-
December 2013
Thermal Characteristics
FQP5N60C / FQPF5N60CN-Channel QFET® MOSFET600 V, 4.5 A, 2.5
Ω
Description
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com1
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
This N-Channel enhancement mode power MOSFET is produced using
Fairchild Semiconductor’s proprietary planar stripe and DMOS
technology. This advanced MOSFET technology has been especially
tailored to reduce on-state resistance, and to provide superior
switching performance and high avalanche energy strength. These
devices are suitable for switched mode power supplies, active power
factor correction (PFC), and electronic lamp ballasts.
Features• 4.5 A, 600 V, RDS(on) = 2.5 Ω (Max.) @ VGS = 10 V,
ID = 2.25 A
• Low Gate Charge (Typ. 15 nC)
• Low Crss (Typ. 6.5 pF)
• 100% Avalanche Tested
Absolute Maximum Ratings TC = 25°C unless otherwise noted.
Symbol Parameter FQP5N60C FQPF5N60C UnitRθJC Thermal Resistance,
Junction-to-Case, Max. 1.25 3.79 °C/WRθCS Thermal Resistance,
Case-to-Sink Typ, Max. 0.5 -- °C/WRθJA Thermal Resistance,
Junction-to-Ambient, Max. 62.5 62.5 °C/W
TO-220GDS TO-220F
GDS
G
S
D
* Drain current limited by maximum junction temperature.
Symbol Parameter FQP5N60C FQPF5N60C UnitVDSS Drain-Source
Voltage 600 VID Drain Current - Continuous (TC = 25°C) 4.5 4.5 *
A
- Continuous (TC = 100°C) 2.6 2.6 * AIDM Drain Current - Pulsed
(Note 1) 18 18 * AVGSS Gate-Source Voltage ± 30 VEAS Single Pulsed
Avalanche Energy (Note 2) 210 mJIAR Avalanche Current (Note 1) 4.5
AEAR Repetitive Avalanche Energy (Note 1) 10 mJdv/dt Peak Diode
Recovery dv/dt (Note 3) 4.5 V/nsPD Power Dissipation (TC = 25°C)
100 33 W
- Derate above 25°C 0.8 0.26 W/°CTJ, TSTG Operating and Storage
Temperature Range -55 to +150 °C
TLMaximum Lead Temperature for Soldering, 1/8" from Case for 5
Seconds
300 °C
-
Package Marking and Ordering Information
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com2
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
Electrical Characteristics TC = 25°C unless otherwise noted.
Part Number Top Mark Package Reel Size Tape Width
QuantityFQP5N60CFQP5N60C TO-220 N/A N/A 50 units
Packing MethodTube
TO-220F Tube N/A N/A 50 unitsFQPF5N60CFQPF5N60C
Notes:1. Repetitive rating : pulse-width limited by maximum
junction temperature.2. L = 18.9 mH, IAS = 4.5 A, VDD = 50 V, RG =
25 Ω, starting TJ = 25°C.3. ISD ≤ 4.5 A, di/dt ≤ 200 A/µs , VDD ≤
BVDSS, starting TJ = 25°C.4. Essentially independent of operating
temperature.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Off CharacteristicsBVDSS Drain-Source Breakdown Voltage VGS = 0
V, ID = 250 µA 600 -- -- V∆BVDSS / ∆TJ
Breakdown Voltage Temperature Coefficient
ID = 250 µA, Referenced to 25°C -- 0.6 -- V/°C
IDSS Zero Gate Voltage Drain CurrentVDS = 600 V, VGS = 0 V -- --
1 µAVDS = 480 V, TC = 125°C -- -- 10 µA
IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V
-- -- 100 nAIGSSR Gate-Body Leakage Current, Reverse VGS = -30 V,
VDS = 0 V -- -- -100 nA
On Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID
= 250 µA 2.0 -- 4.0 VRDS(on) Static Drain-Source
On-ResistanceVGS = 10 V, ID = 2.25 A -- 2.0 2.5 Ω
gFS Forward Transconductance VDS = 40 V, ID = 2.25 A -- 4.7 --
S
Dynamic CharacteristicsCiss Input Capacitance VDS = 25 V, VGS =
0 V,
f = 1.0 MHz
-- 515 670 pFCoss Output Capacitance -- 55 72 pFCrss Reverse
Transfer Capacitance -- 6.5 8.5 pF
Switching Characteristics td(on) Turn-On Delay Time VDD = 300 V,
ID = 4.5
A, RG = 25 Ω
(Note 4)
-- 10 30 nstr Turn-On Rise Time -- 42 90 nstd(off) Turn-Off
Delay Time -- 38 85 nstf Turn-Off Fall Time -- 46 100 nsQg Total
Gate Charge VDS = 480 V, ID = 4.5 A,
VGS = 10 V (Note 4)
-- 15 19 nCQgs Gate-Source Charge -- 2.5 -- nCQgd Gate-Drain
Charge -- 6.6 -- nC
Drain-Source Diode Characteristics and Maximum RatingsIS Maximum
Continuous Drain-Source Diode Forward Current -- -- 4.5 AISM
Maximum Pulsed Drain-Source Diode Forward Current -- -- 18 AVSD
Drain-Source Diode Forward Voltage VGS = 0 V, IS = 4.5 A -- -- 1.4
Vtrr Reverse Recovery Time VGS = 0 V, IS = 4.5 A,
dIF / dt = 100 A/µs -- 300 -- ns
Qrr Reverse Recovery Charge -- 2.2 -- µC
-
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com3
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
� !�����������������
0.2 0.4 0.6 0.8 1.0 1.2 1.410-1
100
101
150℃
※ Notes :1. VGS = 0V2. 250μs Pulse Test
25℃I DR, R
ever
se D
rain
Cur
rent
[A]
VSD, Source-Drain voltage [V]
0 4 12 160
2
4
6
8
10
12
VDS = 300V
VDS = 120V
VDS = 480V
※ Note : ID = 4.5A
V GS, G
ate-
Sour
ce V
olta
ge [V
]
8
QG, Total Gate Charge [nC]
0 2 4 86 100
1
2
3
4
5
6
VGS = 20V
VGS = 10V
※ Note : TJ = 25℃
RDS
(ON)
[Ω],
Drai
n-So
urce
On-
Resis
tanc
e
ID, Drain Current [A]
Figure 5. Capacitance Characteristics Figure 6. Gate Charge
Characteristics
Figure 3. On-Resistance Variation vsDrain Current and Gate
Voltage
Figure 4. Body Diode Forward Voltage Variation with Source
Current
and Temperature
Figure 2. Transfer CharacteristicsFigure 1. On-Region
Characteristics
10-1 0 1010
200
400
600
800
1000Ciss = Cgs + Cgd (Cds = shorted)Coss = Cds + CgdCrss =
Cgd
※ Notes ; 1. VGS = 0 V 2. f = 1 MHz
Crss
Coss
Ciss
Capa
citan
ce [p
F]
10
VDS, Drain-Source Voltage [V]
10-1 0 10110-2
10-1
100
101 VGS
Top : 15.0 V 10.0 V
8.0 V 7.0 V 6.5 V 6.0 V 5.5 V 5.0 V
Bottom : 4.5 V
※ Notes :1. 250μ s Pulse Test2. TC = 25℃
I D, D
rain
Cur
rent
[A]
10
VDS, Drain-Source Voltage [V]
842 1010-1
100
101
150oC
25oC
-55oC
※ Notes : 1. VDS = 40V2. 250μ s Pulse Test
I D, D
rain
Cur
rent
[A]
6
VGS, Gate-Source Voltage [V]
-
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com4
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
Typical Characteristics (Continued)
100 101 102 10310-2
10-1
100
101
100 ms
