FPC1011F Introduction of a new sensor package
FPC1011F Introduction of a new sensor package. Summary: FPC has invested + 1 000 KUSD High quality design Electrically compatible with FPC1011C Available.
Mar 28, 2015
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FPC1011FIntroduction of a new sensor package
Summary:
FPC has invested + 1 000 KUSD
High quality design
Electrically compatible with FPC1011C
Available as solderable component
New high quality supplier chain
Production start June 2008
FPC1011F
Product improvements:
BT substrate
+ High quality FR4
+ No silver migration or oxide
- May need mechanical support from underneath
FPC1011F
Product improvements:
BT substrateFilm Assisted Moulding
+ Standard mould method
+ Embedded passives
+ Protects silicon edges
FPC1011F
Product improvements:
BT substrateFilm Assisted Moulding
Flex film contact
+ Custom design of flex film (length etc.)
- Sourced by customer
FPC1011F
Product improvements:
BT substrate Film Assisted Moulding
Flex film contactAvailable for soldering with BGA
+ Enables automated assembly process
+ Low cost
FPC1011F
Product improvements:
BT substrate Film Assisted Moulding
Flex film contactAvailable for soldering with BGA
New hard coating
+ Mass production process, applied on wafer
+ Not sensitive to scratches,
- May give ESD footprint under extreme conditions
FPC1011F
Product improvements:
BT substrate Film Assisted Moulding
Flex film contactAvailable for soldering with BGA
New hard coating
- May give ESD footprint under extreme conditions:
FPC1011F
Strong ESD discharge from test electrode (>7.5KV) => Coating surface may be affected by oxygen plasma reaction => May be detected in image from extremely wet fingers.
Disappears over time (typically by 30% after 3 days)
Conditions for possible appearance: & Low humidity, typically northern China (may bring high voltage ESD discharges), & High humidity, typically southern China (may bring wet skin properties), & Electrode approach from top & discharge via sensor surface.
Not observed by live finger discharge.
Product improvements:
BT substrate Film Assisted Moulding
Flex film contactAvailable for soldering with BGA
New hard coatingMetal frame
+ More robust versus plastic frame in FPC1011C
+ Available in different forms
+ Colour and surface conditions (default Satine finish metal colour)
- Needs minimum order quantity
FPC1011F
Product improvements:
BT substrate Film Assisted Moulding
Flex film contactAvailable for soldering with BGA
New hard coatingMetal frame available in different forms
FPC1011F
Production improvements:
Assembly managed by Amkor+ No. one package supplier world wide
Full automated production process+ High volume capacity+ Repeatable high quality process
Well defined qualification process+ High product quality- Longer product change time
New Supplier chain
Production process:
Silicon production
New Supplier chain
Production process:
Silicon production
Coating
New Supplier chain
Spin coating process
Production process:
Silicon production
Coating
Packaging
New Supplier chain
Wafer dicing Die attach Wire bonding Passives FIM mould Frame assembly Flex contact assembly Test & outgoing inspection
Customer feedback:
Questions?
Acceptable product?
Thank you for your attention !
FPC1011F
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