIFIED
Dr. Livia M. Racz
Chemical, Microsystems, and Nanoscale Technologies Group
This material is based upon work supported by the Assistant Secretary of Defense for Research and Engineering under Air Force Contract No. FA8721-05-C-0002 and/or FA8702-15-D-0001. Any opinions, findings, conclusions or
Delivered to the U.S. Government with Unlimited Rights, as defined in DFARS Part 252.227-7013 or 7014 (Feb 2014). Notwithstanding any copyright notice, U.S. Government rights in this work are defined by DFARS 252.227-7013 or
DFARS 252.227-7014 as detailed above. Use of this work other than as specifically authorized by the U.S. Government may violate any copyrights that exist in this work.
Members included Eric Schmidt (Google Alphabet), Jeff Bezos (Amazon), Reid Hoffman (LinkedIn),
Neil deGrasse Tyson (astrophysicist), Adm. William McRaven (former commander of USSOCOM).
Promote a more inclusive view of the national security enterprise
Driving a next-generation business model in defense
electronics, M. Aslett, G. Haines II, Mercury Systems, Inc.,
Jan. 2015
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“We continuously iterate on how best to identify, contract, and
prototype novel innovations through sources traditionally not
available to the Department of Defense…”
www.diux.mil/
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Army Research Laboratory (ARL)
“…to pursue leading-edge…research in a truly collaborative fashion by enabling the continuous
flow of people and ideas between government, academia, and the private sector…viewed as a
critical element of national security.”
ARL Open Campus Strategic Plan, Approved for public release; distribution unlimited, May 2016.
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“The facility is open to all MIT students, faculty, and collaborators, and
provides a nexus for innovation, collaboration, and hands-on development.”
beaverworks.ll.mit.edu/CMS/bw/
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• Continue to miniaturize
– There continues to be demand for “integrated everything.”
• Focus on new form factors that enable agility, adaptability, reconfigurability, and affordability
• Understand and engage in technology “at the seams”
– Co-locate and cross-fertilize
– Engage more materials scientists. Interfaces become increasingly important as systems shrink.
– Be rigorous where your peers are empirical.
• Go after big problems
– But understand that game changers may not be obvious or profit-motivated
What Can Electronics Packaging Researchers Do?
• Reconfigure/reinvent yourself and your workforce.
– “Today’s answer is tomorrow’s idiocy.”
• Become generalists in addition to experts
– Understand the system and get a seat at the table early
• Keep regulatory processes in perspective
– Beware of well-intentioned regulation becoming an end in itself
• Capture a diverse workforce;
– Diverse background, skill set, cultural background, expertise
– Create a work environment friendly to multiple work styles and generations
“Survival goes neither to the strongest nor the swiftest, but the fastest to adapt to change.” --Frequently attributed to, but probably not said by Charles Darwin.
--Martin Seifert, President, Nufern
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• The history of electronic packaging, and the unique needs and role of Defense
• What has changed?
• What can be done? In broad terms? In Electronic Packaging?
• Technology Highlights: Innovations in microsystems integration
• Summary
Outline
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Microsystems Integration Innovation Framework
Established Device
New Device
Established Form Factor New Form Factor
Established integration
methods used to create
new devices
New devices, new form
factors, completely new
concept of operations
Status Quo New integration methods
for established / known /
existing devices
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• Technology Enablers
• Blue Sky
• Potential technology and/or
business disruptors
(if cost is low enough and
time is right)
Status quo
• “Integrated Everything”
• Cost reducers
• Ubiquitous devices
• Potential business disruptors
Microsystems Integration Innovation Framework
Established Device
New Device
Established Form Factor New Form Factor
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• The measured self
• 3D integrated microjets
• 3D integration enabled
quantum computing
• Multi-functional fiber devices
• MEMS picoprojector
• Paper electronics
• Tiled large-format imager
• Microplasma sputterer
Microsystems Integration Innovation Framework
Established Device
New Device
Established Form Factor New Form Factor
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• MEMS scanning mirror devices integrated within a Smartphone
– Operation in reflection mode maximizes efficiency
– Miniature, low-power electronics for ease of integration
– Sophisticated software and algorithms for image brightness and quality
MEMS Pico-Projector
Sources:
C. Lopez, “How to design an efficient MEMS-based pico-projector,”
EE Times Europe, Feb. 10, 2014
“Micromirror technology for smartphones,” Phys.org, July 16, 2013.
“Integrated Everything”
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• Solar cells on paper
• Loudspeakers on paper
• “Power paper”
Paper Electronics
Sources: A. Hubler, et al., Adv. Energy Mater. (2011)
MC. Barr, et al., J. Adv. Mater. (2011)
Source: A. Hubler, et al., Organic Electr. (2012)
Source: MIT Technology Review (2009)
Low Cost and Ubiquity
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