10 µs
DC
10 ms
1 ms
100 µs
Operation in This Area is Limited by R DS(on)
※ Notes :
1. TC = 25 oC
2. TJ = 150 oC
3. Single Pulse
I D, D
rain
Curre
nt [A
]
VDS, Drain-Source Voltage [V]
100 101 102 10310-2
10-1
100
101
100 msDC
10 ms
1 ms
100 µs
Operation in This Area is Limited by R DS(on)
※ Notes :
1. TC = 25 oC
2. TJ = 150 oC
3. Single Pulse
I D, D
rain
Curre
nt [A
]
VDS, Drain-Source Voltage [V]
Figure 9-1. Maximum Safe Operating Areafor FQP5N60C
Figure 10. Maximum Drain Currentvs Case Temperature
Figure 7. Breakdown Voltage Variationvs Temperature
Figure 8. On-Resistance Variationvs Temperature
Figure 9-2. Maximum Safe Operating Areafor FQPF5N60C
25 50 75 100 125 1500
1
2
3
4
5
I D, D
rain
Cur
rent
[A]
TC, Case Temperature [℃]
-100 -50 0 50 100 150 2000.8
0.9
1.0
1.1
1.2
※ Notes : 1. VGS = 0 V 2. ID = 250 μA
BVDS
S, (
Norm
alize
d)Dr
ain-S
ourc
e Br
eakd
own
Volta
ge
TJ, Junction Temperature [oC]
-100 -50 0 50 100 150 2000.0
0.5
1.0
1.5
2.0
2.5
3.0
※ Notes : 1. VGS = 10 V 2. ID = 2.25 A
RDS
(ON)
, (No
rmali
zed)
Drain
-Sou
rce
On-
Resis
tanc
e
TJ, Junction Temperature [oC]
-
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com5
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
Typical Characteristics (Continued)
1 0 -5 1 0 01 0 -4 1 0 -3 1 0 -2 1 0 -1 1 0 11 0 -2
1 0 -1
1 0 0
※ N o te s : 1 . Z
θ J C( t) = 3 .7 9 ℃ /W M a x . 2 . D u ty F a c to r , D = t1 /
t 2 3 . T J M - T C = P D M * Z θ J C( t)
s in g le p u ls e
D = 0 .5
0 .0 2
0 .2
0 .0 5
0 .1
0 .0 1
1 0 -5 1 0 -4 1 0 0 1 0 1
1 0 -2
1 0 -1
1 0 0
※ N o te s : 1 . Z θ J C( t ) = 1 .2 5 ℃ /W M a x . 2 . D u ty F
a c to r , D = t 1 / t 2
- 3 . T J M = T C P D M * Z θ J C( t )
s ein g le p u ls
D = 0 .5
0 .0 2
0 .2
0 .0 5
0 .1
0 .0 1
1 0 -3 1 0 -2 1 0 -1
t 1 , S q u a re W a v e P u ls e D u r a t io n [s e c ]
Figure 11-1. Transient Thermal Response Curve for FQP5N60C
t 1 , S q u a re W a v e P u ls e D u ra t io n [s e c ]
Figure 11-2. Transient Thermal Response Curve for FQPF5N60C
t1
PDM
t2
t1
PDM
t2Z JC
(t), T
herm
al R
espo
nse
[oC
/W]
Z JC
(t), T
herm
al R
espo
nse
[oC
/W]
-
Figure 12. Gate Charge Test Circuit & Waveform
Figure 13. Resistive Switching Test Circuit & Waveforms
Figure 14. Unclamped Inductive Switching Test Circuit &
Waveforms
VGS
VDS
10%
90%
td(on) tr
t on t off
td(off) tf
VDD
10V
VDSRL
DUT
RGVGS
VGS
VDS
10%
90%
td(on) tr
t on t off
td(off) tf
VDD
10V
VDSRL
DUT
RGVGS
VGS
Charge
VGS
10VQg
Qgs Qgd
3mA
VGS
DUT
VDS
300nF
50KΩ
200nF12V
Same Typeas DUT
Charge
VGS
10VQg
Qgs Qgd
3mA
VGS
DUT
VDS
300nF
50KΩ
200nF12V
Same Typeas DUT
EAS = L IAS2----21 --------------------
BVDSS - VDD
BVDSS
VDD
VDS
BVDSS
t p
VDD
IAS
VDS (t)
ID (t)
Time
10V DUT
RG
L
I D
t p
EAS = L IAS2----21EAS = L IAS2----21----21
--------------------
BVDSS - VDD
BVDSS
VDD
VDS
BVDSS
t p
VDD
IAS
VDS (t)
ID (t)
Time
10V DUT
RG
LL
I DI D
t p
VGSVGS
IG = const.
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com6
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
-
Figure 15. Peak Diode Recovery dv/dt Test Circuit &
Waveforms
DUT
VDS
+
_
DriverRG
Same Type as DUT
VGS • dv/dt controlled by RG• ISD controlled by pulse period
VDD
LI SD
10VVGS
( Driver )
I SD( DUT )
VDS( DUT )
VDD
Body DiodeForward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D =Gate Pulse WidthGate Pulse Period
--------------------------
DUT
VDS
+
_
DriverRG
Same Type as DUT
VGS • dv/dt controlled by RG• ISD controlled by pulse period
VDD
LLI SD
10VVGS
( Driver )
I SD( DUT )
VDS( DUT )
VDD
Body DiodeForward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D =Gate Pulse WidthGate Pulse Period
--------------------------D =Gate Pulse WidthGate Pulse
Period
--------------------------
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com7
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
-
www.fairchildsemi.com8
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
Mechanical Dimensions
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
Figure 16. TO-220, Molded, 3-Lead, Jedec Variation ABPackage
drawings are provided as a service to customers considering
Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and
contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not
expand the terms of Fairchild’s worldwide terms and conditions,
specif-ically the warranty therein, which covers Fairchild
products.
Always visit Fairchild Semiconductor’s online packaging area for
the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT220-003
-
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com9
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
Mechanical Dimensions
Figure 17. TO220, Molded, 3-Lead, Full Pack, EIAJ SC91, Straight
LeadPackage drawings are provided as a service to customers
considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing
and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not
expand the terms of Fairchild’s worldwide terms and conditions,
specif-ically the warranty therein, which covers Fairchild
products.
Always visit Fairchild Semiconductor’s online packaging area for
the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TF220-003
-
©2003 Fairchild Semiconductor Corporation FQP5N60C / FQPF5N60C
Rev. C1
www.fairchildsemi.com10
TRADEMARKSThe following includes registered and unregistered
trademarks and service marks, owned by Fairchild Semiconductor
and/or its global subsidiaries, and is not intended to be an
exhaustive list of all such trademarks.
*Trademarks of System General Corporation, used under license by
Fairchild Semiconductor.
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CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
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devices or systems which, (a) are
intended for surgical implant into the body or (b) support or
sustain life, and (c) whose failure to perform when properly used
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can be reasonably expected to result in a significant injury of the
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2. A critical component in any component of a life support,
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or to affect its safety oreffectiveness.
PRODUCT STATUS DEFINITIONSDefinition of Terms
AccuPower™AX-CAP®*BitSiC™Build it
Now™CorePLUS™CorePOWER™CROSSVOLT™CTL™Current Transfer
Logic™DEUXPEED®Dual Cool™EcoSPARK®EfficentMax™ESBC™
Fairchild®Fairchild Semiconductor®FACT Quiet
Series™FACT®FAST®FastvCore™FETBench™FPS™
F-PFS™FRFET®Global Power ResourceSMGreenBridge™Green FPS™Green
FPS™ e-Series™Gmax™GTO™IntelliMAX™ISOPLANAR™Marking Small Speakers
Sound Louder and
Better™MegaBuck™MICROCOUPLER™MicroFET™MicroPak™MicroPak2™MillerDrive™MotionMax™mWSaver®OptoHiT™OPTOLOGIC®OPTOPLANAR®
PowerTrench®PowerXS™Programmable Active Droop™QFET®QS™Quiet
Series™RapidConfigure™
Saving our world, 1mW/W/kW at a time™SignalWise™SmartMax™SMART
START™Solutions for Your
Success™SPM®STEALTH™SuperFET®SuperSOT™-3SuperSOT™-6SuperSOT™-8SupreMOS®SyncFET™
Sync-Lock™®*
TinyBoost®TinyBuck®TinyCalc™TinyLogic®TINYOPTO™TinyPower™TinyPWM™TinyWire™TranSiC™TriFault
Detect™TRUECURRENT®*SerDes™
UHC®Ultra FRFET™UniFET™VCX™VisualMax™VoltagePlus™XS™
®
™
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the
design specifications for product development. Specifications may
change in any manner without notice.
Preliminary First ProductionDatasheet contains preliminary data;
supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time
without notice to improve design.
No Identification Needed Full Production Datasheet contains
final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete Not In Production Datasheet contains specifications on
a product that is discontinued by Fairchild Semiconductor. The
datasheet is for reference information only.
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Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy
is also stated on our external website, www.Fairchildsemi.com,
under Sales Support.Counterfeiting of semiconductor parts is a
growing problem in the industry. All manufactures of semiconductor
products are experiencing counterfeiting of their parts. Customers
who inadvertently purchase counterfeit parts experience many
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Rev. I66
tm
®
FQP5N
60C / FQ
PF5N60C
— N
-Channel Q
FET® M
OSFET
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